CN218849472U - Novel COME module reinforcing and installing heat dissipation device - Google Patents
Novel COME module reinforcing and installing heat dissipation device Download PDFInfo
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- CN218849472U CN218849472U CN202320069885.5U CN202320069885U CN218849472U CN 218849472 U CN218849472 U CN 218849472U CN 202320069885 U CN202320069885 U CN 202320069885U CN 218849472 U CN218849472 U CN 218849472U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model belongs to the technical field of the electron, specifically be a novel COME module consolidates installation heat abstractor, including radiator, heat-conducting plate and CPU heat conduction piece, radiator surface equidistance is provided with the fin shape fin, and is per two sets of be formed with the heat dissipation wind channel between the fin shape fin, the heat-conducting plate passes through the fix with screw on the radiator, the CPU heat conduction piece passes through the fix with screw on the heat-conducting plate, coating heat conduction silicone grease in the middle of radiator and the heat-conducting plate, the CPU heat conduction piece is installed to the heat-conducting plate bottom, install the heat abstractor between CPU heat conduction piece and the heat-conducting plate, the inductance heat conduction piece is installed on the right side between CPU heat conduction piece and the heat-conducting plate. The utility model discloses be favorable to increasing heat abstractor on the COME module, reach good radiating effect simultaneously under the condition of a small amount of increase equipment weight and volume, be favorable to improving its suitability, be favorable to cost control simultaneously.
Description
Technical Field
The utility model relates to the field of electronic technology, specifically be a novel COME module consolidates installation heat abstractor.
Background
The development of the industrial field can not leave the participation of industrial equipment, because the equipment in the industrial field generally has larger power consumption, long working time and higher temperature, the heat dissipation problem always troubles the application of the equipment in the industrial field, especially reinforced and portable equipment, wherein the COME module requires good heat dissipation effect and has higher requirements on the weight and the volume of a heat sink, the existing heat dissipation device erected on the COME module is difficult to achieve good heat dissipation effect under the condition of slightly increasing the weight and the volume of the equipment, the weight of the heat dissipation device is often larger, so that the COME module is deformed, or the volume of the COME module is greatly increased due to larger volume, so that the heat dissipation device does not accord with the requirements of the equipment; meanwhile, the adaptability and the cost of the heat dissipation device are difficult to control, and a single heat dissipation device is difficult to be used universally when facing different COME modules.
Therefore, we provide a novel COME module and consolidate installation heat abstractor, be favorable to increasing heat abstractor on COME module, reach good radiating effect simultaneously under the condition of a small amount of increase equipment weight and volume, be favorable to improving its suitability, be favorable to cost control simultaneously.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a novel COME module reinforcing installation heat abstractor to solve the problem that the COME module requirement proposed in the background art can not only reach the heat dissipation effect, but also has higher requirements on the weight and the volume of the heat sink, and the existing heat abstractor erected on the COME module is difficult to achieve the good heat dissipation effect under the condition of slightly increasing the weight and the volume of the equipment; and the adaptability and the cost of the device are difficult to control.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel COME module consolidates installation heat abstractor, includes radiator, heat-conducting plate and CPU heat conduction piece, radiator surface equidistance is provided with fin shape fin, and is per two sets of be formed with the heat dissipation wind channel between the fin shape fin, the heat-conducting plate passes through the fix with screw on the radiator, the CPU heat conduction piece passes through the fix with screw on the heat-conducting plate, coating heat conduction silicone grease in the middle of radiator and the heat-conducting plate, the CPU heat conduction piece is installed to the heat-conducting plate bottom, install the radiator between CPU heat conduction piece and the heat-conducting plate, the inductance heat conduction piece is installed on the right side between CPU heat conduction piece and the heat-conducting plate.
Preferably, a heat conducting pad is arranged between the CPU heat conducting block and the heat radiating device, and a heat conducting fixing screw hole is formed in the upper side of the top surface of the fin-shaped heat radiating fin from top to bottom.
Preferably, the heat dissipation device adopts a heat dissipation fan, and the left side of the top surface of the fin-shaped heat dissipation fin is provided with a heat dissipation fixing screw hole from top to bottom.
Preferably, the top surface of the heat conducting plate is provided with fixing screw holes for fixing the CPU heat conducting block, and fan fixing holes are formed in the four corners of the radiator close to the heat conducting fixing screw holes.
Preferably, the radiator is an integrally formed aluminum plate, the heat conducting plate is an integrally formed aluminum plate, and the CPU heat conducting block is an integrally formed copper plate.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a novel COME module consolidates installation heat abstractor, set up through radiator surface fin shape fin, can reduce the device's volume and weight when increase heat radiating area, install the CPU heat-conducting block on the heat-conducting plate, the heat-conducting plate is installed on the radiator simultaneously, the heat that produces in the equipment work loops through the CPU heat-conducting block, the heat-conducting plate, the radiator gives off in the air, the radiating wind channel on cooperation radiator surface effectively accelerates thermal giving off, mode through increasing heat radiating area, the radiating purpose of equipment has been realized, COME module equipment heat is when big, installation heat radiation equipment between CPU heat-conducting block and heat-conducting plate, and install the fan additional at the radiator top, when more changing equipment, only need according to the structural feature of the heat dissipation device of equipment, it can to change heat-conducting plate or CPU heat-conducting block, the used repeatedly of radiator has been reached, and heat abstractor easy dismounting, be convenient for later maintenance and management, be favorable to increase heat abstractor on the COME module, good radiating effect is reached in the condition of a small amount of increasing equipment weight and volume simultaneously, be favorable to improving its adaptability, and be favorable to cost control simultaneously.
Drawings
Fig. 1 is a schematic view of the overall structure of the cooling device reinforced and installed by the COME module of the present invention;
FIG. 2 is a schematic diagram of the overall structure of the COME module reinforced heat dissipation device of the present invention;
fig. 3 is the schematic view of the heat-conducting plate structure of the cooling device for reinforcing and installing the COME module of the present invention.
In the figure: 1. a heat sink; 2. a heat conducting plate; 3. a CPU heat conducting block; 4. a heat sink device; 5. an inductive heat-conducting block; 11. a fin-shaped heat sink; 12. a heat dissipation air duct; 13. a heat conducting fixing screw hole; 14. a heat-dissipating fixing screw hole; 15. a fan mounting hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
The embodiment is as follows:
referring to fig. 1-3, the present invention provides a technical solution: a novel COME module reinforcing, mounting and radiating device comprises a radiator 1, a heat conducting plate 2 and a CPU heat conducting block 3, wherein fin-shaped radiating fins 11 are arranged on the surface of the radiator 1 at equal intervals, a radiating air duct 12 is formed between every two groups of fin-shaped radiating fins 11, the heat conducting plate 2 is fixed on the radiator 1 through screws, the CPU heat conducting block 3 is fixed on the heat conducting plate 2 through screws, heat conducting silicone grease is coated between the radiator 1 and the heat conducting plate 2, the CPU heat conducting block 3 is mounted at the bottom of the heat conducting plate 2, radiating equipment 4 is mounted between the CPU heat conducting block 3 and the heat conducting plate 2, and an inductance heat conducting block 5 is mounted on the right side between the CPU heat conducting block 3 and the heat conducting plate 2;
through the arrangement of the fin-shaped radiating fins 11 on the surface of the radiator 1, the volume and the weight of the device can be reduced while the radiating area is increased, the CPU heat-conducting block 3 is arranged on the heat-conducting plate 2, meanwhile, the heat-conducting plate 2 is arranged on the radiator 1, heat generated in the working of the equipment is sequentially radiated into the air through the CPU heat-conducting block 3, the heat-conducting plate 2 and the radiator 1, the radiation of the heat is effectively accelerated by matching with a radiating air duct 12 on the surface of the radiator 1, the radiating purpose of the equipment is realized by increasing the radiating area, when the heat of the COME module equipment is large, a radiating device 4 is arranged between the CPU heat-conducting block 3 and the heat-conducting plate 2, and a fan is additionally arranged at the top of the radiator 1, when the equipment is replaced, only the heat-conducting plate 2 or the CPU heat-conducting block 3 needs to be replaced according to the structural characteristics of the radiator 1 of the equipment, the repeated use of the radiator 1 is achieved, and the radiator is convenient to disassemble and is convenient to later maintenance and management;
heat-conducting plate 2 assembles together through set screw and radiator 1, for abundant contact, middle coating heat dissipation silicone grease, CPU heat conduction piece 3 passes through set screw to be fixed on heat-conducting plate 2, CPU heat conduction piece 3 and inductance heat conduction piece 5 pass through set screw to be fixed on heat-conducting plate 2, radiator 1's surface sets up fan mounting hole 15, the heat when equipment is bigger, when the supplementary fan heat dissipation of needs, can be through 1 surface fan mounting hole 15 installation fan of radiator, the fan rotates the back and spreads out the heat through radiating air duct 12, further promote the radiating effect.
The heat conducting plate 2 is provided with screw fixing holes, the CPU heat conducting block 3 and the inductance heat conducting block 5 are fixed on the heat conducting plate 2 through screws, when the structure of the equipment is changed, only the CPU heat conducting block 3, the inductance heat conducting block 5 and the heat conducting plate 2 are changed, or only one of the CPU heat conducting block 3, the inductance heat conducting block 5 and the heat conducting plate 2 is changed, or the heat conducting block or the heat conducting plate 2 is not installed according to the actual structure.
A heat-conducting rubber pad is arranged between the CPU heat-conducting block 3 and the equipment, and the radiator 1, the heat-conducting plate 2 and the heat-radiating equipment 4 are arranged together through the fixing screw holes, so that the assembly is tight, the matching effect is good, and the heat-radiating effect is improved.
Wherein, a heat conducting pad is arranged between the CPU heat conducting block 3 and the heat radiating equipment 4, and a heat conducting fixing screw hole 13 is arranged on the upper side of the top surface of the fin-shaped heat radiating fin 11 from top to bottom;
the heat conducting pad is arranged between the CPU heat conducting block 3 and the heat radiating device 4, so that heat transfer is faster, the upper side of the top surface of the fin-shaped radiating fin 11 is provided with a heat conducting fixing screw hole 13 from top to bottom, and the radiator 1, the CPU heat conducting block 3 and the heat conducting plate 2 are sequentially connected through the heat conducting fixing screw hole 13.
The heat dissipation device 4 adopts a heat dissipation fan, and the left side of the top surface of the fin-shaped heat dissipation fin 11 is provided with a heat dissipation fixing screw hole 14 from top to bottom;
the heat sink 1 and the heat dissipating device 4 are fixedly connected to each other through the heat dissipating fixing screw holes 14.
Fixing screw holes for fixing the CPU heat conducting block 3 are formed in the top surface of the heat conducting plate 2, and fan fixing holes are formed in the four corners of the radiator 1 close to the heat conducting fixing screw holes 13;
the top surface of the heat conducting plate 2 is provided with a fixed screw hole for fixing the CPU heat conducting block 3, the heat conducting plate 2 is connected with the CPU heat conducting block 3 through the fixed screw hole, the surface of the radiator 1 is provided with a fan mounting hole 15, and when the heat of the equipment is large and the fan needs to be assisted to dissipate heat, the fan can be mounted through the fan mounting hole 15 on the surface of the radiator 1.
The radiator 1 is an integrally formed aluminum plate, the heat conducting plate 2 is an integrally formed aluminum plate, and the CPU heat conducting block 3 is an integrally formed red copper plate;
the radiator 1 is an integrally formed aluminum plate, the heat conducting plate 2 is an integrally formed aluminum plate, and the CPU heat conducting block 3 is an integrally formed red copper plate made of light materials.
The working principle is as follows: erect the device on the COME module, CPU heat conduction piece 3 and inductance heat conduction piece 5 pass through set screw to be fixed on heat-conducting plate 2, the heat that the COME module produced loops through CPU heat conduction piece 3, heat-conducting plate 2, radiator 1 gives off in the air, the radiating wind channel 12 on 1 surface of cooperation radiator effectively accelerates thermal giving off, through the mode that increases heat radiating area, the radiating purpose of equipment has been realized, COME module equipment heat is big, install heat abstractor 4 between CPU heat conduction piece 3 and heat-conducting plate 2, and install the fan additional at radiator 1 top, when changing equipment, only need according to the structural feature of 1 radiator of equipment, it can to change heat-conducting plate 2 or CPU heat conduction piece 3.
Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a novel COME module consolidates installation heat abstractor, includes radiator (1), heat-conducting plate (2) and CPU heat conduction piece (3), its characterized in that: radiator (1) surface equidistance is provided with fin shape fin (11), and every two sets of be formed with heat dissipation wind channel (12) between fin shape fin (11), heat-conducting plate (2) are fixed on radiator (1) through the screw, CPU heat-conducting block (3) are fixed on heat-conducting plate (2) through the screw, heat conduction silicone grease of coating in the middle of radiator (1) and heat-conducting plate (2), CPU heat-conducting block (3) are installed to heat-conducting plate (2) bottom, heat-radiating equipment (4) are installed in the left side between CPU heat-conducting block (3) and heat-conducting plate (2), inductance heat-conducting block (5) are installed on the right side between CPU heat-conducting block (3) and heat-conducting plate (2).
2. The novel COME module reinforced mounting heat dissipation device as claimed in claim 1, wherein: a heat conducting pad is arranged between the CPU heat conducting block (3) and the heat radiating equipment (4), and a heat conducting fixing screw hole (13) is formed in the upper side of the top surface of the fin-shaped heat radiating fin (11) from top to bottom.
3. The novel COME module reinforced mounting heat dissipation device of claim 1, wherein: the heat dissipation device (4) adopts a heat dissipation fan, and the left side of the top surface of the fin-shaped heat dissipation fin (11) is provided with a heat dissipation fixing screw hole (14) from top to bottom.
4. The novel COME module reinforced mounting heat dissipation device of claim 1, wherein: the top surface of the heat conducting plate (2) is provided with a fixing screw hole for fixing the CPU heat conducting block (3), and fan fixing holes are formed in the positions, close to the heat conducting fixing screw holes (13), of four corners of the radiator (1).
5. The novel COME module reinforced mounting heat dissipation device of claim 1, wherein: the radiator (1) is an integrally formed aluminum plate, the heat conducting plate (2) is an integrally formed aluminum plate, and the CPU heat conducting block (3) is an integrally formed copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320069885.5U CN218849472U (en) | 2023-01-10 | 2023-01-10 | Novel COME module reinforcing and installing heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320069885.5U CN218849472U (en) | 2023-01-10 | 2023-01-10 | Novel COME module reinforcing and installing heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
| CN218849472U true CN218849472U (en) | 2023-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320069885.5U Active CN218849472U (en) | 2023-01-10 | 2023-01-10 | Novel COME module reinforcing and installing heat dissipation device |
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| Country | Link |
|---|---|
| CN (1) | CN218849472U (en) |
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2023
- 2023-01-10 CN CN202320069885.5U patent/CN218849472U/en active Active
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