CN220015497U - Claw pump with heat dissipation function - Google Patents

Abstract

The utility model relates to the technical field of vacuum pumps, in particular to a claw pump with a heat dissipation function, which comprises a base, wherein a pump box is arranged at the top end of the outer wall of the base, a heat dissipation component for dissipating heat of the pump box is arranged above the outer wall of the pump box, the heat dissipation component comprises an upper supporting plate, a heat dissipation box, a refrigerating component and a heat exchange component, the upper supporting plate is arranged above the top end of the outer wall of the pump box, and the heat dissipation box is arranged above the outer wall of the upper supporting plate.

Description

Claw pump with heat dissipation function

Technical Field

The utility model relates to the technical field of vacuum pumps, in particular to a claw pump with a heat dissipation function.

Background

The Chinese patent publication No. CN113864187A discloses an oil claw dry vacuum pump, which comprises a box body fixed on one side of the top of a fixed base, wherein a driving motor is arranged on one side of the top of the fixed base, and a working module is arranged on one side of the center of the box body far away from the driving motor; the working module comprises a pump body, one side of the center of the box body, which is far away from the driving motor, is provided with a pump cavity, two sides of the center of the pump cavity are respectively connected with a first pump claw and a second pump claw in a rotating way, and the center of the top of the pump body is provided with an air inlet channel corresponding to the pump cavity; a transmission module corresponding to the working module is arranged at one side of the center of the box body, which is close to the driving motor;

the beneficial effects of the above-mentioned patent technology are through the simple work module of design, transmission module and air intake filter module, not only save a large amount of energy consumption, can provide the clean vacuum environment of high and steady yet, this vacuum pump later stage is maintenance-free at the same time, have the utilization to reduce the cost of enterprises;

however, as can be seen from the specification and the drawing of the specification disclosed in the above patent technology, the oil claw dry vacuum pump generates heat during the operation, and in order to ensure that the claw pump can stably operate for a long period of time, it is necessary to ensure that the claw pump can perform heat dissipation, while the heat dissipation grid provided in the specific use of the above patent technology dissipates heat of the claw pump main body during operation, but the heat dissipation grid is adopted to perform heat dissipation in a passive manner, in this manner, the temperature of the surrounding environment is required, that is, the temperature of the environment where the claw pump is located cannot be too high, and in the specific use, the factory cannot always ensure that the working environment where the claw pump is located is at a lower temperature, so when the claw pump is in a higher temperature environment, the heat dissipation manner often causes the temperature of the claw pump main body to rise, thereby damaging the working parts in the claw pump, and thus the above patent technology has certain disadvantages.

In summary, it is necessary to invent a claw pump with a heat dissipation function.

Disclosure of Invention

Therefore, the utility model provides the claw pump with the heat dissipation function, so that the problem that when the claw pump is in a higher-temperature environment, the heat dissipation mode often causes the temperature of the claw pump body to rise, and therefore, the working parts in the claw pump are damaged is solved.

In order to achieve the above object, the present utility model provides the following technical solutions: the claw pump with the heat dissipation function comprises a base, wherein a pump box is arranged at the top end of the outer wall of the base, and a heat dissipation component for dissipating heat of the pump box is arranged above the outer wall of the pump box;

the heat dissipation assembly comprises an upper supporting plate, a heat dissipation box, a refrigerating component and a heat exchange component, wherein the upper supporting plate is arranged above the top end of the outer wall of the pump box, and the heat dissipation box is arranged above the outer wall of the upper supporting plate.

Preferably, the refrigerating component is arranged at the upper end and the lower end of the inner wall of the heat dissipation box, and the heat exchange component is arranged on the refrigerating component.

Preferably, one side of the bottom end of the outer wall of the upper supporting plate is fixed at a position corresponding to the top end of the outer wall of the base through a side supporting plate, and a reinforcing block is fixed at the joint of the bottom end of the outer wall of the upper supporting plate and the side supporting plate.

Preferably, the outer wall top left side of pump box is fixed with driving motor, the inner wall of pump box and the position department that corresponds with driving motor are provided with claw pump body, driving motor's output is fixed through pivot and claw pump body's input, claw pump body's top inlet end fixedly communicates there is the intake pipe, the louvre has been seted up to the outer wall left side of pump box and the below that is located driving motor.

Preferably, the refrigerating component comprises semiconductor refrigerating sheets, the two semiconductor refrigerating sheets are respectively arranged at the upper end and the lower end of the inner wall of the heat dissipation box, heat conducting plates are respectively embedded at the upper end and the lower end of the inner wall of the heat dissipation box and at positions corresponding to the semiconductor refrigerating sheets, and the two heat conducting plates are respectively abutted with the heating ends of the semiconductor refrigerating sheets.

Preferably, the outer walls of two opposite sides of the heat conducting plate are respectively fixed with a heat radiating fin, a plurality of heat radiating fins extend out to the upper end and the lower end of the outer wall of the heat radiating box, an air inlet groove is formed in the upper left side of the inner wall of the heat radiating box, an air inlet fan is mounted on the inner wall of the air inlet groove, and the air inlet fan is arranged between the two semiconductor refrigerating sheets.

Preferably, the inner wall right side of radiating box is fixed to be linked together and is had the gas-supply pipe, the bottom of gas-supply pipe and the inner wall right side of pump box just are located the fixed intercommunication of below of claw pump body.

Preferably, the heat exchange component comprises liquid storage cylinders, two liquid storage cylinders are respectively fixed on two sides of the top end of the outer wall of the semiconductor refrigeration piece, and a radiating pipe is fixedly communicated between the two liquid storage cylinders.

Preferably, the radiating pipe comprises a main pipe and a liquid dividing pipe, two ends of the main pipe are fixedly communicated with the bottom of the inner wall of one side opposite to the liquid storage cylinder respectively, the liquid dividing pipe is arranged on the front side and the rear side of the radiating pipe respectively, two ends of the liquid dividing pipe are fixedly communicated with the main pipe, and the bottom of the outer wall of the main pipe and the bottom of the liquid dividing pipe are connected with the top of the outer wall of the semiconductor refrigerating sheet.

Preferably, the outer wall left side of radiating box just corresponds the position department with the liquid storage tube and is fixed with the infusion pump, the left side the liquid storage tube passes through the liquid suction mouth intercommunication of pipeline with the infusion pump, the liquid outlet fixed intercommunication of infusion pump has the feed liquor pipe, the other end and the top feed liquor mouth intercommunication of claw pump body of feed liquor pipe, the leakage fluid dram of semiconductor refrigeration piece passes through pipeline and right side the liquid storage tube intercommunication.

The beneficial effects of the utility model are as follows:

according to the utility model, the air inlet fan is arranged to convey the external air into the heat dissipation box, the two semiconductor refrigerating sheets are arranged to cool the air, and the cooled air can enter the pump box through the air conveying pipe to cool the claw pump body in an air-cooling way;

can carry the coolant liquid to the flow intracavity of seting up of claw pump body inner wall through the infusion pump and the feed liquor pipe that set up, can cool down the inside liquid cooling of claw pump body through the coolant liquid that sets up, the coolant liquid rethread is responsible for after the cooling and divides the cooperation effect of liquid pipe to cool down the processing through bottom semiconductor refrigeration piece, can know through above-mentioned mode the utility model discloses a cooling to the heat dissipation cooling of claw pump body is accomplished to the cold complex cooling mode of forced air cooling liquid feeding to can effectively improve the cooling to the cooling processing of claw pump body, make the claw pump body can adapt to more operational environment.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model in a side view;

FIG. 2 is a schematic cross-sectional view of the pump housing of the present utility model;

FIG. 3 is a schematic cross-sectional view of a radiator tank according to the present utility model;

FIG. 4 is a schematic view of a part of a main pipe in a side view direction in a perspective structure;

fig. 5 is a schematic perspective view showing a top view of a main pipe and a liquid separation pipe according to the present utility model.

In the figure: 100. a base; 110. an upper support plate; 200. a pump case; 210. a claw pump body; 220. a driving motor; 230. a heat radiation hole; 300. a heat radiation box; 310. a semiconductor refrigeration sheet; 320. a heat conductive plate; 321. a heat radiation fin; 330. an infusion pump; 331. a liquid inlet pipe; 340. an air intake fan; 350. a gas pipe; 360. a liquid storage cylinder; 361. a heat radiating pipe; 362. a main pipe; 363. a liquid separating pipe.

Detailed Description

The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.

Referring to fig. 1-5, the claw pump with heat dissipation function provided by the utility model comprises a base 100, a pump box 200 is arranged at the top end of the outer wall of the base 100, a heat dissipation component for dissipating heat of the pump box 200 is arranged above the outer wall of the pump box 200, the heat dissipation component comprises an upper supporting plate 110, a heat dissipation box 300, a refrigerating part and a heat exchange part, the upper supporting plate 110 is arranged above the top end of the outer wall of the pump box 200, one side of the bottom end of the outer wall of the upper supporting plate 110 is fixed through a side supporting plate at the position corresponding to the top end of the outer wall of the base 100, the upper supporting plate 110 is mainly used for supporting the heat dissipation box 300, the upper supporting plate 110 is fixed with the top end of the outer wall of the base 100 through a side supporting plate and a reinforcing plate, a reinforcing block is mainly used for improving the fixing effect between the upper supporting plate 110 and the side supporting plate, a driving motor 220 is fixed at the left side of the top end of the outer wall of the pump box 200, a claw pump body 210 is arranged at the position corresponding to the inner wall of the pump box 200, the output end of the driving motor 220 is mainly used for driving the claw pump 210 is fixed through a rotating shaft and the motor body 210 is arranged at the position corresponding to the top end of the driving motor body 210, and the left side of the claw pump body is not mainly used for driving the claw 210 is arranged at the top end of the pump body is arranged, the pump body is preferably provided with a pump inlet hole is arranged at the top end of the pump 210;

the heat dissipation box 300 is arranged above the outer wall of the upper support plate 110, the refrigerating component is arranged at the upper and lower ends of the inner wall of the heat dissipation box 300, the refrigerating component comprises semiconductor refrigerating sheets 310, two semiconductor refrigerating sheets 310 are respectively arranged at the upper and lower ends of the inner wall of the heat dissipation box 300, the arranged semiconductor refrigerating sheets 310 utilize the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be respectively absorbed and released at the two ends of the couple, the purpose of refrigeration can be realized, the refrigerating technology for generating negative thermal resistance is characterized in that no moving component exists, the refrigerating surface of the semiconductor refrigerating sheet 310 can face the inside of the heat dissipation box 300 during specific installation, the heat generating ends of the semiconductor refrigerating sheet 310 can be respectively arranged at the upper and lower sides of the inner wall of the heat dissipation box 300, the upper and lower ends of the inner wall of the heat dissipation box 300 and the positions corresponding to the semiconductor refrigerating sheets 310 are respectively embedded with heat conducting plates 320, the two heat conducting plates 320 are respectively abutted with the heating ends of the semiconductor refrigerating sheets 310, the outer walls of the opposite sides of the two heat conducting plates 320 are respectively fixed with radiating fins 321, a plurality of radiating fins 321 extend to the upper and lower ends of the outer wall of the radiating box 300, the arranged heat conducting plates 320 and radiating fins 321 are used for conducting heat to the environment when the semiconductor refrigerating sheets 310 work, the arranged heat conducting plates 320 and radiating fins 321 are preferably made of metal copper or metal aluminum, an air inlet groove is formed above the left side of the inner wall of the radiating box 300, an air inlet fan 340 is arranged on the inner wall of the air inlet groove, the air inlet fan 340 is arranged between the two semiconductor refrigerating sheets 310, the arranged air inlet fan 340 can convey outside air into the radiating box 300 after being electrified and started, and the air entering the radiating box 300 can be cooled through the arranged semiconductor refrigerating sheets 310, specifically, a dust-separating net is further required to be disposed in the air inlet groove, the right side of the inner wall of the heat dissipation box 300 is fixedly communicated with an air pipe 350, the bottom end of the air pipe 350 is fixedly communicated with the right side of the inner wall of the pump box 200 and is positioned below the claw pump body 210, the air pipe 350 is disposed to convey the cooled air into the pump box 200 to cool the inside of the claw pump body 210 by air cooling, and the air conveyed by the air pipe 350 can be discharged through the heat dissipation holes 230;

the heat exchange component is arranged on the refrigeration component, the arranged heat exchange component is used for carrying out heat exchange refrigeration on cooling liquid by utilizing the refrigeration of the semiconductor refrigeration piece 310, then the cooled cooling liquid is conveyed into the flow arranged on the inner wall of the claw pump body 210, the arranged cooling liquid can cool the claw pump body 210 through the flow cavity, the cooling liquid after heat exchange and temperature rise flows back into the heat radiation box 300 for cooling again and is used, the heat exchange component comprises liquid storage cylinders 360, the two liquid storage cylinders 360 are respectively fixed on the two sides of the top end of the outer wall of the semiconductor refrigeration piece 310, the arranged liquid storage cylinders 360 play the role of converging the cooling liquid to be cooled, a radiating pipe 361 is fixedly communicated between the two liquid storage cylinders 360, the radiating pipe 361 comprises a main pipe 362 and a liquid distributing pipe 363, the two ends of the main pipe 362 are respectively fixedly communicated with the bottom of the inner wall on the opposite side of the liquid storage cylinder 360, the liquid distributing pipe 363 is respectively arranged on the front side and the rear side of the radiating pipe 361, the two ends of the liquid dividing pipe 363 are fixedly communicated with the main pipe 362, the main pipe 362 and the liquid dividing pipe 363 are arranged for dividing the cooling liquid to be cooled, so that the cooling effect of the bottom end semiconductor refrigerating piece 310 on the cooling liquid can be improved, the main pipe 362 and the liquid dividing pipe 363 are preferably made of metal copper or metal aluminum, the bottom ends of the outer walls of the main pipe 362 and the liquid dividing pipe 363 are connected with the top ends of the outer walls of the bottom end semiconductor refrigerating piece 310, the liquid conveying pump 330 is fixed at the position corresponding to the liquid conveying cylinder 360 on the left side of the outer wall of the heat radiating box 300, the liquid conveying pump 330 is arranged for conveying the cooled cooling liquid into a flowing cavity formed in the inner wall of the claw pump body 210 through the liquid conveying pipe 331 after being electrified, the left liquid conveying cylinder 360 is communicated with a liquid suction port of the liquid conveying pump 330 through a pipeline, the liquid conveying port of the liquid conveying pump 330 is fixedly communicated with the liquid conveying pipe 331, the other end of the liquid inlet pipe 331 is communicated with a liquid inlet at the top of the claw pump body 210, the liquid outlet of the semiconductor refrigerating sheet 310 is communicated with the right liquid storage barrel 360 through a conveying pipeline, and cooling liquid after heat exchange and temperature rise can flow back into the right liquid storage barrel 360 through the conveying pipeline again for cooling treatment.

The application process of the utility model is as follows: firstly, a workpiece inside the claw pump body 210 can be driven to rotate by the driving motor 220, so that the claw pump body 210 can complete vacuum work, and when the heating value of the claw pump body 210 is gradually increased along with the work of the claw pump body 210, the air inlet fan 340 and the driving motor 220 can be started, the air inlet fan 340 can convey air to the inside of the heat dissipation box 300 after the air inlet fan 340 is started, the semiconductor refrigerating sheet 310 which is electrified and started can cool the conveyed air through a cooling end, the cooled air can enter the pump box 200 through the air conveying pipe 350, so that the claw pump body 210 can be cooled by air, and the air in the pump box 200 can carry heat to be discharged from the heat dissipation holes 230;

meanwhile, the arranged infusion pump 330 can convey cooling liquid into the flowing cavity formed in the inner wall of the claw pump body 210 through the liquid inlet pipe 331 after being started, the cooling liquid can dissipate heat and cool working devices in the claw pump body 210 through the flowing cavity, cooled cooling liquid can flow back into the right liquid storage barrel 360 through the infusion pipeline, then the cooling liquid can flow into the main pipe 362 and the liquid separation pipe 363 through the liquid storage barrel 360, the bottom semiconductor refrigerating sheet 310 can cool the cooling liquid through the main pipe 362 and the liquid separation pipe 363, and cooled cooling liquid can be collected at the left liquid storage barrel 360 and enter the infusion pump 330 through the left liquid storage barrel 360 for re-circulation cooling.

The above description is of the preferred embodiments of the present utility model, and any person skilled in the art may modify the present utility model or make modifications to the present utility model with the technical solutions described above. Therefore, any simple modification or equivalent made according to the technical solution of the present utility model falls within the scope of the protection claimed by the present utility model.

Claims (10)

1. The utility model provides a claw pump with heat dissipation function, includes base (100), the outer wall top of base (100) is provided with pump box (200), its characterized in that: a heat radiation component for radiating heat of the pump box (200) is arranged above the outer wall of the pump box (200);

the heat dissipation assembly comprises an upper support plate (110), a heat dissipation box (300), a refrigerating component and a heat exchange component, wherein the upper support plate (110) is arranged above the top end of the outer wall of the pump box (200), and the heat dissipation box (300) is arranged above the outer wall of the upper support plate (110).

2. A claw pump with a heat radiation function according to claim 1, characterized in that: the refrigerating component is arranged at the upper end and the lower end of the inner wall of the radiating box (300), and the heat exchange component is arranged on the refrigerating component.

3. A claw pump with a heat radiation function according to claim 1, characterized in that: the outer wall bottom of the upper supporting plate (110) is fixed at a position corresponding to the top end of the outer wall of the base (100) through a side supporting plate, and a reinforcing block is fixed at the joint of the outer wall bottom of the upper supporting plate (110) and the side supporting plate.

4. A claw pump with a heat radiation function according to claim 1, characterized in that: the novel air conditioner is characterized in that a driving motor (220) is fixed on the left side of the top end of the outer wall of the pump box (200), a claw pump body (210) is arranged on the inner wall of the pump box (200) and at a position corresponding to the driving motor (220), the output end of the driving motor (220) is fixed with the input end of the claw pump body (210) through a rotating shaft, an air inlet pipe is fixedly communicated with the top air inlet end of the claw pump body (210), and a heat dissipation hole (230) is formed in the left side of the outer wall of the pump box (200) and below the driving motor (220).

5. The claw pump with a heat radiation function according to claim 4, wherein: the refrigerating component comprises semiconductor refrigerating sheets (310), the two semiconductor refrigerating sheets (310) are respectively arranged at the upper end and the lower end of the inner wall of the heat dissipation box (300), heat conducting plates (320) are respectively inlaid at the upper end and the lower end of the inner wall of the heat dissipation box (300) and at positions corresponding to the semiconductor refrigerating sheets (310), and the two heat conducting plates (320) are respectively abutted with the heating ends of the semiconductor refrigerating sheets (310).

6. The claw pump with a heat radiation function according to claim 5, wherein: two the outer wall of opposite side of heat conduction board (320) all is fixed with radiating fin (321), and a plurality of radiating fin (321) all stretch out to the outer wall upper and lower extreme of cooling tank (300), the air inlet tank has been seted up to the inner wall left side top of cooling tank (300), air inlet fan (340) are installed to the inner wall of air inlet tank, air inlet fan (340) set up two between semiconductor refrigeration piece (310).

7. The claw pump with a heat radiation function according to claim 6, wherein: the inner wall right side of radiating box (300) is fixed to be linked together and is had gas-supply pipe (350), the bottom of gas-supply pipe (350) is fixed to be linked together with the below that just is located claw pump body (210) on the inner wall right side of pump case (200).

8. The claw pump with a heat radiation function according to claim 5, wherein: the heat exchange component comprises liquid storage cylinders (360), two liquid storage cylinders (360) are respectively fixed on two sides of the top end of the outer wall of the semiconductor refrigerating sheet (310), and radiating pipes (361) are fixedly communicated between the two liquid storage cylinders (360).

9. The claw pump with a heat radiation function according to claim 8, wherein: the radiating pipe (361) comprises a main pipe (362) and a liquid separating pipe (363), two ends of the main pipe (362) are fixedly communicated with the bottom of the inner wall of one side opposite to the liquid storage barrel (360) respectively, the liquid separating pipe (363) is arranged on the front side and the rear side of the radiating pipe (361) respectively, two ends of the liquid separating pipe (363) are fixedly communicated with the main pipe (362), and the bottom of the outer wall of the main pipe (362) and the bottom of the liquid separating pipe (363) are connected with the top of the outer wall of the semiconductor refrigerating sheet (310).

10. The claw pump with a heat radiation function according to claim 9, characterized in that: the liquid storage device is characterized in that an infusion pump (330) is fixed on the left side of the outer wall of the heat dissipation box (300) and at a position corresponding to the liquid storage barrel (360), the liquid storage barrel (360) is communicated with a liquid suction port of the infusion pump (330) through a pipeline, a liquid inlet pipe (331) is fixedly communicated with a liquid outlet of the infusion pump (330), the other end of the liquid inlet pipe (331) is communicated with a top liquid inlet of the claw pump body (210), and a liquid outlet of the semiconductor refrigerating sheet (310) is communicated with the liquid storage barrel (360) through a conveying pipeline.