CN207652756U - A kind of minitype radiator - Google Patents

A kind of minitype radiator Download PDF

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Publication number
CN207652756U
CN207652756U CN201721499823.9U CN201721499823U CN207652756U CN 207652756 U CN207652756 U CN 207652756U CN 201721499823 U CN201721499823 U CN 201721499823U CN 207652756 U CN207652756 U CN 207652756U
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CN
China
Prior art keywords
heat sink
heat
heat conduction
conduction platform
boss
Prior art date
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Active
Application number
CN201721499823.9U
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Chinese (zh)
Inventor
王冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Suzhong Precision Metal Products Co Ltd
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Suzhou Suzhong Precision Metal Products Co Ltd
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Priority to CN201721499823.9U priority Critical patent/CN207652756U/en
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Publication of CN207652756U publication Critical patent/CN207652756U/en
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Abstract

The utility model discloses a kind of minitype radiator, including heat sink, heat conduction platform and thermally conductive sheet, heat sink is three stage structure and surface is coated with insulated paint, heat sink is equipped with via, is boss in the middle part of heat sink, and boss is equipped with fastening hole, heat conduction platform is equipped with below boss, heat conduction platform upper surface is extended with buckling parts, heat conduction platform and heat sink and is connected by buckling parts and fastening hole, and gasket is additionally provided with below heat sink, the projecting inductance of spacer height, heat sink are connected and fixed by screw and mainboard.The utility model, which integrally occupies little space, to be suitble to install in narrow space, can be interfered to avoid with inductance around while reaching heat dissipation effect, is further provided with electrostatic drainage channel, securely and reliably.

Description

A kind of minitype radiator
Technical field
The utility model is related to radiator more particularly to a kind of minitype radiators for display main board.
Background technology
Either television indicator or computer monitor all develop toward slimming at this stage, to master in assembling process The thickness of plate and the electric elements being bonded thereon has strict requirements, TV motherboard that can generate heat during the work time, if It radiates not in time, it will burn out mainboard, generally radiated at this stage to TV motherboard using passive heat radiation device, common is passive Formula radiator is integrally formed radiating fin using cheap aluminium extruded, and the structure occupied space is big and can not avoid surrounding components Interference, in addition mainboard will produce electrostatic during the work time, if exported not in time, be easy breakdown mainboard on electric elements Cause economic loss.
Utility model content
In view of the deficiencies of the prior art, the utility model provides a kind of minitype radiator, and the heat spreader structures are simple, account for It is small with space, do not generate the electrostatic interfered and can exported simultaneously on mainboard with inductance around.
Technical solutions of the utility model are as follows:A kind of minitype radiator, including heat sink, heat conduction platform and thermally conductive sheet, it is special Sign is:The heat sink is three stage structure, and the heat sink is equipped with via, is boss in the middle part of the heat sink, described Boss is equipped with fastening hole, is equipped with heat conduction platform below the boss, heat conduction platform upper surface is extended with buckling parts, the heat conduction Platform and the heat sink are connected by the buckling parts and the fastening hole, are additionally provided with gasket below the heat sink, institute It states heat sink and the heat conduction platform is thermally connected, the heat conduction platform and the thermally conductive sheet are thermally connected, and the thermally conductive sheet and mainboard heat connect It connects, the heat sink is connected and fixed by screw and mainboard.
Specifically:It is cased with spring outside the screw, conductive spacer is additionally provided on the spring and heat sink contact surface, it is described Screw is additionally provided with latch closure with mainboard bearing, and the screw, the spring, the conductive spacer and the latch closure are conductive gold Belong to.
Specifically:The gasket and the thermally conductive sheet are made of copper, and the heat sink is aluminium sheet.
Specifically:The projecting inductance of spacer height.
Specifically:The heat dissipation plate surface is coated with insulated paint.
The beneficial effects of the utility model are:It adopts and is screwed and is cased with spring outside screw, can adjust and lock power; It is equipped with gasket below heat sink and spacer height is more than surrounding inductance and can interfere to avoid with inductance around;Screw, spring are conductive Gasket, latch closure and mainboard, which constitute electric pathway, to export to appointed place by the electrostatic of mainboard;Heat dissipation plate surface is coated with insulated paint It can prevent heat sink from being contacted with surrounding electric elements and generate punch-through;It is radiated using three-stage heat sink cooperation heat conduction platform, Entirety occupies little space, suitable for being installed in narrow space.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the utility model exploded perspective view.
Fig. 2 is the utility model front view.
Fig. 3 is the utility model vertical view.
Fig. 4 is the utility model upward view.
Wherein:1, screw 2, spring 3, conductive spacer 4, heat sink 41, via 42, fastening hole 43, boss 5, gasket 6, lead Thermal station 61, buckling parts 7, latch closure 8, thermally conductive sheet.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings.
- 4 a kind of minitype radiator refering to fig. 1, including heat sink 4, heat conduction platform 6 and thermally conductive sheet 8, it is characterised in that:It is described Heat sink 4 is three stage structure, and the heat sink 4 is equipped with via 41, and 4 middle part of the heat sink is boss 43, the boss 43 are equipped with fastening hole 42, using three stage structure, in assembly not only can with fool proof, can also increasing heat radiation area, it is described 43 lower section of boss is equipped with heat conduction platform 6, and 6 upper surface of heat conduction platform is extended with buckling parts 61, the heat conduction platform 6 and the heat sink 4 are connected by the buckling parts 61 and the fastening hole 42, and 4 lower section of the heat sink is additionally provided with gasket 5, the heat sink 4 and the heat conduction platform 6 be thermally connected, the heat conduction platform 6 and the thermally conductive sheet 8 are thermally connected, and the thermally conductive sheet 8 and mainboard are thermally connected, The heat sink 4 is connected and fixed by screw 1 with mainboard.
It is cased with spring 2 outside screw 1 described in the utility model, conduction is additionally provided on the spring 2 and 4 contact surface of heat sink Gasket 3, the screw 1 are additionally provided with latch closure 7 with mainboard bearing, and latch closure 7 is used for further lock screw 1 and mainboard, play steady Surely the effect reinforced, the screw 1, the spring 2, the conductive spacer 3 and the latch closure 7 are conductive metal, screw 1, Spring 2, conductive spacer 3, latch closure 7 and mainboard, which constitute electric pathway, to export to appointed place by the electrostatic of mainboard.
Gasket described in the utility model and the thermally conductive sheet are made of copper, and the heat sink is aluminium sheet.
The projecting inductance of spacer height described in the utility model can interfere to avoid with inductance around.
The plate surface that radiates described in the utility model is coated with insulated paint, prevents heat sink from contacting generation with surrounding electric elements Punch-through.
The utility model heat in radiation processes sends heat conduction platform 6 to by thermally conductive sheet 8, and heat conduction platform 6 sends heat dissipation to Plate 4 radiates, and is suitable for the little low side mainboard of calorific value;The beneficial effects of the utility model are:It adopts and is screwed and spiral shell Silk is outer to be cased with spring, can adjust and lock power;Be equipped with gasket below heat sink and spacer height be more than surrounding inductance can be to avoid Interfere with inductance around;Screw, spring, conductive spacer, latch closure and mainboard constitute electric pathway and can export to the electrostatic of mainboard Appointed place;Heat dissipation plate surface, which is coated with insulated paint, can prevent heat sink from contacting generation punch-through with surrounding electric elements.
Above-mentioned accompanying drawings and embodiments are merely to illustrate the utility model, and any technical field those of ordinary skill is to it The appropriate changes or modifications done all should be regarded as not departing from the utility model patent scope.

Claims (5)

1. a kind of minitype radiator, including heat sink, heat conduction platform and thermally conductive sheet, it is characterised in that:The heat sink is three-stage Structure, the heat sink are equipped with via, are boss in the middle part of the heat sink, and the boss is equipped with fastening hole, the boss Lower section is equipped with heat conduction platform, and heat conduction platform upper surface is extended with buckling parts, and the heat conduction platform and the heat sink pass through the button Conjunction portion and the fastening hole are connected, and gasket, the heat sink and the heat conduction Tai Relian are additionally provided with below the heat sink It connects, the heat conduction platform and the thermally conductive sheet are thermally connected, and the thermally conductive sheet and mainboard are thermally connected, and the heat sink passes through screw and master Plate is connected and fixed.
2. a kind of minitype radiator according to claim 1, it is characterised in that:It is cased with spring, the spring outside the screw Be additionally provided with conductive spacer on heat sink contact surface, the screw is additionally provided with latch closure, the screw, the bullet with mainboard bearing Spring, the conductive spacer and the latch closure are conductive metal.
3. a kind of minitype radiator according to claim 1, it is characterised in that:The gasket and the thermally conductive sheet are by copper At the heat sink is aluminium sheet.
4. a kind of minitype radiator according to claim 1, it is characterised in that:The projecting inductance of spacer height.
5. a kind of minitype radiator according to claim 1, it is characterised in that:The heat dissipation plate surface is coated with insulated paint.
CN201721499823.9U 2017-11-13 2017-11-13 A kind of minitype radiator Active CN207652756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721499823.9U CN207652756U (en) 2017-11-13 2017-11-13 A kind of minitype radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721499823.9U CN207652756U (en) 2017-11-13 2017-11-13 A kind of minitype radiator

Publications (1)

Publication Number Publication Date
CN207652756U true CN207652756U (en) 2018-07-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721499823.9U Active CN207652756U (en) 2017-11-13 2017-11-13 A kind of minitype radiator

Country Status (1)

Country Link
CN (1) CN207652756U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112404890A (en) * 2020-10-17 2021-02-26 苏州苏众精密金属制品有限公司 Processing technology of computer radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112404890A (en) * 2020-10-17 2021-02-26 苏州苏众精密金属制品有限公司 Processing technology of computer radiator

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