CN210405767U - Multilayer circuit board with high aspect ratio blind hole - Google Patents
Multilayer circuit board with high aspect ratio blind hole Download PDFInfo
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- CN210405767U CN210405767U CN201921320704.1U CN201921320704U CN210405767U CN 210405767 U CN210405767 U CN 210405767U CN 201921320704 U CN201921320704 U CN 201921320704U CN 210405767 U CN210405767 U CN 210405767U
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Abstract
The utility model relates to a high aspect ratio blind hole multilayer circuit board technical field discloses a multilayer circuit board with high aspect ratio blind hole, the inside sliding connection of spout has the clearance subassembly, the first dielectric layer of last fixed surface of third conducting layer is connected with, and the front and back of third conducting layer is provided with radiator unit, the last fixed surface of first dielectric layer is connected with the first insulation layer, the last fixed surface on first insulation layer is connected with the second conducting layer, the last fixed surface of second conducting layer is connected with the second insulating layer, the last fixed surface of second insulating layer is connected with the second dielectric layer. The utility model discloses a be provided with the clearance subassembly, can clear up fast the surface of circuit board, simple structure convenient to use, the utility model discloses a be provided with radiator unit, can derive the heat of circuit board inside to first heating panel and second heating panel in, increase the area of contact of heat and air, increase the radiating effect.
Description
Technical Field
The utility model relates to a high aspect ratio blind hole multilayer circuit board technical field specifically is a multilayer circuit board with high aspect ratio blind hole.
Background
The circuit board determines the process difficulty and the processing price according to the number of wiring surfaces, the multilayer circuit board is formed by superposing a plurality of layers of circuits in one circuit board through positioning and pressing by optical equipment, the multilayer circuit board is at least provided with three conductive layers, two conductive layers are arranged on the outer surface, the rest conductive layer is synthesized in an insulating board, a dielectric layer is arranged between every two conductive layers, and the blind holes are positioned on the surfaces of the top layer and the bottom layer of the printed circuit board, have certain depth and are used for connecting a surface layer circuit and a lower inner layer circuit.
However, the existing multilayer circuit board still has some disadvantages, for example, impurities such as dust and the like are easily attached to the surface of the existing multilayer circuit board, which causes inconvenience for normal use, and the existing multilayer circuit board has poor heat dissipation effect and is easy to cause damage to the circuit board after long-term use. Accordingly, one skilled in the art provides a multilayer wiring board having high aspect ratio blind vias to solve the problems set forth in the background art described above.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer circuit board with high aspect ratio blind hole to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a multi-layer circuit board with high aspect ratio blind holes comprises a bearing plate, a third conductive layer is fixedly arranged on the upper surface of the bearing plate, and the upper surface of the bearing plate is provided with sliding chutes at the two sides of the third conductive layer, the inner part of the sliding chute is connected with a cleaning component in a sliding way, the upper surface of the third conductive layer is fixedly connected with a first medium layer, and the front and back of the third conductive layer are provided with heat dissipation components, the upper surface of the first medium layer is fixedly connected with a first insulating layer, a second conductive layer is fixedly connected to the upper surface of the first insulating layer, a second insulating layer is fixedly connected to the upper surface of the second conductive layer, the upper surface of the second insulating layer is fixedly connected with a second medium layer, the upper surface of the second medium layer is fixedly connected with a first conducting layer, and the surfaces of the first conducting layer and the sliding groove are provided with blind holes.
As a further aspect of the present invention: the clearance subassembly is including installation horizontal pole, connecting rod, push pedal, clean strip and slider, the upper surface intermediate position department fixed mounting of installation horizontal pole has the push pedal, and the lower fixed surface of installation horizontal pole installs clean strip, the equal fixedly connected with connecting rod in both sides of installation horizontal pole, the equal fixedly connected with slider of lower surface of connecting rod.
As a further aspect of the present invention: the radiating component comprises a first radiating plate, a first heat-conducting plate, a first connecting block, a second radiating plate, a second connecting block and a second heat-conducting plate, wherein the first connecting block is fixedly mounted on the surfaces of the two sides of the first heat-conducting plate, the second heat-conducting plate is arranged under the first heat-conducting plate, the second connecting block is fixedly mounted on the surfaces of the two sides, the first connecting block and the second connecting block which are located on one side are fixedly connected with the first radiating plate, and the first connecting block and the second connecting block which are located on the other side are fixedly connected with the second radiating plate.
As a further aspect of the present invention: the installation horizontal pole and the connecting rod are members made of aluminum alloy materials, the cleaning strip on the lower surface of the installation horizontal pole is a member made of sponge materials, and the lower surface of the cleaning strip is tightly attached to the upper surface of the first conducting layer.
As a further aspect of the present invention: the slider is a component made of stainless steel materials, and the slider is tightly attached to the inside of the sliding groove.
As a further aspect of the present invention: the first heat dissipation plate and the second heat dissipation plate are both copper members, and heat dissipation holes are formed in the surfaces of the first heat dissipation plate and the second heat dissipation plate.
As a further aspect of the present invention: the through-hole has all been seted up on the surface of first heat-conducting plate and second heat-conducting plate, and first heat-conducting plate and second heat-conducting plate are latticed, and the through-hole is inside to be filled there is graphite alkene.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is provided with the cleaning component, which can quickly clean the surface of the circuit board, has simple structure and convenient use;
2. the utility model discloses a be provided with radiator unit, can derive the inside heat of circuit board to first heating panel and second heating panel in, increase the area of contact of heat and air, increase the radiating effect.
Drawings
FIG. 1 is a schematic diagram of a multilayer wiring board having high aspect ratio blind vias;
FIG. 2 is a schematic diagram of the internal structure of a multilayer wiring board having high aspect ratio blind vias;
FIG. 3 is a schematic diagram of a cleaning assembly for a multilayer wiring board having high aspect ratio blind vias;
FIG. 4 is a schematic diagram of a heat dissipation assembly in a multilayer wiring board having high aspect ratio blind vias;
FIG. 5 is a diagram of the structure of the first thermal conductive plate in a multilayer wiring board with high aspect ratio blind vias.
In the figure: 1. cleaning the assembly; 101. installing a cross bar; 102. a connecting rod; 103. pushing the plate; 104. a cleaning strip; 105. a slider; 2. a heat dissipating component; 201. a first heat dissipation plate; 202. a first heat-conducting plate; 203. a first connection block; 204. a second heat dissipation plate; 205. a second connecting block; 206. a second heat-conducting plate; 3. a carrier plate; 4. a first conductive layer; 5. blind holes; 6. a first insulating layer; 7. a first dielectric layer; 8. a chute; 9. a second dielectric layer; 10. a second insulating layer; 11. a second conductive layer; 12. and a third conductive layer.
Detailed Description
Referring to fig. 1 to 5, in an embodiment of the present invention, a multilayer circuit board with a blind hole having a high aspect ratio includes a carrier board 3, a third conductive layer 12 is fixedly mounted on an upper surface of the carrier board 3, sliding grooves 8 are formed on both sides of the third conductive layer 12 on the upper surface of the carrier board 3, a cleaning assembly 1 is slidably connected inside the sliding grooves 8, a first dielectric layer 7 is fixedly connected to the upper surface of the third conductive layer 12, heat dissipation assemblies 2 are disposed in front of and behind the third conductive layer 12, a first insulating layer 6 is fixedly connected to the upper surface of the first dielectric layer 7, a second conductive layer 11 is fixedly connected to the upper surface of the first insulating layer 6, a second insulating layer 10 is fixedly connected to the upper surface of the second conductive layer 11, a second dielectric layer 9 is fixedly connected to the upper surface of the second insulating layer 10, and a first conductive layer 4 is fixedly connected to the upper surface of, the blind holes 5 are formed in the surfaces of the first conducting layer 4 and the sliding groove 8.
In fig. 3: the cleaning component 1 is connected inside the sliding groove 8 in a sliding way, the cleaning component 1 comprises a mounting cross rod 101, a connecting rod 102, a push plate 103, a cleaning strip 104 and a sliding block 105, the push plate 103 is fixedly mounted at the middle position of the upper surface of the mounting cross rod 101, the lower surface of the installation cross bar 101 is fixedly provided with a cleaning strip 104, both sides of the installation cross bar 101 are fixedly connected with connecting rods 102, the lower surface of the connecting rods 102 is fixedly connected with a slide block 105, the installation cross bar 101 and the connecting rods 102 are all members made of aluminum alloy, the cleaning strip 104 arranged on the lower surface of the cross bar 101 is a sponge member, the lower surface of the cleaning strip 104 is tightly attached to the upper surface of the first conductive layer 4, the sliding block 105 is a stainless steel member, the sliding block 105 is tightly attached to the inside of the sliding groove 8, through being provided with clearance subassembly 1, can clear up the surface of circuit board fast, simple structure convenient to use.
In fig. 4: the heat dissipation assembly 2 is disposed in front of and behind the third conductive layer 12, the heat dissipation assembly 2 includes a first heat dissipation plate 201, a first heat conduction plate 202, a first connection block 203, a second heat dissipation plate 204, a second connection block 205 and a second heat conduction plate 206, the first connection block 203 is fixedly mounted on both side surfaces of the first heat conduction plate 202, a second heat conduction plate 206 is disposed under the first heat conduction plate 202, the second connection block 205 is fixedly mounted on both side surfaces of the second heat conduction plate 206, the first connection block 203 and the second connection block 205 on one side are fixedly connected to the first heat dissipation plate 201, the first connection block 203 and the second connection block 205 on the other side are fixedly connected to the second heat dissipation plate 204, the first heat dissipation plate 201 and the second heat dissipation hole 206 are copper members, the surfaces of the first heat dissipation plate 201 and the second heat conduction plate 206 are provided with through holes, the surfaces of the first heat conduction plate 202 and the second heat conduction plate 206 are provided with through holes, and first heat-conducting plate 202 and second heat-conducting plate 206 are latticed, and the through-hole is inside to be filled with graphite alkene, is provided with radiator unit 2, can derive the inside heat of circuit board to first heating panel 201 and second heating panel 204 in, increase the area of contact of heat and air, increase the radiating effect.
The utility model discloses a theory of operation is: when the circuit board is used, the heat dissipation assembly 2 in the circuit board acts, the first heat conduction plate 202 is located between the first conducting layer 4 and the second conducting layer 9, the second heat conduction plate 206 is located between the first conducting layer 7 and the third conducting layer 12, the heat in the circuit board is transmitted to the first heat dissipation plate 201 and the second heat dissipation plate 204 through the first heat conduction plate 202 and the second heat conduction plate 206, the surfaces of the first heat dissipation plate 201 and the second heat dissipation plate 204 are provided with heat dissipation holes, the heat dissipation assembly 2 is arranged, the heat in the circuit board can be led out to the first heat dissipation plate 201 and the second heat dissipation plate 204, the contact area of the heat and air is increased, the heat dissipation effect is increased, when the surface of the circuit board needs to be cleaned, a user can push the push plate 103 to drive the sliding block 105 to slide in the sliding groove 8, so that the installation cross rod 101 moves back and forth, through being provided with clearance subassembly 1, can clear up the surface of circuit board fast, simple structure convenient to use.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. A multilayer circuit board with a high aspect ratio blind hole comprises a bearing plate (3) and is characterized in that a third conducting layer (12) is fixedly mounted on the upper surface of the bearing plate (3), sliding grooves (8) are formed in positions, located on two sides of the third conducting layer (12), of the upper surface of the bearing plate (3), a cleaning assembly (1) is connected to the inner portion of each sliding groove (8) in a sliding mode, a first dielectric layer (7) is fixedly connected to the upper surface of the third conducting layer (12), heat dissipation assemblies (2) are arranged on the front portion and the rear portion of the third conducting layer (12), a first insulating layer (6) is fixedly connected to the upper surface of the first dielectric layer (7), a second conducting layer (11) is fixedly connected to the upper surface of the first insulating layer (6), a second insulating layer (10) is fixedly connected to the upper surface of the second conducting layer (11), and a second dielectric layer (9) is fixedly connected to the upper surface of the second insulating, the upper surface of the second medium layer (9) is fixedly connected with a first conducting layer (4), and blind holes (5) are formed in the surfaces of the first conducting layer (4) and the sliding groove (8).
2. The multilayer circuit board with the high aspect ratio blind hole as claimed in claim 1, wherein the cleaning assembly (1) comprises a mounting cross rod (101), a connecting rod (102), a push plate (103), a cleaning strip (104) and a sliding block (105), the push plate (103) is fixedly mounted at the middle position of the upper surface of the mounting cross rod (101), the cleaning strip (104) is fixedly mounted on the lower surface of the mounting cross rod (101), the connecting rod (102) is fixedly connected to both sides of the mounting cross rod (101), and the sliding block (105) is fixedly connected to the lower surface of the connecting rod (102).
3. A multilayer circuit board having high aspect ratio blind vias according to claim 1, the heat dissipation component (2) comprises a first heat dissipation plate (201), a first heat conduction plate (202), a first connecting block (203), a second heat dissipation plate (204), a second connecting block (205) and a second heat conduction plate (206), the surfaces of both sides of the first heat conducting plate (202) are fixedly provided with first connecting blocks (203), and a second heat-conducting plate (206) is arranged right below the first heat-conducting plate (202), the surfaces of both sides of the second heat conducting plate (206) are fixedly provided with second connecting blocks (205), the first connecting block (203) and the second connecting block (205) which are positioned at one side are fixedly connected with the first heat dissipation plate (201), and the first connecting block (203) and the second connecting block (205) which are positioned on the other side are fixedly connected with the second heat dissipation plate (204).
4. The multilayer circuit board with the high aspect ratio blind hole as claimed in claim 2, wherein the mounting cross bar (101) and the connecting bar (102) are both members made of aluminum alloy, the cleaning strip (104) on the lower surface of the mounting cross bar (101) is a member made of sponge, and the lower surface of the cleaning strip (104) is tightly attached to the upper surface of the first conductive layer (4).
5. The multilayer circuit board with the high aspect ratio blind hole as claimed in claim 2, wherein the sliding block (105) is a member made of stainless steel, and the sliding block (105) is tightly attached to the inside of the sliding groove (8).
6. The multilayer circuit board with the high aspect ratio blind hole according to claim 3, wherein the first heat dissipation plate (201) and the second heat dissipation plate (206) are both copper members, and heat dissipation holes are formed in the surfaces of the first heat dissipation plate (201) and the second heat dissipation plate (206).
7. The multilayer circuit board with the high aspect ratio blind hole as claimed in claim 3, wherein the surfaces of the first heat conducting plate (202) and the second heat conducting plate (206) are both provided with through holes, and the first heat conducting plate (202) and the second heat conducting plate (206) are both in a grid shape, and graphene is filled in the through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921320704.1U CN210405767U (en) | 2019-08-15 | 2019-08-15 | Multilayer circuit board with high aspect ratio blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921320704.1U CN210405767U (en) | 2019-08-15 | 2019-08-15 | Multilayer circuit board with high aspect ratio blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210405767U true CN210405767U (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921320704.1U Active CN210405767U (en) | 2019-08-15 | 2019-08-15 | Multilayer circuit board with high aspect ratio blind hole |
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| CN (1) | CN210405767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423143A (en) * | 2021-12-31 | 2022-04-29 | 江西威尔高电子股份有限公司 | Corrosion-resistant power circuit board |
-
2019
- 2019-08-15 CN CN201921320704.1U patent/CN210405767U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423143A (en) * | 2021-12-31 | 2022-04-29 | 江西威尔高电子股份有限公司 | Corrosion-resistant power circuit board |
| CN114423143B (en) * | 2021-12-31 | 2024-05-10 | 江西威尔高电子股份有限公司 | Corrosion-resistant power circuit board |
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