CN210183632U - A printed circuit board with high temperature resistance - Google Patents
A printed circuit board with high temperature resistance Download PDFInfo
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- CN210183632U CN210183632U CN201920939158.3U CN201920939158U CN210183632U CN 210183632 U CN210183632 U CN 210183632U CN 201920939158 U CN201920939158 U CN 201920939158U CN 210183632 U CN210183632 U CN 210183632U
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- circuit board
- printed circuit
- board body
- heat dissipation
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Abstract
本实用新型公开了一种具有耐高温性能的印制电路板，包括印制电路板本体、散热翅片和支撑块，所述印制电路板本体的边侧开设有侧螺纹孔，所述印制电路板本体边侧内部固定有内管，所述内管侧壁上固定有贯穿翅片和导流管，且导流管与定位条内侧相互连接，并且定位条与散热卡条相互连接，所述定位条底部固定有支撑块，且支撑块顶部与印制电路板本体底面贴合，并且定位条和支撑块的底部均涂布有三防漆层。该具有耐高温性能的印制电路板，采用新型的结构设计，使得本装置中的印制电路板本体具有较高的散热效率，电子元器件工作时产生的热量可以快速的散发，不易积累，使得印制电路板本体不易变形，提高了印制电路板本体的耐高温性能。
The utility model discloses a printed circuit board with high temperature resistance, comprising a printed circuit board body, a heat dissipation fin and a support block. An inner tube is fixed inside the side of the circuit board body, and a through-fin and a guide tube are fixed on the side wall of the inner tube, and the guide tube and the inner side of the positioning strip are connected to each other, and the positioning strip and the heat dissipation clip are connected to each other. A support block is fixed at the bottom of the positioning strip, the top of the support block is attached to the bottom surface of the printed circuit board body, and the bottom of the positioning strip and the support block is coated with a three-proof paint layer. The printed circuit board with high temperature resistance adopts a new structure design, so that the printed circuit board body in the device has high heat dissipation efficiency, and the heat generated by the electronic components can be quickly dissipated and not easy to accumulate. The printed circuit board body is not easily deformed, and the high temperature resistance performance of the printed circuit board body is improved.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is a printed circuit board with high temperature resistance.
Background
The printed circuit board is also called as a PCB circuit board, is a main component of modern high-integration electronic equipment, mainly provides a mounting and connecting basis for electronic components, can reduce the wiring error rate of the traditional circuit connection by circuit design and surface mounting welding of the electronic components, and is matched with various automatic production equipment to greatly improve the production efficiency.
Along with the continuous development of electronic science and technology, the size of electronic components is smaller and smaller, the number of the electronic components which are installed and fixed on the printed circuit board with the same area is more and more, and the following problems are found in the use process of the printed circuit board:
1. the smaller the size of the electronic components is, the greater the number of the electronic components which are fixedly arranged on the printed circuit board with the same area is, and the heat generated during working is increased;
2. the low easy heat accumulation that leads to the printed circuit board body of radiating efficiency often is provided with the great printed circuit board of a plurality of sizes in electronic equipment, and a large amount of heats of a plurality of printed circuit board during common work accumulation easily lead to printed circuit board to warp the damage, and printed circuit board high temperature resistance is poor promptly.
Therefore, it is necessary to design a printed circuit board having high temperature resistance in view of the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a printed circuit board with high temperature resistance to it is low to provide the radiating efficiency in solving above-mentioned background art, problem that high temperature resistance is poor.
In order to achieve the above object, the utility model provides a following technical scheme: a printed circuit board with high temperature resistance comprises a printed circuit board body, radiating fins and supporting blocks, wherein side thread holes are formed in the side edge of the printed circuit board body, the side edge of the printed circuit board body is connected with radiating clamping strips, the radiating fins are fixed on the tops of the radiating clamping strips, three-proofing paint layers are coated on the bottom surfaces of the radiating clamping strips, bottom holes are formed in the bottom of the radiating clamping strips and the three-proofing paint layers, side adding pipes are fixed on the side edge of the radiating clamping strips, positioning screws are installed on the side edge of the radiating clamping strips and are connected with the printed circuit board body, the side adding pipes penetrate through the side wall of a cooling oil groove, the cooling oil groove is formed in the top of the inner side of the radiating clamping strips, an inner pipe is fixed inside the side edge of the printed circuit board body, a top adding pipe is installed on the top of the inner pipe, the heat dissipation clamp is characterized in that a penetrating fin and a flow guide pipe are fixed on the side wall of the inner pipe, the flow guide pipe is connected with the inner side of the positioning strip, the positioning strip is connected with the heat dissipation clamp strip, a supporting block is fixed at the bottom of the positioning strip, the top of the supporting block is attached to the bottom surface of the printed circuit board body, and a three-proofing paint layer is coated on the bottoms of the positioning strip and the supporting block.
Preferably, the printed circuit board body is connected with the heat dissipation card strip in a clamping manner, the side edge of the printed circuit board body is arranged to be isosceles trapezoid, and the copper heat dissipation card strip is symmetrically distributed on the printed circuit board body.
Preferably, the cooling oil groove is provided with a wave-shaped inclined edge close to the radiating fins and a wave-shaped inclined edge close to the printed circuit board body, the radiating fins and the radiating clamping strip are of an integrated structure, and the radiating fins are distributed on the top of the radiating clamping strip at equal intervals in an intensive manner.
Preferably, the penetrating fins penetrate through the inner tube, and the copper penetrating fins are distributed on the side, away from the positioning strip, of the inner tube at equal angles in an intensive mode.
Preferably, the welding position of the guide pipe and the positioning strip is horn-shaped, the guide pipe and the positioning strip are made of copper, the positioning strip and the supporting block are of an integrated structure, and the front section of the supporting block is in the shape of a right triangle.
Compared with the prior art, the beneficial effects of the utility model are that: the printed circuit board with high temperature resistance adopts a novel structural design, so that the printed circuit board body in the device has high heat dissipation efficiency, heat generated by electronic components during operation can be quickly dissipated and is not easy to accumulate, the printed circuit board body is not easy to deform, and the high temperature resistance of the printed circuit board body is improved;
1. the heat dissipation clamping strip is tightly contacted with the side of the printed circuit board body, and the heat on the side of the printed circuit board body is quickly absorbed and dissipated through the bottom hole, the cooling oil groove and the heat dissipation fins;
2. the inner tube, run through fin, honeycomb duct and location strip during operation, can follow the printed circuit board body inside, with the heat that electronic components during operation produced, quick derivation has improved the high temperature resistance of printed circuit board body.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic diagram of a side view cross-sectional structure of the cooling oil tank of the present invention;
fig. 3 is a schematic view of the front sectional structure of the inner tube of the present invention.
In the figure: 1. a printed circuit board body; 2. a side threaded bore; 3. a heat dissipation clamping strip; 4. a three-proofing paint layer; 5. a bottom hole; 6. a side addition tube; 7. cooling the oil tank; 8. a set screw; 9. a heat dissipating fin; 10. an inner tube; 11. a top addition pipe; 12. penetrating the fins; 13. a flow guide pipe; 14. a positioning bar; 15. and (7) a supporting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a printed circuit board with high temperature resistance comprises a printed circuit board body 1, side threaded holes 2, heat dissipation clamping strips 3, three-proofing paint layers 4, bottom holes 5, side adding pipes 6, a cooling oil groove 7, positioning screws 8, heat dissipation fins 9, an inner pipe 10, top adding pipes 11, through fins 12, a flow guide pipe 13, positioning strips 14 and a support block 15, wherein the side threaded holes 2 are formed in the side of the printed circuit board body 1, the side of the printed circuit board body 1 is connected with the heat dissipation clamping strips 3, the top of each heat dissipation clamping strip 3 is fixedly provided with the heat dissipation fins 9, the bottom surfaces of the heat dissipation clamping strips 3 are coated with the three-proofing paint layers 4, the bottom of each heat dissipation clamping strip 3 and the three-proofing paint layers 4 are respectively provided with the bottom holes 5, the side adding pipes 6 are fixedly arranged on the side of each heat dissipation clamping strip 3, the side of each heat dissipation clamping strip 3 is provided with the positioning screws 8, the side is added pipe 6 and is run through 7 lateral walls of cooling oil groove, and cooling oil groove 7 is seted up at 3 inboard tops of heat dissipation card strip, 1 avris inside of printed circuit board body is fixed with inner tube 10, and inner tube 10 top is installed and is added pipe 11, and top is added pipe 11 and is run through 1 top of printed circuit board body, be fixed with on the inner tube 10 lateral wall and run through fin 12 and honeycomb duct 13, and honeycomb duct 13 and the 14 inboard interconnect of location strip, and location strip 14 and heat dissipation card strip 3 interconnect, location strip 14 bottom is fixed with supporting shoe 15, and the laminating of supporting shoe 15 top and 1 bottom surface of printed circuit board body, and location strip 14 and the bottom of supporting shoe 15 all scribble cloth and have three proofings lacquer layer 4.
In the embodiment, the printed circuit board body 1 is connected with the heat dissipation clamping strips 3 in a clamping manner, the side edge of the printed circuit board body 1 is in an isosceles trapezoid shape, and the copper heat dissipation clamping strips 3 are symmetrically distributed relative to the printed circuit board body 1, so that the contact area between the side edge of the printed circuit board body 1 and the heat dissipation clamping strips 3 at the inclined edge position of the cooling oil groove 7 is increased by the structural design, and the heat can be rapidly transmitted from the printed circuit board body 1 to the heat dissipation clamping strips 3;
the inclined edge of the cooling oil tank 7 close to the radiating fins 9 and the inclined edge of the cooling oil tank close to the printed circuit board body 1 are both wave-shaped, the radiating fins 9 and the radiating clamping strips 3 are of an integrated structure, the radiating fins 9 are distributed on the tops of the radiating clamping strips 3 at equal intervals in an intensive manner, and the wave-shaped boundary is designed, so that transformer oil in the cooling oil tank 7 can receive and absorb heat in a large area, and the contact area of the radiating clamping strips 3 and air is increased by the radiating fins 9;
the penetrating fins 12 penetrate through the inner tube 10, and the copper penetrating fins 12 are distributed on the side, away from the positioning strips 14, of the inner tube 10 at equal angles in an intensive manner, so that the heat absorbed by the penetrating fins 12 can be quickly conducted into the transformer oil in the inner tube 10 through the structural design;
the welding position of the guide pipe 13 and the positioning strip 14 is set to be horn-shaped, the guide pipe 13 and the positioning strip 14 are made of copper, the positioning strip 14 and the supporting block 15 are of an integrated structure, meanwhile, the front section of the supporting block 15 is in the shape of a right triangle, the structural design enables transformer oil absorbing heat in the inner pipe 10 to be in large-area contact with the positioning strip 14 through the guide pipe 13, rapid heat dissipation is conducted, and the supporting block 15 plays a role in stable support.
The working principle is as follows: when the device is used, transformer oil is fully filled in the cooling oil groove 7 and the inner pipe 10 through the side adding pipe 6 in fig. 2 and the top adding pipe 11 in fig. 3 respectively, the side adding pipe 6 and the top adding pipe 11 are sealed by rubber plugs, the transformer oil is oil used by an oil-immersed transformer and has insulating and heat-radiating functions, the three-proofing paint layer 4 is polyurethane three-proofing paint, has waterproof, insulating and anti-corrosion functions, is the prior mature technology, is well known by a person skilled in the art, and is not described in detail herein;
the side of the printed circuit board body 1 in the figure 1 is conducted to the heat dissipation clamping strip 3, the wavy edge at the bottom of the cooling oil groove 7 receives heat in a large area and transmits the heat to transformer oil, the transformer oil absorbs the heat and then radiates the heat outwards through the wavy edge at the top, the heat is quickly radiated to the air by the heat radiation fins 9, the quick heat radiation effect is achieved, and the copper heat radiation fins 9 are directly connected with the printed circuit board body 1 and also play a certain heat conduction and radiation effect;
and the fin 12 that runs through in fig. 3 can be with the inside heat that accumulates of printed circuit board body 1, in the transformer oil in quick leading-in inner tube 10, transformer oil is heated to contact through honeycomb duct 13 and location strip 14, location strip 14 dispels the heat to transformer oil in honeycomb duct 13, plays quick radiating effect equally, guarantees that printed circuit board body 1 body can not accumulate the heat, makes printed circuit board body 1 can not warp, has improved printed circuit board body 1's high temperature resistance.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a printed circuit board with high temperature resistance, includes printed circuit board body (1), radiating fin (9) and supporting shoe (15), its characterized in that: side threaded hole (2) has been seted up to the avris of printed circuit board body (1), and printed circuit board body (1) avris and heat dissipation card strip (3) interconnect, and heat dissipation card strip (3) top is fixed with radiating fin (9), heat dissipation card strip (3) bottom surface coating has three proofings lacquer layer (4), and all seted up bottom hole (5) on heat dissipation card strip (3) bottom and the three proofings lacquer layer (4), and heat dissipation card strip (3) avris is fixed with side interpolation pipe (6), set screw (8) are installed to the avris of heat dissipation card strip (3), and set screw (8) and printed circuit board body (1) interconnect, side interpolation pipe (6) run through cooling oil groove (7) lateral wall, and cooling oil groove (7) set up at heat dissipation card strip (3) inboard top, printed circuit board body (1) avris inside is fixed with inner tube (10), and inner tube (10) top is installed and is pushed up and add pipe (11) to push up and add pipe (11) and run through printed circuit board body (1) top, be fixed with on inner tube (10) lateral wall and run through fin (12) and honeycomb duct (13), and honeycomb duct (13) and location strip (14) inboard interconnect, and location strip (14) and heat dissipation card strip (3) interconnect, location strip (14) bottom is fixed with supporting shoe (15), and supporting shoe (15) top and printed circuit board body (1) bottom surface laminating, and the bottom of location strip (14) and supporting shoe (15) all scribbles cloth and has three proofings lacquer layer (4).
2. A printed circuit board having high temperature resistance according to claim 1, wherein: printed circuit board body (1) is connected for the block with heat dissipation card strip (3), and printed circuit board body (1) avris sets up to isosceles trapezoid to copper heat dissipation card strip (3) are about printed circuit board body (1) symmetric distribution.
3. A printed circuit board having high temperature resistance according to claim 1, wherein: the cooling oil groove (7) is close to the inclined edge of the radiating fin (9) and the inclined edge of the printed circuit board body (1) and is wave-shaped, the radiating fin (9) and the radiating clamping strip (3) are of an integrated structure, and the radiating fins (9) are distributed on the top of the radiating clamping strip (3) at equal intervals in a dense mode.
4. A printed circuit board having high temperature resistance according to claim 1, wherein: the through fins (12) penetrate through the inner tube (10), and the copper through fins (12) are distributed on one side, far away from the positioning strip (14), of the inner tube (10) in an equal-angle dense mode.
5. A printed circuit board having high temperature resistance according to claim 1, wherein: the welding position of the guide pipe (13) and the positioning strip (14) is horn-shaped, the guide pipe (13) and the positioning strip (14) are made of copper, the positioning strip (14) and the supporting block (15) are of an integrated structure, and the front section of the supporting block (15) is in a right-angled triangle shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920939158.3U CN210183632U (en) | 2019-06-21 | 2019-06-21 | A printed circuit board with high temperature resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920939158.3U CN210183632U (en) | 2019-06-21 | 2019-06-21 | A printed circuit board with high temperature resistance |
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| Publication Number | Publication Date |
|---|---|
| CN210183632U true CN210183632U (en) | 2020-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920939158.3U Active CN210183632U (en) | 2019-06-21 | 2019-06-21 | A printed circuit board with high temperature resistance |
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| CN (1) | CN210183632U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
-
2019
- 2019-06-21 CN CN201920939158.3U patent/CN210183632U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
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Effective date of registration: 20251128 Granted publication date: 20200324 |
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