CN210183625U

CN210183625U - Heat dissipation type multilayer circuit board

Info

Publication number: CN210183625U
Application number: CN201920553507.8U
Authority: CN
Inventors: 高攀
Original assignee: Individual
Current assignee: Putian Xinhongyi Electronic Technology Co ltd
Priority date: 2019-04-23
Filing date: 2019-04-23
Publication date: 2020-03-24
Anticipated expiration: 2029-04-23

Abstract

The utility model discloses a heat dissipation type multilayer circuit board relates to a circuit board, specifically includes heat dissipation base plate and circuit substrate, and circuit substrate and heat dissipation base plate equipment operation process as follows: the four T-shaped rotary rods are sequentially rotated to enable the T-shaped rotary rods to be parallel and level to correspond to the through grooves, the circuit substrate is pressed downwards, the T-shaped rotary rods can penetrate through the circular grooves and the through grooves in the circuit substrate, the T-shaped rotary rods are immediately rotated, a heat-conducting silica gel elastic cushion layer and a heat dissipation substrate connected with a plurality of heat dissipation fins are adopted, the heat dissipation efficiency of the circuit substrate is improved, the circuit can be used for a long time, the service life is prolonged, the elastic cushion layer has certain elasticity, the circuit is basically buffered by an external instant extrusion process, and the damage possibility is reduced; through the rotatory and logical groove dislocation mode that produces of T shape rotary rod equipment heat dissipation base plate and circuit substrate, equipment operation process labour saving and time saving has damaged the change of being convenient for, improves assembly personnel work efficiency.

Description

Heat dissipation type multilayer circuit board

Technical Field

The utility model relates to a circuit board specifically is a heat dissipation type multilayer circuit board.

Background

Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. First, a single panel, on the most basic PCB, the components are concentrated on one side and the wires are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection.

The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.

Most of the existing circuit boards on the market do not carry a heat dissipation assisting structure, so that the circuit boards are used for a long time, the circuits are aged, and the service life of the circuit boards is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation type multilayer circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a heat dissipation type multilayer circuit board, includes heat dissipation base plate and circuit substrate, surface mounting has circuit substrate on the heat dissipation base plate, and heat dissipation base plate upper surface complex is connected with the elastic cushion layer, and the another side and the circuit substrate lower surface contact of elastic cushion layer, heat dissipation substrate lower surface are connected with the radiating fin that a plurality of quantity all had the setting.

As a further aspect of the present invention: the heat dissipation substrate both sides wall welded connection has a plurality of L shape mounting panel, and the inside screw hole that is equipped with of L shape mounting panel horizontal side, the vertical side height of L shape mounting panel is greater than the high sum of heat dissipation substrate thickness and radiating fin.

As a further aspect of the present invention: the circuit board comprises a circuit substrate and is characterized in that four circular grooves are formed in the upper surface of the circuit substrate, T-shaped rotary rods are arranged inside the circular grooves, the upper surface of a heat dissipation substrate is connected with bearings arranged in four rectangles, the inner embedded surfaces of the circular grooves in one ends of the T-shaped rotary rods are rotatably connected with the bearings, springs are sleeved at one ends of the T-shaped rotary rods penetrating through the circular grooves, one ends of the T-shaped rotary rods and the connecting rings in the circular grooves are rotatably connected, and two through grooves are formed in the inner embedded surfaces of the circular grooves.

As a further aspect of the present invention: the spring is in a dumbbell shape with two large ends and a small middle.

As a further aspect of the present invention: the radiating fins are copper-filled radiating fins.

As a further aspect of the present invention: the elastic cushion layer is made of heat-conducting silica gel.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the circuit substrate has the advantages that the heat-conducting silica gel elastic cushion layer and the heat-radiating substrate connected with the plurality of heat-radiating fins are adopted, so that the heat-radiating efficiency of the circuit substrate is improved, the circuit can be used for a long time, the service life is prolonged, the elastic cushion layer has certain elasticity, the circuit is basically buffered by an external instant extrusion process, and the damage possibility is reduced;

2. through the rotatory and logical groove dislocation mode that produces of T shape rotary rod equipment heat dissipation base plate and circuit substrate, equipment operation process labour saving and time saving has damaged the change of being convenient for, improves assembly personnel work efficiency.

Drawings

FIG. 1 is a schematic diagram of a formal structure of a heat dissipation type multi-layer circuit board.

FIG. 2 is a schematic top view of a heat dissipation type multi-layer circuit board.

In the figure: 1. a heat-dissipating substrate; 2. a circuit substrate; 3. an elastic cushion layer; 4. an L-shaped mounting plate; 5. a T-shaped rotating rod; 6. a heat dissipating fin; 7. a bearing; 8. a spring; 9. a circular groove; 10. a through groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-2, in the embodiment of the utility model, a heat dissipation type multilayer circuit board, including heat dissipation base plate 1 and circuit substrate 2, surface mounting has circuit substrate 2 on heat

dissipation base plate

1, and 1 upper surface complex of heat dissipation base plate is connected with elastic cushion 3, and elastic cushion 3's another side and 2 lower surface contact of circuit substrate, and 1 lower surface of heat dissipation base plate is connected with the radiating fin 6 that a plurality of quantity all had the setting, the 3 material of elastic cushion is heat conduction silica gel, can let circuit substrate 2 go up heat transfer to heat dissipation base plate 1 through elastic cushion 3, all has radiating fin 6 that sets up through a plurality of quantities, with the increase of external air area of contact to make the radiating effect increase, and heat conduction silica gel has elasticity, can let circuit substrate 2 receive external collision force process and obtain the buffering, reduce the damage possibility.

1 both sides wall welded connection of radiating basal plate has a plurality of L shape mounting panel 4, and the inside screw hole that is equipped with of 4 horizontal sides of L shape mounting panel, the vertical side height of 4 vertical sides of L shape mounting panels is greater than the thickness and the 6 high sums of radiating fin of radiating basal plate 1, and L shape installation bar 4 is with on 1 erection equipment casing of whole radiating basal plate.

2 upper surfaces of circuit substrate are equipped with the circular recess 9 that four rectangles set up, the inside of circular recess 9 is equipped with T

shape rotary rod

5, 1 upper surface of heat dissipation substrate has the bearing 7 that four rectangles set up, the embedded face of the circular recess 9 of one end of T shape rotary rod 5 is and rotate with bearing 7 and be connected, T shape rotary rod 5 runs through inside one pot head of circular recess 9 and has spring 8, the one end of T shape rotary rod 5 and the inside go-between that rotates of circular recess 9, the embedded face is equipped with two logical grooves 10 that set up to this in the circular recess 9,

circuit substrate

2 and 1 equipment operation processes of heat dissipation substrate are as follows: rotate four T shape rotary rods 5 in proper order, make T shape rotary rod 5 correspond with logical groove 10 parallel and level, push down circuit substrate 2, make T shape rotary rod 5 can follow circuit substrate 2 and go up circular recess 9 and lead to groove 10 and can pass, rotate T shape rotary rod 5 immediately, make the inside T shape rotary rod 5 of circular recess 9 and passageway 10 take place to deviate, rotatory T shape rotary rod 5 of accomplishing in proper order, can let circuit substrate 2 install on heat dissipation substrate 1, operation process labour saving and time saving, improve convenience for the assembly workman.

The spring 8 is in a dumbbell shape with two large ends and a small middle part,

the radiating fins 6 are copper-filled radiating fins.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a heat dissipation type multilayer circuit board, includes heat dissipation base plate (1) and circuit substrate (2), its characterized in that, surface mounting has circuit substrate (2) on heat dissipation base plate (1), and heat dissipation base plate (1) upper surface complex is connected with elastic cushion layer (3), and the another side and the circuit substrate (2) lower surface contact of elastic cushion layer (3), and heat dissipation base plate (1) lower surface is connected with radiating fin (6) that a plurality of quantity all had the setting.

2. The heat dissipation type multilayer circuit board according to claim 1, wherein a plurality of L-shaped mounting plates (4) are welded to two side walls of the heat dissipation substrate (1), screw holes are formed in horizontal side surfaces of the L-shaped mounting plates (4), and the height of vertical side surfaces of the L-shaped mounting plates (4) is greater than the sum of the thickness of the heat dissipation substrate (1) and the height of the heat dissipation fins (6).

3. The heat dissipation type multilayer circuit board according to claim 1, wherein the upper surface of the circuit substrate (2) is provided with four rectangular circular grooves (9), the inside of the circular groove (9) is provided with a T-shaped rotating rod (5), the upper surface of the heat dissipation substrate (1) is connected with four rectangular bearings (7), the embedded surface of one end of the circular groove (9) of the T-shaped rotating rod (5) is rotatably connected with the bearing (7), one end of the T-shaped rotating rod (5) penetrates through the inside of the circular groove (9) and is sleeved with a spring (8), one end of the T-shaped rotating rod (5) is rotatably connected with the inside of the circular groove (9), and the embedded surface of the circular groove (9) is provided with two through grooves (10) arranged in a corresponding way.

4. The heat dissipation type multilayer wiring board according to claim 3, wherein the spring (8) has a dumbbell shape with two large ends and a small middle.

5. The heat dissipation type multilayer wiring board according to claim 1, wherein the heat dissipation fins (6) are copper plug type heat dissipation fins.

6. The heat dissipation type multilayer circuit board according to claim 1, wherein the material of the elastic cushion layer (3) is a heat conductive silicone.