CN212341816U

CN212341816U - Computer modularization radiator unit

Info

Publication number: CN212341816U
Application number: CN202021612340.7U
Authority: CN
Inventors: 梁婷婷
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-06
Filing date: 2020-08-06
Publication date: 2021-01-12
Anticipated expiration: 2030-08-06

Abstract

The utility model discloses a computer modularization heat dissipation assembly, including the computer machine case, the inside of computer machine case is provided with the heat transfer board, one side fixed mounting outside the computer machine case has the heat dissipation case, the inside of heat transfer board is provided with circulation heat transfer return bend, the inside of heat dissipation case is installed water tank and circulation heat dissipation return bend, the one end and the water tank intercommunication of circulation heat dissipation return bend, the delivery port of water tank is connected with the water supply pipe, the one end and the intake end of circulation heat transfer return bend of water supply pipe are connected, install miniature hydraulic pump and solenoid valve on the water supply pipe, the water outlet end and the intake end of circulation heat dissipation return bend of circulation heat transfer return bend are connected; the utility model discloses a water-cooling heat dissipation, because the specific heat capacity of water is big, consequently can absorb a large amount of heats and keep the temperature not to have obvious change, therefore can improve the radiating efficiency of computer, and this water-cooling heat dissipation structure is closed heat radiation structure, and the dust can not enter into the inside of computer thereupon during the heat dissipation, guarantees the clean cleanness of computer inside.

Description

Computer modularization radiator unit

Technical Field

The utility model relates to a computer heat dissipation technical field especially relates to a computer modularization radiator unit.

Background

The development of computer chip technology makes the heat productivity of the CPU larger and larger, and the development of effective cooling technology to solve the heat dissipation of the CPU is an important subject being researched in the world today. The most widely used CPU heat dissipation technology at present is still forced air cooling heat dissipation. But the air cooling heat dissipation efficiency is poor, and the heat dissipation requirement of a modern computer cannot be gradually met; and the air-cooled heat dissipation belongs to open heat radiation structure, and outside dust can enter into the computer inside together during the heat dissipation, leads to the inside components and parts surface of computer can adsorb a large amount of dust, not only influences the normal work of computer easily, still can reduce the radiating efficiency of computer.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a computer modularization radiator unit can increase substantially the radiating efficiency through the water-cooling heat dissipation, can prevent simultaneously that the dust from getting into inside the computer.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a computer modularization radiator unit, includes computer machine case, the inside of computer machine case is provided with the heat transfer board, one side fixed mounting of computer machine case outside has the heat dissipation case, the heat transfer board pastes the one side of adorning in computer CPU board, the inside of heat transfer board is provided with circulation heat transfer return bend, the internally mounted of heat dissipation case has water tank and circulation heat dissipation return bend, the one end of circulation heat dissipation return bend and the water inlet intercommunication of water tank, the delivery port of water tank is connected with the water supply pipe, the one end of water supply pipe is connected with the end of intaking of circulation heat transfer return bend, install miniature hydraulic pump and solenoid valve on the water supply pipe, the end of intaking of circulation heat transfer return bend is connected with the end of intaking of circulation heat dissipation return bend.

As an optimized technical scheme of the utility model, miniature hydraulic pump, solenoid valve are by the automatically controlled connection of computer CPU of computer machine incasement portion.

As an optimal technical scheme of the utility model, install the level sensor with computer CPU signal connection in the water tank, the upper end of water tank (5) is provided with the filler.

As an optimized technical scheme of the utility model, the radiator-grid is all installed to the front and back and the side of heat dissipation case.

As an optimal technical scheme of the utility model, radiator fan is all installed to the side around the heat dissipation case, install temperature sensor on the computer CPU board, temperature sensor and computer CPU signal connection, computer CPU and radiator fan automatically controlled are connected.

As an optimized technical scheme of the utility model, install the refrigerator in the water tank, computer CPU is connected with the refrigerator is automatically controlled.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

the utility model discloses a water-cooling heat dissipation, because the specific heat capacity of water is big, consequently can absorb a large amount of heats and keep the temperature not to have obvious change, therefore can improve the radiating efficiency of computer, and this water-cooling heat dissipation structure is closed heat radiation structure, and the dust can not enter into the inside of computer thereupon during the heat dissipation, guarantees the clean cleanness of computer inside.

Drawings

FIG. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic structural view of the surface of the present invention;

fig. 3 is a cross-sectional view of a heat exchange plate of the present invention;

fig. 4 is a block schematic diagram of the present invention;

wherein: 1. a computer chassis; 2. a heat dissipation box; 3. a heat exchange plate; 4. a heat-dissipating web; 5. a water tank; 6. a water filling port; 7. a water supply conduit; 8. a micro hydraulic pump; 9. an electromagnetic valve; 10. circulating heat dissipation bent pipes; 11. a heat radiation fan; 12. a circulating heat exchange elbow; 13. a computer CPU; 14. a temperature sensor; 15. a liquid level sensor.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to fig. 1-4, a modular computer heat dissipation assembly includes a computer case 1, a heat exchange plate 3 is disposed inside the computer case 1, a heat dissipation box 2 is fixedly mounted on one side of the exterior of the computer case 1, the heat exchange plate 3 is attached to one side of a CPU board of a computer, a circulating heat exchange elbow 12 is disposed inside the heat exchange plate 3, a water tank 5 and a circulating heat dissipation elbow 10 are mounted inside the heat dissipation box 2, one end of the circulating heat dissipation elbow 10 is communicated with a water inlet of the water tank 5, a water outlet of the water tank 5 is connected to a water supply conduit 7, one end of the water supply conduit 7 is connected to a water inlet end of the circulating heat exchange elbow 12, a micro hydraulic pump 8 and an electromagnetic valve 9 are mounted on the water supply conduit 7, and a water outlet end of the circulating heat exchange elbow 12 is connected to.

The micro hydraulic pump 8 and the electromagnetic valve 9 are electrically connected by a computer CPU13 in the computer case 1, when the computer is started, the computer CPU13 controls the micro hydraulic pump 8 and the electromagnetic valve 9 to be started at the same time, and water cooling heat dissipation is started.

A liquid level sensor 15 in signal connection with a computer CPU13 is installed in the water tank 5, a water filling opening 6 is arranged at the upper end of the water tank 5, and when the liquid level is monitored to be low, water can be added into the water tank 5 through the water filling opening 6.

The front, back and side of the heat dissipation box 2 are provided with heat dissipation nets 4, so that the heat dissipation box 2 can ventilate and dissipate heat conveniently.

The front side and the rear side of the heat dissipation box 2 are respectively provided with a heat dissipation fan 11, a computer CPU board is provided with a temperature sensor 14, the temperature sensor 14 is in signal connection with a computer CPU13, a computer CPU13 is in electric control connection with the heat dissipation fan 11, the temperature sensor 14 is used for detecting the temperature of a computer CPU13, and when the temperature of the computer CPU13 is high and the self-heat dissipation efficiency of the circulating heat dissipation elbow 10 is insufficient, the heat dissipation fan 11 can be started to perform auxiliary ventilation and heat dissipation on the circulating heat dissipation elbow 10.

The refrigerator is installed in the water tank 5, the computer CPU13 is electrically connected with the refrigerator, and when the room temperature and the water temperature are high in summer, the water in the water tank 5 can be refrigerated through the refrigerator, so that the water temperature is lower than the room temperature, and the water cooling and heat dissipation efficiency is improved.

Specifically, when the device uses, miniature hydraulic pump 8 drive rivers are at water tank 5, water supply pipe 7, circulation flow between circulation heat transfer return bend 12 and the circulation heat dissipation return bend 10, when cold water in water tank 5 flows to circulation heat transfer return bend 12, absorb the heat that computer CPU13 work produced through heat transfer plate 3, thereby for computer CPU13 cooling, cold water heat absorption intensifies simultaneously and becomes the warm water, later the warm water flows to circulation heat dissipation return bend 10, begin spontaneous heat dissipation, radiator fan 11 also can be opened, improve the radiating efficiency of circulation heat dissipation return bend 10, make the warm water turn into cold water again, cold water after the heat dissipation gets into water tank 5 cyclic utilization, thereby reach and last radiating effect.

The embodiments of the present invention are not limited to the above embodiments, and according to the contents of the above embodiments of the present invention, the above preferred embodiments can also make modifications, replacements or combinations of other forms by using conventional technical knowledge and conventional means in the field without departing from the basic technical idea of the present invention, and the obtained other embodiments all fall within the scope of the present invention.

Claims

1. The utility model provides a computer modularization radiator unit, includes computer machine case (1), its characterized in that, the inside of computer machine case (1) is provided with heat transfer board (3), one side fixed mounting of computer machine case (1) outside has heat dissipation case (2), heat transfer board (3) paste adorn in one side of computer CPU board, the inside of heat transfer board (3) is provided with circulation heat transfer return bend (12), the internally mounted of heat dissipation case (2) has water tank (5) and circulation heat dissipation return bend (10), the one end of circulation heat dissipation return bend (10) communicates with the water inlet of water tank (5), the delivery port of water tank (5) is connected with water supply pipe (7), the one end of water supply pipe (7) is connected with the end of intaking of circulation heat transfer return bend (12), install miniature hydraulic pump (8) and solenoid valve (9) on water supply pipe (7), the water outlet end of the circulating heat exchange elbow (12) is connected with the water inlet end of the circulating heat dissipation elbow (10).

2. The computer modular heat dissipation assembly according to claim 1, wherein the micro hydraulic pump (8) and the electromagnetic valve (9) are electrically connected by a computer CPU (13) inside the computer case (1).

3. The computer modular heat dissipation assembly according to claim 1, wherein a liquid level sensor (15) in signal connection with a computer CPU (13) is installed in the water tank (5), and a water filling port (6) is arranged at the upper end of the water tank (5).

4. The modular computer heat sink assembly according to claim 1, wherein the heat sink box (2) is provided with heat sinks (4) on the front, back and side surfaces thereof.

5. The modular computer heat dissipation assembly according to claim 1, wherein a heat dissipation fan (11) is installed on each of the front and rear sides of the heat dissipation box (2), a temperature sensor (14) is installed on the CPU board of the computer, the temperature sensor (14) is in signal connection with the CPU (13) of the computer, and the CPU (13) of the computer is in electrical control connection with the heat dissipation fan (11).

6. A computer modular heat sink assembly according to claim 1, wherein a refrigerator is mounted in the water tank (5), and the computer CPU (13) is electrically connected to the refrigerator.