CN112394796A - Heat dissipation device for box body - Google Patents

Heat dissipation device for box body Download PDF

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Publication number
CN112394796A
CN112394796A CN202011381356.6A CN202011381356A CN112394796A CN 112394796 A CN112394796 A CN 112394796A CN 202011381356 A CN202011381356 A CN 202011381356A CN 112394796 A CN112394796 A CN 112394796A
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CN
China
Prior art keywords
heat
heat dissipation
hole
box
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011381356.6A
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Chinese (zh)
Inventor
唐左平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Haiying Cal Tec Marine Technology Co ltd
Original Assignee
Wuxi Haiying Cal Tec Marine Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Haiying Cal Tec Marine Technology Co ltd filed Critical Wuxi Haiying Cal Tec Marine Technology Co ltd
Priority to CN202011381356.6A priority Critical patent/CN112394796A/en
Publication of CN112394796A publication Critical patent/CN112394796A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • G06F1/182Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat dissipation device for a box body, which relates to the technical field of heat dissipation of a sealing box and comprises the sealing box, wherein a heating source circuit board is arranged in the sealing box, a hole is formed in the sealing box, a heat dissipation assembly is arranged between the hole and the heating source circuit board, a waterproof air inlet fan and a waterproof air outlet fan are arranged between the heat dissipation assembly and the hole, the heat dissipation assembly, the air inlet fan and the air outlet fan are arranged in a sealing frame, and the sealing frame covers the hole.

Description

Heat dissipation device for box body
Technical Field
The invention relates to the technical field of heat dissipation of seal boxes, in particular to a heat dissipation device for a box body.
Background
The CPU heat dissipation problem can all be considered to the box of conventional area computer mainboard, such as domestic desktop computer passes through the radiating block, on heat conduction to the radiating block with the CPU temperature, then blow the radiating block through the fan, with heat diffusion to peripheral air on the radiating block, then get rid of the box heat through the louvre, but if in open-air operation in the field, sealing performance just needs to be considered to the box, avoid moisture in the air and rainwater etc. to get into the box, but use sealed box can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the hardware damage.
Disclosure of Invention
The invention aims to provide a heat dissipation device for a box body, which aims to solve the problems that the box body does not have sealing performance in outdoor operation in the field, and the heat cannot be discharged after the temperature of a CPU (central processing unit) of a mainboard is increased due to the fact that moisture, rainwater and the like in the air enter the box body and the sealed box body is used, so that hardware is damaged.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a heat abstractor for box, includes the seal box, be provided with the source circuit board that generates heat in the seal box, the seal box is provided with the hole, be provided with radiator unit between hole and the source circuit board that generates heat, be provided with waterproof inlet fan and the fan of giving vent to anger between radiator unit and the hole.
Preferably, the heat dissipation assembly is provided as a heat dissipation plate.
Preferably, a plurality of radiating fins are arranged on one side of the radiating plate.
Preferably, a heat conducting block is arranged at the connecting part of the heating source circuit board and the heat dissipation assembly.
Preferably, a sealing frame is arranged at a position corresponding to the hole in the sealing box, and the heat dissipation assembly, the air inlet fan and the air outlet fan are arranged in the sealing frame.
Preferably, the inner wall of the sealing frame is provided with a waterproof power supply block, and the power supply block is connected with the air inlet fan and the air outlet fan.
Preferably, the heat dissipation assembly and the heat conduction block are made of aluminum.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the heating source circuit board is arranged in the sealing box, so that the problem that the general box body does not have sealing performance, and moisture, rainwater and the like in the air enter the box body to further damage hardware in outdoor operation is solved.
According to the invention, the sealed box is provided with the hole, the heat dissipation assembly is arranged between the hole and the heating source circuit board, and the waterproof air inlet fan and the waterproof air outlet fan are arranged between the heat dissipation assembly and the hole, so that the problem that the heat cannot be discharged after the temperature of the CPU of the mainboard is raised by using the sealed box body, and further hardware is damaged is solved.
Drawings
FIG. 1 is a cross-sectional view of a seal box of the present invention;
FIG. 2 is an elevation cross-sectional view of the seal box of the present invention;
FIG. 3 is a front view of the heat dissipation device of the present invention;
FIG. 4 is a right side view of the heat dissipation device of the present invention;
FIG. 5 is a top view of the heat dissipation device of the present invention
FIG. 6 is a front view of the heat sink assembly of the present invention;
fig. 7 is a right side view of the heat sink assembly of the present invention.
In the figure: 1. an air intake fan; 2. an air outlet fan; 3. a power supply block; 4. a heat dissipating component; 5. a sealing frame; 6. a heat source circuit board; 7. a heat conducting block; 8. a sealing box; 81. and (4) holes.
Detailed Description
In order to solve the problem that when the box body is used for outdoor operation in the field, the box body does not have sealing performance, moisture, rainwater and the like in the air can enter the box body, and the heat cannot be discharged after the temperature of a CPU (central processing unit) of a mainboard is increased by using the sealed box body, so that hardware is damaged, the embodiment of the invention provides the heat dissipation device for the box body. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-5, the present embodiment provides a heat dissipation apparatus for a box, which includes a sealing box 8, a heat source circuit board 6 is disposed in the sealing box 8, the sealing frame 8 is made of polyoxymethylene, and moisture and rain in the air can not enter the box when the sealing box 8 is used for outdoor work.
Seal box 8 is provided with hole 81, is provided with radiator unit 4 between hole 81 and the source circuit board 6 that generates heat, radiator unit 4 sets up to the heating panel, is provided with seal frame 5 with the corresponding position of hole 81 in the seal box 8, radiator unit 4, inlet fan 1 and air outlet fan 2 set up in seal frame 5, inlet fan 1 and air outlet fan 2 are waterproof fan, radiator unit 4 passes through screw sealing connection with seal frame 5, the 5 inner walls of seal frame are provided with waterproof power supply block 3, inlet fan 1 and air outlet fan 2 are connected to power supply block 3, seal frame 5 covers in hole 81.
The connection part of the heating source circuit board 6 and the heat dissipation assembly 4 is provided with a heat conduction block 7, the heat conduction block 7 is arranged on a CPU of the heating source circuit board 6, and in the use process of the heating source circuit board 6, the temperature of the CPU of the heating source circuit board 6 can be gradually increased, and the heat conduction block 7 guides the temperature to the heat dissipation assembly 4.
Seal frame 5, radiator unit 4, inlet fan 1 and 2 combinations of outlet fan are heat abstractor, pass through the screw with radiator unit and settle in seal box 8, provide the power to inlet fan 1 and outlet fan 2 through power supply piece 3, power supply piece 3 is waterproof construction, inlet fan 1 aligns hole 81 with outlet fan 2, take out radiator unit 4's temperature from hole 81 through outlet fan 2, take cold wind to radiator unit 4's heating panel through inlet fan 1 from hole 81, will reach and cool off radiator unit 4, and then through heat conduction piece 7 cooling CPU.
Example 2
Referring to fig. 1-7, a further improvement is made on the basis of embodiment 1:
one side of heating panel is provided with a plurality of fin, and the setting of fin can be better derive the heat by 2 discharges of fan of giving vent to anger, and then has solved and can lead to the unable discharge of heat behind the CPU temperature rising of mainboard, and then make the problem that hardware damaged using sealed box.
Example 3
Referring to fig. 2-7, a further improvement is made on the basis of embodiment 1:
the heat dissipation assembly 4 and the heat conduction block 7 are made of aluminum, and the aluminum has the advantages of fast heat dissipation, good heat conductivity, high plasticity, low price, low density, light weight and no pollution.
Of course, the material of the heat sink 4 and the heat conducting block 7 is not limited to aluminum, as long as the heat dissipation is fast and the heat conductivity is good, for example, copper.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a heat abstractor for box, includes seal box (8), be provided with in seal box (8) and generate heat source circuit board (6), its characterized in that: hole (81) have been seted up in seal box (8), be provided with radiator unit (4) between hole (81) and the source circuit board that generates heat (6), be provided with inlet fan (1) and air outlet fan (2) between radiator unit (4) and hole (81).
2. The heat dissipating device for a case according to claim 1, wherein: the heat dissipation assembly (4) is arranged as a heat dissipation plate.
3. The heat dissipating device for a case according to claim 2, wherein: the above-mentioned
One side of the heat dissipation plate is provided with a plurality of heat dissipation fins.
4. The heat dissipating device for a case according to claim 2, wherein: and a heat conducting block (7) is arranged at the connecting part of the heating source circuit board (6) and the heat dissipation assembly (4).
5. The heat dissipating device for a case according to claim 1, wherein: the sealing box (8) is internally provided with a sealing frame (5) at a position corresponding to the hole (81), and the heat dissipation assembly (4), the air inlet fan (1) and the air outlet fan (2) are arranged in the sealing frame (5).
6. The heat dissipating device for a case according to claim 3, wherein: the inner wall of the sealing frame (5) is provided with a power supply block (3), and the power supply block (3) is connected with the air inlet fan (1) and the air outlet fan (2).
7. The heat dissipating device for a case according to claim 1, wherein: the heat dissipation assembly (4) and the heat conduction block (7) are made of aluminum materials.
CN202011381356.6A 2020-11-30 2020-11-30 Heat dissipation device for box body Pending CN112394796A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011381356.6A CN112394796A (en) 2020-11-30 2020-11-30 Heat dissipation device for box body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011381356.6A CN112394796A (en) 2020-11-30 2020-11-30 Heat dissipation device for box body

Publications (1)

Publication Number Publication Date
CN112394796A true CN112394796A (en) 2021-02-23

Family

ID=74604882

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011381356.6A Pending CN112394796A (en) 2020-11-30 2020-11-30 Heat dissipation device for box body

Country Status (1)

Country Link
CN (1) CN112394796A (en)

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