CN219087587U

CN219087587U - Multilayer printed PCB circuit board capable of rapidly radiating heat

Info

Publication number: CN219087587U
Application number: CN202223206022.2U
Authority: CN
Inventors: 佟彤; 陈林乐
Original assignee: Huizhou Jinxin Electronic Industry Co ltd
Current assignee: Huizhou Jinxin Electronic Industry Co ltd
Priority date: 2022-12-01
Filing date: 2022-12-01
Publication date: 2023-05-26
Anticipated expiration: 2032-12-01

Abstract

The utility model relates to a multilayer printed PCB circuit board capable of rapidly radiating, which comprises a base, a first circuit board, a second circuit board and a third circuit board which are movably arranged on the base, wherein radiating mechanisms are arranged on the base and the first circuit board, the second circuit board and the third circuit board, each radiating mechanism comprises two radiating mounting plates fixedly arranged on the upper surface of the base, the surfaces of the opposite sides of the two radiating mounting plates are respectively provided with three mounting grooves, and a first heat conducting block is fixedly arranged on the left surface and the right surface of the first circuit board, the second circuit board and the third circuit board respectively. This but quick radiating multilayer printed PCB circuit board is equipped with the heat conduction piece through being equipped with on the circuit board, is equipped with the heat dissipation mounting panel on the base, is equipped with mounting groove, heating panel and radiating fin on the heat dissipation mounting panel, is equipped with the return bend in the heating panel, is equipped with the coolant liquid in the return bend, can take away the heat that produces on the circuit board fast when using, prevents that circuit board surface temperature from being too high.

Description

Multilayer printed PCB circuit board capable of rapidly radiating heat

Technical Field

The utility model relates to the technical field of PCB circuit boards, in particular to a multilayer printed PCB circuit board capable of rapidly radiating heat.

Background

The PCB printed board, also called printed circuit board, multilayer printed board refers to more than two layers of printed boards, it is made up of connecting wires on several layers of insulating base plates and bonding pads for assembling and welding electronic components, it has effects of conducting each layer of circuit, and insulating each other.

According to chinese patent CN 217064091U, a multilayer printed PCB circuit board capable of fast heat dissipation is disclosed, which comprises a base, a multilayer printed PCB circuit board body, and the technical points are: the four corners of the upper surface of the base are respectively provided with a pair of vertical screws which are positioned on the same side of the base, each pair of vertical screws is provided with a plurality of horizontal supporting tables, the number of the horizontal supporting tables arranged on the two pairs of vertical screws is equal and corresponds to that of the two horizontal supporting tables one by one, a wave-shaped supporting plate is connected between the two horizontal supporting tables which correspond to each other, an air supply channel is longitudinally inserted into the horizontal supporting tables, the wave-shaped supporting plate is a hollow plate and is communicated with a lateral opening of the air supply channel, and a printed PCB circuit board body is arranged above the wave-shaped supporting plate, and the bottom surface of the printed PCB circuit board body is a wave surface matched with the wave-shaped supporting plate; the problem of current multilayer printed PCB circuit board poor heat dissipation is solved, the life of circuit board has been showing to the improvement.

The above patent improves the problem of poor heat dissipation of the existing multilayer printed PCB circuit board during use, and improves the heat dissipation of the multilayer printed PCB circuit board and the service life of the circuit board.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides the multilayer printed PCB which can rapidly dissipate heat, has the advantages of good heat dissipation and contribution to prolonging the service life of the PCB, and solves the problem of poor heat dissipation of the traditional multilayer printed PCB.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a but quick radiating multilayer printed PCB circuit board, includes base and movable mounting is the circuit board No. one, no. two circuit boards and No. three circuit boards on the base, be equipped with the cooling machanism on base and the circuit board No. one, no. two circuit boards and No. three circuit boards;

the heat dissipation mechanism comprises heat dissipation mounting plates which are fixedly mounted on the upper surface of a base and are two in number, three mounting grooves are formed in the surfaces of one side, opposite to the heat dissipation mounting plates, of the heat dissipation mounting plates, a first heat conduction block, a second heat conduction block and a third heat conduction block are fixedly mounted on the left surface and the right surface of the first circuit board, the second circuit board and the third circuit board respectively, the first heat conduction block, the second heat conduction block and the third heat conduction block are movably mounted in the three mounting grooves respectively, and heat dissipation fins are fixedly mounted on the surface of one side, opposite to the heat dissipation mounting plates, of the heat dissipation mounting plates.

Further, two fixed mounting has the heating panel between the relative one side surface of heat dissipation mounting panel, fixed mounting has the return bend in the heating panel, be equipped with the coolant liquid in the return bend, two heating panel upper surface and lower surface respectively with No. one circuit board lower surface, no. two circuit board upper surfaces and No. two circuit board lower surfaces, no. three circuit board upper surfaces contact.

Further, the number of the radiating fins is not less than eighteen.

Further, the first heat conducting block, the second heat conducting block and the third heat conducting block are all matched with the mounting groove.

Further, the distance between two adjacent radiating fins is not smaller than five millimeters and not larger than eight millimeters.

Further, the surfaces of the first circuit board, the second circuit board and the third circuit board, which are in contact with the heat dissipation plate, are coated with heat dissipation silica gel.

Further, the distance between the first circuit board, the second circuit board and the third circuit board is larger than the thickness of the heat dissipation plate.

Further, the distance between the lower surface of the third circuit board and the upper surface of the base is more than zero and less than one centimeter.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

this but quick radiating multilayer printed PCB circuit board is equipped with the heat conduction piece through being equipped with on the circuit board, is equipped with the heat dissipation mounting panel on the base, is equipped with mounting groove, heating panel and radiating fin on the heat dissipation mounting panel, is equipped with the return bend in the heating panel, is equipped with the coolant liquid in the return bend, can take away the heat that produces on the circuit board fast when using, prevents that circuit board surface temperature from being too high.

Drawings

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic diagram of the internal structure of the heat dissipating plate according to the present utility model;

FIG. 3 is a schematic view of the appearance structure of the present utility model.

In the figure: 1. a base; 2. a first circuit board; 3. a second wiring board; 4. a third wiring board; 5. a heat dissipation mounting plate; 6. a mounting groove; 7. a first heat conducting block; 8. a second heat conducting block; 9. a third heat conducting block; 10. a heat radiation fin; 11. a heat dissipation plate; 12. and (3) bending the pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, a multilayer printed PCB circuit board capable of fast heat dissipation in this embodiment includes a base 1, a first circuit board 2, a second circuit board 3 and a third circuit board 4 movably mounted on the base 1, a heat dissipation mechanism disposed on the base 1 and the first circuit board 2, the second circuit board 3 and the third circuit board 4, the heat dissipation mechanism includes two heat dissipation mounting plates 5 fixedly mounted on an upper surface of the base 1, heat dissipation plates 11 are fixedly mounted between opposite side surfaces of the two heat dissipation mounting plates 5, an elbow 12 is fixedly mounted in the heat dissipation plates 11, a cooling liquid is filled in the elbow 12, upper surfaces and lower surfaces of the two heat dissipation plates 11 are respectively contacted with a lower surface of the first circuit board 2, an upper surface of the second circuit board 3, a lower surface of the second circuit board 3 and an upper surface of the third circuit board 4, so as to further enhance heat dissipation effects of the circuit boards, the contact surfaces of the first circuit board 2, the second circuit board 3 and the third circuit board 4 and the heat radiation plate 11 are coated with heat radiation silica gel, the distance between the first circuit board 2, the second circuit board 3 and the third circuit board 4 is larger than the thickness of the heat radiation plate 11, the opposite side surfaces of the two heat radiation mounting plates 5 are provided with three mounting grooves 6, the left surfaces and the right surfaces of the first circuit board 2, the second circuit board 3 and the third circuit board 4 are respectively and fixedly provided with a first heat conducting block 7, a second heat conducting block 8 and a third heat conducting block 9, the first heat conducting block 7, the second heat conducting block 8 and the third heat conducting block 9 are respectively and mutually matched with the mounting grooves 6, the first circuit board 2, the second circuit board 3 and the third circuit board 4 are convenient to mount, the first heat conducting block 7, the second heat conducting block 8 and the third heat conducting block 9 are respectively and movably mounted in the three mounting grooves 6, the heat dissipation fins 10 are fixedly arranged on the surfaces of the opposite sides of the two heat dissipation mounting plates 5, the number of the heat dissipation fins 10 is not less than eighteen, heat conduction is facilitated, the distance between two adjacent heat dissipation fins 10 is not less than five millimeters and not more than eight millimeters, and heat dissipation on the heat dissipation fins 10 is facilitated.

In order to facilitate heat dissipation, the heat dissipation mounting plate 5 in this embodiment is made of a material having high thermal conductivity.

The working principle of the embodiment is as follows:

during the use, through with heat conduction piece 7, no. two heat conduction pieces 8 and No. three heat conduction pieces 9 card go into mounting groove 6 in, install No. one circuit board 2, no. two circuit boards 3 and No. three circuit boards 4 in proper order between two heat dissipation mounting panel 5 opposite side surfaces, return bend 12 in the heating panel 11 and coolant liquid when No. one circuit board 2, no. two circuit boards 3 and No. three circuit boards 4 generate heat will absorb a part heat, the surplus heat gives off on radiating fin 10 through heat conduction piece and heat dissipation mounting panel 5, the rethread radiating fin 10 gives off.

In the second embodiment, on the basis of the first embodiment, the space between the lower surface of the third circuit board 4 and the upper surface of the base 1 is larger than zero, eight millimeters and smaller than one centimeter, which is beneficial to heat dissipation of the lower surface of the third circuit board 4.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a but quick radiating multilayer printed PCB circuit board, includes base (1) and movable mounting circuit board (2), no. two circuit boards (3) and No. three circuit boards (4) on base (1), its characterized in that: the base (1) and the first circuit board (2), the second circuit board (3) and the third circuit board (4) are provided with heat dissipation mechanisms;

the heat dissipation mechanism comprises heat dissipation mounting plates (5) fixedly mounted on the upper surface of a base (1) and two in number, wherein the two opposite side surfaces of the heat dissipation mounting plates (5) are provided with three mounting grooves (6), a first heat conduction block (7), a second heat conduction block (8) and a third heat conduction block (9) are fixedly mounted on the left surface and the right surface of a first circuit board (2), a second circuit board (3) and a third circuit board (4) respectively, the first heat conduction block (7), the second heat conduction block (8) and the third heat conduction block (9) are movably mounted in the three mounting grooves (6) respectively, and the two opposite side surfaces of the heat dissipation mounting plates (5) are fixedly provided with heat dissipation fins (10) respectively.

2. The multilayer printed PCB of claim 1 wherein: a heat radiation plate (11) is fixedly installed between the two opposite side surfaces of the heat radiation installation plates (5), an elbow (12) is fixedly installed in the heat radiation plate (11), cooling liquid is filled in the elbow (12), and the upper surfaces and the lower surfaces of the heat radiation plates (11) are respectively contacted with the lower surface of a first circuit board (2), the upper surface of a second circuit board (3), the lower surface of the second circuit board (3) and the upper surface of a third circuit board (4).

3. The multilayer printed PCB of claim 1 wherein: the number of the radiating fins (10) is not less than eighteen.

4. The multilayer printed PCB of claim 1 wherein: the first heat conducting block (7), the second heat conducting block (8) and the third heat conducting block (9) are all matched with the mounting groove (6).

5. A multilayer printed PCB circuit board with rapid heat dissipation according to claim 3, wherein: the distance between two adjacent radiating fins (10) is not less than five millimeters and not more than eight millimeters.

6. The multilayer printed PCB of claim 2 wherein: and the contact surfaces of the first circuit board (2), the second circuit board (3) and the third circuit board (4) and the radiating plate (11) are coated with radiating silica gel.

7. The multilayer printed PCB of claim 2 wherein: the distance between the first circuit board (2), the second circuit board (3) and the third circuit board (4) is larger than the thickness of the heat dissipation plate (11).

8. The multilayer printed PCB of claim 1 wherein: the distance between the lower surface of the third circuit board (4) and the upper surface of the base (1) is more than zero and less than one centimeter.