CN213302976U - Computer chip water cooling plant - Google Patents
Computer chip water cooling plant Download PDFInfo
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- CN213302976U CN213302976U CN202022588294.8U CN202022588294U CN213302976U CN 213302976 U CN213302976 U CN 213302976U CN 202022588294 U CN202022588294 U CN 202022588294U CN 213302976 U CN213302976 U CN 213302976U
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- heat dissipation
- water
- chip
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- heat
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Abstract
The utility model discloses a computer chip water cooling plant, including mainboard and chip groove, the inner wall in chip groove is provided with the chip, the heating panel is installed through the fixture block to the upper surface in chip groove, the equal fixedly connected with return bend in the left and right sides of heating panel, two the looks remote site fixedly connected with heat pipe of return bend, the upper surface of mainboard installs the heat exchanger that looses through fixing bolt. This computer chip water cooling plant, through setting up the heating panel, the heat pipe, the water tank, the water-cooling heat abstractor that first water pump and second water pump are constituteed, can realize the hydrologic cycle heat dissipation, simultaneously can take away the heat that the chip produced through the circulation of coolant liquid through heat pipe and heating panel, the radiating effect of device has been improved, through using first water pump and second water pump simultaneously, the velocity of flow of coolant liquid has been accelerated, the speed of hydrologic cycle has been improved, make the further improvement of the radiating efficiency of the device, the service life of chip has been prolonged.
Description
Technical Field
The utility model relates to a computer technology field specifically is a computer chip water cooling plant.
Background
At present, with the rapid development of electronic products, computers have become indispensable articles for daily life of people, and a computer CPU chip is the most important component in computers, and is responsible for the operation and calculation of computers, and has a large workload, and is very easy to generate a large amount of heat, which can slow down the operation speed of computers, so that a heat radiator is required to cool and dissipate the computer CPU chip.
At present, the heat dissipation of the CPU chip is mostly air-cooled, the efficiency of the air-cooled heat dissipation is too low, the heat generated by the chip cannot be timely dissipated, and the dust can be sucked into the interior of the air-blown process, so that the service life of the computer chip is further influenced.
Therefore, the computer chip water cooling device is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer chip water cooling plant to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a water cooling device for computer chips comprises a main board and a chip groove, wherein the inner wall of the chip groove is provided with a chip, the upper surface of the chip groove is provided with a heat dissipation plate through a clamping block, the left side and the right side of the heat dissipation plate are both fixedly connected with bent pipes, the opposite ends of the two bent pipes are fixedly connected with heat conduction pipes, the upper surface of the main board is provided with a heat dissipation cover through a fixing bolt, the inner top wall of the heat dissipation cover is fixedly connected with a placing box, the inner bottom wall of the placing box is provided with a water tank, the left side and the right side of the placing box are respectively and fixedly connected with a first water pump and a second water pump, the output end of the first water pump is fixedly connected with a first water pipe, the first water pipe penetrates through the left sides of the placing box and the water tank and extends to the inside of the water tank, the input end fixedly connected with second water pipe of second water pump, first water pipe runs through the right side of placing box and water tank and extends to the inside of water tank.
Preferably, the inner top wall of the heat dissipation cover is fixedly connected with a first cold row and a second cold row respectively, the output end of the first cold row is fixedly connected with the input end of the first water pump through a water pipe, and the input end of the second cold row is fixedly connected with the output end of the second water pump through a water pipe.
Preferably, the input end of the first cold row and the output end of the second cold row are both fixedly connected with the bent pipe through water pipes.
Preferably, the heat conduction pipe is arranged inside the heat dissipation plate, the shape of the heat conduction pipe is S-shaped, and a heat conduction silica gel layer is arranged between the lower surface of the heat dissipation plate and the chip.
Preferably, the left side and the right side of the heat dissipation cover are both provided with heat dissipation holes, the inner walls of the heat dissipation holes are provided with dust screens, and the left side and the right side of the heat dissipation cover corresponding to the positions of the heat dissipation holes are both fixedly connected with heat dissipation fans.
Preferably, the upper surface of the heat dissipation cover is provided with a through hole corresponding to the position of the placing box, a top cover is arranged at the position of the upper surface of the heat dissipation cover corresponding to the through hole, and the upper surface of the water tank is provided with a liquid feeding pipe.
Advantageous effects
The utility model provides a computer chip water cooling plant possesses following beneficial effect:
1. this computer chip water cooling plant, through setting up the heating panel, the heat pipe, the water tank, the water-cooling heat abstractor that first water pump and second water pump are constituteed, can realize the hydrologic cycle heat dissipation, simultaneously can take away the heat that the chip produced through the circulation of coolant liquid through heat pipe and heating panel, the radiating effect of device has been improved, through using first water pump and second water pump simultaneously, the velocity of flow of coolant liquid has been accelerated, the speed of hydrologic cycle has been improved, make the further improvement of the radiating efficiency of the device, the service life of chip has been prolonged.
2. This computer chip water cooling plant is linked together with water tank and heat pipe through setting up first cold row and the cold row of second, can cool down the cooling liquid that has heat in the heat pipe, through setting up radiator fan and dust screen, realizes that forced air cooling and water-cooling combine together, prevents that the dust from entering into the inside influence chip of heat exchanger and using, through the liquid feeding pipe that sets up top cap and water tank, conveniently carries out the replenishment of coolant liquid and changes.
Drawings
FIG. 1 is a schematic view of a front cross-sectional structure of the present invention;
FIG. 2 is a schematic view of a heat dissipation plate of the present invention;
fig. 3 is a schematic diagram of a first cold row side view structure of the present invention.
In the figure: 1 chip groove, 2 heating panels, 3 return bends, 4 heat pipes, 5 heat dissipation covers, 6 water tanks, 7 first water pumps, 8 second water pumps, 9 first water pipes, 10 second water pipes, 11 first cold rows, 12 second cold rows, 13 dust screens, 14 cooling fans, 15 top covers.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a computer chip water cooling plant, includes mainboard and chip groove 1, the inner wall in chip groove 1 is provided with the chip, heating panel 2 is installed through the fixture block to the upper surface in chip groove 1, the equal fixedly connected with return bend 3 in the left and right sides of heating panel 2, the opposite end fixedly connected with heat pipe 4 of two return bends 3, heat pipe 4 sets up the inside at heating panel 2, heat pipe 4 shape is the S-shaped, be provided with heat conduction silica gel layer between the lower surface of heating panel 2 and the chip.
The upper surface of mainboard installs heat exchanger 5 through fixing bolt, and the louvre has all been seted up to the left and right sides of heat exchanger 5, and the inner wall of louvre is provided with dust screen 13, and the equal fixedly connected with radiator fan 14 in the left and right sides that heat exchanger 5 and louvre position are corresponding, through setting up radiator fan 14 and dust screen 13, realizes that forced air cooling and water-cooling combine together, prevents that the dust from entering into the inside influence chip of heat exchanger 5 and using.
The box is placed to the interior roof fixedly connected with of heat exchanger 5, the interior diapire of placing the box is provided with water tank 6, the left and right sides of placing the box is fixedly connected with first water pump 7 and second water pump 8 respectively, the output end fixedly connected with of first water pump 7 is first water pipe 9, first water pipe 9 runs through the left side of placing box and water tank 6 and extends to the inside of water tank 6, the input fixedly connected with second water pipe 10 of second water pump 8, first water pipe 9 runs through the right side of placing box and water tank 6 and extends to the inside of water tank 6.
Through setting up heating panel 2, heat pipe 4, water tank 6, the water-cooling heat abstractor that first water pump 7 and second water pump 8 are constituteed, can realize the hydrologic cycle heat dissipation, simultaneously can take away the heat that the chip produced through the circulation of coolant liquid through heat pipe 4 and heating panel 2, the radiating effect of device has been improved, through using first water pump 7 and second water pump 8 simultaneously, the velocity of flow of coolant liquid has been accelerated, the speed of hydrologic cycle has been improved, make the further improvement of the device's radiating efficiency, the service life of chip has been prolonged.
The first cold row 11 of interior roof difference fixedly connected with and the cold row 12 of second of heat exchanger 5, the output of first cold row 11 leads to pipe fixed connection with the input of first water pump 7, the input of the cold row 12 of second leads to pipe fixed connection with the output of second water pump 8, the input of first cold row 11 and the output of the cold row 12 of second all lead to pipe and 3 fixed connection of return bend, be linked together with water tank 6 and heat pipe 4 through setting up the leading to pipe of first cold row 11 and the cold row 12 of second, can cool down the cooling with the thermal coolant liquid in the heat pipe 4.
The upper surface of the heat dissipation cover 5 is provided with a through hole corresponding to the position of the placing box, a top cover 15 is arranged at the position, corresponding to the through hole, of the upper surface of the heat dissipation cover 5, a liquid feeding pipe is arranged on the upper surface of the water tank 6, and the liquid feeding pipe provided with the top cover 15 and the water tank 6 facilitates the supplement and replacement of cooling liquid.
The working principle is as follows: when the device is used, firstly, the heat dissipation cover 5 is installed on a mainboard by using bolts, the heat dissipation plate 2 is clamped with the chip groove 1, so that the heat dissipation plate 2 is contacted with the chip, then a computer power supply is started, the chip of the computer starts to generate heat, the heat is transferred to the inside of the heat dissipation plate 2, the first water pump 7 and the second water pump 8 circularly exchange cooling liquid in the water tank 6 and the heat conduction pipe 4 by the power supply of the computer power supply, so that the heat in the heat dissipation plate 2 is continuously taken away by the heat conduction pipe 4, meanwhile, the cooling effect of water circulation is further enhanced by the cooling effect of the first cold row 11 and the second cold row 12, the heat dissipation fan 14 can discharge the heat in the heat dissipation cover 5 to the outside, the combination of air cooling and water cooling is realized, the dust can be prevented from entering the heat dissipation cover 5 by the dust screen 13, when the cooling liquid in the water tank 6 needs to be supplemented, the top cover 15 can be opened to supplement through the liquid feeding pipe, the operation is convenient, and the practicability is high.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a computer chip water cooling plant, includes mainboard and chip groove (1), its characterized in that: the inner wall of the chip groove (1) is provided with a chip, the upper surface of the chip groove (1) is provided with a heat dissipation plate (2) through a clamping block, the left side and the right side of the heat dissipation plate (2) are fixedly connected with bent pipes (3) and two heat conduction pipes (4) respectively, the upper surface of the mainboard is provided with a heat dissipation cover (5) through fixing bolts, the inner top wall of the heat dissipation cover (5) is fixedly connected with a placement box, the inner bottom wall of the placement box is provided with a water tank (6), the left side and the right side of the placement box are respectively fixedly connected with a first water pump (7) and a second water pump (8), the output end of the first water pump (7) is fixedly connected with a first water pipe (9), the first water pipe (9) penetrates through the left side of the placement box and the water tank (6) and extends to the inside of the water tank (6), the input end of the second water pump (8) is fixedly connected with, the first water pipe (9) penetrates through the right sides of the placing box and the water tank (6) and extends to the inside of the water tank (6).
2. The computer chip water cooling device according to claim 1, characterized in that: the heat dissipation cover is characterized in that the inner top wall of the heat dissipation cover (5) is fixedly connected with a first cold row (11) and a second cold row (12) respectively, the output end of the first cold row (11) is fixedly connected with the input end of the first water pump (7) through a water pipe, and the input end of the second cold row (12) is fixedly connected with the output end of the second water pump (8) through a water pipe.
3. The computer chip water cooling device according to claim 2, characterized in that: the input end of the first cold row (11) and the output end of the second cold row (12) are fixedly connected with the bent pipe (3) through water pipes.
4. The computer chip water cooling device according to claim 1, characterized in that: the heat conduction pipe (4) is arranged inside the heat dissipation plate (2), the heat conduction pipe (4) is S-shaped, and a heat conduction silica gel layer is arranged between the lower surface of the heat dissipation plate (2) and the chip.
5. The computer chip water cooling device according to claim 1, characterized in that: the heat dissipation cover is characterized in that heat dissipation holes are formed in the left side and the right side of the heat dissipation cover (5), dust screens (13) are arranged on the inner walls of the heat dissipation holes, and heat dissipation fans (14) are fixedly connected to the left side and the right side of the heat dissipation cover (5) corresponding to the positions of the heat dissipation holes.
6. The computer chip water cooling device according to claim 1, characterized in that: the upper surface of the heat dissipation cover (5) is provided with a through hole corresponding to the position of the placement box, a top cover (15) is arranged at the position, corresponding to the through hole, of the upper surface of the heat dissipation cover (5), and a liquid feeding pipe is arranged on the upper surface of the water tank (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022588294.8U CN213302976U (en) | 2020-11-11 | 2020-11-11 | Computer chip water cooling plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022588294.8U CN213302976U (en) | 2020-11-11 | 2020-11-11 | Computer chip water cooling plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213302976U true CN213302976U (en) | 2021-05-28 |
Family
ID=76016063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022588294.8U Expired - Fee Related CN213302976U (en) | 2020-11-11 | 2020-11-11 | Computer chip water cooling plant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213302976U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113629544A (en) * | 2021-06-21 | 2021-11-09 | 国网河北省电力有限公司临城县供电分公司 | Heat dissipation device for power equipment |
-
2020
- 2020-11-11 CN CN202022588294.8U patent/CN213302976U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113629544A (en) * | 2021-06-21 | 2021-11-09 | 国网河北省电力有限公司临城县供电分公司 | Heat dissipation device for power equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210528 Termination date: 20211111 |