CN218244195U - IGBT module structure with high-efficient heat dissipation function - Google Patents

IGBT module structure with high-efficient heat dissipation function Download PDF

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Publication number
CN218244195U
CN218244195U CN202221848514.9U CN202221848514U CN218244195U CN 218244195 U CN218244195 U CN 218244195U CN 202221848514 U CN202221848514 U CN 202221848514U CN 218244195 U CN218244195 U CN 218244195U
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Prior art keywords
heat dissipation
igbt module
heat
sliding block
dissipation function
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CN202221848514.9U
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Chinese (zh)
Inventor
杨种南
蔡万顺
蔡文诚
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Heritage Electronic Technology Jiangsu Co ltd
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Heritage Electronic Technology Jiangsu Co ltd
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Abstract

The utility model discloses a IGBT modular structure with high-efficient heat dissipation function, including heat dissipation shell, U-shaped handle and louvre, heat dissipation shell internally mounted has the IGBT module, IGBT module both sides are provided with radiator fan and No. two radiator fan respectively, the heat-conducting plate is installed to IGBT module top, be provided with the heating panel directly over the heat-conducting plate, first sliding block of heating panel side fixedly connected with and second sliding block, first sliding block and second sliding block are installed inside the spout, the louvre is seted up in the heat dissipation shell top. The utility model discloses a radiator fan, no. two radiator fan, heating panel, heat-conducting plate and louvre of design have constituted efficient heat dissipation mechanism, are convenient for carry out quick evacuation to the heat that the IGBT module produced, and then have ensured that the IGBT module can long-time operation and not receive the damage, have improved the life of IGBT module.

Description

IGBT module structure with high-efficient heat dissipation function
Technical Field
The utility model relates to a IGBT technical field, concretely relates to IGBT modular structure with high-efficient heat dissipation function.
Background
The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices composed of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), and have the advantages of both high input impedance of MOSFETs and low conduction voltage drop of GTRs.
Existing, for example, publication No. CN102097418A discloses an IGBT drive unit in 2011, 6 months and 15 days, only the IGBT module and the drive circuit board that arrange the IGBT drive unit perpendicularly have reduced IGBT drive unit's area occupation, can make the internal structure of box or cabinet compacter, be favorable to the electrical performance optimization, but do not solve the IGBT module and can produce a large amount of heats in the operation process, can't dispel the heat to the heat that produces fast, can cause great damage to the IGBT module, and then reduce the life of IGBT module.
Therefore, it is necessary to provide an IGBT module structure with a high heat dissipation efficiency to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a IGBT modular structure with high-efficient heat dissipation function to the heat that the IGBT module produced in long-time operation process can't accomplish quick heat dissipation and then lead to the problem that the IGBT module takes place to damage easily in solving the technique.
In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a IGBT modular structure with high-efficient heat dissipation function, includes radiator shell, fixed screw, installing port, no. two installing ports, mounting bracket, U-shaped handle and louvres, radiator shell internally mounted has the IGBT module, IGBT module both sides are provided with radiator fan and No. two radiator fan respectively, the heat-conducting plate is installed to IGBT module top, be provided with the heating panel directly over the heat-conducting plate, the first sliding block of heating panel side fixedly connected with and second sliding block, first sliding block and second sliding block are installed inside the spout, the louvre is seted up at the radiator shell top, the quantity of louvre sets up to a plurality of.
Preferably: the side face of the heat dissipation shell is provided with a first square door and a second square door, the second square door is installed on the outer side of the first square door, the side face of the first square door is fixedly connected with a door handle, and the door handle is arranged in a U shape.
Preferably: the side of IGBT module bottom is provided with the installation piece, the structure that the set screw runs through has the installation piece.
Preferably, the following components: a mounting hole is opened in the heat dissipation shell side, a radiator fan is installed to a mounting hole internally mounted.
Preferably: no. two installing ports are opened on the side face of the heat dissipation shell, and No. two heat dissipation fans are arranged inside the No. two installing ports.
Preferably: the spout is installed on the heat dissipation shell inner wall, the quantity of spout is established to two.
Preferably: the mounting bracket top is connected with the heating panel, the heat-conducting plate is installed to the department of buckling of mounting bracket.
Preferably: one end of the U-shaped handle is connected with a heat dissipation plate, and one end of the U-shaped handle is connected with a heat conduction plate.
In the technical scheme, the utility model provides a technological effect and advantage:
through the designed first cooling fan, the second cooling fan, the cooling plate, the heat conducting plate and the cooling holes, a high-efficiency cooling mechanism is formed, heat generated by the IGBT module can be rapidly dissipated, the IGBT module can be ensured to run for a long time without being damaged, and the service life of the IGBT module is prolonged;
through spout, first sliding block, second sliding block and the U-shaped handle of design, be convenient for carry out quick getting with heating panel and heat-conducting plate and put for the cleanness and the change of heating panel and heat-conducting plate are convenient and swift more, very big promotion the practicality of device.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic perspective view of a second cooling fan of the present invention;
FIG. 3 is a schematic perspective view of the chute according to the present invention;
fig. 4 is a schematic perspective view of the heat dissipating plate of the present invention.
Description of the reference numerals:
1. a heat dissipation housing; 2. a first square door; 3. a second square door; 4. a door handle; 5. an IGBT module; 6. mounting a sheet; 7. fixing screws; 8. a first mounting port; 9. a first heat dissipation fan; 10. a second mounting port; 11. a second heat dissipation fan; 12. a chute; 13. a first slider; 14. a second slider; 15. a heat dissipation plate; 16. a mounting frame; 17. a heat conducting plate; 18. a U-shaped handle; 19. and (4) heat dissipation holes.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
The utility model provides a IGBT modular structure with high-efficient heat dissipation function as shown in fig. 1-4, including radiator shell 1, set screw 7, a installing port 8, no. two installing ports 10, mounting bracket 16, U-shaped handle 18 and louvre 19, radiator shell 1 internally mounted has IGBT module 5, IGBT module 5 both sides are provided with radiator fan 9 and No. two radiator fan 11 respectively, heat-conducting plate 17 is installed to IGBT module 5 top, be provided with heating panel 15 directly over heat-conducting plate 17, the first sliding block 13 of 15 side fixedly connected with of heating panel and second sliding block 14, first sliding block 13 and second sliding block 14 are installed inside spout 12, louvre 19 is seted up in radiator shell 1 top, the quantity of louvre 19 sets up to a plurality of.
The side of the heat dissipation shell 1 is provided with a first square door 2 and a second square door 3, the second square door 3 is installed on the outer side of the first square door 2, the door handle 4 is fixedly connected to the side of the first square door 2, the appearance of the door handle 4 is set to be U-shaped, the side of the bottom of the IGBT module 5 is provided with an installation piece 6, and the installation piece 6 is arranged on a structure penetrated by a fixing screw 7.
No. 8 installing ports are arranged on the side face of the radiating shell 1, a first radiating fan 9 is arranged inside the first installing port 8, a second installing port 10 is arranged on the side face of the radiating shell 1, a second radiating fan 11 is arranged inside the second installing port 10, the sliding grooves 12 are arranged on the inner wall of the radiating shell 1, the number of the sliding grooves 12 is two, the top of the mounting frame 16 is connected with a radiating plate 15, a heat conducting plate 17 is arranged at the bending position of the mounting frame 16, one end of the U-shaped handle 18 is connected with the radiating plate 15, and one end of the U-shaped handle 18 is connected with the heat conducting plate 17.
This practical theory of operation:
referring to the attached drawings 1-4 of the specification, when the device is used, after a power supply is switched on, the IGBT module 5 can operate, the IGBT module 5 can generate heat in the operation process, the heat generated at the upper part of the IGBT module 5 is firstly absorbed by the heat conducting plate 17, then the heat is radiated by the heat radiating plate 15, and finally the heat is dissipated to the outside through the plurality of heat radiating holes 19 positioned on the upper surface of the heat radiating shell 1, meanwhile, the heat generated at the two sides of the IGBT module 5 can be dissipated to the outside environment through the first heat radiating fan 9 and the second heat radiating fan 11 at the two sides of the IGBT module 5, and the heat generated by the IGBT module 5 in the operation process can be continuously dissipated to the outside through the common cooperation of the first heat radiating fan 9, the second heat radiating fan 11, the heat radiating plate 15, the heat conducting plate 17 and the heat radiating holes 19;
referring to the attached drawings 1-4 of the specification, when the device is used, after the heat dissipation plate 15 and the heat conduction plate 17 are used for a long time, the heat dissipation plate 15 and the heat conduction plate 17 need to be cleaned and replaced, at this time, a worker firstly pulls the door handle 4, then opens the first square door 2 and the second square door 3, then pulls the U-shaped handle 18 by hand, the first sliding block 13 and the second sliding block 14 slide out along the sliding groove 12 while the U-shaped handle 18 is pulled outwards, and at this time, the heat dissipation plate 15 and the heat conduction plate 17 are further pulled out.

Claims (8)

1. The utility model provides a IGBT modular structure with high-efficient heat dissipation function, includes radiating shell (1), fixed screw (7), installing port (8), no. two installing ports (10), mounting bracket (16), U-shaped handle (18) and louvre (19), its characterized in that: radiating shell (1) internally mounted has IGBT module (5), IGBT module (5) both sides are provided with radiator fan (9) and No. two radiator fan (11) respectively, heat-conducting plate (17) are installed to IGBT module (5) top, be provided with heating panel (15) directly over heat-conducting plate (17), heating panel (15) side fixedly connected with first sliding block (13) and second sliding block (14), install inside spout (12) first sliding block (13) and second sliding block (14), radiating hole (19) are seted up at radiating shell (1) top, the quantity of radiating hole (19) sets up to a plurality of.
2. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: the heat dissipation door is characterized in that a first square door (2) and a second square door (3) are arranged on the side face of the heat dissipation shell (1), the second square door (3) is installed on the outer side of the first square door (2), a door handle (4) is fixedly connected to the side face of the first square door (2), and the door handle (4) is in a U shape.
3. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: the side of IGBT module (5) bottom is provided with installation piece (6), the structure that set screw (7) run through has installation piece (6).
4. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: a installing port (8) is arranged on the side face of the heat dissipation shell (1), and a heat dissipation fan (9) is arranged inside the installing port (8).
5. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: no. two installing port (10) set up in radiating shell (1) side, no. two radiator fan (11) are provided with in No. two installing port (10).
6. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: the sliding grooves (12) are arranged on the inner wall of the heat dissipation shell (1), and the number of the sliding grooves (12) is two.
7. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: the top of the mounting frame (16) is connected with a heat dissipation plate (15), and a heat conduction plate (17) is installed at the bent part of the mounting frame (16).
8. The IGBT module structure with high-efficiency heat dissipation function according to claim 1, characterized in that: one end of the U-shaped handle (18) is connected with a heat dissipation plate (15), and one end of the U-shaped handle (18) is connected with a heat conduction plate (17).
CN202221848514.9U 2022-07-18 2022-07-18 IGBT module structure with high-efficient heat dissipation function Active CN218244195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221848514.9U CN218244195U (en) 2022-07-18 2022-07-18 IGBT module structure with high-efficient heat dissipation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221848514.9U CN218244195U (en) 2022-07-18 2022-07-18 IGBT module structure with high-efficient heat dissipation function

Publications (1)

Publication Number Publication Date
CN218244195U true CN218244195U (en) 2023-01-06

Family

ID=84676206

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221848514.9U Active CN218244195U (en) 2022-07-18 2022-07-18 IGBT module structure with high-efficient heat dissipation function

Country Status (1)

Country Link
CN (1) CN218244195U (en)

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