CN219999671U - Metal substrate structure - Google Patents
Metal substrate structure Download PDFInfo
- Publication number
- CN219999671U CN219999671U CN202321146606.7U CN202321146606U CN219999671U CN 219999671 U CN219999671 U CN 219999671U CN 202321146606 U CN202321146606 U CN 202321146606U CN 219999671 U CN219999671 U CN 219999671U
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- CN
- China
- Prior art keywords
- mounting
- metal substrate
- substrate structure
- layer
- structure according
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- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 39
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model discloses a metal substrate structure which comprises mounting plates, wherein mounting layers are symmetrically arranged on side walls of two opposite sides of each mounting plate, wire pavement is arranged on each of the two mounting layers, and insulating layers are arranged between the mounting plates and the mounting layers. According to the metal substrate structure provided by the utility model, the mounting layers are arranged on the two side walls of the mounting plate, the line pavement is arranged on the mounting layers, the lines can be arranged on the two layout surfaces of one mounting plate, the holding capacity of the mounting plate is increased, the insulating layer is arranged between the mounting layers and the mounting plate, the current can be isolated, the short circuit of the two line surfaces through the mounting plate is avoided, the independent operation of the two line surfaces is ensured, and the mutual influence is avoided.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a metal substrate structure.
Background
The circuit board is one of important components of modern electric appliances, can miniaturize and visualise a circuit, and plays an important role in mass production of fixed circuits and optimizing electric appliance layout.
According to publication (bulletin) number CN212344138U, publication (bulletin) date 2021.01.12, a metal substrate structure is disclosed, comprising a metal substrate, and characterized in that, the upper surface of metal substrate is provided with the dielectric layer, the upper surface of dielectric layer is provided with copper foil one, the lower surface of metal substrate is provided with the insulating layer, the lower surface of insulating layer is provided with copper foil two, follow on the metal substrate the isolation hole has been seted up to the thickness direction of metal substrate, the isolation hole is followed the upper surface of dielectric layer extends to the lower surface of insulating layer, with be provided with the heat dissipation area on the metal substrate that the isolation hole corresponds, the periphery of metal substrate is provided with the structural hole respectively. The device welds components and parts directly on metal substrate, and the components and parts pass through metal substrate and dispel the heat directly, and self heat-sinking capability is very high after this design dielectric layer, insulating layer and copper foil layer combine, can improve the heat dissipation function of metal substrate system circuit board greatly to satisfy high-power heat dissipation requirement, improved the range of application of LED product.
In the prior art including the above patent, the circuit board is formed by a substrate and a circuit printed on the substrate, and the substrate is printed on one side, so when the requirement for the circuit is high, several circuit boards are required to be manufactured or the size of the substrate is increased so as to bear the circuit, but this affects the layout inside the electrical appliance.
Disclosure of Invention
The utility model aims to provide a metal substrate structure, which aims to solve the problem that only one surface of a traditional circuit board is a circuit surface and circuits capable of being carried are limited.
In order to achieve the above purpose, the utility model provides a metal substrate structure, which comprises a mounting plate, wherein mounting layers are symmetrically arranged on side walls of two opposite sides of the mounting plate, a wire road surface is arranged on each of the two mounting layers, and an insulating layer is arranged between the mounting plate and the mounting layers.
Preferably, the mounting plate includes a cavity portion and fixing portions symmetrically distributed on both sides of the cavity portion.
Preferably, a plurality of heat conductive sheets are provided inside the cavity.
Preferably, two adjacent heat conductive sheets are abutted.
Preferably, the fixing portion is provided with a plurality of through holes.
Preferably, through holes matched with the through holes are formed in the mounting layer and the insulating layer.
Preferably, the mounting layer is provided with supporting cylinders corresponding to the through holes one by one.
Preferably, the mounting plate is specifically an aluminum plate.
Preferably, the insulating layer is specifically a high-thermal-conductivity adhesive layer.
Preferably, the mounting layer is specifically copper foil.
In the technical scheme, the metal substrate structure provided by the utility model has the following beneficial effects: all be provided with the erection bed on two lateral walls of mounting panel, be provided with the circuit face on the erection bed, can set up the circuit on two layouts of a mounting panel, increased the holding capacity of mounting panel, and be provided with the insulating layer between erection bed and the mounting panel, can the isolated current, avoid two circuit faces to pass through the mounting panel and the short circuit, guarantee that two circuit faces can independently operate, each other do not influence.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of the overall structure provided by an embodiment of the present utility model;
fig. 2 is an enlarged view at a in fig. 1.
Reference numerals illustrate:
1. a mounting plate; 11. a cavity portion; 12. a fixing part; 13. a heat conductive sheet; 2. an installation layer; 21. a support cylinder; 3. an insulating layer.
Description of the embodiments
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-2, a metal substrate structure comprises a mounting plate 1, wherein mounting layers 2 are symmetrically arranged on side walls of two opposite sides of the mounting plate 1, circuit surfaces are arranged on the two mounting layers 2, and insulating layers 3 are arranged between the mounting plate 1 and the mounting layers 2.
In the above technical scheme, all be provided with mounting layer 2 on the two lateral walls of mounting panel 1, be provided with the line road surface on the mounting layer 2, can set up the circuit on two layouts of a mounting panel 1, increased mounting panel 1's holding capacity, and be provided with insulating layer 3 between mounting layer 2 and the mounting panel 1, can the isolated electric current, avoid two circuit faces to pass through mounting panel 1 and the short circuit, guarantee that two circuit faces can independently operate, each other do not influence.
As a further provided embodiment of the present utility model, as shown in fig. 1-2, the mounting plate 1 includes a cavity portion 11 and fixing portions 12 symmetrically distributed on both sides of the cavity portion 11, wherein a plurality of heat conducting fins 13 are disposed in the cavity portion 11, and two adjacent heat conducting fins 13 are abutted; the cavity portion 11 can provide a passage through which air flows, and the heat conductive sheet 13 can increase the contact area between the mounting plate 1 and the air so as to better dissipate heat, and the adjacent two heat conductive sheets 13 are abutted to form a plurality of triangular structures with the mounting plate 1, so that the bending resistance of the mounting plate 1 is improved.
As still another embodiment of the present utility model, as shown in fig. 1-2, a plurality of through holes are formed in the fixing portion 12, through holes adapted to the through holes are formed in the mounting layer 2 and the insulating layer 3, and supporting cylinders 21 corresponding to the through holes one by one are arranged on the mounting layer 2; the through hole on the fixed part 12 can be opposite to the holes on the installation layer 2 and the insulating layer 3 so as to be convenient to install, and the installation layer 2 is provided with a supporting cylinder 21, the supporting cylinder 21 can prop up the circuit surface on the installation layer 2, so that the circuit surface is prevented from being attached to a fixed foundation, the operation safety of the circuit surface is ensured, and the heat dissipation can be better.
As a further embodiment of the present utility model, as shown in fig. 1-2, the mounting board 1 is specifically an aluminum board, the aluminum board is simply and durable to obtain and process, the insulating layer 3 is specifically a high heat conductive adhesive layer, and heat generated during operation of the circuit surface on the mounting layer 2 can be transferred to the mounting board 1, so as to better dissipate heat, the mounting layer 2 is specifically a copper foil, and the heat conductivity and the electrical conductivity of the copper foil are both good, so that good assurance can be provided for the circuit operation thereon.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (10)
1. The utility model provides a metal substrate structure, its characterized in that includes mounting panel (1), symmetry is provided with mounting layer (2) on the lateral wall of mounting panel (1) both sides relatively, two all be provided with the circuit face on mounting layer (2), mounting panel (1) with all be provided with insulating layer (3) between mounting layer (2).
2. A metal substrate structure according to claim 1, characterized in that the mounting plate (1) comprises a cavity portion (11) and fixing portions (12) symmetrically distributed on both sides of the cavity portion (11).
3. A metal substrate structure according to claim 2, characterized in that the cavity (11) is internally provided with a plurality of heat conductive fins (13).
4. A metal substrate structure according to claim 3, wherein two adjacent heat conducting fins (13) are abutted.
5. A metal substrate structure according to claim 2, wherein the fixing portion (12) is provided with a plurality of through holes.
6. A metal substrate structure according to claim 5, characterized in that the mounting layer (2) and the insulating layer (3) are provided with through holes adapted to the through holes.
7. A metal substrate structure according to claim 5, wherein the mounting layer (2) is provided with support cylinders (21) in one-to-one correspondence with the through holes.
8. A metal substrate structure according to claim 1, characterized in that the mounting plate (1) is in particular an aluminium plate.
9. A metal substrate structure according to claim 1, characterized in that the insulating layer (3) is in particular a high thermal conductivity glue layer.
10. A metal substrate structure according to claim 1, characterized in that the mounting layer (2) is in particular a copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321146606.7U CN219999671U (en) | 2023-05-13 | 2023-05-13 | Metal substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321146606.7U CN219999671U (en) | 2023-05-13 | 2023-05-13 | Metal substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999671U true CN219999671U (en) | 2023-11-10 |
Family
ID=88614143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321146606.7U Active CN219999671U (en) | 2023-05-13 | 2023-05-13 | Metal substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999671U (en) |
-
2023
- 2023-05-13 CN CN202321146606.7U patent/CN219999671U/en active Active
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