CN210579452U - Double-layer aluminum high-scattering printed circuit board - Google Patents
Double-layer aluminum high-scattering printed circuit board Download PDFInfo
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- CN210579452U CN210579452U CN201921746053.2U CN201921746053U CN210579452U CN 210579452 U CN210579452 U CN 210579452U CN 201921746053 U CN201921746053 U CN 201921746053U CN 210579452 U CN210579452 U CN 210579452U
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Abstract
The utility model discloses a double-layer aluminum high-bulk printed circuit board, which comprises an aluminum printed board body, wherein an inserting plate is laid on the top of the surface of the aluminum printed board body, the aluminum printed board body comprises an aluminum base plate and an insulating base plate, the insulating base plate is laid on the outer side of the aluminum base plate, mica plates are arranged on the side edges of the aluminum printed board body, and the mica plates are arranged on three sides of the aluminum printed board body; the circuit board is organized by multilayer substrate and is established and form, the circuit board is at the during operation, the base plate can produce certain heat, through conduction layer upon layer, inlay at the side of plate body and be equipped with the mica plate, between the leading-in double-deck aluminum plate of one end of mica plate, can take the heat on the aluminum product base plate board out, carry out the efficient heat dissipation, if the plate body receives the extrusion after laying the copper foil wire, the flower is scraped easily to the plate body surface, influence the conductivity of circuit board, influence the use of this plate body, the elastic ball pad of establishing at the corner card, can avoid the plate body surface to scrape the flower impaired, the practicality of this plate.
Description
Technical Field
The utility model belongs to the technical field of printed circuit board, concretely relates to high printed circuit board that looses of double-deck aluminum product.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the main advantages of using circuit boards are that wiring and assembly errors are greatly reduced, automation level and production labor rate are improved, single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards can be divided according to the number of layers of the circuit boards, and the printed circuit boards are not general terminal products, so that the definition of names is slightly disordered, for example: a mother board for a personal computer is called a motherboard, but cannot be directly called a circuit board, and a printed circuit board generally refers to a bare board, i.e., a circuit board without an upper component. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement.
The existing double-layer aluminum product high-radiation printed circuit board is constructed by a double-layer aluminum product base layer, the printed circuit board is formed by adhering insulating heat conduction materials and the like on the surface of an aluminum product, when the circuit board is used, the base layer of the board body is a metal layer, the base layers are tightly adhered, when the circuit board is used, heat generated on the circuit board is finally radiated by conducting layer upon layer, the heat radiation efficiency is influenced to a certain degree, the problem of the practical service life of the circuit board is reduced, and therefore the double-layer aluminum product high-radiation printed circuit board is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high printed circuit board that looses of double-deck aluminum product, with the current high printed circuit board that looses of double-deck aluminum product that proposes in solving above-mentioned background art, this circuit board is founded by double-deck aluminum product basic unit, through forming printed circuit board such as the insulating heat conduction material of bonding on the aluminum product surface, this circuit board is when using, the basic unit of this plate body is the metal level, closely bond between each basic unit, when the board way uses, the heat that produces on the circuit board dispels the heat at last through conducting layer upon layer, the radiating efficiency receives certain influence, reduce the problem of the practical life of this board way.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high printed circuit board that looses of double-deck aluminum product, includes the aluminum product printed plate body, the inserted sheet board has been laid at the surperficial top of aluminum product printed plate body, the aluminum product printed plate body includes aluminum product base plate and insulating base plate, the outside at the aluminum product base plate is laid to insulating base plate, the mica plate has been installed to the side of aluminum product printed plate body, the mica plate has all been installed to trilateral of aluminum product printed plate body.
Preferably, the four corners of the aluminum product printing plate body are provided with clamping grooves, and the inner sides of the clamping grooves are clamped with elastic ball pads.
Preferably, the elastic ball pad is of a symmetrical structure.
Preferably, a double-layer aluminum base plate is paved on the aluminum printing plate body.
Preferably, one end of the mica plate is led into the space between two layers of aluminum base plates.
Preferably, the outer sides of the double-layer aluminum base plate are provided with insulating base plates.
Preferably, a copper foil layer is laid on one end surface of the insulation base plate.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) when the printed circuit board is used, the circuit board is formed by assembling a plurality of layers of base plates, when the circuit board works, the base plates can generate certain heat and finally reach the surface of the board body through layer-by-layer conduction, the heat dissipation efficiency is poor, the mica plates are embedded at the side edges of the board body, one ends of the mica plates are led into the space between the double-layer aluminum plates, the heat on the aluminum base plate can be taken out, efficient heat dissipation is carried out, and the practicability of the board body is improved;
(2) this aluminum product printed plate body receives the extrusion after laying the copper foil wire when using to install, and the flower is scraped easily to the plate body surface, can influence the conductibility of circuit board simultaneously, influences the use of this plate body, through the elastic ball pad of establishing at the corner card, can avoid the plate body surface to scrape the flower impaired, has improved the practicality of this plate body.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of the present invention;
FIG. 3 is a schematic view of the locking structure of the elastic ball pad of the present invention;
in the figure: 1. an aluminum material printed board body; 2. an elastic ball pad; 3. a card slot; 4. a card insertion plate; 5. mica plates; 6. an aluminum base layer plate; 7. an insulating substrate plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: the utility model provides a high printed circuit board that looses of double-deck aluminum product, including aluminum product printed plate body 1, inserted sheet board 4 has been laid at the surperficial top of aluminum product printed plate body 1, aluminum product printed plate body 1 includes aluminum product base plate 6 and insulating base plate 7, insulating base plate 7 is laid in the outside of aluminum product base plate 6, mica plate 5 has been installed to aluminum product printed plate body 1's side, mica plate 5 has all been installed to aluminum product printed plate body 1's trilateral, the leading-in double-deck aluminum product base plate of one end of mica plate 5 is 6 between, can take out the heat on the aluminum product base plate 6, carry out the efficient heat dissipation, the practicality of this plate.
In order to better place, in the embodiment, preferably, the four corners of the aluminum printed board body 1 are provided with the clamping grooves 3, the inner sides of the clamping grooves 3 are clamped with the elastic ball pads 2 to prevent the surface of the aluminum printed board body 1 from being scratched, for better cushion, in this embodiment, the elastic ball cushion 2 is preferably of a symmetrical structure, and for better installation of the circuit board, in this embodiment, the aluminum printed board 1 is preferably paved with a double-layer aluminum base plate 6, in order to better dissipate the heat on the aluminum base plate 6, in the embodiment, preferably, one end of the mica plate 5 is led between two layers of aluminum base plates 6, so that the heat dissipation efficiency is improved, in order to better use the plate body, in the embodiment, preferably, the outer sides of the double-layer aluminum base plate 6 are both provided with an insulating base plate 7, in order to facilitate assembly of the board, in this embodiment, a copper foil layer is preferably laid on one end surface of the insulating substrate 7.
The utility model discloses a theory of operation and use flow: when the double-layer aluminum product printed circuit board is used, the commonly used circuit board is formed by assembling a plurality of layers of base plates, wherein an aluminum product base plate 6 is a mainboard, the circuit board can generate certain heat when in work, the base plates can reach the surface of the board body through layer-by-layer conduction, the heat dissipation efficiency is poor, a mica plate 5 is embedded at the side edge of the board body, one end of the mica plate 5 is led into the space between the double-layer aluminum product base plate 6, when the aluminum product printed board body 1 works, the heat on the aluminum product base plate 6 can be taken out to carry out high-efficiency heat dissipation, the practicability of the aluminum product printed board body 1 is improved, if the surface of the aluminum product printed board body 1 is extruded after copper foil wires are laid, the surface of the aluminum product printed board body 1 is easy to scrape, the conductivity of the circuit board body can be influenced, the use of the board body is influenced, the elastic ball pad 2 can prevent the surface of the plate body from scratching and damaging, and the practicability of the plate body is improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a high printed circuit board that looses of double-deck aluminum product, includes aluminum product printed plate body (1), inserted sheet board (4), its characterized in that have been laid at the surface top of aluminum product printed plate body (1): aluminum product printed plate body (1) includes aluminum product base plate (6) and insulating base plate (7), the outside at aluminum product base plate (6) is laid in insulating base plate (7), mica plate (5) have been installed to the side of aluminum product printed plate body (1), mica plate (5) have all been installed to trilateral of aluminum product printed plate body (1).
2. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 1, wherein: clamping grooves (3) are formed in four corners of the aluminum product printing plate body (1), and elastic ball pads (2) are clamped on the inner sides of the clamping grooves (3).
3. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 2, wherein: the elastic ball pad (2) is of a symmetrical structure.
4. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 1, wherein: and a double-layer aluminum base plate (6) is paved on the aluminum printing plate body (1).
5. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 1, wherein: one end of the mica plate (5) is led into the space between the two layers of aluminum base plate (6).
6. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 1, wherein: and the outer sides of the double-layer aluminum base plate (6) are provided with insulating base plates (7).
7. The double-layer aluminum high-dispersion printed circuit board as claimed in claim 1, wherein: and a copper foil layer is laid on the surface of one end of the insulating base plate (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746053.2U CN210579452U (en) | 2019-10-17 | 2019-10-17 | Double-layer aluminum high-scattering printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746053.2U CN210579452U (en) | 2019-10-17 | 2019-10-17 | Double-layer aluminum high-scattering printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210579452U true CN210579452U (en) | 2020-05-19 |
Family
ID=70661674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921746053.2U Active CN210579452U (en) | 2019-10-17 | 2019-10-17 | Double-layer aluminum high-scattering printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210579452U (en) |
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2019
- 2019-10-17 CN CN201921746053.2U patent/CN210579452U/en active Active
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