CN221465975U - Auxiliary heat dissipation device for waste heat recovery of computer processor - Google Patents

Abstract

The present application relates to a computer processor waste heat recovery auxiliary heat dissipation device, and relates to the technical field of heat dissipation devices. It includes a heat dissipation component, a thermoelectric sheet, and a heat dissipation fan. The thermoelectric sheet includes a heat source surface and a cold source surface, and the heat dissipation component is attached to the heat source surface; the heat dissipation fan is arranged on the heat dissipation component, and the heat dissipation fan is electrically connected to the thermoelectric sheet. The heat dissipation component absorbs the heat generated from the computer processor. Since the heat source sheet is attached to the heat dissipation component, the temperature of the heat source sheet increases, while the temperature of the cold source surface on the other side of the thermoelectric sheet does not change much. At this time, a temperature difference is generated between the heat source surface and the cold source surface. At this time, the thermoelectric sheet generates an electric potential between the heat source surface and the cold source surface, thereby causing the heat dissipation fan to rotate and promote the heat dissipation of the heat dissipation component. When the computer processor needs to dissipate heat during operation, the heat dissipation fan automatically works. When the computer processor is not working, the heat dissipation fan automatically stops working, which solves the problem of poor energy consumption and heat dissipation combination in the existing heat dissipation structure of the computer processor.

Description

A computer processor waste heat recovery auxiliary heat dissipation device

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a computer processor waste heat recovery auxiliary heat dissipation device.

Background technique

The computer's central processing unit (CPU) is the core component of the computer, but the CPU produced based on existing production technology still has the problem of high heat generation, and the direct heat exchange between the computer processor and the air is not enough to keep the CPU stable at the operating temperature. Therefore, the auxiliary heat dissipation device of the CPU is indispensable for the CPU. With the rapid expansion of the computer market, the demand for radiators has also increased.

Depending on whether an external power supply is required, current radiators can be mainly divided into two types: active radiators and passive radiators.

In terms of the logic of heat dissipation, active radiators and passive radiators are basically the same. Both of them connect the metal thermal conductor to the processor through thermal conductive materials to transfer heat from the CPU surface to the external heat sink.

For example, CN219492695U discloses a computer cooling fan, comprising: an air inlet hood, wherein filter cotton is arranged inside the air inlet hood, and the outer wall of the filter cotton is connected to the air inlet hood; an air supply hood, wherein the air supply hood is connected to the air inlet hood, wherein a first fan is arranged inside the air supply hood, and the first fan is fixedly connected to the air supply hood; a heat conductive block, wherein a semiconductor cooling sheet is installed inside the heat conductive block, a first heat sink is installed on the outer wall of the heat conductive block, and the first heat sink is fixedly connected to the first fan.

Active radiators and passive radiators have different strategies. Active radiators generally refer to radiators that require an external power supply. Usually, the fan is driven by an external power supply to accelerate the air circulation on the surface of the heat sink, thereby accelerating the heat dissipation. Passive radiators generally refer to radiators that do not require an external power supply. By designing the shape of the heat sink, increasing the surface area of the heat sink, or using metal with stronger thermal conductivity to make the heat sink, the heat exchange between the CPU and the outside world can be accelerated. Active radiators have better heat dissipation effects, while passive radiators have lower noise and do not require an additional external power supply, which is energy-saving and environmentally friendly.

Regarding the above-mentioned related technologies, there is a problem that the heat dissipation structure of the existing computer processor has poor integration of energy consumption and heat dissipation.

Utility Model Content

In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a computer processor waste heat recovery auxiliary heat dissipation device, aiming to solve the problem of poor energy consumption and heat dissipation combination of the existing computer processor heat dissipation structure.

The present application provides a computer processor waste heat recovery auxiliary heat dissipation device that adopts the following technical solution: a computer processor waste heat recovery auxiliary heat dissipation device, including a heat dissipation component for contacting with the computer processor and absorbing heat;

The thermoelectric sheet comprises a heat source surface and a cold source surface, the heat source surface and the cold source surface are arranged opposite to each other on the thermoelectric sheet, and the heat dissipation component is attached to the heat source surface;

A heat dissipation fan is arranged on the heat dissipation component, and the heat dissipation fan is electrically connected to the thermoelectric sheet.

Optionally, the heat dissipation assembly includes a heat dissipation base, a heat conductive member and a first heat dissipation member, and the heat conductive member is respectively connected to the heat dissipation base and the first heat dissipation member;

The heat dissipation base is used to contact with the computer processor and absorb heat;

One side of the first heat sink is in contact with the heat source surface, and the other side is provided with the heat dissipation fan.

Optionally, the first heat sink comprises a first heat sink substrate and a first heat sink fin, the first heat sink fin is arranged on the first heat sink substrate, a plurality of the first heat sink fins are arranged, and the plurality of the first heat sink fins are arranged at intervals on the first heat sink substrate;

The first heat dissipation substrate is attached to the heat source surface, and the heat dissipation fan is arranged on the first heat dissipation fins.

Optionally, a plurality of the heat conducting members are provided, and the plurality of the heat conducting members are arranged at intervals between the heat dissipation base and the first heat dissipation member.

Optionally, the heat conducting member is a copper heat pipe, and a plurality of the heat conducting members all pass through the first heat dissipating member.

Optionally, a mounting groove is provided on the first heat dissipation component, a mounting bracket is provided in the mounting groove, and the heat dissipation fan is provided on the mounting bracket.

Optionally, the cold source surface is provided with a second heat sink.

Optionally, surfaces of the heat source surface and the heat sink surface are both coated with a first heat conductive layer.

Optionally, a side of the heat dissipation base in contact with the computer processor is coated with a second heat conductive layer.

Optionally, threaded holes for installation are provided on the heat dissipation base.

Compared with the prior art, the embodiment of the utility model has the following advantages:

When the computer processor is working, it will generate waste heat. The heat dissipation component absorbs the heat generated from the computer processor. Since the heat source sheet is attached to the heat dissipation component, the temperature of the heat source sheet increases, while the temperature of the cold source surface on the other side of the thermoelectric sheet does not change much. At this time, a temperature difference is generated between the heat source surface and the cold source surface. According to the Seebeck effect, the thermoelectric sheet generates an electric potential between the heat source surface and the cold source surface. Since there is an electrical connection between the heat dissipation fan and the thermoelectric sheet, the heat dissipation fan rotates, thereby promoting the heat dissipation of the heat dissipation component.

When the computer processor stops working, the heat dissipation component cannot absorb heat from the computer processor, so there is no temperature difference between the heat source surface and the cold source surface, and no electric potential is generated, and the cooling fan stops rotating.

When the computer processor needs to dissipate heat during operation, the cooling fan automatically starts to promote heat dissipation. When the computer processor does not work and does not need heat dissipation, the cooling fan can automatically stop working without the need for an external power supply, thereby solving the problem of poor energy consumption and heat dissipation integration in the existing heat dissipation structure of computer processors.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic diagram of the overall structure of a computer processor waste heat recovery auxiliary heat dissipation device in an embodiment of the present application;

FIG2 is an exploded view of a computer processor waste heat recovery auxiliary heat dissipation device according to an embodiment of the present application;

3 is an exploded view of the cooperation between the thermoelectric sheet and the second heat sink of the computer processor waste heat recovery auxiliary heat sink in the embodiment of the present application;

4 is a schematic diagram of the structure of a heat dissipation component of a computer processor waste heat recovery auxiliary heat dissipation device according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of different angles of a heat dissipation component of a computer processor waste heat recovery auxiliary heat dissipation device in an embodiment of the present application.

Description of reference numerals:

1. Heat dissipation assembly; 11. Heat dissipation base; 111. Threaded hole; 12. Heat conducting member; 121. Heat absorbing member; 122. Heat conducting member; 13. First heat dissipation member; 131. First heat dissipation substrate; 132. First heat dissipation fin; 1321. Mounting groove; 1322. Mounting bracket; 1322a. Fixing member; 1322b. Connecting member; 2. Thermoelectric sheet; 21. Heat source surface; 22. Cold source surface; 221. Second heat dissipation member; 23. Electric wire; 3. Cooling fan.

Detailed ways

In order to enable those skilled in the art to better understand the solution of the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

The present application is further described in detail below in conjunction with the accompanying drawings.

The embodiment of the present application discloses a computer processor waste heat recovery auxiliary heat dissipation device.

As shown in Figures 1, 2 and 3, a computer processor waste heat recovery auxiliary heat dissipation device includes: a heat dissipation component 1, a thermoelectric sheet 2 and a heat dissipation fan 3. The heat dissipation component 1 is used to contact with the computer processor and absorb heat; the thermoelectric sheet 2 includes a heat source surface 21 and a cold source surface 22, the heat source surface 21 and the cold source surface 22 are arranged on the thermoelectric sheet 2, and the heat dissipation component 1 is attached to the heat source surface 21; the heat dissipation fan 3 is arranged on the heat dissipation component 1, and the heat dissipation fan 3 is electrically connected to the thermoelectric sheet 2.

When the computer processor is working, the computer processor generates waste heat, and the heat dissipation component 1 absorbs the heat generated from the computer processor. Since the heat source sheet is attached to the heat dissipation component 1, the temperature of the heat source sheet increases, while the temperature of the cold source surface 22 on the other side of the thermoelectric sheet 2 does not change much. At this time, a temperature difference is generated between the heat source surface 21 and the cold source surface 22. It can be seen from the Seebeck effect that the thermoelectric sheet 2 generates an electric potential between the heat source surface 21 and the cold source surface 22. Since there is an electrical connection between the heat dissipation fan 3 and the thermoelectric sheet 2, the heat dissipation fan 3 rotates, thereby promoting the heat dissipation of the heat dissipation component 1.

When the computer processor stops working, the heat dissipation component 1 cannot absorb heat from the computer processor, so there is no temperature difference between the heat source surface 21 and the cold source surface 22, and no electric potential is generated, and the heat dissipation fan 3 also stops rotating.

When the computer processor is working and needs heat dissipation, the cooling fan 3 automatically works to promote heat dissipation. When the computer processor is not working and does not need heat dissipation, the cooling fan 3 can automatically stop working without an external power supply, thereby solving the problem of poor energy consumption and heat dissipation integration of the existing heat dissipation structure of the computer processor.

Specifically, the thermoelectric sheet 2 is a semiconductor thermoelectric sheet. The shape of the thermoelectric sheet 2 is rectangular as a whole. The cold source surface 22 and the hot source surface 21 are two opposite surfaces of the thermoelectric sheet 2 .

The heat dissipation fan 3 is a low-pressure fan, which can not only accelerate the air circulation on the surface of the heat dissipation component 1 and promote heat dissipation, but also has a low rotation speed and low noise during operation.

The thermoelectric sheet 2 and the cooling fan 3 are connected via a jumper wire 23 .

The heat dissipation assembly 1 comprises a heat dissipation base 11 , a heat conducting member 12 and a first heat dissipation member 13 , wherein the heat conducting member 12 is connected to the heat dissipation base 11 and the first heat dissipation member 13 , respectively.

The heat dissipation base 11 is used to contact with the computer processor and absorb heat. The heat dissipation base 11 is provided with threaded holes 111 for installation.

One side of the first heat sink 13 is in contact with the heat source surface 21 , and the other side is provided with a heat dissipation fan 3 .

Specifically, as shown in Fig. 1, Fig. 2, Fig. 4 and Fig. 5, the heat sink 11 is in the shape of a cube as a whole, and a plurality of threaded holes 111 are provided, and the plurality of threaded holes 111 are respectively provided at the four vertex corners of the heat sink 11. With the provision of the four threaded holes 111, when the heat sink 11 is installed on the CPU, it can be fixed to the base bracket installed on the back of the motherboard through the four threaded holes 111.

The provision of the threaded holes 111 also facilitates the disassembly, maintenance and replacement of the heat dissipation base 11 .

The side of the heat dissipation base 11 that contacts the computer processor is coated with a second heat conductive layer.

Specifically, the second heat-conducting layer is a silicone grease layer. Applying the second heat-conducting layer can improve the heat conductivity between the computer processor and the base, and effectively reduce the temperature of the computer processor.

The heat conducting member 12 is a copper heat pipe. Using copper as the material of the heat conducting member 12 can improve the heat conduction efficiency so as to quickly introduce heat to the first heat sink 13 .

The heat conducting member 12 is in the shape of a bent tube as a whole. In this embodiment, the bending angle of the heat conducting member 12 is 90 degrees.

One end of the heat conducting member 12 passes through one side of the heat dissipation base 11, and the other end passes through the bottom of the first heat dissipation member 13. The heat conducting member 12 passing through the heat dissipation base 11 can fully absorb the heat in the heat dissipation base 11, and the heat conducting member 12 passing through the first heat dissipation member 13 can fully transfer the heat in the heat conducting member 12 to the first heat dissipation member 13, and can make the heat in the first heat dissipation member 13 evenly distributed.

The heat-conducting member 12 includes a heat-absorbing portion 121 and a heat-conducting portion 122. The angle between the heat-absorbing portion 121 and the heat-conducting portion 122 is ninety degrees. The heat-absorbing portion 121 passes through the heat dissipation base plate to absorb the heat in the heat dissipation base plate. The heat-conducting portion 122 passes through the first heat dissipating member 13 to conduct the heat in the heat-conducting member 12 into the first heat dissipating member 13.

The side wall of the heat conducting part 122 is exposed from the inside of the heat dissipation bottom and directly contacts the computer processor, so that the heat on the computer processor can be directly absorbed by the heat conducting part 122, so that the heat conducting part 122 can absorb heat directly from the computer processor while absorbing heat from the heat dissipation base, thereby increasing the heat conduction efficiency of the heat conducting part 12.

A plurality of heat conducting members 12 are provided, and the plurality of heat conducting members 12 are arranged at intervals between the heat dissipation base 11 and the first heat dissipation member 13 .

A plurality of heat conducting members 12 are arranged between the heat dissipation base 11 and the first heat dissipation member 13 to fully absorb the heat at various positions of the heat dissipation base 11 and to make the heat distribution on the first heat dissipation member 13 more uniform.

The connection between the heat dissipation base 11, the heat conductive member 12 and the first heat dissipation member 13 forms an L-shape as a whole. Through the connection of the heat conductive member 12, the heat dissipation base 11 and the first heat dissipation member 13 are distributed as two layers, upper and lower. This stacked heat dissipation structure can improve the effective conduction of heat and prevent the computer processor from directly contacting the thermoelectric sheet 2, resulting in poor heat dissipation of the computer processor.

The first heat sink 13 includes a first heat sink substrate 131 and first heat sink fins 132 . The first heat sink fins 132 are disposed on the first heat sink substrate 131 . A plurality of first heat sink fins 132 are provided, and the plurality of first heat sink fins 132 are spaced apart from each other on the first heat sink substrate 131 .

The first heat dissipation substrate 131 is attached to the heat source surface 21 , and the heat dissipation fan 3 is disposed on the first heat dissipation fins 132 .

Specifically, the first heat dissipation substrate 131 is a rectangle with the same shape as the thermoelectric sheet 2, and the surface area of the first heat dissipation substrate 131 on the side in contact with the thermoelectric sheet 2 is the same as the surface area of the heat source surface 21. In this way, the heat source surface 21 can fully absorb the heat on the first heat dissipation substrate 131, so that the heat source surface 21 is heated evenly.

A plurality of first heat dissipation fins 132 are arranged at intervals on a surface of the first heat dissipation substrate 131 away from the heat source surface 21. The ends of the plurality of first heat dissipation fins away from the first heat dissipation substrate 131 together form a heat dissipation surface, and the heat dissipation fan 3 is attached to the heat dissipation surface.

Part of the heat absorbed by the first heat dissipation substrate 131 is absorbed by the heat source surface 21, so that a temperature difference is formed between the heat source surface 21 and the cold source surface 22 to generate an electric potential, driving the heat dissipation fan 3 to work, and the other part is transferred to the first heat dissipation fins 132 for heat dissipation. The heat dissipation fan 3 attached to the heat dissipation surface starts to work after receiving the energy transferred by the thermoelectric sheet 2, thereby accelerating the heat dissipation on the first heat dissipation fins 132.

The first heat sink 13 is provided with a mounting groove 1321 , a mounting bracket 1322 is provided in the mounting groove 1321 , and the heat dissipation fan 3 is provided on the mounting bracket 1322 .

Specifically, the plurality of first heat dissipating fins 132 form a mounting surface on a side away from the heat dissipating base 11 , and the mounting groove 1321 is provided on the mounting surface. The mounting groove 1321 passes through the plurality of first heat dissipating fins 132 , and the mounting groove 1321 is parallel to a side of the first heat dissipating base 131 away from the heat dissipating base 11 .

The mounting bracket 1322 includes a fixing portion 1322a and a connecting portion 1322b, wherein two connecting portions 1322b are provided, and the two connecting portions 1322b are provided at both ends of the fixing portion 1322a. The fixing portion 1322a is embedded and fixed in the mounting groove 1321, and the two connecting portions 1322b extend toward the direction of the heat dissipation fan 3.

Two snap-in holes are respectively provided at the positions of the two connecting parts 1322b on the outer frame of the cooling fan 3, and the two connecting parts 1322b are respectively inserted into the corresponding snap-in holes, and each connecting part 1322b passes through its own snap-in hole and is bent on the passing side, so that the cooling fan 3 is installed and fixed on the mounting bracket 1322. Since the fixing part 1322a is fixed in the mounting groove 1321, the cooling fan 3 is fixed on the first heat sink 13.

As shown in FIG. 1 , FIG. 2 and FIG. 3 , the cold source surface 22 is provided with a second heat sink 221 .

Specifically, a second heat sink 221 is provided on the cold source surface 22. The second heat sink 221 has the same structure as the first heat sink 13, including a second heat sink substrate and a plurality of second heat sink fins. One side of the second heat sink substrate is in contact with the cold source surface 22, and a plurality of heat sink fins are spaced apart on a side of the second heat sink substrate away from the cold source surface 22. The second heat sink 221 can cool the cold source surface 22, thereby ensuring the heat dissipation of the cold end of the thermoelectric sheet 2 and the temperature difference between the two ends of the thermoelectric sheet 2.

The surfaces of the heat source surface 21 and the heat sink surface 22 are both coated with a first heat conducting layer.

Specifically, coating the surfaces of the heat source surface 21 and the cold source surface 22 with the first heat conductive layer can enhance the heat conduction efficiency between the heat source surface 21 and the first heat sink 13 and between the cold source surface 22 and the second heat sink 221 .

In this embodiment, the first heat-conducting layer is a heat-conducting adhesive, which can ensure a close fit between the heat source surface 21 and the first heat sink 13, a close fit between the cold source surface 22 and the second heat sink 221, and ensure heat conduction.

In summary, a computer processor waste heat recovery auxiliary heat dissipation device includes: a heat dissipation component 1, a thermoelectric sheet 2 and a heat dissipation fan 3. The heat dissipation component 1 is used to contact with the computer processor and absorb heat; the thermoelectric sheet 2 includes a heat source surface 21 and a cold source surface 22, the heat source surface 21 and the cold source surface 22 are arranged opposite to each other on the thermoelectric sheet 2, and the heat dissipation component 1 is attached to the heat source surface 21; the heat dissipation fan 3 is arranged on the heat dissipation component 1, and the heat dissipation fan 3 is electrically connected to the thermoelectric sheet 2.

When the computer processor is working, the computer processor generates waste heat, and the heat dissipation component 1 absorbs the heat generated from the computer processor. Since the heat source sheet is attached to the heat dissipation component 1, the temperature of the heat source sheet increases, while the temperature of the cold source surface 22 on the other side of the thermoelectric sheet 2 does not change much. At this time, a temperature difference is generated between the heat source surface 21 and the cold source surface 22. It can be seen from the Seebeck effect that the thermoelectric sheet 2 generates an electric potential between the heat source surface 21 and the cold source surface 22. Since there is an electrical connection between the heat dissipation fan 3 and the thermoelectric sheet 2, the heat dissipation fan 3 rotates, thereby promoting the heat dissipation of the heat dissipation component 1.

When the computer processor stops working, the heat dissipation component 1 cannot absorb heat from the computer processor, so there is no temperature difference between the heat source surface 21 and the cold source surface 22, and no electric potential is generated, and the heat dissipation fan 3 also stops rotating.

When the computer processor is working and needs heat dissipation, the cooling fan 3 automatically works to promote heat dissipation. When the computer processor is not working and does not need heat dissipation, the cooling fan 3 can automatically stop working without an external power supply, thereby solving the problem of poor energy consumption and heat dissipation integration of the existing heat dissipation structure of the computer processor.

It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

It should be noted that the utility model takes a computer processor waste heat recovery auxiliary heat dissipation device as an example to introduce the specific structure and working principle of the utility model, but the application of the utility model is not limited to a computer processor waste heat recovery auxiliary heat dissipation device, and can also be applied to the production and use of other similar workpieces.

It should be understood that the present invention is not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims (10)

1. A computer processor waste heat recovery auxiliary heat dissipation device, characterized in that it comprises: A heat sink assembly for contacting with a computer processor and absorbing heat; The thermoelectric sheet comprises a heat source surface and a cold source surface, the heat source surface and the cold source surface are arranged opposite to each other on the thermoelectric sheet, and the heat dissipation component is attached to the heat source surface; A heat dissipation fan is arranged on the heat dissipation component, and the heat dissipation fan is electrically connected to the thermoelectric sheet. 2. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 1, characterized in that the heat dissipation assembly comprises a heat dissipation base, a heat conductive member and a first heat dissipation member, and the heat conductive member is respectively connected to the heat dissipation base and the first heat dissipation member; The heat dissipation base is used to contact with the computer processor and absorb heat; One side of the first heat sink is in contact with the heat source surface, and the other side is provided with the heat dissipation fan. 3. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 2, characterized in that the first heat dissipation element comprises a first heat dissipation substrate and a first heat dissipation fin, the first heat dissipation fin is arranged on the first heat dissipation substrate, a plurality of the first heat dissipation fins are arranged at intervals on the first heat dissipation substrate; The first heat dissipation substrate is attached to the heat source surface, and the heat dissipation fan is arranged on the first heat dissipation fins. 4. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 2, characterized in that a plurality of the heat conducting members are provided, and the plurality of the heat conducting members are arranged at intervals between the heat dissipation base and the first heat dissipation member. 5. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 4, characterized in that the heat conducting member is a copper heat pipe, and a plurality of the heat conducting members all pass through the first heat dissipation member. 6. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 2, characterized in that a mounting groove is provided on the first heat dissipation member, a mounting bracket is provided in the mounting groove, and the heat dissipation fan is provided on the mounting bracket. 7. A computer processor waste heat recovery auxiliary heat dissipation device according to claim 1, characterized in that the cold source surface is provided with a second heat dissipation element. 8 . The computer processor waste heat recovery auxiliary heat dissipation device according to claim 1 , wherein the surfaces of the heat source surface and the cold source surface are both coated with a first heat conductive layer. 9. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 2, characterized in that a side of the heat dissipation base in contact with the computer processor is coated with a second heat conductive layer. 10. The computer processor waste heat recovery auxiliary heat dissipation device according to claim 2, characterized in that the heat dissipation base is provided with threaded holes for installation.