CN213581923U - Notebook computer lower casing heat radiation structure - Google Patents
Notebook computer lower casing heat radiation structure Download PDFInfo
- Publication number
- CN213581923U CN213581923U CN202023118836.1U CN202023118836U CN213581923U CN 213581923 U CN213581923 U CN 213581923U CN 202023118836 U CN202023118836 U CN 202023118836U CN 213581923 U CN213581923 U CN 213581923U
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- heat
- heat dissipation
- notebook computer
- lower shell
- shell body
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Abstract
The utility model relates to the technical field of notebook computers, in particular to a notebook computer lower shell heat dissipation structure, which comprises an integrally formed lower shell body, a placement cavity arranged on the lower shell body, a heat conduction area arranged in the placement cavity, heat dissipation grooves arranged on the lower shell body and positioned at two sides of the heat conduction area, and a heat dissipation area arranged in the heat conduction area; the heat conducting area comprises an aluminum substrate arranged in the accommodating cavity, a heat transfer copper plate integrally die-cast in the aluminum substrate, and a heat conducting copper layer formed on the surface of the heat transfer copper plate through cold spraying, and the heat radiating area comprises a plurality of heat radiating grooves formed in the aluminum substrate and on the surface of the heat radiating groove away from the heat conducting copper layer; the utility model discloses a inferior valve body of a body structure to through the installation of settling chamber cooperation heat conduction district of seting up at the inferior valve body, be used for the inside heat dissipation of notebook computer through the heat conduction district, the radiating effect is good, and structural reliability is strong.
Description
Technical Field
The utility model relates to a notebook computer technical field especially relates to a notebook computer inferior valve heat radiation structure.
Background
With the large-scale popularization of the notebook computers, the notebook computers are updated and replaced more and more frequently, the quality requirements of people on the notebook computers are higher and higher, and the market puts new demands on the efficient and high-quality production and assembly of the notebook computers. The notebook computer is an integral portable personal computer with a host, a display screen, a keyboard and a mouse integrated together, and the notebook computer is widely used due to the convenience in carrying and using.
The notebook computer comprises a main machine, a keyboard panel, a power supply and a power supply, wherein the main machine of the notebook computer consists of a lower shell and an upper shell, the lower shell is used for installing an electric control structure of the main machine, and the upper shell is used for installing the keyboard panel; the existing lower shell of the notebook computer is generally processed by aluminum alloy or injection molded, the structure of the general direct molding does not have the heat dissipation effect, and only the heat dissipation groove is arranged at the position needing heat dissipation to dissipate heat, so that the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an adopt inferior valve body of a body structure to through the installation of settling chamber cooperation heat conduction district of seting up at the inferior valve body, be used for the inside heat dissipation of notebook computer through the heat conduction district, the radiating effect is good, the notebook computer inferior valve heat radiation structure that the structural reliability is strong.
The utility model adopts the technical proposal that: a notebook computer lower shell heat dissipation structure comprises an integrally formed lower shell body, a placement cavity arranged on the lower shell body, a heat conduction area arranged in the placement cavity, heat dissipation grooves arranged on the lower shell body and positioned on two sides of the heat conduction area, and heat dissipation areas arranged in the heat conduction area; the heat conducting area comprises an aluminum substrate arranged in the arranging cavity, a heat transfer copper plate integrally die-cast in the aluminum substrate and a heat conduction copper layer formed on the surface of the heat transfer copper plate through cold spraying, and the heat radiating area comprises a plurality of heat radiating grooves which are arranged on the aluminum substrate and deviate from one surface of the heat conduction copper layer.
The further improvement of the scheme is that the lower shell body is made of pure aluminum or aluminum alloy through integral die-casting molding and is subjected to surface anodic treatment.
The further improvement of the scheme is that the lower shell body is formed by numerical control machining of aluminum alloy and is subjected to surface anodic treatment.
The further improvement of the scheme is that the mounting cavity is integrally formed on the lower shell body and runs through the lower shell body.
The scheme is further improved in that mounting lug grooves are formed in two sides of the mounting cavity, connecting blocks are formed in two sides of the aluminum substrate, and the connecting blocks are mounted in the mounting lug grooves.
The scheme is further improved in that the mounting cavity is rectangular, circular or elliptical.
The further improvement of the scheme is that the heat dissipation grooves are pull grooves, a plurality of groups of the heat dissipation grooves are formed in the heat dissipation grooves, and the heat dissipation grooves in each group are all communicated with the lower shell body.
The further improvement of the scheme is that the heat transfer copper plate is provided with a plurality of filling holes, and the aluminum base fills the filling holes through die casting.
The further improvement of the scheme is that the surface of the heat-conducting copper layer is a flat surface or a capillary structure surface.
The scheme is further improved in that the heat dissipation grooves are net-shaped grooves.
The utility model has the advantages that:
compared with the heat dissipation structure of the traditional notebook computer lower shell, the utility model adopts the lower shell body with an integrated structure, and through arranging the installation that the arrangement cavity is matched with the heat conduction area on the lower shell body, the heat conduction area is used for dissipating heat inside the notebook computer, the heat dissipation effect is good, and the structural reliability is strong; the integrated heat dissipation structure comprises an integrally formed lower shell body, a placement cavity arranged on the lower shell body, a heat conduction area arranged in the placement cavity, heat dissipation grooves arranged on the lower shell body and positioned on two sides of the heat conduction area, and heat dissipation areas arranged in the heat conduction area; the heat dissipation groove is used for ventilation and heat dissipation of the internal structure, the heat conduction areas on the left and the right of the heat dissipation area dissipate heat, and the heat dissipation effect is good.
The heat conducting area comprises an aluminum substrate, a heat transfer copper plate and a heat conduction copper layer, wherein the aluminum substrate is arranged in the accommodating cavity, the heat transfer copper plate is integrally die-cast in the aluminum substrate, the heat conduction copper layer is formed on the surface of the heat transfer copper plate through cold spraying, the heat radiating area comprises a plurality of heat radiating grooves which are formed in the aluminum substrate and deviate from one side of the heat conduction copper layer, the aluminum substrate is adopted for the structure base body, the heat transfer copper plate is integrally die-cast in the heat conducting area, the heat conducting effect is improved, the heat conducting copper layer can further improve the heat conducting effect of.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the heat conducting area of the present invention;
fig. 3 is a schematic structural view of the heat conduction area of the present invention.
Description of reference numerals: the heat sink comprises a lower case body 100, a mounting cavity 110, a mounting lug groove 111, a heat dissipation groove 120, a heat conduction region 200, a heat dissipation region 210, an aluminum substrate 220, a connection block 221, a heat transfer copper plate 230, a filling hole 231, a heat conduction copper layer 240 and a heat dissipation groove 250.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 3, a heat dissipation structure of a notebook computer lower case includes an integrally formed lower case body 100, a mounting cavity 110 formed in the lower case body 100, a heat conduction area 200 installed in the mounting cavity 110, heat dissipation grooves 120 formed in the lower case body 100 and located at two sides of the heat conduction area 200, and a heat dissipation area 210 formed in the heat conduction area 200; the heat conducting area 200 includes an aluminum substrate 220 mounted in the mounting cavity 110, a heat transfer copper plate 230 integrally die-cast inside the aluminum substrate 220, and a heat conducting copper layer 240 formed on the surface of the heat transfer copper plate 230 by cold spraying, and the heat dissipating area 210 includes a plurality of heat dissipating grooves 250 opened on the aluminum substrate 220 and facing away from the heat conducting copper layer 240.
In this embodiment, the lower case body 100 is formed by integrally die-casting pure aluminum or aluminum alloy, and is surface-anodized; the die-casting forming is adopted, the forming effect is good, and the surface is more attractive after being subjected to anodic treatment.
In another embodiment, the lower case body 100 is formed by numerical control machining using aluminum alloy, and surface-anodized; the structure formed by machining is more reliable, the strength is higher, and the surface of the metal plate is more attractive after being subjected to anodic treatment.
The mounting cavity 110 is formed in a rectangular, circular or elliptical shape, and is configured according to a structure requiring heat dissipation.
The heat dissipating grooves 120 are pull grooves, and a plurality of groups are formed therein, the heat dissipating grooves 120 of each group are all connected to the lower case body 100, and the structure of the heat dissipating grooves 120 is configured according to an internal heat generating component or an air exhausting structure.
The heat transfer copper plate 230 is provided with a plurality of filling holes 231, the aluminum base fills the filling holes 231 through die casting, and the connecting area between the heat transfer copper plate 230 and the aluminum base is larger through the filling holes 231.
The surface of the heat conductive copper layer 240 is a flat surface or a capillary structure surface, and generally, the flat surface is selected to be attached to heat conduction and dissipation.
The heat dissipation grooves 250 are mesh grooves, so that the area of the whole structure is larger and the heat dissipation effect is better.
The utility model adopts the lower shell body 100 with an integrated structure, and the arrangement cavity 110 is arranged on the lower shell body 100 to be matched with the installation of the heat conducting area 200, so that the heat conducting area 200 is used for radiating the inside of the notebook computer, the heat radiating effect is good, and the structural reliability is strong; the integrated heat dissipation structure comprises an integrally formed lower shell body 100, a mounting cavity 110 formed in the lower shell body 100, a heat conduction area 200 arranged in the mounting cavity 110, heat dissipation grooves 120 formed in the lower shell body 100 and located on two sides of the heat conduction area 200, and a heat dissipation area 210 arranged in the heat conduction area 200; the heat dissipation groove 120 is further arranged for ventilation and heat dissipation of the internal structure, the left heat conduction area 200 and the right heat conduction area 210 dissipate heat, and the heat dissipation effect is good. The heat conducting area 200 includes an aluminum substrate 220 mounted in the mounting cavity 110, a heat transfer copper plate 230 integrally die-cast inside the aluminum substrate 220, and a heat conducting copper layer 240 formed on the surface of the heat transfer copper plate 230 by cold spraying, the heat radiating area 210 includes a plurality of heat radiating grooves 250 opened on the aluminum substrate 220 and facing away from one side of the heat conducting copper plate 240, and an aluminum-based left and right structural base body is adopted, the heat conducting copper plate 230 is integrally die-cast inside, so that the heat conducting effect is improved, the heat conducting copper layer 240 can further improve the heat conducting effect of a heating component, and the heat radiating grooves 250 are used for structural heat radiation, so that the.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A notebook computer inferior valve heat radiation structure which characterized in that: the heat dissipation structure comprises an integrally formed lower shell body, a placement cavity arranged on the lower shell body, a heat conduction area arranged in the placement cavity, heat dissipation grooves arranged on the lower shell body and positioned on two sides of the heat conduction area, and heat dissipation areas arranged on the heat conduction area; the heat conducting area comprises an aluminum substrate arranged in the arranging cavity, a heat transfer copper plate integrally die-cast in the aluminum substrate and a heat conduction copper layer formed on the surface of the heat transfer copper plate through cold spraying, and the heat radiating area comprises a plurality of heat radiating grooves which are arranged on the aluminum substrate and deviate from one surface of the heat conduction copper layer.
2. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the lower shell body is formed by pure aluminum or aluminum alloy through integral die-casting, and is subjected to surface anodic treatment.
3. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the lower shell body is formed by aluminum alloy through numerical control machining, and surface anode treatment is carried out.
4. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the mounting cavity is integrally formed in the lower shell body, and the mounting cavity penetrates through the lower shell body.
5. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: mounting lug grooves are formed in two sides of the mounting cavity, connecting blocks are formed in two sides of the aluminum substrate, and the connecting blocks are mounted in the mounting lug grooves.
6. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the placing cavity is rectangular, circular or oval.
7. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the radiating grooves are pull grooves, a plurality of groups are arranged on the radiating grooves, and the radiating grooves of each group are all communicated with the lower shell body.
8. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the heat transfer copper plate is provided with a plurality of filling holes, and the aluminum base fills the filling holes through die casting.
9. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the surface of the heat conduction copper layer is a flat surface or a capillary structure surface.
10. The heat dissipation structure of the lower case of the notebook computer according to claim 1, wherein: the heat dissipation grooves are net-shaped grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118836.1U CN213581923U (en) | 2020-12-22 | 2020-12-22 | Notebook computer lower casing heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118836.1U CN213581923U (en) | 2020-12-22 | 2020-12-22 | Notebook computer lower casing heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213581923U true CN213581923U (en) | 2021-06-29 |
Family
ID=76549737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023118836.1U Expired - Fee Related CN213581923U (en) | 2020-12-22 | 2020-12-22 | Notebook computer lower casing heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213581923U (en) |
-
2020
- 2020-12-22 CN CN202023118836.1U patent/CN213581923U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210629 |
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| CF01 | Termination of patent right due to non-payment of annual fee |