CN201285015Y - Road lamp radiation fin structure - Google Patents
Road lamp radiation fin structure Download PDFInfo
- Publication number
- CN201285015Y CN201285015Y CNU2008202120455U CN200820212045U CN201285015Y CN 201285015 Y CN201285015 Y CN 201285015Y CN U2008202120455 U CNU2008202120455 U CN U2008202120455U CN 200820212045 U CN200820212045 U CN 200820212045U CN 201285015 Y CN201285015 Y CN 201285015Y
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- CN
- China
- Prior art keywords
- heat
- insulating layer
- circuit board
- power led
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
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- Road Signs Or Road Markings (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a radiating fin structure for street lamps, comprising radiating fins and high-power LEDs arranged on the radiating fins; the bottom of the high-power LED is provided with a heat sink; the radiating fin is provided with a heat conducting and insulating layer which is provided with a printed circuit board; and the printed circuit board is coated with a printing ink insulating layer. Compared with the prior art, the utility model is free of the aluminium base plate and a layer of heat-conducting cream in the traditional scheme, thus greatly reducing the whole thermal resistance of the street lamp and reducing the manufacturing cost.
Description
Technical field:
The utility model relates to the road lamp cooling technology, specifically is a kind of heat radiating fin structure of LED street lamp.
Background technology:
The heat radiating fin structure of the power LED street lamp of present most of enterprises all is a coating heat-conducting cream on fin, fixing aluminium base on heat-conducting cream then, then applying one deck heat-conducting cream at aluminium base, and then connection led light source, need to adopt two-layer heat-conducting cream that aluminium base is clipped in the middle in the total, so that respectively led chip in the led light source and aluminium base are dispelled the heat, manufacturing procedure is many, and cost is higher.
Summary of the invention:
For this reason, the purpose of this utility model is to provide a kind of road lamp cooling chip architecture, to solve the existing problem that LED street lamp radiation fins manufacturing procedure is many, cost is high.
For achieving the above object, the utility model mainly adopts following technical scheme:
A kind of road lamp cooling chip architecture, comprise fin and the great power LED that is installed on the fin, described great power LED bottom is provided with heat sink, and described fin is provided with a heat conductive insulating layer, this heat conductive insulating layer is provided with printed circuit board (PCB), applies the printing ink insulating barrier on the described printed circuit board (PCB).
Described heat conductive insulating layer, printed circuit board (PCB) and printing ink insulating barrier are provided with respective perforations, the heat sink heat-conducting cream that is coated with in described great power LED bottom, and great power LED passes above-mentioned perforation and contacts with fin by heat-conducting cream.
Described printing ink insulating barrier is provided with perforation, the heat sink heat-conducting cream that is coated with in described great power LED bottom, and great power LED passes above-mentioned perforation and contacts with printed circuit board (PCB) by heat-conducting cream.
Described fin one end is a foliaceous radiator structure side by side, and an end is a plane, and described heat conductive insulating layer is arranged on this plane.
Described heat conductive insulating layer is made by epoxy resin and aluminium nitride.
The utility model at first is provided with the heat conductive insulating layer on fin, on this heat conductive insulating layer printed circuit board (PCB) is set then, and applies the printing ink insulating barrier on printed circuit board (PCB), compared with prior art, the utility model is simple in structure, has reduced the application of material, has reduced cost.
Description of drawings:
Fig. 1 is the utility model first example structure schematic diagram.
Fig. 2 is the utility model second example structure schematic diagram.
Identifier declaration among the figure: fin 1, blade 101, plane 102, heat conductive insulating layer 2, perforation 201, printed circuit board (PCB) 3, perforation 301, printing ink insulating barrier 4, perforation 401, great power LED 5, heat-conducting cream 6.
The specific embodiment:
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
The utility model mainly provides a kind of road lamp cooling chip architecture, it mainly includes fin 1 and a plurality of great power LEDs 5 that are installed on the fin 1, described fin 1 comprises two ends up and down, the lower end is a blade 101 side by side, the slit is left in the centre, so that heat radiation, the upper end then is a plane 102, and this plane is used to conduct heat to the heat radiation of blade 101 places.
Here said great power LED 5 bottoms are provided be used for that heat conduction uses heat sink, and between transverse plane 102 on the fin 1 and great power LED 5, also include heat conductive insulating layer 2, printed circuit board (PCB) 3 and printing ink insulating barrier 4, wherein said heat conductive insulating layer 2 is to be made by epoxy resin and aluminium nitride, it is laid on the plane 102, and heat conductive insulating layer 2 is provided with printed circuit board (PCB) 3, applies printing ink insulating barrier 4 on the described printed circuit board (PCB) 3.
Preferred embodiment one, as shown in Figure 1, a kind of road lamp cooling chip architecture, it mainly includes fin 1 and a plurality of great power LEDs 5 that are installed on the fin 1, wherein the last transverse plane 102 of fin 1 is provided with heat conductive insulating layer 2, is evenly distributed with a plurality of perforation 201 on the heat conductive insulating layer 2.Be provided with printed circuit board (PCB) 3 on heat conductive insulating layer 2, printed circuit board (PCB) 3 is the copper foil circuit layer, and also is provided with a plurality of perforation 301 corresponding to perforation 201 on this copper foil circuit layer.In addition.One deck printing ink insulating barrier 4 is stamped on printed circuit board (PCB) 3 upper berths, and corresponding printing ink insulating barrier 4 is provided with perforation 401, and above-mentioned perforation 201,301,401 is an one-to-one relationship.
Wherein great power LED 5 correspondences pass above-mentioned perforation 201,301,401, and inlay card is therein, thereby great power LED 5 bottoms are contacted with the plane 102 of fin 1 upper end.In addition,, on this is heat sink, also be coated with heat-conducting cream 6 because great power LED 5 bottoms are provided with heat sinkly, so contacting by heat-conducting cream 6 realizations between great power LED 5 and the plane 102, can be convenient to the heat radiation of great power LED 5 by this heat-conducting cream 6.
Preferred embodiment two, as shown in Figure 2, the utility model is the another kind of structure of street lamp radiation fins, it mainly includes fin 1 and a plurality of great power LEDs 5 that are installed on the fin 1, wherein the last transverse plane 102 of fin 1 is provided with heat conductive insulating layer 2, and heat conductive insulating layer 2 is provided with printed circuit board (PCB) 3, applies printing ink insulating barrier 4 on the described printed circuit board (PCB) 3.
Wherein said heat conductive insulating layer 2 is made by epoxy resin and aluminium nitride, printed circuit board (PCB) 3 is the copper foil circuit layer, 4 of printing ink insulating barriers are arranged on the printed circuit board (PCB) 3, wherein said printing ink insulating barrier 4 is provided with a plurality of perforation 401, corresponding to these perforation great power LED 5 inlay cards of 401 therein, and the bottom of this great power LED 5 contacts with the printed circuit board (PCB) 3 of printing ink insulating barrier 4 lower ends.
Because great power LED 5 bottoms are provided with heat sinkly, also are coated with heat-conducting cream 6 on this is heat sink, so great power LED 5 contacts with printed circuit board (PCB) 3 by heat-conducting cream 6, thereby reaches the purpose of heat radiation.
Compared with prior art, the utility model has saved the MCPCB in the traditional scheme (aluminium base) and one deck heat-conducting cream, significantly reduces the overall thermal resistance of power LED street lamp, has reduced manufacturing cost.
More than be that a kind of road lamp cooling chip architecture provided by the utility model is described in detail, used specific case herein structural principle of the present utility model and embodiment are set forth, above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (5)
1, a kind of road lamp cooling chip architecture, comprise fin and the great power LED that is installed on the fin, described great power LED bottom is provided with heat sink, it is characterized in that: described fin is provided with a heat conductive insulating layer, this heat conductive insulating layer is provided with printed circuit board (PCB), applies the printing ink insulating barrier on the described printed circuit board (PCB).
2, road lamp cooling chip architecture according to claim 1, it is characterized in that: described heat conductive insulating layer, printed circuit board (PCB) and printing ink insulating barrier are provided with respective perforations, the heat sink heat-conducting cream that is coated with in described great power LED bottom, great power LED passes above-mentioned perforation and contacts with fin by heat-conducting cream.
3, road lamp cooling chip architecture according to claim 1 is characterized in that: described printing ink insulating barrier is provided with perforation, the heat sink heat-conducting cream that is coated with in described great power LED bottom, and great power LED passes above-mentioned perforation and contacts with printed circuit board (PCB) by heat-conducting cream.
4, road lamp cooling chip architecture according to claim 1 is characterized in that: described fin one end is a foliaceous radiator structure side by side, and an end is a plane, and described heat conductive insulating layer is arranged on this plane.
5, road lamp cooling chip architecture according to claim 1 is characterized in that: described heat conductive insulating layer is made by epoxy resin and aluminium nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202120455U CN201285015Y (en) | 2008-09-25 | 2008-09-25 | Road lamp radiation fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202120455U CN201285015Y (en) | 2008-09-25 | 2008-09-25 | Road lamp radiation fin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201285015Y true CN201285015Y (en) | 2009-08-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202120455U Expired - Fee Related CN201285015Y (en) | 2008-09-25 | 2008-09-25 | Road lamp radiation fin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201285015Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014154083A1 (en) * | 2013-03-27 | 2014-10-02 | 深圳市耀嵘科技有限公司 | Led lamp module and led lamp |
| CN107420753A (en) * | 2017-07-25 | 2017-12-01 | 飞浦防爆电器有限公司 | A kind of New LED explosion-proof lamp that can be directly mounted on aluminium alloy heat radiator |
| CN108343850A (en) * | 2010-04-02 | 2018-07-31 | Ge照明解决方案有限责任公司 | The LED light that lightweight is heat sink and uses the lightweight heat sink |
-
2008
- 2008-09-25 CN CNU2008202120455U patent/CN201285015Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108343850A (en) * | 2010-04-02 | 2018-07-31 | Ge照明解决方案有限责任公司 | The LED light that lightweight is heat sink and uses the lightweight heat sink |
| WO2014154083A1 (en) * | 2013-03-27 | 2014-10-02 | 深圳市耀嵘科技有限公司 | Led lamp module and led lamp |
| CN107420753A (en) * | 2017-07-25 | 2017-12-01 | 飞浦防爆电器有限公司 | A kind of New LED explosion-proof lamp that can be directly mounted on aluminium alloy heat radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN JIUZHOU PHOTONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN JIUZHOU PHOTOELECTRON CO., LTD. Effective date: 20100917 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 BUILDING 7, SHAERLANTIAN SCI-TECH PARK, DITANG ROAD, SHAJING TOWN, BAOAN DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE TO: 518000 1, BUILDING 1, JIUZHOU INDUSTRIAL PARK, ZHENTANG ROAD 1, GUANGMING NEW DISTRICT, SHENZHEN CITY, GUANGDONG PROVINCE, 2/F |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100917 Address after: 518000, Guangdong, Shenzhen Guangming New District, Tong Tong Road, Jiuzhou Industrial Park, building No. one or two Patentee after: Shenzhen Jiuzhou Optoelectronics Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Hall Dili Lu Sha two Lantian Science Park 7 Patentee before: Shenzhen Jiuzhou Photoelectron Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20130925 |