CN214851989U - High heat conduction type flexible circuit board - Google Patents
High heat conduction type flexible circuit board Download PDFInfo
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- CN214851989U CN214851989U CN202121313241.3U CN202121313241U CN214851989U CN 214851989 U CN214851989 U CN 214851989U CN 202121313241 U CN202121313241 U CN 202121313241U CN 214851989 U CN214851989 U CN 214851989U
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- heat
- heat conduction
- circuit board
- silica gel
- conducting
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Abstract
The utility model discloses a high heat conduction type flexible circuit board, which belongs to the technical field of flexible circuit boards, and improves the efficiency of high temperature heat conduction and the heat dissipation effect of components by arranging components such as a flexible substrate, a heat conduction sheet mounting area, a heat conduction silica gel sheet, heat dissipation holes and the like; through setting up the louvre and above fin, heat conduction silica gel piece and through-hole, the cooperation is used to make the circuit board have good heat conductivity and heat dispersion, carry out the heat conduction through the heat conduction silica gel piece in the flexible base plate and absorb, then make the absorptive temperature conduction of heat conduction silica gel piece heat conduction on the fin, dispel the heat, thereby prolong the life of components and parts on the flexible base plate and use through the through-hole on the flexible base plate and louvre cooperation, thereby improve the effect of heat conductivity and heat dispersion of flexible base plate.
Description
Technical Field
The utility model relates to a flexible printed circuit board technical field specifically is a high heat conduction type flexible printed circuit board.
Background
A Flexible Printed Circuit (FPC), which is a circuit board mainly composed of cu (copper foil), a (adhesive) and PI (Polyimide film), has many advantages such as space saving, weight reduction, and high flexibility, and is widely used in production and life, and the market is expanding.
At present, the heat conductivity of a common flexible circuit board is poor, and when the circuit board works for a long time, the circuit board is easy to generate higher temperature, so that the service life of the circuit board is shortened, loss is caused, and the common circuit board is not convenient to mount, so that the efficiency of mounting the circuit board is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high heat conduction type flexible circuit board, which improves the efficiency of high temperature heat conduction and the heat dissipation effect of components by arranging components such as a flexible substrate, a heat conduction sheet mounting area, a heat conduction silica gel sheet and heat dissipation holes; through the arrangement of the heat dissipation holes and the heat dissipation sheets, the heat conduction silica gel sheets and the through holes, the circuit board has good heat conductivity and heat dissipation performance.
To solve the problems set forth in the background art described above.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high heat conduction type flexible printed circuit, includes flexible base plate, first heat conduction glue film, through-hole, conducting strip installation region, heat conduction silica gel piece, louvre and fin, flexible base plate's top is equipped with the lower surface, the top of lower surface scribbles first heat conduction glue film, flexible base plate's inside both ends are equipped with conducting strip installation region, the inside heat conduction silica gel piece that bonds of conducting strip installation region, flexible base plate's bottom is equipped with the upper surface, the top both ends of upper surface are equipped with the fin, at least three groups of louvres are seted up at flexible base plate's inside center, flexible base plate's the through-hole is seted up at both ends about the surface.
Preferably, the hard plates are fixed on two sides of the soft substrate, the upper end and the lower end of the lower surface of each hard plate are bonded with the fixed blocks through the first heat-conducting adhesive layers, and the tops of the fixed blocks are fixedly connected with the clamping blocks.
Preferably, the upper end and the lower end of the center of the lower surface of the flexible substrate are provided with component mounting areas, and the width of each component mounting area is 3 cm.
Preferably, the thickness of the heat-conducting silica gel sheet is 3mm, and the density of the heat-conducting silica gel sheet is 3.55 g.
Preferably, the heat conductivity coefficient of the heat-conducting silica gel sheet is 8.0w, and the withstand voltage value of the heat-conducting silica gel sheet is 15 kv.
Preferably, the thickness of the radiating fin is 3.5mm, and the distance between the radiating fin and the heat conduction silica gel sheet is 0.5 mm.
Preferably, opposite thread blocks are bonded to the middle parts of the two groups of fixing blocks, and concave holes are formed in the thread blocks.
Preferably, the internal thread of shrinkage pool connects the screw thread post, the top fixed connection locating lever of screw thread post.
Preferably, the top of the upper surface is coated with a second heat-conducting glue layer.
Preferably, the two ends of the surface of the second heat-conducting adhesive layer are provided with heat-radiating fin mounting areas, and heat-radiating fins are bonded in the heat-radiating fin mounting areas.
Compared with the prior art, the beneficial effects of the utility model are that:
compared with the prior art, the heat conducting silicon sheet is convenient to mount and place by arranging the soft substrate, the heat conducting sheet mounting area, the heat conducting silicon sheet, the heat radiating holes and other parts, and arranging the heat conducting sheet mounting areas at the two ends in the soft substrate, so that when components on the soft substrate work, the generated high temperature conducts heat through the heat conducting silicon sheet, and the efficiency of the components for generating high-temperature heat conduction is improved; through the through holes arranged on the periphery of the flexible substrate, the heat dissipation effect of the component is improved;
the heat dissipation holes, the heat dissipation plate mounting area, the heat dissipation plate and other components are arranged to be matched with the heat conduction silica gel sheet for use, so that a good heat dissipation effect is achieved on components on the flexible substrate, and the service life of the components is prolonged; through the arrangement of the heat dissipation holes and the heat dissipation sheets, the heat conduction silica gel sheets and the through holes, the circuit board has good heat conductivity and heat dissipation performance.
The fixing block is bonded around the flexible substrate by arranging the fixing block, the clamping block, the positioning rod, the threaded column, the threaded block, the concave hole and the like in a matched manner, so that the clamping block on the fixing block is fixedly supported, and the flexible substrate has an effect of facilitating installation by arranging the clamping block; through setting up the locating lever, make soft base plate play the effect of location when the installation, and through setting up screw thread post, screw thread piece and shrinkage pool to be convenient for play the effect of dismouting to the locating lever above that.
Drawings
FIG. 1 is a schematic view of the lower surface structure of the circuit board of the present invention;
FIG. 2 is a schematic view of the upper surface structure of the circuit board of the present invention;
FIG. 3 is a schematic view of the positioning rod of the present invention;
fig. 4 is a schematic view of the overlooking structure of the lower surface of the circuit board of the present invention.
In the figure: 1. a flexible substrate; 2. a fixed block; 201. a clamping block; 3. positioning a rod; 301. a threaded post; 302. a thread block; 303. concave holes; 4. a first heat-conducting adhesive layer; 5. a component mounting area; 6. a through hole; 7. a heat-conducting sheet mounting area; 701. a heat-conducting silica gel sheet; 8. heat dissipation holes; 9. a second heat-conducting adhesive layer; 10. a heat sink mounting area; 11. a heat sink; 12. an upper surface; 13. a lower surface; 14. and (5) hard plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 4, the present invention provides a technical solution: a high heat conduction type flexible circuit board comprises a flexible substrate 1, a first heat conduction adhesive layer 4, a through hole 6, a heat conduction sheet mounting area 7, a heat conduction silica gel sheet 701, a heat dissipation hole 8 and a heat dissipation fin 11, wherein the top of the flexible substrate 1 is provided with a lower surface 13, the top of the lower surface 13 is coated with the first heat conduction adhesive layer 4, the first heat conduction adhesive layer 4 and a second heat conduction adhesive layer 9 are single-component heat conduction type room temperature curing organic silicon bonding sealant which mainly has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance, the heat conduction sheet mounting area 7 is arranged at two inner ends of the flexible substrate 1, and the heat conduction sheet mounting area 7 mainly plays a role in placing the heat conduction silica gel sheet 701, so that disorder is avoided;
the heat conducting silicone sheet 701 is bonded in the heat conducting sheet mounting area 7, the heat conducting silicone sheet 701 is made of silicone rubber as a base material, various auxiliary materials such as metal oxides are added, a heat conducting medium material synthesized by a special process mainly plays a role in heat conducting and transferring, the bottom of the flexible substrate 1 is provided with an upper surface 12, two ends of the top of the upper surface 12 are provided with radiating fins 11, the top of the upper surface 12 is coated with a second heat conducting adhesive layer 9, two ends of the surface of the second heat conducting adhesive layer 9 are provided with radiating fin mounting areas 10, the radiating fins 11 are bonded in the radiating fin mounting areas 10, the radiating fins 11 are devices for radiating electronic elements which are easy to generate heat in an electrical appliance, are made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a multi-sheet shape and the like, and mainly play a role in radiating heat of components on the flexible substrate 1, at least three groups of radiating holes 8 are formed in the inner center of the flexible substrate 1, through holes 6 are formed in the upper end and the lower end of the surface of the flexible substrate 1, and the heat dissipation holes 8 and the through holes 6 are formed, so that a good heat dissipation effect is achieved when components on the flexible substrate 1 dissipate heat;
hard plates 14 are fixed on two sides of the flexible substrate 1, the upper end and the lower end of the lower surface 13 of each hard plate 14 are bonded with the fixed block 2 through the first heat-conducting adhesive layer 4, the upper end and the lower end of the lower surface 13 of each hard plate 14 are bonded with the fixed blocks 2 through the first heat-conducting adhesive layers 4, the tops of the fixed blocks 2 are fixedly connected with the fixture blocks 201, and the flexible substrate 1 has the effect of being convenient to install through the fixed blocks 2 and the fixture blocks 201;
the upper end and the lower end of the center of the lower surface 13 of the flexible substrate 1 are provided with component mounting areas 5, the component mounting areas 5 mainly have the function of mounting components on the flexible substrate 1, and the width of the component mounting areas 5 is 3 cm;
the thickness of the heat-conducting silicone sheet 701 is 3mm, the density of the heat-conducting silicone sheet 701 is 3.55g, the heat conductivity coefficient of the heat-conducting silicone sheet 701 is 8.0w, the voltage resistance value of the heat-conducting silicone sheet 701 is 15kv, the thickness of the heat sink 11 is 3.5mm, the distance between the heat sink 11 and the heat-conducting silicone sheet 701 is 0.5mm, and the heat conduction and the heat dissipation performance of the flexible substrate 1 reach the optimal state by setting the specification distance between the heat-conducting silicone sheet 701 and the heat sink 11;
firstly, when the components on the flexible substrate 1 work, the components on the flexible substrate are easy to generate high temperature, at this time, heat conduction and absorption are carried out through the heat conduction silicone sheet 701 in the flexible substrate 1, then the heat conduction and absorption temperature of the heat conduction silicone sheet 701 is conducted on the radiating fin 11 for radiating, so that the service life of the components on the flexible substrate 1 is prolonged, and the components are matched with the radiating holes 8 through the through holes 6 on the flexible substrate 1, so that the effects of heat conductivity and radiating performance of the flexible substrate 1 are improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a high heat conduction type flexible printed circuit, includes flexible substrate (1), first heat conduction glue film (4), through-hole (6), conducting strip installation region (7), heat conduction silica gel piece (701), louvre (8) and fin (11), its characterized in that: the top of soft base plate (1) is equipped with lower surface (13), the top of lower surface (13) scribbles first heat-conducting adhesive layer (4), the inside both ends of soft base plate (1) are equipped with conducting strip installation area (7), conducting strip installation area (7) inside bonding heat conduction silica gel piece (701), the bottom of soft base plate (1) is equipped with upper surface (12), the top both ends of upper surface (12) are equipped with fin (11), at least three group's louvres (8) are seted up at the inside center of soft base plate (1), through-hole (6) are seted up at the both ends about the surface of soft base plate (1).
2. The high thermal conductivity flexible printed circuit board of claim 1, wherein: hard board (14) are fixed to the both sides of soft base plate (1), the lower surface (13) of hard board (14) is from top to bottom held and is bonded fixed block (2) through first heat-conducting glue layer (4), top fixed connection fixture block (201) of fixed block (2).
3. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the upper end and the lower end of the center of the lower surface (13) of the flexible substrate (1) are provided with component mounting areas (5), and the width of each component mounting area (5) is 3 cm.
4. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the thickness of heat conduction silica gel piece (701) is 3mm, the density of heat conduction silica gel piece (701) is 3.55 g.
5. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the heat conductivity coefficient of the heat-conducting silica gel sheet (701) is 8.0w, and the withstand voltage value of the heat-conducting silica gel sheet (701) is 15 kv.
6. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the thickness of the radiating fin (11) is 3.5mm, and the distance between the radiating fin (11) and the heat-conducting silica gel sheet (701) is 0.5 mm.
7. The high thermal conductivity flexible printed circuit board of claim 2, wherein: opposite thread blocks (302) are bonded at the middle parts of the two opposite groups of fixed blocks (2), and concave holes (303) are formed in the thread blocks (302).
8. The high thermal conductivity flexible printed circuit board of claim 7, wherein: the internal thread of shrinkage pool (303) connects screw thread post (301), the top fixed connection locating lever (3) of screw thread post (301).
9. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the top of the upper surface (12) is coated with a second heat-conducting glue layer (9).
10. The high thermal conductivity flexible printed circuit board of claim 9, wherein: and heat radiating fin mounting areas (10) are arranged at two ends of the surface of the second heat conducting adhesive layer (9), and heat radiating fins (11) are bonded inside the heat radiating fin mounting areas (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121313241.3U CN214851989U (en) | 2021-06-12 | 2021-06-12 | High heat conduction type flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121313241.3U CN214851989U (en) | 2021-06-12 | 2021-06-12 | High heat conduction type flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214851989U true CN214851989U (en) | 2021-11-23 |
Family
ID=78805553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121313241.3U Active CN214851989U (en) | 2021-06-12 | 2021-06-12 | High heat conduction type flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214851989U (en) |
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2021
- 2021-06-12 CN CN202121313241.3U patent/CN214851989U/en active Active
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