CN213904270U

CN213904270U - Heat radiator for sealed box

Info

Publication number: CN213904270U
Application number: CN202022834691.9U
Authority: CN
Inventors: 唐左平
Original assignee: Wuxi Haiying Cal Tec Marine Technology Co ltd
Current assignee: Wuxi Haiying Cal Tec Marine Technology Co ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-08-06
Anticipated expiration: 2030-11-30

Abstract

The utility model discloses a heat abstractor of seal box relates to seal box heat dissipation technical field, including the seal box, be provided with the source circuit board that generates heat in the seal box, the seal box is provided with the hole, be provided with radiator unit between hole and the source circuit board that generates heat, be provided with waterproof inlet fan and the fan of giving vent to anger between radiator unit and the hole, radiator unit, inlet fan and the fan of giving vent to anger set up in sealed frame, sealed frame covers in the hole, when having solved open-air work, and generally the box does not have sealing performance, and moisture and rainwater in the air etc. can get into the box, use sealed box can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the problem that hardware damaged.

Description

Heat radiator for sealed box

Technical Field

The utility model relates to a seal box heat dissipation technical field specifically is a heat abstractor of seal box body.

Background

The CPU heat dissipation problem can all be considered to the box of conventional area computer mainboard, such as domestic desktop computer passes through the radiating block, on heat conduction to the radiating block with the CPU temperature, then blow the radiating block through the fan, with heat diffusion to peripheral air on the radiating block, then get rid of the box heat through the louvre, but if in open-air operation in the field, sealing performance just needs to be considered to the box, avoid moisture in the air and rainwater etc. to get into the box, but use sealed box can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the hardware damage.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor of sealed box to what provide in solving above-mentioned background art is when open-air work in the field, general box does not possess sealing performance, and moisture in the air and rainwater etc. get into the box, use sealed box can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the problem that hardware damaged.

In order to achieve the above object, the utility model provides a following technical scheme: the heat dissipation device of the sealed box body comprises a sealed box body, wherein a heating source circuit board is arranged in the sealed box body, a hole is formed in the sealed box body, a heat dissipation assembly is arranged between the hole and the heating source circuit board, and a waterproof air inlet fan and a waterproof air outlet fan are arranged between the heat dissipation assembly and the hole.

Preferably, the heat dissipation assembly is provided as a heat dissipation plate.

Preferably, a plurality of radiating fins are arranged on one side of the radiating plate.

Preferably, a heat conducting block is arranged at the connecting part of the heating source circuit board and the heat dissipation assembly.

Preferably, a sealing frame is arranged at a position corresponding to the hole in the sealing box, and the heat dissipation assembly, the air inlet fan and the air outlet fan are arranged in the sealing frame.

Preferably, the inner wall of the sealing frame is provided with a waterproof power supply block, and the power supply block is connected with the air inlet fan and the air outlet fan.

Preferably, the heat dissipation assembly and the heat conduction block are made of aluminum.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses, through will generate heat source circuit board setting in the seal box, solved when open-air work in the field, general box does not have sealing performance, and moisture and rainwater in the air etc. get into the box, and then make the problem that hardware damaged.

The utility model discloses, be provided with the hole through the seal box, be provided with radiator unit between hole and the source circuit board that generates heat, be provided with waterproof inlet fan and the fan of giving vent to anger between radiator unit and the hole, solved and used sealed box can lead to the unable discharge of CPU temperature rising back heat of mainboard, and then made the problem that hardware damaged.

Drawings

FIG. 1 is a sectional view of the sealing box of the present invention;

FIG. 2 is a cross-sectional view of the sealing box according to the present invention;

FIG. 3 is a front view of the heat dissipation device of the present invention;

FIG. 4 is a right side view of the heat dissipating device of the present invention;

FIG. 5 is a top view of the heat dissipation device of the present invention

Fig. 6 is a front view of the heat dissipating assembly of the present invention;

fig. 7 is a right side view of the heat dissipation assembly of the present invention.

In the figure: 1. an air intake fan; 2. an air outlet fan; 3. a power supply block; 4. a heat dissipating component; 5. a sealing frame; 6. a heat source circuit board; 7. a heat conducting block; 8. a sealing box; 81. and (4) holes.

Detailed Description

In order to solve when open-air work in the field, general box does not have sealing performance, and the humidity in the air and rainwater etc. can get into the box, use sealed box can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the problem that hardware damaged, the embodiment of the utility model provides a heat abstractor of sealed box. The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-5, the present embodiment provides a heat dissipation device for a sealed box, which includes a sealed box 8, a heat source circuit board 6 is disposed in the sealed box 8, the sealed frame 8 is made of polyoxymethylene, and moisture and rain in the air can not enter the box when the sealed box 8 is used for outdoor work.

Seal box 8 is provided with hole 81, is provided with radiator unit 4 between hole 81 and the source circuit board 6 that generates heat, radiator unit 4 sets up to the heating panel, is provided with seal frame 5 with the corresponding position of hole 81 in the seal box 8, radiator unit 4, inlet fan 1 and air outlet fan 2 set up in seal frame 5, inlet fan 1 and air outlet fan 2 are waterproof fan, radiator unit 4 passes through screw sealing connection with seal frame 5, the 5 inner walls of seal frame are provided with waterproof power supply block 3, inlet fan 1 and air outlet fan 2 are connected to power supply block 3, seal frame 5 covers in hole 81.

The connection part of the heating source circuit board 6 and the heat dissipation assembly 4 is provided with a heat conduction block 7, the heat conduction block 7 is arranged on a CPU of the heating source circuit board 6, and in the use process of the heating source circuit board 6, the temperature of the CPU of the heating source circuit board 6 can be gradually increased, and the heat conduction block 7 guides the temperature to the heat dissipation assembly 4.

Seal frame 5, radiator unit 4,

inlet fan

1 and 2 combinations of outlet fan are heat abstractor, pass through the screw with radiator unit and settle in seal box 8, provide the power to inlet fan 1 and outlet fan 2 through power supply piece 3, power supply piece 3 is waterproof construction, inlet fan 1 aligns hole 81 with outlet fan 2, take out radiator unit 4's temperature from hole 81 through outlet fan 2, take cold wind to radiator unit 4's heating panel through inlet fan 1 from hole 81, will reach and cool off radiator unit 4, and then through heat conduction piece 7 cooling CPU.

Example 2

Referring to fig. 1-7, a further improvement is made on the basis of embodiment 1:

one side of heating panel is provided with a plurality of fin, and the setting of fin can be better derive the heat by 2 discharges of fan of giving vent to anger, and then has solved and can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the problem that hardware damaged using sealed box.

Example 3

Referring to fig. 2-7, a further improvement is made on the basis of embodiment 1:

the heat dissipation assembly 4 and the heat conduction block 7 are made of aluminum, and the aluminum has the advantages of fast heat dissipation, good heat conductivity, high plasticity, low price, low density, light weight and no pollution.

Of course, the material of the heat sink 4 and the heat conducting block 7 is not limited to aluminum, as long as the heat dissipation is fast and the heat conductivity is good, for example, copper.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat abstractor of seal box, includes seal box (8), be provided with in seal box (8) and generate heat source circuit board (6), its characterized in that: hole (81) have been seted up in seal box (8), be provided with radiator unit (4) between hole (81) and the source circuit board that generates heat (6), be provided with inlet fan (1) and air outlet fan (2) between radiator unit (4) and hole (81).

2. The heat dissipating device for a sealed case of claim 1, wherein: the heat dissipation assembly (4) is arranged as a heat dissipation plate.

3. The heat dissipating device for a sealed case of claim 2, wherein: the above-mentioned

One side of the heat dissipation plate is provided with a plurality of heat dissipation fins.

4. The heat dissipating device for a sealed case of claim 2, wherein: and a heat conducting block (7) is arranged at the connecting part of the heating source circuit board (6) and the heat dissipation assembly (4).

5. The heat dissipating device for a sealed case of claim 1, wherein: the sealing box (8) is internally provided with a sealing frame (5) at a position corresponding to the hole (81), and the heat dissipation assembly (4), the air inlet fan (1) and the air outlet fan (2) are arranged in the sealing frame (5).

6. The heat dissipating device for a sealed case of claim 5, wherein: the inner wall of the sealing frame (5) is provided with a power supply block (3), and the power supply block (3) is connected with the air inlet fan (1) and the air outlet fan (2).

7. The heat dissipating device for a sealed case of claim 1, wherein: the heat dissipation assembly (4) and the heat conduction block (7) are made of aluminum materials.