CN221465975U - Auxiliary heat dissipation device for waste heat recovery of computer processor - Google Patents
Auxiliary heat dissipation device for waste heat recovery of computer processor Download PDFInfo
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- CN221465975U CN221465975U CN202323190166.8U CN202323190166U CN221465975U CN 221465975 U CN221465975 U CN 221465975U CN 202323190166 U CN202323190166 U CN 202323190166U CN 221465975 U CN221465975 U CN 221465975U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 129
- 239000002918 waste heat Substances 0.000 title claims abstract description 30
- 238000011084 recovery Methods 0.000 title claims abstract description 24
- 230000005855 radiation Effects 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 description 13
- 239000000306 component Substances 0.000 description 10
- 230000005678 Seebeck effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The application relates to an auxiliary heat dissipation device for waste heat recovery of a computer processor, and relates to the technical field of heat dissipation devices. Comprises a heat radiation component, a thermoelectric plate and a heat radiation fan. The thermoelectric sheet comprises a heat source surface and a cold source surface, and the heat dissipation assembly is attached to the heat source surface; the heat dissipation fan is arranged on the heat dissipation assembly and is electrically connected with the thermoelectric chip. The heat radiating component absorbs heat generated from the computer processor, the heat source sheet is attached to the heat radiating component, so that the temperature of the heat source sheet is increased, the temperature of the cold source surface at the other side of the thermoelectric sheet is not greatly changed, at the moment, a temperature difference is generated between the heat source surface and the cold source surface, at the moment, the thermoelectric sheet generates an electric potential between the heat source surface and the cold source surface, and therefore the heat radiating fan rotates to promote heat radiation of the heat radiating component. When the computer processor works and needs to radiate heat, the radiating fan automatically works, and when the computer processor does not work, the radiating fan automatically stops working, so that the problem that the existing radiating structure of the computer processor has poor energy consumption and radiating combination property is solved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to an auxiliary heat dissipation device for waste heat recovery of a computer processor.
Background
The central logic processing unit (CPU) of the computer is a core component of the computer, but the CPU produced based on the prior production technology still has the problem of large heat productivity, and the direct heat exchange between the computer processor and the air is insufficient for stabilizing the CPU at the working temperature. Therefore, an auxiliary heat sink for the CPU is indispensable for the CPU. With the rapid expansion of the computer market, the demand for heat sinks has grown.
The current radiator is mainly divided into an active radiator and a passive radiator according to whether an external power supply is required.
In the logic of heat conduction, the active radiator and the passive radiator are basically consistent, and are radiating fins for conducting heat from the surface of the CPU to the outside through contact and adhesion of a metal heat conductor and the processor through a heat conducting material.
As CN219492695U discloses a computer cooling fan, comprising: the air inlet cover is internally provided with filter cotton, and the outer walls of the filter cotton are connected with the air inlet cover; the air supply cover is connected with the air inlet cover, a first fan is arranged in the air supply cover, and the first fan is fixedly connected with the air supply cover; the semiconductor cooling device comprises a heat conducting block, wherein a semiconductor cooling fin is arranged in the heat conducting block, a first radiating fin is arranged on the outer wall of the heat conducting block, and the first radiating fin is fixedly connected with a first fan.
Active heat sinks differ from passive heat sink strategies. The active radiator generally refers to a radiator needing an external power supply, and the fan is driven to operate through the external power supply, so that the ventilation of the surface of the radiating fin is accelerated, and the effect of accelerating heat dissipation is achieved. The passive radiator refers to a radiator without an external power supply, and the surface area of the radiating fin is increased by carrying out morphological design on the radiating fin, or the radiating fin is manufactured by using metal with stronger heat conduction performance, so that the effect of accelerating heat exchange with the CPU and the outside is achieved. The active radiator has better radiating effect, the passive radiator has smaller noise, and an additional external power supply is not needed, so that the energy is saved and the environment is protected.
In view of the above related art, there is a problem that the heat dissipation structure of the conventional computer processor has poor energy consumption and heat dissipation combination.
Disclosure of utility model
In view of the above-mentioned shortcomings of the prior art, the present utility model is directed to a waste heat recovery auxiliary heat dissipating device for a computer processor, which aims to solve the problem of poor energy consumption and heat dissipation combination of the heat dissipating structure of the existing computer processor.
The application provides an auxiliary heat dissipation device for waste heat recovery of a computer processor, which adopts the following technical scheme: the auxiliary heat dissipating device for recovering waste heat of computer processor includes heat dissipating assembly for contacting with the computer processor and absorbing heat;
The thermoelectric sheet comprises a heat source surface and a cold source surface, the heat source surface and the cold source surface are oppositely arranged on the thermoelectric sheet, and the heat dissipation assembly is attached to the heat source surface;
And the heat radiation fan is arranged on the heat radiation component and is electrically connected with the thermoelectric sheet.
Optionally, the heat dissipation assembly includes a heat dissipation base, a heat conduction member, and a first heat dissipation member, where the heat conduction member is connected to the heat dissipation base and the first heat dissipation member respectively;
the heat dissipation base is used for contacting with the computer processor and absorbing heat;
one side of the first heat dissipation piece is attached to the heat source surface, and the heat dissipation fan is arranged on the other side of the first heat dissipation piece.
Optionally, the first heat dissipation piece includes a first heat dissipation substrate and first heat dissipation fins, the first heat dissipation fins are disposed on the first heat dissipation substrate, the first heat dissipation fins are plural, and the plural first heat dissipation fins are disposed at intervals on the first heat dissipation substrate;
the first radiating substrate is attached to the heat source surface, and the radiating fan is arranged on the first radiating fins.
Optionally, the heat conducting piece is provided with a plurality of, and a plurality of the heat conducting piece is in the heat dissipation base with the interval arrangement between the first heat dissipation piece.
Optionally, the heat conducting piece is a copper heat pipe, and the plurality of heat conducting pieces penetrate through the first heat radiating piece.
Optionally, the first heat dissipation piece is provided with a mounting groove, a mounting bracket is arranged in the mounting groove, and the heat dissipation fan is arranged on the mounting bracket.
Optionally, the cold source surface is provided with a second heat dissipation element.
Optionally, the surfaces of the heat source surface and the cold source surface are coated with a first heat conducting layer.
Optionally, a surface of the heat dissipation base, which is in contact with the computer processor, is coated with a second heat conduction layer.
Optionally, the heat dissipation base is provided with a threaded hole for installation.
Compared with the prior art, the embodiment of the utility model has the following advantages:
When the computer processor works, the computer processor generates waste heat, the heat radiating component absorbs heat generated from the computer processor, the heat source sheet is attached to the heat radiating component, so that the temperature of the heat source sheet is increased, the temperature of the cold source surface at the other side of the thermoelectric sheet is not greatly changed, at the moment, the temperature difference is generated between the heat source surface and the cold source surface, and the thermoelectric sheet generates an electric potential between the heat source surface and the cold source surface as known by the Seebeck effect. The heat dissipation fan is electrically connected with the thermoelectric sheets, so that the heat dissipation fan rotates, and heat dissipation of the heat dissipation assembly is promoted.
When the computer processor stops working, the heat radiating component cannot absorb heat from the computer processor, so that no temperature difference exists between the heat source surface and the cold source surface, no electric potential is generated any more, and the heat radiating fan stops rotating along with the electric potential.
When the computer processor works and needs to radiate heat, the radiating fan automatically works to promote heat radiation, and when the computer processor does not work and does not need to radiate heat, the radiating fan can automatically stop working and does not need an external power supply, so that the problem that the existing radiating structure of the computer processor has poor energy consumption and heat radiation combination property is solved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic diagram showing the overall structure of an auxiliary heat dissipating device for waste heat recovery of a computer processor in accordance with an embodiment of the present application;
FIG. 2 is an exploded view of a computer processor waste heat recovery auxiliary heat sink in accordance with an embodiment of the present application;
FIG. 3 is an exploded view of a thermoelectric chip of a computer processor waste heat recovery auxiliary heat sink mated with a second heat sink in accordance with an embodiment of the present application;
FIG. 4 is a schematic view of a heat dissipating assembly of an auxiliary heat dissipating device for waste heat recovery of a computer processor according to an embodiment of the present application;
Fig. 5 is a schematic view illustrating different angles of a heat dissipating assembly of an auxiliary heat dissipating device for waste heat recovery of a computer processor according to an embodiment of the present application.
Reference numerals illustrate:
1. A heat dissipation assembly; 11. a heat dissipation base; 111. a threaded hole; 12. a heat conductive member; 121. a heat absorbing section; 122. a heat conduction part; 13. a first heat sink; 131. a first heat dissipation substrate; 132. a first heat radiating fin; 1321. a mounting groove; 1322. a mounting bracket; 1322a, a fixing portion; 1322b, a connection; 2. a thermoelectric sheet; 21. a heat source surface; 22. a cold source surface; 221. a second heat sink; 23. an electric wire; 3. a heat radiation fan.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the following description will make clear and complete descriptions of the technical solutions of the embodiments of the present utility model with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The application is described in further detail below with reference to the drawings.
The embodiment of the application discloses an auxiliary heat dissipation device for waste heat recovery of a computer processor.
As shown in fig. 1, 2 and 3, a waste heat recovery auxiliary heat dissipating device for a computer processor includes: a heat dissipation assembly 1, a thermoelectric sheet 2 and a heat dissipation fan 3. The heat dissipation assembly 1 is used for contacting with a computer processor and absorbing heat; the thermoelectric sheet 2 includes a heat source surface 21 and a cold source surface 22, the heat source surface 21 and the cold source surface 22 are disposed opposite to each other on the thermoelectric sheet 2, and the heat dissipation assembly 1 is attached to the heat source surface 21; the heat dissipation fan 3 is disposed on the heat dissipation assembly 1, and the heat dissipation fan 3 is electrically connected with the thermoelectric chip 2.
When the computer processor works, the computer processor generates waste heat, the heat dissipation component 1 absorbs heat generated from the computer processor, the heat source sheet is attached to the heat dissipation component 1, so that the temperature of the heat source sheet is increased, the temperature of the cold source surface 22 on the other side of the thermoelectric sheet 2 is not greatly changed, at this time, a temperature difference is generated between the heat source surface 21 and the cold source surface 22, and at this time, the thermoelectric sheet 2 generates an electric potential between the heat source surface 21 and the cold source surface 22 as known from the Seebeck effect. The heat dissipation fan 3 is electrically connected with the thermoelectric sheets 2, so that the heat dissipation fan 3 rotates, and heat dissipation of the heat dissipation assembly 1 is promoted.
When the computer processor stops working, the heat radiating component 1 cannot absorb heat from the computer processor, so that no temperature difference exists between the heat source surface 21 and the cold source surface 22, no electric potential is generated any more, and the heat radiating fan 3 stops rotating along with the electric potential.
When the computer processor works and needs to radiate heat, the radiating fan 3 works automatically to promote heat radiation, and when the computer processor does not work and does not need to radiate heat, the radiating fan 3 can stop working automatically and does not need an external power supply, so that the problem that the existing radiating structure of the computer processor has poor energy consumption and heat radiation combination property is solved.
Specifically, the thermoelectric sheet 2 is a semiconductor thermoelectric sheet, the thermoelectric sheet 2 has a rectangular shape as a whole, and the cold source surface 22 and the heat source surface 21 are opposite surfaces of the thermoelectric sheet 2.
The cooling fan 3 is a low-pressure fan, so that the air circulation on the surface of the cooling assembly 1 can be accelerated, the cooling is promoted, the rotating speed of the cooling assembly is low, and the noise is low in the running process.
The thermoelectric chip 2 and the cooling fan 3 are connected by a wire 23 jumper.
The heat dissipation assembly 1 comprises a heat dissipation base 11, a heat conduction member 12 and a first heat dissipation member 13, wherein the heat conduction member 12 is respectively connected with the heat dissipation base 11 and the first heat dissipation member 13.
The heat dissipation base 11 is used for contacting with the computer processor and absorbing heat, and a threaded hole 111 for installation is arranged on the heat dissipation base 11.
One side of the first heat sink 13 is bonded to the heat source surface 21, and the other side is provided with a heat radiation fan 3.
Specifically, as shown in fig. 1, 2, 4 and 5, the heat dissipation base 11 has a cubic shape as a whole, a plurality of screw holes 111 are provided, and a plurality of screw holes 111 are provided at four top corners of the heat dissipation base 11, respectively. The arrangement of the four screw holes 111 can fix the heat dissipation base 11 with the base bracket installed on the back of the motherboard through the four screw holes 111 when the heat dissipation base is installed on the CPU.
The provision of the threaded hole 111 also facilitates disassembly, maintenance and replacement of the heat dissipation base 11.
The surface of the heat dissipation base 11, which is contacted with the computer processor, is coated with a second heat conduction layer
Specifically, the second heat conduction layer is a silicone grease layer, and the coating of the second heat conduction layer can improve the heat conductivity between the computer processor and the base and effectively reduce the temperature of the computer processor.
The heat conducting member 12 is a copper heat pipe, and copper is used as a material of the heat conducting member 12, so that heat conducting efficiency can be improved, and heat can be quickly conducted to the first heat radiating member 13.
The heat conducting member 12 is integrally formed in a bent tubular shape, and in this embodiment, the bending angle of the bending portion of the heat conducting member 12 is ninety degrees.
One end of the heat conductive member 12 penetrates from one side of the heat dissipation base 11, and the other end penetrates from the bottom of the first heat dissipation member 13. The heat conducting member 12 penetrates through the heat dissipation base 11 to fully absorb heat in the heat dissipation base 11, and the heat conducting member 12 penetrates through the first heat dissipation member 13 to fully transfer the heat in the heat conducting member 12 into the first heat dissipation member 13, so that the heat in the first heat dissipation member 13 is uniformly distributed.
The heat conducting member 12 includes a heat absorbing portion 121 and a heat conducting portion 122, an included angle between the heat absorbing portion 121 and the heat conducting portion 122 is ninety degrees, the heat absorbing portion 121 penetrates through the heat dissipating bottom plate to absorb heat in the heat dissipating bottom plate, and the heat conducting portion 122 penetrates through the first heat dissipating member 13 to guide heat in the heat conducting member 12 into the first heat dissipating member 13.
The side wall of the heat conducting part 122 is exposed from the inside of the heat dissipation bottom and is directly contacted with the computer processor, so that the heat on the computer processor can be directly absorbed by the heat conducting part 122, the heat conducting part 122 can absorb the heat from the computer processor while absorbing the heat from the heat dissipation bottom plate, and the heat conduction efficiency of the heat conducting piece 12 is increased.
The heat conductive member 12 is provided in plurality, and the plurality of heat conductive members 12 are arranged at intervals between the heat dissipation base 11 and the first heat dissipation member 13.
The plurality of heat conducting pieces 12 are arranged between the heat radiating base 11 and the first heat radiating piece 13 at intervals, so that heat at each position of the heat radiating base 11 can be fully absorbed, and the heat distribution on the first heat radiating piece 13 is more uniform.
The heat dissipation base 11, the heat conduction member 12 and the first heat dissipation member 13 are connected to form an L shape as a whole, and the heat dissipation base 11 and the first heat dissipation member 13 are distributed into an upper layer and a lower layer through the connection of the heat conduction member 12.
The first heat dissipation element 13 includes a first heat dissipation substrate 131 and first heat dissipation fins 132, the first heat dissipation fins 132 are disposed on the first heat dissipation substrate 131, the first heat dissipation fins 132 are disposed in plurality, and the plurality of first heat dissipation fins 132 are disposed on the first heat dissipation substrate 131 at intervals.
The first heat radiation substrate 131 is attached to the heat source surface 21, and the heat radiation fan 3 is provided on the first heat radiation fins 132.
Specifically, the first heat dissipation substrate 131 has a rectangular shape identical to the thermoelectric sheet 2, and the surface area of the surface of the first heat dissipation substrate 131 to which the thermoelectric sheet 2 is attached is identical to the surface area of the heat source surface 21. So that the heat source surface 21 can sufficiently absorb the heat on the first heat radiating substrate 131 to uniformly heat the heat source surface 21.
The plurality of first heat dissipation fins 132 are disposed at intervals on a surface of the first heat dissipation substrate 131 facing away from the heat source bonding surface 21. One end of the plurality of first radiating fins, which is away from the first radiating substrate 131, jointly forms a radiating surface, and the radiating fan 3 is attached to the radiating surface.
A part of the heat absorbed by the first heat dissipating substrate 131 is absorbed by the heat source surface 21, so that a temperature difference is formed between the heat source surface 21 and the cold source surface 22 to generate electric potential, the heat dissipating fan 3 is driven to work, and the other part of the heat is transferred to the first heat dissipating fins 132 to dissipate heat. And the heat radiation fan 3 attached to the heat radiation surface starts to operate after receiving the energy transferred from the thermoelectric chips 2, thereby accelerating the heat radiation from the first heat radiation fins 132.
The first heat sink 13 is provided with a mounting groove 1321, a mounting bracket 1322 is provided in the mounting groove 1321, and the heat radiation fan 3 is provided on the mounting bracket 1322.
Specifically, the plurality of first heat dissipation fins 132 are formed with a mounting surface on a side facing away from the heat dissipation base 11, and a mounting groove 1321 is provided on the mounting surface, the mounting groove 1321 penetrates the plurality of first heat dissipation fins 132, and the mounting groove 1321 is parallel to a side of the first heat dissipation substrate 131 facing away from the heat dissipation base 11.
The mounting bracket 1322 includes a fixing portion 1322a and a connecting portion 1322b, two connecting portions 1322b are provided, and two connecting portions 1322b are provided at both ends of the fixing portion 1322 a. The fixing portion 1322a is fitted and fixed in the mounting groove 1321, and the two connecting portions 1322b extend in the direction of the cooling fan 3.
The outer frame of the cooling fan 3 is provided with two clamping holes corresponding to the positions of the two connecting parts 1322b, the two connecting parts 1322b respectively penetrate into the corresponding clamping holes, each connecting part 1322b penetrates out of the corresponding clamping hole and bends at one side of the penetrating out, so that the cooling fan 3 is mounted and fixed on the mounting bracket 1322, and the fixing part 1322a is fixed in the mounting groove 1321, so that the cooling fan 3 is fixed on the first cooling piece 13.
As shown in fig. 1, 2 and 3, the cold source surface 22 is provided with a second heat sink 221.
Specifically, set up the second radiating piece 221 on the cold source face 22, the second radiating piece 221 is the same with the structure of first radiating piece 13, including second radiating base plate and a plurality of second radiating fin, second radiating base plate one side is laminated with cold source face 22, a plurality of radiating fin intervals set up in the second radiating base plate one side that deviates from cold source face 22, the second radiating piece 221 can cool down cold source face 22, can ensure the heat dissipation of thermoelectric piece 2 cold junction, guaranteed the difference in temperature at thermoelectric piece 2 both ends.
The surfaces of the heat source surface 21 and the cold source surface 22 are coated with a first heat conductive layer.
Specifically, the surfaces of the heat source surface 21 and the heat sink surface 22 are coated with the first heat conductive layer, so that the heat conduction efficiency between the heat source surface 21 and the first heat sink 13 and the heat conduction efficiency between the heat sink surface 22 and the second heat sink 221 can be enhanced.
In this embodiment, the first heat conducting layer is a heat conducting adhesive, which can ensure the close adhesion between the heat source surface 21 and the first heat dissipation element 13, and the close adhesion between the cold source surface 22 and the second heat dissipation element 221, and also ensure the heat conduction.
In summary, the auxiliary heat dissipation device for waste heat recovery of a computer processor includes: a heat dissipation assembly 1, a thermoelectric sheet 2 and a heat dissipation fan 3. The heat dissipation assembly 1 is used for contacting with a computer processor and absorbing heat; the thermoelectric sheet 2 includes a heat source surface 21 and a cold source surface 22, the heat source surface 21 and the cold source surface 22 are disposed opposite to each other on the thermoelectric sheet 2, and the heat dissipation assembly 1 is attached to the heat source surface 21; the heat dissipation fan 3 is disposed on the heat dissipation assembly 1, and the heat dissipation fan 3 is electrically connected with the thermoelectric chip 2.
When the computer processor works, the computer processor generates waste heat, the heat dissipation component 1 absorbs heat generated from the computer processor, the heat source sheet is attached to the heat dissipation component 1, so that the temperature of the heat source sheet is increased, the temperature of the cold source surface 22 on the other side of the thermoelectric sheet 2 is not greatly changed, at this time, a temperature difference is generated between the heat source surface 21 and the cold source surface 22, and at this time, the thermoelectric sheet 2 generates an electric potential between the heat source surface 21 and the cold source surface 22 as known from the Seebeck effect. The heat dissipation fan 3 is electrically connected with the thermoelectric sheets 2, so that the heat dissipation fan 3 rotates, and heat dissipation of the heat dissipation assembly 1 is promoted.
When the computer processor stops working, the heat radiating component 1 cannot absorb heat from the computer processor, so that no temperature difference exists between the heat source surface 21 and the cold source surface 22, no electric potential is generated any more, and the heat radiating fan 3 stops rotating along with the electric potential.
When the computer processor works and needs to radiate heat, the radiating fan 3 works automatically to promote heat radiation, and when the computer processor does not work and does not need to radiate heat, the radiating fan 3 can stop working automatically and does not need an external power supply, so that the problem that the existing radiating structure of the computer processor has poor energy consumption and heat radiation combination property is solved.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
It should be noted that the specific structure and working principle of the utility model are described by taking an auxiliary heat dissipating device for recovering waste heat of a computer processor as an example, but the application of the utility model is not limited by the auxiliary heat dissipating device for recovering waste heat of the computer processor, and the utility model can be applied to the production and use of other similar workpieces.
It is to be understood that the utility model is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. A computer processor waste heat recovery auxiliary heat sink, comprising:
the heat dissipation assembly is used for contacting with the computer processor and absorbing heat;
The thermoelectric sheet comprises a heat source surface and a cold source surface, the heat source surface and the cold source surface are oppositely arranged on the thermoelectric sheet, and the heat dissipation assembly is attached to the heat source surface;
And the heat radiation fan is arranged on the heat radiation component and is electrically connected with the thermoelectric sheet.
2. The auxiliary heat dissipating device for waste heat recovery of a computer processor of claim 1, wherein the heat dissipating assembly comprises a heat dissipating base, a heat conducting member, and a first heat dissipating member, the heat conducting member being connected to the heat dissipating base and the first heat dissipating member, respectively;
the heat dissipation base is used for contacting with the computer processor and absorbing heat;
one side of the first heat dissipation piece is attached to the heat source surface, and the heat dissipation fan is arranged on the other side of the first heat dissipation piece.
3. The auxiliary heat dissipating device for waste heat recovery of a computer processor according to claim 2, wherein the first heat dissipating member comprises a first heat dissipating substrate and first heat dissipating fins, the first heat dissipating fins are disposed on the first heat dissipating substrate, the first heat dissipating fins are provided in plurality, and the plurality of first heat dissipating fins are disposed at intervals on the first heat dissipating substrate;
the first radiating substrate is attached to the heat source surface, and the radiating fan is arranged on the first radiating fins.
4. The auxiliary heat dissipating device for waste heat recovery of a computer processor according to claim 2, wherein a plurality of the heat conducting members are provided, and a plurality of the heat conducting members are arranged at intervals between the heat dissipating base and the first heat dissipating member.
5. The auxiliary heat dissipating apparatus for waste heat recovery of a computer processor of claim 4, wherein the heat conducting member is a copper heat pipe, and a plurality of the heat conducting members penetrate the first heat dissipating member.
6. The auxiliary heat dissipating device for waste heat recovery of a computer processor of claim 2, wherein the first heat dissipating member is provided with a mounting groove, a mounting bracket is provided in the mounting groove, and the heat dissipating fan is provided on the mounting bracket.
7. The auxiliary heat dissipating device for waste heat recovery of a computer processor of claim 1, wherein the cold source surface is provided with a second heat sink.
8. The auxiliary heat sink for waste heat recovery of a computer processor of claim 1, wherein the surfaces of the heat source surface and the heat sink surface are each coated with a first heat conductive layer.
9. The auxiliary heat sink for waste heat recovery of a computer processor of claim 2, wherein a side of the heat dissipation base in contact with the computer processor is coated with a second thermally conductive layer.
10. The auxiliary heat dissipating device for waste heat recovery of a computer processor of claim 2, wherein the heat dissipating base is provided with a threaded hole for installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323190166.8U CN221465975U (en) | 2023-11-23 | 2023-11-23 | Auxiliary heat dissipation device for waste heat recovery of computer processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323190166.8U CN221465975U (en) | 2023-11-23 | 2023-11-23 | Auxiliary heat dissipation device for waste heat recovery of computer processor |
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| Publication Number | Publication Date |
|---|---|
| CN221465975U true CN221465975U (en) | 2024-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323190166.8U Active CN221465975U (en) | 2023-11-23 | 2023-11-23 | Auxiliary heat dissipation device for waste heat recovery of computer processor |
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| Country | Link |
|---|---|
| CN (1) | CN221465975U (en) |
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2023
- 2023-11-23 CN CN202323190166.8U patent/CN221465975U/en active Active
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| GR01 | Patent grant |