CN202977519U - Electric appliance element substrate with high heat transfer efficiency - Google Patents
Electric appliance element substrate with high heat transfer efficiency Download PDFInfo
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- CN202977519U CN202977519U CN 201220518566 CN201220518566U CN202977519U CN 202977519 U CN202977519 U CN 202977519U CN 201220518566 CN201220518566 CN 201220518566 CN 201220518566 U CN201220518566 U CN 201220518566U CN 202977519 U CN202977519 U CN 202977519U
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- lyriform pore
- electric elements
- substrate
- lyriform
- insulating barrier
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Abstract
The utility model provides an electric appliance element substrate with high heat transfer efficiency. The substrate comprises a base material, an insulation layer and a copper-clad layer which are stacked in turn from the bottom to the top, wherein at least two first apertures are arranged on the position of the substrate corresponded with an electric appliance element to be mounted and pass through the copper-clad layer, the insulation layer and the base material in turn, a heat conduction material is filled in the first aperture, and the upper surface of the filled heat conduction material is contacted with the electric appliance element. The electric appliance element substrate with high heat transfer efficiency can quickly and high efficiently conduct the heat of the electric appliance element.
Description
Technical field
The utility model relates to a kind of substrate of electric elements, particularly a kind of electric elements substrate with high-heat conductive efficency.
Background technology
Light-emitting diode (Light Emitting Diode, LED) is as solid state light emitter of new generation, has the many merits such as long, energy-efficient, environmental protection of life-span, is widely used.Develop rapidly along with electronics industry, the volume size of electronic product is more and more less, increasing (the LED for example of power density, especially great power LED), yet great power LED can produce a large amount of heats in the electrified light emitting process, these heats concentrate in small-sized chip, and chip temperature raises, and cause the sharp decrease in efficiency of penetrating of non-uniform Distribution, chip light emitting efficient and fluorescent material of thermal stress; When temperature surpassed certain value, part failure rate is index law to be increased.Statistics shows, 2 ℃ of the every risings of component temperature, reliability decrease 10%.When a plurality of LED dense arrangement formed white lumination system, the dissipation problem of heat was more serious.Solve thermal management issues and become the prerequisite that high-brightness LED is used.
In LED light fixture manufacturing process, a plurality of LED are used in combination due to needs, therefore, need circuit board to provide rated voltage and electric current for many group LED, due to the impact of heat on LED, in the LED circuit plate, need good insulating properties and high performance thermal conductivity to combine, present most producers aluminium substrate is as circuit and the heat-transfer device of LED.Major way is to do a layer insulating on aluminium sheet, then spreads layer of copper as conducting channel.Because the insulating barrier thermal conductivity is relatively poor, only have 2-4W/m.k, although the thermal conductivity of copper and aluminium is all pretty good, according to Bucket Principle, the thermal conductivity of whole aluminium base determines to only have 2-4W/m.k by the poorest insulating barrier of heat conduction, has had a strong impact on heat conduction and the thermal diffusivity of light fixture.
The radiating effect of the aluminium base of LED light fixture directly has influence on the luminous efficiency of LED light fixture, if can not efficiently radiates heat, the LED internal temperature is raise, temperature is higher, and the luminous efficiency of LED is lower, and the life-span of LED is shorter, in serious situation, can cause LED chip to lose efficacy at once.
application number is that 201120490055.7 utility model patent discloses a kind of aluminium base cooling mechanism for LED, as shown in Figure 1, described aluminium base cooling mechanism comprises heat-dissipation aluminum sectional material 11, aluminium base 13 and be arranged on heat-dissipation aluminum sectional material 11 and aluminium base 13 between heat conductive silica gel pad or silicone grease 12, aluminium base 13 is layer structure, by aluminium sheet 131, insulating barrier 132 and cover copper layer 133 and be formed by stacking successively, be provided with the first through hole (not shown) on insulating barrier 132, cover on copper layer 133 and the first through hole correspondence position and be provided with the second through hole 1331, be coated with soldering tin metal layer 14 on the aluminium sheet 131 of the first via bottoms.By adopting said structure, LED light fixture heat radiation process is directly avoided insulating barrier 132, heat dissipation path is as follows, the heat that the PN junction of LED sends from base be delivered to tin cream weld layer 14 again to soldering tin metal layer 14 again to aluminium sheet 131 again to heat conductive silica gel pad 12 again to heat-dissipation aluminum sectional material 11, last and air heat exchange.
Although above-mentioned aluminium base cooling mechanism can be guided to the heat of LED on aluminium sheet 131, thereby dispel the heat, but this aluminium base cooling mechanism is that the first through hole is set on insulating barrier 132, the second through hole 1331 is set covering copper layer 133, because described the first clear size of opening is larger, so can destroy insulating barrier in forming process, affect the performance of insulating barrier, make the withstand voltage properties of insulating barrier significantly reduce, thereby make LED possible breakdown.
The information that is disclosed in this utility model background technology part only is intended to deepen the understanding to general background technology of the present utility model, and should not be regarded as admitting or hint that in any form this information structure has been prior art known in those skilled in the art.
The utility model content
Main purpose of the present utility model is to provide a kind of electric elements substrate with high-heat conductive efficency, to transmit quickly and efficiently the heat of electric elements, guarantees simultaneously the withstand voltage properties of insulating barrier.
Another purpose of the present utility model is to provide a kind of electric elements substrate with high-heat conductive efficency, and it not only helps heat radiation, more can effectively avoid under low temperature environment producing steam at the electric elements places, thereby avoid steam to cause electric elements to damage.
For achieving the above object, the utility model provides a kind of electric elements substrate with high-heat conductive efficency, wherein: described substrate comprises base material, the insulating barrier that stacks gradually from the bottom up and covers the copper layer, be provided with at least two the first lyriform pores corresponding to electric elements to be installed places on described substrate, described the first lyriform pore runs through described copper layer, insulating barrier and the base material of covering successively, be filled with Heat Conduction Material in described the first lyriform pore, and the upper surface of the Heat Conduction Material of this filling contacts with described electric elements.
In the above-mentioned electric elements substrate with high-heat conductive efficency, when the quantity of described the first lyriform pore during greater than two, the upper surface of described substrate also is provided with at least one second lyriform pore in the location about corresponding to electric elements to be installed, described the second lyriform pore runs through successively described and covers copper layer, insulating barrier and base material, and does not fill Heat Conduction Material in described the second lyriform pore.
In the above-mentioned electric elements substrate with high-heat conductive efficency, also stacking between described base material and insulating barrier have the insulating barrier of one deck at least and cover the copper layer, and described the first lyriform pore runs through all copper layer and insulating barrier and described base materials of covering.
In the above-mentioned electric elements substrate with high-heat conductive efficency, also stacking between described base material and insulating barrier have the insulating barrier of one deck at least and cover the copper layer, and described the first lyriform pore and the second lyriform pore run through all copper layer and insulating barrier and described base materials of covering.
In the above-mentioned electric elements substrate with high-heat conductive efficency, the number of described the first lyriform pore is 2-12, and the number of described the second lyriform pore is 2-6.
In the above-mentioned electric elements substrate with high-heat conductive efficency, the Heat Conduction Material of filling in described the first lyriform pore is copper.
In the above-mentioned electric elements substrate with high-heat conductive efficency, described the first lyriform pore is arranged as array, and described the second lyriform pore is arranged in around described the first lyriform pore.
In the above-mentioned electric elements substrate with high-heat conductive efficency, described the first lyriform pore is arranged as annular, and described the second lyriform pore is arranged in around described the first lyriform pore.
In the above-mentioned electric elements substrate with high-heat conductive efficency, the ratio of the quantity of described the first lyriform pore and described the second lyriform pore is 1:1,2:1,3:1 or 4:1.
In the above-mentioned electric elements substrate with high-heat conductive efficency, described electric elements are LED.
The utility model is by arranging a plurality of the first lyriform pores that cover copper layer, insulating barrier and base material that run through successively, and be filled with the Heat Conduction Material of good heat conductivity in the first lyriform pore, thereby the heat that electric elements send is delivered to the radiator of substrate, to realize quick heat radiating, simultaneously the size in a plurality of first lyriform pore each hole is less, can not affect like this performance of insulating barrier, thereby can effectively avoid the problem of electric elements over-voltage breakdown.
In addition, the utility model can also be provided with at least one and run through successively the second lyriform pore that covers copper layer, insulating barrier and base material, forms thermal convection thereby make between the radiator of electric elements and substrate, to reach the effect of accelerating heat radiation; Because such radiating effect is splendid, makes the section temperature of electric elements to be effectively controlled, thereby avoid under low temperature environment producing steam at the electric elements places, and then avoid steam to cause electric elements to damage.
By the accompanying drawing of including this paper in and the embodiment that is used from subsequently explanation some principle of the present utility model with accompanying drawing one, the further feature that method and apparatus of the present utility model has and advantage will become clear or more specifically be illustrated.
Description of drawings
Fig. 1 is the generalized section of the aluminium base cooling mechanism of utility model 201120490055.7.
Fig. 2 a is the generalized section of an embodiment of the electric elements substrate with high-heat conductive efficency of the present utility model.
Fig. 2 b is the generalized section of another embodiment of the electric elements substrate with high-heat conductive efficency of the present utility model.
Fig. 3 a to Fig. 3 f is the schematic top plan view of a plurality of embodiment of the arrangement of the first lyriform pore of the electric elements substrate with high-heat conductive efficency of the present utility model and the second lyriform pore.
Fig. 4 a to Fig. 4 c be the electric elements substrate with high-heat conductive efficency of the present utility model have more than one deck cover the copper layer time embodiment.
Fig. 5 is the generalized section that the electric elements substrate with high-heat conductive efficency of the present utility model is used for the LED light fixture.
Should understand, appended accompanying drawing is not the technique of painting of slightly simplifying that has shown pari passu the exemplifying various features of basic principle of the present utility model.Specific design feature of the present utility model disclosed herein for example comprises that concrete size, direction, position and profile will be partly will be used and the environment of use is determined by concrete.
In these figures, run through several figures of accompanying drawing, Reference numeral is quoted same or part that be equal to of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Fig. 2 a, the utility model provides a kind of electric elements substrate 23 with high-heat conductive efficency, described substrate 23 comprises base material 231, the insulating barrier 232 that stacks gradually from the bottom up and covers copper layer 233, be provided with at least two the first lyriform pores 24 corresponding to electric elements to be installed places on substrate 23, the first lyriform pore 24 runs through successively and covers copper layer 233, insulating barrier 232 and base material 231, be filled with Heat Conduction Material in the first lyriform pore 24, and the upper surface of the Heat Conduction Material of this filling contacts with electric elements.
In the embodiment shown in Fig. 2 a, the quantity of the first lyriform pore 24 only has two, and all be filled with Heat Conduction Material in these two lyriform pores 24, the Heat Conduction Material of this filling is preferably copper, certainly, the utility model is not limited in filling copper, and it also can fill the metal (for example silver) of other heat conduction, perhaps fills the nonmetal of other heat conduction.In addition, base material 231 is preferably aluminium sheet, and the utility model is not limited in the filling aluminium sheet certainly, and it can be also other metallic plate, for example copper coin; In addition, base material 231 also can not use metal material, and uses other this area through being commonly used for the material of base material.
Further, as shown in Fig. 2 b, in another embodiment of the electric elements substrate 23 with high-heat conductive efficency, when the quantity of described the first lyriform pore 24 during greater than two, the upper surface of substrate 23 also is provided with at least one second lyriform pore 25 corresponding to electric elements to be installed places, successively run through the same with the first lyriform pore 24 of the second lyriform pore 25 covered copper layer 233, insulating barrier 232 and base material 231, but do not fill Heat Conduction Material in the second lyriform pore 25.The benefit that the second lyriform pore 25 do not fill Heat Conduction Material is set is, its can electric elements and the radiator that arranges below (with reference to figure 5) of substrate 23 between form thermal convection, to reach the effect of accelerating heat radiation; Because such radiating effect is splendid, makes the section temperature of electric elements to be effectively controlled, thereby avoid under low temperature environment producing steam at the electric elements places, and then avoid steam to cause electric elements to damage.
Although only show two the first lyriform pores 24 and second lyriform pore 25 in the described embodiment of Fig. 2 b, but this is only a cross section of the present embodiment, therefore be understandable that for those skilled in the art, also can be arranged as first lyriform pore 24 and two the second lyriform pores 25 in adjacent cross section, perhaps with regard to there is no the second lyriform pore 25, the first lyriform pore only not arranged in other adjacent sections.Therefore, the utility model does not limit the first lyriform pore 24 and the second lyriform pore 25 so that how adjacent mode is arranged, and the more important thing is, the utility model is intended to limit and has simultaneously the first lyriform pore 24 and the second lyriform pore 25, and as a rule the quantity of the first lyriform pore 24 is more than the quantity of the second lyriform pore 25, for example the ratio of the quantity of the first lyriform pore 24 and described the second lyriform pore 25 is approximately 2:1,3:1 or 4:1, in addition, the ratio of the quantity of the first lyriform pore 24 and described the second lyriform pore 25 also can be 1:1.
Below with reference to Fig. 3 a to Fig. 3 f, it has shown several arrangements of the first lyriform pore 24 of the present utility model and the second lyriform pore 25.For example as shown in Fig. 3 a, the first lyriform pore 24 and the second lyriform pore 25 can be set to linear.For another example shown in Fig. 3 b to Fig. 3 d, the first lyriform pore 24 is arranged as array, and the second lyriform pore cloth 25 is put around the first lyriform pore 24, although the first lyriform pore is 2 * 2 array in Fig. 3 b, the first lyriform pore is 3 * 3 array in Fig. 3 c, the first lyriform pore is 3 * 4 array in Fig. 3 d, but this is only three kinds of signals, and it can be also array of 4 * 4,2 * 3 or 5 * 5 etc.As shown in Fig. 3 e, the first lyriform pore 24 is arranged as annular, and the second lyriform pore 25 be arranged in the first lyriform pore 24 around.Although do not show in Fig. 3 e, it will be appreciated by persons skilled in the art that the centre of the annular that this first lyriform pore 24 forms also can arrange the first lyriform pore 24.In addition, the first lyriform pore 24 of the present utility model and the second lyriform pore 25 can also be arranged to the such irregular layout of Fig. 3 f.
In the above-described embodiment, the utility model is described mainly for only having the single electric elements substrate that covers the copper layer, and still, what the utility model also can have double-deck or a multilayer covers the copper layer.As shown in Fig. 4 a, also stacking on base material 231 have an other layer insulating 232 ' and other one deck to cover copper layer 233 ', and the first lyriform pore 24 runs through all copper layers 233,233 ' and insulating barrier 232,232 ' and base material 231 that cover.Certainly, shown in Fig. 4 a is to have the double-deck copper layer that covers, and is understandable that for those skilled in the art, the utility model can be also three layers cover copper layer or more, as shown in Fig. 4 b, its demonstration be exactly three layers cover the copper layer.
In addition, as shown in Fig. 4 c, its demonstration be the embodiment that covers the copper layer that has when the utlity model has the first lyriform pore 24 and the second lyriform pore 25.As shown in Fig. 4 c, also stacking on base material 231 have an other layer insulating 232 ' and other one deck to cover copper layer 233 ', and the first lyriform pore 24 and the second lyriform pore 25 run through all copper layers 233,233 ' and insulating barrier 232,232 ' and base material 231 that cover.Similarly, it will be appreciated by persons skilled in the art that the embodiment shown in Fig. 4 c also can be changed to be three layers cover copper layer or more, just give unnecessary details no longer in addition at this.
In an embodiment of the present utility model, described electric elements can be LED.Below with reference to shown in Figure 5, the execution mode when introducing the electric elements substrate with high-heat conductive efficency of the present utility model and being applied to the LED light fixture.
As shown in Figure 5, LED27 is fixed on substrate 23 upper surface places with a plurality of the first lyriform pores 24 by scolder or glue 26, it is radiator that substrate 23 is connected with heat sink section bar 21(by heat conductive silica gel pad or silicone grease 22), the upper surface of the heat sink material in the first lyriform pore 24 contacts with the back side of LED27, and the lower surface of the heat sink material in the first lyriform pore 24 contacts with heat conductive silica gel pad or silicone grease 22.LED27 heat radiation process is directly avoided insulating barrier 232, heat dissipation path is as follows, the heat that LED sends is delivered to the Heat Conduction Material that covers in copper layer 233 and the first lyriform pore 24 from the LED base, directly heat is delivered to heat conductive silica gel pad or silicone grease 22 by Heat Conduction Material, and then be delivered to heat sink section bar 21, then carry out heat exchange with air.
Adopt said structure to make the heat that LED sends directly be delivered to heat sink section bar 21 by the Heat Conduction Material in the first lyriform pore 24, can quick heat radiating, and because the size that adopts a plurality of the first lyriform pores and each lyriform pore is less, thereby there is no Damage to insulation layer 232 in forming process, the insulating properties of insulating barrier 232 is almost constant, and the withstand voltage properties of insulating barrier 232 is constant, and then can avoid the LED on substrate 23 breakdown.
Further, also be provided with on substrate 23 between the radiator that the second lyriform pore 25, the second lyriform pores 25 can make LED and substrate 23 and form well thermal convection, accelerate the heat that LED sends and be delivered on radiator, realize quick heat radiating; Because such radiating rate is very fast, radiating effect is splendid, thus the LED section temperature can be effectively controlled, thereby avoid being applied in low temperature environment lower time at LED element place's generation steam as LED, and then avoid steam to cause the LED component wear.
In the utility model, when filling Heat Conduction Material, preferably Heat Conduction Material does not contact with the hole wall of the first lyriform pore 24, but, for the consideration of simplifying technique, therefore Heat Conduction Material also can contact with the hole wall of the first lyriform pore 24, because the copper layer 233 that covers under electric elements does not have the cloth circuits, even the Heat Conduction Material of metal and the problem of covering copper layer 233 and contacting and also can not be short-circuited.
In addition, be well known that for those skilled in the art, the covering the top of copper layer and can also be provided with anti-welding paint of substrate provided by the utility model, this anti-welding paint can just be provided with before the first lyriform pore and/or the formation of the second lyriform pore, can after the first lyriform pore and/or the second lyriform pore form, anti-welding paint be set again, but the existence of this anti-welding paint does not affect the use of the first lyriform pore and the second lyriform pore in a word yet.That is to say, if having anti-welding paint at the first lyriform pore and/or the second lyriform pore place, the first lyriform pore and/or the second lyriform pore should run through this anti-welding paint so.Setting about anti-welding paint is the known technology that belongs to this area, therefore do not giving unnecessary details in this article.In addition, for some user demand, also anti-welding paint can be set not.
The above is only preferred embodiment of the present utility model, and all equalizations of doing according to the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (10)
1. electric elements substrate with high-heat conductive efficency, it is characterized in that: described substrate comprises base material, the insulating barrier that stacks gradually from the bottom up and covers the copper layer, be provided with at least two the first lyriform pores corresponding to electric elements to be installed places on described substrate, described the first lyriform pore runs through described copper layer, insulating barrier and the base material of covering successively, be filled with Heat Conduction Material in described the first lyriform pore, and the upper surface of the Heat Conduction Material of this filling contacts with described electric elements.
2. the electric elements substrate with high-heat conductive efficency according to claim 1, it is characterized in that, when the quantity of described the first lyriform pore during greater than two, the upper surface of described substrate also is provided with at least one second lyriform pore in the location about corresponding to electric elements to be installed, described the second lyriform pore runs through successively described and covers copper layer, insulating barrier and base material, and does not fill Heat Conduction Material in described the second lyriform pore.
3. the electric elements substrate with high-heat conductive efficency according to claim 1, it is characterized in that, also stacking between described base material and insulating barrier have the insulating barrier of one deck at least and cover the copper layer, and described the first lyriform pore runs through all copper layer and insulating barrier and described base materials of covering.
4. the electric elements substrate with high-heat conductive efficency according to claim 2, it is characterized in that, also stacking between described base material and insulating barrier have the insulating barrier of one deck at least and cover the copper layer, and described the first lyriform pore and the second lyriform pore run through all copper layer and insulating barrier and described base materials of covering.
5. the electric elements substrate with high-heat conductive efficency according to claim 2, is characterized in that, the number of described the first lyriform pore is 2-12, and the number of described the second lyriform pore is 2-6.
6. the described electric elements substrate with high-heat conductive efficency of according to claim 1-5 any one, is characterized in that, the Heat Conduction Material of filling in described the first lyriform pore is copper, and described base material is aluminium sheet.
7. the electric elements substrate with high-heat conductive efficency according to claim 5, is characterized in that, described the first lyriform pore is arranged as array, and described the second lyriform pore is arranged in around described the first lyriform pore.
8. the electric elements substrate with high-heat conductive efficency according to claim 5, is characterized in that, described the first lyriform pore is arranged as annular, and described the second lyriform pore is arranged in around described the first lyriform pore.
9. the electric elements substrate with high-heat conductive efficency according to claim 2, is characterized in that, the ratio of the quantity of described the first lyriform pore and described the second lyriform pore is 1:1,2:1,3:1 or 4:1.
10. the described electric elements substrate with high-heat conductive efficency of according to claim 1-5 any one, is characterized in that, described electric elements are LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220518566 CN202977519U (en) | 2012-10-10 | 2012-10-10 | Electric appliance element substrate with high heat transfer efficiency |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220518566 CN202977519U (en) | 2012-10-10 | 2012-10-10 | Electric appliance element substrate with high heat transfer efficiency |
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| CN202977519U true CN202977519U (en) | 2013-06-05 |
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| CN 201220518566 Expired - Fee Related CN202977519U (en) | 2012-10-10 | 2012-10-10 | Electric appliance element substrate with high heat transfer efficiency |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883814A (en) * | 2015-05-28 | 2015-09-02 | 乐健科技（珠海）有限公司 | Graphite substrate and manufacture method thereof, LED module and manufacture method thereof |
| CN107039568A (en) * | 2016-02-03 | 2017-08-11 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate |
| CN107527988A (en) * | 2016-06-20 | 2017-12-29 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate and encapsulation |
| CN107546308A (en) * | 2016-06-23 | 2018-01-05 | 苏州科医世凯半导体技术有限责任公司 | A kind of high light large power automobile-used LED light source module group |
| CN111045251A (en) * | 2019-12-19 | 2020-04-21 | 武汉华星光电技术有限公司 | Side-in backlight structure and display device |
| CN112803793A (en) * | 2021-01-06 | 2021-05-14 | 杭州湘滨电子科技有限公司 | EPS device with base plate for heat dissipation |
-
2012
- 2012-10-10 CN CN 201220518566 patent/CN202977519U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104883814A (en) * | 2015-05-28 | 2015-09-02 | 乐健科技（珠海）有限公司 | Graphite substrate and manufacture method thereof, LED module and manufacture method thereof |
| CN107039568A (en) * | 2016-02-03 | 2017-08-11 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate |
| CN107527988A (en) * | 2016-06-20 | 2017-12-29 | 苏州科医世凯半导体技术有限责任公司 | A kind of compound high heat conductive insulating metal substrate and encapsulation |
| CN107546308A (en) * | 2016-06-23 | 2018-01-05 | 苏州科医世凯半导体技术有限责任公司 | A kind of high light large power automobile-used LED light source module group |
| CN111045251A (en) * | 2019-12-19 | 2020-04-21 | 武汉华星光电技术有限公司 | Side-in backlight structure and display device |
| CN112803793A (en) * | 2021-01-06 | 2021-05-14 | 杭州湘滨电子科技有限公司 | EPS device with base plate for heat dissipation |
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Granted publication date: 20130605 Termination date: 20151010 |
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