CN216700705U - Modular multilayer circuit board place structure - Google Patents
Modular multilayer circuit board place structure Download PDFInfo
- Publication number
- CN216700705U CN216700705U CN202123172891.3U CN202123172891U CN216700705U CN 216700705 U CN216700705 U CN 216700705U CN 202123172891 U CN202123172891 U CN 202123172891U CN 216700705 U CN216700705 U CN 216700705U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mounting
- mounting panel
- multilayer circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a combined multilayer circuit board placing structure, and relates to the technical field of multilayer circuit boards. Including the mounting panel of two upper and lower settings, the mounting groove has all been seted up to one side that two mounting panels kept away from each other, and all installs the circuit board in the mounting groove, and the equal fixedly connected with connecting block in top four corners position of the mounting panel that is located the below, the mounting panel that is located the top passes through the bolted connection connecting block, is formed with the heat dissipation space between two mounting panels, and evenly is provided with the fin of connecting two mounting panels in this heat dissipation space. This multilayer circuit board of combination formula places structure, the circuit board of installing in the mounting groove can give the mounting panel with heat transfer when work produced heat, and the mounting panel gives the fin with heat transfer, because of forming the heat dissipation space between two mounting panels, therefore the fin can play good radiating effect.
Description
Technical Field
The utility model relates to the technical field of multilayer circuit boards, in particular to a combined multilayer circuit board placing structure.
Background
Nowadays, electronic products are developed rapidly, the application range of electronic products is more and more extensive, many electronic devices used by people are constantly updated, more convenience is provided for people, in the production of electronic products, a circuit board is a core part of the electronic products, and in the production of many electronic products with more functions, one circuit board cannot integrate all circuits and electronic elements, so that multilayer circuit boards can be produced at the same time, and the functional requirements of the electronic products are met.
After the existing multilayer circuit boards are combined together, a large amount of heat can be generated in the working operation of the circuit boards, and if the heat cannot be effectively dissipated, the working failure rate of the multilayer circuit boards is high, and the operation of equipment is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a combined multilayer circuit board placing structure, which aims to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a modular multilayer circuit board places structure, includes the mounting panel that sets up about two, two the mounting panel one side of keeping away from each other all has seted up the mounting groove, and all installs the circuit board in the mounting groove, is located the below the equal fixedly connected with connecting block in top four corners position of mounting panel is located the top the mounting panel passes through the bolted connection connecting block, two be formed with the heat dissipation space between the mounting panel, and evenly be provided with in this heat dissipation space and connect two the fin of mounting panel.
Furthermore, through holes are uniformly formed in the surface of the radiating fin.
Further, the inner wall of mounting groove is provided with graphite alkene insulation heat-conducting layer.
Furthermore, slots are formed in one side, close to each other, of the two mounting plates, and the two ends of the radiating fins are inserted into the slots.
Furthermore, the slot is filled with heat-conducting silicone grease.
Furthermore, the mounting plate and the radiating fins are made of aluminum.
Compared with the prior art, the utility model provides a combined multilayer circuit board placing structure, which has the following beneficial effects: this multilayer circuit board of combination formula places structure, the circuit board of installing in the mounting groove can give the mounting panel with heat transfer when work produced heat, and the mounting panel gives the fin with heat transfer, because of forming the heat dissipation space between two mounting panels, therefore the fin can play good radiating effect.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic plan view of the present invention;
FIG. 3 is a schematic structural view of a mounting plate of the present invention;
fig. 4 is an enlarged schematic view of the utility model at a.
In the figure: 1. mounting a plate; 2. mounting grooves; 3. a circuit board; 4. a heat sink; 5. a through hole; 6. connecting blocks; 7. a graphene insulating and heat conducting layer; 8. a slot; 9. and (3) heat-conducting silicone grease.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the utility model discloses a combined multilayer circuit board placing structure, which comprises two mounting plates 1 arranged up and down, wherein one side, away from each other, of each of the two mounting plates 1 is provided with a mounting groove 2, a circuit board 3 is arranged in each mounting groove 2, four corners of the top of the mounting plate 1 positioned below are fixedly connected with connecting blocks 6, the mounting plate 1 positioned above is connected with the connecting blocks 6 through bolts, a heat dissipation space is formed between the two mounting plates 1, and heat dissipation fins 4 for connecting the two mounting plates 1 are uniformly arranged in the heat dissipation space.
Specifically, through holes 5 are uniformly formed in the surface of the radiating fin 4.
In the present embodiment, the provision of the through holes 5 can increase the contact area between the heat sink 4 and the air, and can promote the flow of the air, so that the heat sink 4 can satisfactorily dissipate heat from the circuit board 3, and the weight of the heat sink 4 can be reduced.
Specifically, the inner wall of the mounting groove 2 is provided with a graphene insulation heat conduction layer 7.
In this embodiment, the graphene insulation heat conduction layer 7 can efficiently transfer heat generated by the circuit board 3 to the mounting board 1, and can also play a role in insulation protection for the circuit board 3.
Specifically, two slots 8 are formed in the side, close to each other, of the mounting plate 1, and the two ends of the radiating fins 4 are inserted into the slots 8.
In this embodiment, the slot 8 is provided, so that the heat dissipation plate 4 can be conveniently disassembled and fixed, meanwhile, the slot 8 can also enlarge the contact area between the heat dissipation plate 4 and the mounting plate 1, and the efficiency of the mounting plate 1 for transferring heat to the heat dissipation plate 4 can be improved.
Specifically, the heat-conducting silicone grease 9 is filled in the slot 8.
In this embodiment, when the two ends of the heat sink 4 are installed in the slot 8, the heat-conducting silicone grease 9 can fill the gap between the heat sink 4 and the inner wall of the slot 8, so that the mounting board 1 can efficiently transfer heat to the heat sink 4 to dissipate the heat.
Specifically, the mounting plate 1 and the heat sink 4 are made of aluminum.
In this embodiment, the mounting plate 1 and the heat sink 4 made of aluminum have good heat dissipation capability, and are relatively light in weight and low in cost.
When using, install circuit board 3 in mounting groove 2 when work produced heat, the produced accessible graphite alkene heat-insulating and conducting layer 7 transmission of work gives the mounting panel, and the installation, 1 when giving off heat, also can give off some heat transmission for fin 4, because of forming the heat dissipation space between two mounting panels 1, and the through-hole 5 has been seted up on the surface of fin 4, can promote the air and take away the heat on mounting panel 1 and fin 4 surfaces in the flow in heat dissipation space.
In summary, in the combined multilayer circuit board placing structure, when the circuit board 3 installed in the installation groove 2 generates heat during operation, the heat can be transferred to the installation plate 1, the installation plate 1 transfers the heat to the heat sink 4, and the heat sink 4 can perform a good heat dissipation function because a heat dissipation space is formed between the two installation plates 1.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a modular multilayer circuit board places structure, includes mounting panel (1) that two set up from top to bottom, its characterized in that: two mounting panel (1) one side of keeping away from each other has all been seted up mounting groove (2), and all installs circuit board (3) in mounting groove (2), is located the below the equal fixedly connected with connecting block (6) in top four corners position of mounting panel (1) is located the top mounting panel (1) is through bolted connection connecting block (6), two be formed with the heat dissipation space between mounting panel (1), and evenly be provided with in this heat dissipation space and connect two fin (4) of mounting panel (1).
2. A combined multilayer circuit board placement structure according to claim 1, characterized in that: through holes (5) are uniformly formed in the surface of the radiating fin (4).
3. A combined multilayer circuit board placement structure according to claim 1, wherein: the inner wall of the mounting groove (2) is provided with a graphene insulation heat conduction layer (7).
4. A combined multilayer circuit board placement structure according to claim 1, characterized in that: two slot (8) have all been seted up to the one side that mounting panel (1) are pressed close to each other, the both ends of fin (4) are all pegged graft in slot (8).
5. A modular multilayer circuit board placement structure according to claim 4, wherein: and the heat-conducting silicone grease (9) is filled in the slot (8).
6. A combined multilayer circuit board placement structure according to claim 1, characterized in that: the mounting plate (1) and the radiating fins (4) are made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123172891.3U CN216700705U (en) | 2021-12-16 | 2021-12-16 | Modular multilayer circuit board place structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123172891.3U CN216700705U (en) | 2021-12-16 | 2021-12-16 | Modular multilayer circuit board place structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216700705U true CN216700705U (en) | 2022-06-07 |
Family
ID=81839699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123172891.3U Active CN216700705U (en) | 2021-12-16 | 2021-12-16 | Modular multilayer circuit board place structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216700705U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395865A (en) * | 2023-12-12 | 2024-01-12 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
-
2021
- 2021-12-16 CN CN202123172891.3U patent/CN216700705U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117395865A (en) * | 2023-12-12 | 2024-01-12 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
| CN117395865B (en) * | 2023-12-12 | 2024-02-27 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216700705U (en) | Modular multilayer circuit board place structure | |
| CN202977519U (en) | Electric appliance element substrate with high heat transfer efficiency | |
| CN208462136U (en) | A kind of pcb board convenient for heat dissipation | |
| CN202918632U (en) | Double-sided cooling structure of multi-power components and electronic device thereof | |
| CN209402925U (en) | A kind of two-side radiation device of pcb board | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| CN102036470B (en) | Low-thermal-resistance and high-radiation metal-base circuit board | |
| CN210042381U (en) | PCB circuit board of high-efficient heat dissipation multilayer | |
| CN210579422U (en) | Printed circuit board with copper-based embedded circuit | |
| CN210986573U (en) | High heat dissipation printed wiring board | |
| CN210183625U (en) | Heat dissipation type multilayer circuit board | |
| CN207766655U (en) | A kind of heat sinking circuit board | |
| CN109526136B (en) | Power device heat abstractor | |
| US11662087B2 (en) | Power supply device and high-power illumination system | |
| CN209930602U (en) | Novel circuit board | |
| CN211860651U (en) | Integrated circuit board convenient to heat dissipation | |
| CN110809362A (en) | High-heat-dissipation printed circuit board and manufacturing method thereof | |
| CN215683054U (en) | Automatic display drive plate heat radiation structure of accuse temperature | |
| CN215379571U (en) | Radiator of power converter, power converter and fill electric pile | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN218941419U (en) | Double-sided multilayer printed circuit board | |
| CN219999671U (en) | Metal substrate structure | |
| CN217336014U (en) | Carbon paste through hole circuit board with good heat dissipation effect | |
| CN217283858U (en) | High-heat-conductivity single-side aluminum substrate | |
| CN218194917U (en) | Positioning greasing tool for installing power tube on radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |