CN210038689U - Novel heat dissipation module - Google Patents
Novel heat dissipation module Download PDFInfo
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- CN210038689U CN210038689U CN201920699516.8U CN201920699516U CN210038689U CN 210038689 U CN210038689 U CN 210038689U CN 201920699516 U CN201920699516 U CN 201920699516U CN 210038689 U CN210038689 U CN 210038689U
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- heat
- heat dissipation
- fin group
- radiating
- module
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Abstract
The utility model discloses a novel heat dissipation module, include: the heat dissipation plate comprises a heat dissipation plate body, a heat transfer pipe, a heat dissipation assembly and a heat conduction copper sheet fixed on the heat dissipation plate body, wherein fixing elastic sheets are arranged at four corners of the heat dissipation plate body respectively, and a fixing clip is arranged on one side of the heat dissipation plate body; the heat absorption ends of the two heat transfer pipes are connected with the heat conduction copper sheet through the viscous module; the heat radiating assembly comprises a substrate, a heat radiating fin group is arranged on the substrate, the heat radiating fin group is sequentially connected to the substrate through a plurality of heat radiating fins arranged in parallel, a groove cavity position is arranged between the bottom of the heat radiating fin group and the substrate, a heat radiating fan is arranged in the groove cavity position, and channels for installing the heat radiating end of the heat radiating pipe are arranged on two sides of the heat radiating fin group. The utility model discloses a heat-transfer pipe radiating end and radiating fin group fully contact, and the radiating effect is good, cooperates reciprocating motion's fan heat dissipation simultaneously, and the cooling rate of fin group improves to let the radiating effect of whole heat dissipation module obtain improving greatly.
Description
Technical Field
The utility model discloses a novel heat dissipation module relates to heat dissipation spare part technical field.
Background
With the rapid development of the electronic industry, the operating speed of the computer system is greatly increased, the generated heat is also increased rapidly, and how to dissipate the generated heat in time to ensure the normal operation of the computer system is always a problem that needs to be solved by manufacturers. As is well known, a cpu mounted on a motherboard is the core of a computer system, and generates heat when the computer is running. Excessive heat may cause the cpu to fail to operate properly. In order to effectively dissipate heat generated by a cpu during operation, a heat dissipation device is generally installed to dissipate the heat generated by the cpu.
A conventional heat sink generally includes a base for combining with an electronic component and a plurality of heat dissipating fins provided on the base. The base is usually a smooth heat-conducting metal plate, which is in thermal contact with the surface of the electronic component to directly absorb heat generated by the electronic component, and then the heat is transferred to the heat dissipation fins by heat conduction to be dissipated all around. Along with the corresponding centralized arrangement of the electronic components of the computer system ruler, the generated heat is more concentrated, and the heat of the whole computer system cannot be rapidly expanded through a heat dissipation mode of direct heat conduction.
Therefore, in order to solve the above existing technical problems, the present invention provides a new technical solution.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the defect among the above-mentioned background art, provide a novel heat dissipation module, the good heat dissipation module of radiating effect.
In order to achieve the above object, the utility model adopts the following technical scheme: a novel heat dissipation module, comprising: the heat dissipation plate comprises a heat dissipation plate body, a heat transfer pipe, a heat dissipation assembly and a heat conduction copper sheet fixed on the heat dissipation plate body, wherein fixing elastic sheets are arranged at four corners of the heat dissipation plate body respectively, and a fixing clip is arranged on one side of the heat dissipation plate body; the heat transfer tubes are arranged side by side and clamped on the fixing clamp, and heat absorption ends of the two heat transfer tubes are connected with the heat conduction copper sheet through the viscous module; the heat radiating end of the heat transfer pipe is connected with the heat radiating assembly, the heat radiating assembly comprises a substrate, a heat radiating fin group is arranged on the substrate, the heat radiating fin group is sequentially connected onto the substrate through a plurality of heat radiating fins arranged in parallel, a groove cavity position is arranged between the bottom of the heat radiating fin group and the base, a heat radiating fan is arranged in the groove cavity position, and channels for mounting the heat radiating end of the heat transfer pipe are arranged on two sides of the heat radiating fin group.
Furthermore, the heat dissipation end of the heat transfer pipe comprises a circular shaft body, the shaft body is evenly provided with three first heat conduction parts, the first heat conduction parts radially and integrally extend around the shaft body along the axial direction, the channel uniformly extends outwards to form a first positioning groove, the shaft body and the first heat conduction parts correspondingly penetrate through the channel and the first positioning groove respectively to be combined with the heat dissipation fin group, each first heat conduction part is provided with a second heat conduction part, the second heat conduction parts are integrally formed by extending the first heat conduction parts, the first positioning groove further extends outwards to form a second positioning groove, and the second heat conduction parts correspondingly penetrate through the second positioning groove.
Furthermore, the viscous module comprises a single-sided heat-dissipating adhesive tape and a double-sided heat-dissipating adhesive tape, the double-sided heat-dissipating adhesive tape is positioned between the heat transfer pipe and the heat-conducting copper sheet and is connected with the heat transfer pipe and the heat-conducting copper sheet, and the single-sided heat-dissipating adhesive tape is positioned on the upper layer of the heat transfer pipe so as to bond and fix the heat transfer pipe, the double-sided heat-dissipating adhesive tape; the heat transfer pipe is located cooling plate body one side, makes heat transfer pipe and heat conduction copper sheet one side fixed connection and abundant contact by fixing clip and viscidity module, and heat conduction copper sheet opposite side passes through the silicone grease and is connected with the CPU chip.
Furthermore, the heat dissipation plate body is provided with a positioning hole, and the substrate is provided with a positioning hole.
Furthermore, the radiating fins are made of aluminum alloy.
Furthermore, the cooling fan is arranged on the substrate through a ball screw mechanism, the ball screw mechanism comprises a screw rod, a nut and a driving motor, the screw rod is arranged in the groove cavity position, the nut is arranged on the screw rod, the cooling fan is fixed on the nut, and the cooling fan is driven by the driving motor to do linear reciprocating motion along the screw rod.
The utility model discloses the axis body and the three first heat conduction portion of heat-transfer pipe heat dissipation end are integrated into one piece's structure, when the CPU chip contacts heat conduction copper sheet, the heat that this CPU chip produced can be absorbed by the heat absorption end of heat-transfer pipe, through the transmission of heat-transfer pipe, and heat dissipation end axis body and first heat conduction portion transmit to the fin group that dispels the heat, utilize the structure that this first heat conduction portion extends outwards by this axis body, the heat can be transmitted to this first heat conduction portion by this axis body, and then transmit to other each places of heat radiation fin and dispel the heat by this first heat conduction portion, because first heat conduction portion is the large-area cooling surface, and can extend the second heat conduction portion, can form great contact surface with heat radiation fin, use to reach the effect that increases heat conduction area, and then promote heat conduction effect and efficiency by a wide margin;
the utility model discloses a two sets of the same heat transfer structure combines respectively with the both sides of radiating fin group to cooperation radiating fin group below sets up reciprocating motion's radiator fan, has greatly improved the cooling rate of radiating fin group near radiator fan, thereby lets the radiating effect of whole heat dissipation module obtain improving greatly.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of a structure of a heat dissipating fin assembly of the present invention;
FIG. 3 is a schematic structural view of the viscous module of the present invention;
FIG. 4 is a schematic structural view of the ball screw mechanism of the present invention;
FIG. 5 is a schematic view of a heat dissipating end of the heat transfer tube of the present invention;
fig. 6 is another schematic structural diagram of the heat dissipating plate of the present invention.
Detailed Description
The following describes the embodiments in further detail with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1-6, the utility model provides an embodiment: a novel heat dissipation module, comprising: the heat dissipation plate comprises a heat dissipation plate body 1, a heat transfer pipe 2, a heat dissipation assembly and a heat conduction copper sheet 3 fixed on the heat dissipation plate body 1, wherein four corners of the heat dissipation plate body 1 are respectively provided with a fixing elastic sheet 11, and one side of the heat dissipation plate body 1 is provided with a fixing clip 12; the heat transfer tubes 2 are arranged side by side and clamped on the fixing clamp 12, and the heat absorption ends of the two heat transfer tubes 2 are connected with the heat conduction copper sheet 3 through the viscous module 4; the heat dissipation end of heat-transfer pipe 2 is connected with radiator unit, radiator unit include base plate 51, set up radiating fin group 52 on the base plate 51, radiating fin group 52 connects gradually on base plate 51 by a plurality of parallel arrangement's radiating fin, radiating fin group 52 bottom and base between set up slot chamber position 53, set up radiator fan 61 in the slot chamber position 53, possess the passageway 7 that supplies heat-transfer pipe 2 heat dissipation end installation on radiating fin group 52's the both sides.
The heat dissipation end of the heat transfer tube 2 includes a circular shaft 20, the shaft 20 is uniformly provided with three first heat conduction portions 21, the first heat conduction portions 21 are radially and integrally extended around the shaft 20 along the axial direction, the channel 7 is outwardly and uniformly extended to form a first positioning groove 71, the shaft 20 and the first heat conduction portions 21 are respectively and correspondingly penetrated through the channel 7 and the first positioning groove 71 to be combined with the heat dissipation fin group 52, the first heat conduction portion 21 is provided with a second heat conduction portion 22, the second heat conduction portion 22 is integrally extended and formed by the first heat conduction portion 21, the first positioning groove 71 is further outwardly extended to form a second positioning groove 72, and the second heat conduction portion 22 is correspondingly penetrated through the second positioning groove 72.
The viscous module 4 comprises a single-sided heat-dissipating adhesive tape 41 and a double-sided heat-dissipating adhesive tape 42, the double-sided heat-dissipating adhesive tape 42 is positioned between the heat transfer pipe 2 and the heat-conducting copper sheet 3 and connects the heat transfer pipe 2 and the heat-conducting copper sheet 3, and the single-sided heat-dissipating adhesive tape 41 is positioned on the upper layer of the heat transfer pipe so that the heat transfer pipe 2, the double-sided heat-dissipating adhesive tape 42 and the heat-; the heat transfer pipe 2 is located on one side of the heat dissipation plate body 1, the heat transfer pipe 2 is fixedly connected and fully contacted with one side of the heat conduction copper sheet 3 through the fixing clip 12 and the viscous module 4, and the other side of the heat conduction copper sheet 3 is connected with the CPU chip through silicone grease.
The heat dissipation plate body 1 is provided with a positioning hole 13, and the substrate 51 is provided with a positioning hole 13.
The radiating fins are made of aluminum alloy.
The heat radiation fan 61 is arranged on the substrate 51 through a ball screw 62 mechanism, the ball screw 62 mechanism comprises a screw 62, a nut and a driving motor 63, the screw 62 is arranged in the groove cavity 53, the nut is arranged on the screw 62, the heat radiation fan 61 is fixed on the nut, and the heat radiation fan 61 is driven by the driving motor 63 to do linear reciprocating motion along the screw 62.
The utility model discloses the axis body and the three first heat conduction portion of heat-transfer pipe heat dissipation end are integrated into one piece's structure, when the CPU chip contacts heat conduction copper sheet, the heat that this CPU chip produced can be absorbed by the heat absorption end of heat-transfer pipe, through the transmission of heat-transfer pipe, and heat dissipation end axis body and first heat conduction portion transmit to the fin group that dispels the heat, utilize the structure that this first heat conduction portion extends outwards by this axis body, the heat can be transmitted to this first heat conduction portion by this axis body, and then transmit to other each places of heat radiation fin and dispel the heat by this first heat conduction portion, because first heat conduction portion is the large-area cooling surface, and can extend the second heat conduction portion, can form great contact surface with heat radiation fin, use to reach the effect that increases heat conduction area, and then promote heat conduction effect and efficiency by a wide margin;
the utility model discloses a two sets of the same heat transfer structure combines respectively with the both sides of radiating fin group to cooperation radiating fin group below sets up reciprocating motion's radiator fan, has greatly improved the cooling rate of radiating fin group near radiator fan, thereby lets the radiating effect of whole heat dissipation module obtain improving greatly.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (7)
1. The utility model provides a novel heat dissipation module which characterized in that includes: the heat dissipation plate comprises a heat dissipation plate body, a heat transfer pipe, a heat dissipation assembly and a heat conduction copper sheet fixed on the heat dissipation plate body, wherein fixing elastic sheets are arranged at four corners of the heat dissipation plate body respectively, and a fixing clip is arranged on one side of the heat dissipation plate body; the heat transfer tubes are arranged side by side and clamped on the fixing clamp, and heat absorption ends of the two heat transfer tubes are connected with the heat conduction copper sheet through the viscous module; the heat radiating end of the heat transfer pipe is connected with the heat radiating assembly, the heat radiating assembly comprises a substrate, a heat radiating fin group is arranged on the substrate, the heat radiating fin group is sequentially connected onto the substrate through a plurality of heat radiating fins arranged in parallel, a groove cavity position is arranged between the bottom of the heat radiating fin group and the substrate, a heat radiating fan is arranged in the groove cavity position, and channels for mounting the heat radiating end of the heat transfer pipe are arranged on two sides of the heat radiating fin group.
2. The new heat dissipating module as claimed in claim 1, wherein the heat dissipating end of the heat transfer tube includes a circular shaft body, the shaft body is uniformly provided with three first heat conducting portions, the first heat conducting portions are integrally extended and disposed around the shaft body along the axial direction, the channel is outwardly and uniformly extended with the first positioning groove, the shaft body and the first heat conducting portions are correspondingly inserted into the channel, and the first positioning groove is combined with the heat dissipating fin group.
3. The novel heat dissipation module of claim 1, wherein the adhesive module comprises a single-sided heat dissipation tape and a double-sided heat dissipation tape, the double-sided heat dissipation tape is located between the heat transfer pipe and the heat conductive copper sheet, and the single-sided heat dissipation tape is located on the upper layer of the heat transfer pipe.
4. The heat dissipating module as claimed in claim 2, wherein the first heat conducting portion has a second heat conducting portion integrally formed with the first heat conducting portion, the first positioning groove further extends outwardly to form a second positioning groove, and the second heat conducting portion correspondingly penetrates the second positioning groove.
5. The novel heat dissipation module as claimed in claim 1, wherein the heat dissipation plate has a positioning hole, and the substrate has a positioning hole.
6. The novel heat dissipation module of claim 1, wherein the heat dissipation fins are made of aluminum alloy.
7. The novel heat dissipation module as claimed in claim 1, wherein the heat dissipation fan is disposed on the substrate via a ball screw mechanism, the ball screw mechanism includes a screw, a nut and a driving motor, the screw is disposed in the cavity, the nut is disposed on the screw, the nut is fixed with the heat dissipation fan, and the heat dissipation fan is driven by the driving motor to reciprocate linearly along the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920699516.8U CN210038689U (en) | 2019-05-16 | 2019-05-16 | Novel heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920699516.8U CN210038689U (en) | 2019-05-16 | 2019-05-16 | Novel heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210038689U true CN210038689U (en) | 2020-02-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920699516.8U Expired - Fee Related CN210038689U (en) | 2019-05-16 | 2019-05-16 | Novel heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210038689U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118192773A (en) * | 2024-03-20 | 2024-06-14 | 深圳市领拓创新电子有限公司 | Multi-core design heat dissipation main board |
-
2019
- 2019-05-16 CN CN201920699516.8U patent/CN210038689U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118192773A (en) * | 2024-03-20 | 2024-06-14 | 深圳市领拓创新电子有限公司 | Multi-core design heat dissipation main board |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200207 Termination date: 20200516 |