CN209993589U

CN209993589U - IGBT radiator of miniwatt converter

Info

Publication number: CN209993589U
Application number: CN201920971238.7U
Authority: CN
Inventors: 李创晓; 韦元林
Original assignee: Shenzhen City Merbecke Drive Technology Co Ltd
Current assignee: Shenzhen City Merbecke Drive Technology Co Ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-01-24
Anticipated expiration: 2029-06-25

Abstract

The utility model discloses an IGBT radiator of a low-power frequency converter, which comprises a radiating substrate with a first radiating surface and a second radiating surface which are vertical to each other, and a plurality of radiating fins which are arranged on the inner side surface of the radiating substrate, are inclined to the radiating substrate and are parallel to each other; the length of the heat dissipation substrate in the vertical direction is greater than the length of the heat dissipation fins in the vertical direction. The utility model has the advantages that: 1. the radiating base plates which are mutually vertical in a 7 shape are adopted, two radiating installation surfaces which are mutually vertical are provided, and flexible layout of a plurality of different pin packaged heating components can be facilitated; the heat dissipation substrate and the fins are flexibly matched, so that uniform heat dissipation is facilitated, and the material cost is saved. 2. The radiator substrate extends out of the bottom surface of the machine shell and can be directly contacted with the machine cabinet, so that the frequency converter is directly connected with the machine cabinet in a grounding mode, the interference of the frequency converter is reduced at lower cost without damaging a radiating air duct and the appearance, and the electromagnetic compatibility of the system is improved.

Description

IGBT radiator of miniwatt converter

Technical Field

The utility model relates to a radiator technical field, in particular to IGBT radiator of miniwatt converter.

Background

The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices composed of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), and the driving power of the IGBT and the insulated gate bipolar transistors is small, and the saturation voltage of the IGBT and the insulated gate field effect transistors is reduced. The method is very suitable for being applied to the fields of current transformation systems with direct-current voltage of 600V or more, such as alternating-current motors, frequency converters, switching power supplies, lighting circuits, traction transmission and the like. The IGBT module is a modularized semiconductor product formed by bridge packaging of an IGBT (insulated gate bipolar transistor chip) and an FWD (freewheeling diode chip) through a specific circuit; the packaged IGBT module is directly applied to equipment such as a frequency converter, a UPS (uninterrupted power supply) and the like; the IGBT module has the characteristics of energy conservation, convenience in installation and maintenance, stable heat dissipation and the like; most of the current market products are such modular products, generally, the IGBT is also referred to as IGBT module; the IGBT is a core device for energy conversion and transmission, commonly known as the "CPU" of a power electronic device, and is used as a strategic emerging industry in the country, and has a wide application in the fields of rail transit, smart grid, aerospace, electric vehicles, new energy equipment, and the like. The main heat generating part of the IGBT module is located inside the semiconductor chip, and the heat generated by internal losses is first transferred to the header and the heat sink by thermal conduction.

Most of radiators on frequency converters on the market are in a structure that a single substrate is vertically extended to form a plurality of radiating fins, and the structure is shown in fig. 1 of the accompanying drawings. The components with large heat generation in the low-power frequency converter mainly comprise a rectifier bridge, an IGBT, an MOS tube and the like, and a plurality of single-tube IGBTs are needed. Because the radiator only has a mounting surface, the mounting layout of a plurality of heating components is inflexible, and pins need to be bent for a device with a heat dissipation surface parallel to the pins, so that the processing is complex.

In practical application, most of the frequency converters are installed in the sheet metal cabinet together with the PLC and other devices, and the electromagnetic compatibility of the whole cabinet system has great influence on the performance and stability of the devices. For the frequency converter, whether the frequency converter and the cabinet have good grounding or not determines whether electromagnetic interference can be effectively reduced or not. In the low-power frequency converter, for the consideration of appearance and a heat dissipation air duct, most of the heat radiators are wrapped in the plastic casing, so that the heat radiators cannot be conveniently contacted with the cabinet for grounding.

Disclosure of Invention

For overcoming the defect of radiator in the above-mentioned technique, the utility model provides a IGBT radiator of miniwatt converter is realized through following technical scheme.

An IGBT radiator of a low-power frequency converter comprises a radiating substrate with a first radiating surface and a second radiating surface which are vertical to each other, and a plurality of radiating fins which are arranged on the inner side surface of the radiating substrate, are inclined to the radiating substrate and are parallel to each other; the length of the heat dissipation substrate in the vertical direction is greater than the length of the heat dissipation fins in the vertical direction.

Further, the heat dissipation substrate is an equal-thickness substrate or an unequal-thickness substrate.

Furthermore, the IGBT radiator is an aluminum alloy extruded radiator.

Furthermore, a threaded hole is formed in the radiating substrate and used for installing a heating component and installing the IGBT radiator on the frequency converter shell.

The utility model has the advantages that: 1. the radiating base plates which are mutually vertical in a 7 shape are adopted, two radiating installation surfaces which are mutually vertical are provided, and flexible layout of a plurality of different pin packaged heating components can be facilitated; the heat dissipation substrate and the fins are flexibly matched, so that uniform heat dissipation is facilitated, and the material cost is saved. 2. The radiator substrate extends out of the bottom surface of the machine shell and can be directly contacted with the machine cabinet, so that the frequency converter is directly connected with the machine cabinet in a grounding mode, the interference of the frequency converter is reduced at lower cost without damaging a radiating air duct and the appearance, and the electromagnetic compatibility of the system is improved.

Drawings

Fig. 1 is a schematic view of a prior art heat sink structure.

Fig. 2 is a schematic cross-sectional view of an embodiment of the heat sink of the present invention.

Fig. 3 is a schematic structural diagram of an embodiment of the heat sink of the present invention.

Fig. 4 is an assembly schematic diagram of the heat sink assembly heating component of the present invention.

Fig. 5 is a schematic structural diagram of the heat sink of the present invention assembled on the frequency converter.

Wherein: 11-a heat-dissipating substrate; 111-a mounting plane; 112-a threaded hole;

12-heat dissipation fins;

131-a rectifier bridge; 132-an IGBT module;

21-a first heat dissipation surface; 22-a second heat dissipation surface;

51-a bottom shell of the frequency converter; 511-transducer mounting hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 5, an IGBT heat sink for a low power inverter includes a heat dissipation substrate 11 having a first heat dissipation surface 21 and a second heat dissipation surface 22 perpendicular to each other, a plurality of heat dissipation fins 12 disposed on an inner side surface of the heat dissipation substrate 11 and inclined to the heat dissipation substrate and parallel to each other; the length of the heat dissipation substrate 11 in the vertical direction is larger than the length of the heat dissipation fins 12 in the vertical direction.

The utility model provides a IGBT radiator of miniwatt converter is an extrusion type aluminum alloy radiator, is "7" font and has the heat dissipation base plate 11 of mutually perpendicular's first cooling surface 21 and second cooling surface 22 including the cross-section. Compared with the prior art, the utility model can install the heating components packaged by different pins on two heat dissipation surfaces respectively, as shown in fig. 4, the rectifier bridge 113 (the heat dissipation surface is vertical to the pins) can be installed on the horizontal heat dissipation surface; the IGBT module 132 (with its heat dissipation surface parallel to the pins) can be mounted on a vertical heat dissipation surface without bending the pins of the IGBT module, which is more favorable for flexible layout of heat-generating components and uniform heat dissipation.

Meanwhile, the angle of the radiating fins 12 inclined to the base plate is adjustable during production, the lengths of the radiating fins 12 are different for different inclined angles, the radiating efficiencies are different, and the optimal angle can be obtained according to the total power consumption of heat generated on the radiating surface.

As shown in fig. 5, the length of the heat dissipation substrate 11 in the vertical direction of the present invention is greater than the length of the heat dissipation fins 12 in the vertical direction, and the heat dissipation substrate is installed on the casing of the frequency converter, and can extend out of the bottom casing 51 of the frequency converter, and should be higher than the bottom casing 51 of the frequency converter by a proper size, and the installation of the frequency converter should not be affected by the size that is higher; the frequency converter is locked and installed on the cabinet by screws penetrating through two mounting holes 511 at opposite angles on a bottom shell 51 of the frequency converter, and the convex heat dissipation substrate 11 is in contact with the cabinet, so that the frequency converter and the cabinet have good grounding connection, interference is reduced, and the performance and stability of a product are improved.

Meanwhile, the thicknesses of the heat dissipation substrates 11 may be the same or different, and are adjusted according to the total power consumption of the heat generating components mounted thereon. The heat generating components are mainly a rectifier bridge 131 and an IGBT module 132.

In a specific embodiment, the heat dissipation substrate 11 is provided with a threaded hole 112 for mounting a heat-generating component and mounting the IGBT heat sink on the casing of the frequency converter.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The IGBT radiator of the low-power frequency converter is characterized by comprising a radiating substrate, a plurality of radiating fins, a first radiating surface and a second radiating surface, wherein the radiating substrate is provided with the first radiating surface and the second radiating surface which are vertical to each other; the length of the heat dissipation substrate in the vertical direction is greater than the length of the heat dissipation fins in the vertical direction.

2. The IGBT radiator of low-power converter according to claim 1, characterized in that the radiating substrate is a substrate with equal thickness or a substrate with different thickness.

3. The IGBT heat sink of low-power frequency converter according to claim 1, characterized in that the IGBT heat sink is an aluminum alloy extruded heat sink.

4. The IGBT radiator of low-power converter according to claim 1, characterized in that the radiating substrate is provided with threaded holes for mounting heat-generating components and mounting the IGBT radiator on the converter casing.