CN117119676B - High heat dissipation copper post composite metal base PCB board - Google Patents
High heat dissipation copper post composite metal base PCB board Download PDFInfo
- Publication number
- CN117119676B CN117119676B CN202311367813.XA CN202311367813A CN117119676B CN 117119676 B CN117119676 B CN 117119676B CN 202311367813 A CN202311367813 A CN 202311367813A CN 117119676 B CN117119676 B CN 117119676B
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- Prior art keywords
- layer
- copper
- heat dissipation
- fixing ring
- mounting hole
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 161
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 124
- 239000010949 copper Substances 0.000 title claims abstract description 124
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 title claims abstract description 23
- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 239000011889 copper foil Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 148
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 abstract description 8
- 230000008878 coupling Effects 0.000 abstract description 6
- 238000010168 coupling process Methods 0.000 abstract description 6
- 238000005859 coupling reaction Methods 0.000 abstract description 6
- 239000004411 aluminium Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high heat dissipation copper column composite metal base PCB board, in particular to the technical field of PCB boards, comprising: the base material, the base material includes the copper basic unit, the bottom of copper basic unit is provided with the aluminium basic unit, the top of copper basic unit is provided with coupling assembling, coupling assembling's top is provided with the top material, the top material includes the copper foil layer, the upper surface of copper foil layer is provided with the electroplated copper layer, the surface of electroplated copper layer and copper foil layer all is provided with a plurality of mounting hole, every the mounting hole all runs through electroplated copper layer and copper foil layer, every the inside radiator unit that all is provided with of mounting hole. The invention can make the connection between the layers of the device more tightly improve the heat dissipation performance of the device, and can make the installation of the copper column more convenient, and improve the installation efficiency and the overall heat dissipation performance of the device.
Description
Technical Field
The invention relates to the field of PCB boards, in particular to a high-heat-dissipation copper column composite metal-based PCB board.
Background
In recent years, the metal-based PCB has been widely used, compared with the common FR-4 material, the heat dissipation performance of the metal-based PCB is widely accepted, the heat conductivity of the metal-based PCB is higher and reaches 400W/m.K, but the heat conductivity of the insulating layer can only reach 2-4W/m.K, so the heat conductivity of the insulating layer determines that the whole heat conductivity of the metal-based PCB is lower, the high heat conductivity of the metal-based PCB cannot be fully utilized, the heat of the heating element cannot be timely conducted out, and the service life, the performance and the like of the product are greatly reduced; the PCB board design can adopt a copper column design to directly connect the heating element and the copper substrate, so that the heat generated by the heating element can be directly transmitted to the copper substrate through the copper column and timely dissipated;
but the installation of copper post in the current metal base PCB board that increases the copper post is not convenient enough, and can't change the copper post, and the connection between each sheet layer of metal base PCB board is inseparable enough, influences the radiating efficiency of metal base PCB board.
Disclosure of Invention
The technical problems to be solved are as follows: the installation of copper post in the current metal base PCB board that increases the copper post is not convenient enough, and can't change the copper post, and the connection between each sheet layer of metal base PCB board is inseparable enough, influences the radiating efficiency of metal base PCB board.
Aiming at the defects of the prior art, the invention provides a high-heat-dissipation copper column composite metal-based PCB, which solves the problems in the background art.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
a high heat dissipation copper pillar composite metal-based PCB board comprising: the base material, the base material includes the copper basic unit, the bottom of copper basic unit is provided with the aluminium basic unit, the top of copper basic unit is provided with coupling assembling, coupling assembling's top is provided with the top material, the top material includes the copper foil layer, the upper surface of copper foil layer is provided with the electroplated copper layer, the surface of electroplated copper layer and copper foil layer all is provided with a plurality of mounting hole, every the mounting hole all runs through electroplated copper layer and copper foil layer, every the inside radiator unit that all is provided with of mounting hole.
In one possible implementation manner, the upper surface of the copper base layer is provided with four first connecting grooves, the four first connecting grooves are respectively located at four corners of the upper surface of the copper base layer, and the upper surface of the copper base layer is provided with a first adhesive layer.
In one possible implementation manner, the surface of the copper base layer is provided with a plurality of heat dissipation holes, each heat dissipation hole penetrates through the copper base layer and extends to the surface of the aluminum base layer, the number of the heat dissipation holes is the same as that of the mounting holes, and the positions of each heat dissipation hole and the mounting hole are corresponding to each other.
In one possible implementation manner, the connection assembly comprises a connection layer, the connection layer is located above the copper base layer, four connection blocks are arranged at the bottom of the connection layer, the four connection blocks are located at four corners of the bottom of the connection layer respectively, each connection block is connected with each first connection groove in a matching mode, and second connection grooves are formed in four corners of the top of the connection layer.
In one possible implementation manner, the top and the bottom of the connecting layer are both provided with second adhesive layers, the second adhesive layers at the bottom of the connecting layer are connected with the first adhesive layers in a matched manner, the surface of the connecting layer is provided with perforations, the perforations penetrate through the connecting layer, the number of the perforations is the same as that of the mounting holes, and the positions of the perforations and the mounting holes are mutually corresponding.
In one possible implementation manner, four connecting blocks are arranged at the bottom of the copper foil layer, the four connecting blocks are respectively located at four corners of the bottom of the copper foil layer, the connecting blocks at the bottom of the copper foil layer are respectively connected with the second connecting grooves in a matched mode, a third adhesive layer is arranged at the bottom of the copper foil layer, and the third adhesive layer is connected with the second adhesive layer at the top of the connecting layer in a matched mode.
In one possible implementation manner, the two sides of each mounting hole are respectively provided with an anode and a cathode, the surface of the electroplated copper layer is provided with components, and the components are connected through a connecting circuit.
In one possible implementation manner, the heat dissipation assembly includes a copper pillar, the copper pillar is located inside the mounting hole and penetrates through the through hole, the bottom of the copper pillar is located inside the heat dissipation hole, a first fixing ring and a second fixing ring are arranged on the surface of the copper pillar, the first fixing ring is in sealing connection with the mounting hole, and the second fixing ring is in sealing connection with the through hole.
In one possible implementation manner, a plurality of heat dissipation pins are arranged at the bottom of the copper pillar, one end of each heat dissipation pin is fixedly connected with the copper pillar, and the other end of each heat dissipation pin is connected with the inner side of a heat dissipation hole of the copper base layer.
In one possible implementation manner, the top of the copper pillar is provided with a placing plate, the upper surface of the placing plate is provided with a placing pad, the surface of the placing pad is provided with an electric element, the side surface of the placing plate is provided with a fixing plate, and the surface of the fixing plate is provided with a connecting hole.
Advantageous effects
Firstly, connecting a connecting block at the bottom of a connecting layer with a first connecting groove on the upper surface of a copper base layer, so that a second adhesive layer at the bottom of the connecting layer is connected with a first adhesive layer on the upper surface of the copper base layer, so that the copper base layer is connected with the connecting layer, then, matching connection is carried out between the connecting block at the bottom of the copper foil layer and the second connecting groove on the upper surface of the connecting layer, matching connection is carried out between a third adhesive layer at the bottom of the copper foil layer and the second adhesive layer on the upper surface of the connecting layer, so that the copper foil layer is connected with the connecting layer, and the connection between the layers of the device is more compact, so that the heat dissipation performance of the device is improved;
secondly, through placing the copper post inside the mounting hole, and pass the perforation, make copper post bottom be located the louvre inside and with aluminium alloy contact, and carry out sealing connection with the mounting hole through the first solid fixed ring on copper post surface, then carry out sealing connection with the perforation through the second solid fixed ring, thereby make the installation of copper post more convenient, electric component's heat is led through the copper post, and finally disperse through the radiating pin, hoisting device's radiating efficiency, install electric component places the board surface, and support through placing the pad, then through fixed plate and the connecting hole that sets up, can make electric component's installation more convenient, and make electric component be connected with the positive pole and the negative pole on electroplated copper layer surface respectively, make device's integral erection more convenient.
Drawings
For a clearer description of embodiments of the present application or of the solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments described in the present invention, and that other drawings may be obtained according to these drawings for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is an exploded view of the structure of the present invention;
FIG. 3 is a schematic view of the structure of the substrate of the present invention;
FIG. 4 is a schematic view of a connecting assembly according to the present invention;
FIG. 5 is a schematic view of the structure of the roofing material according to the present invention;
fig. 6 is a schematic structural diagram of a heat dissipating assembly according to the present invention.
Reference numerals illustrate:
1. a substrate; 101. a copper-based layer; 102. a first adhesive layer; 103. a first connection groove; 104. a heat radiation hole; 2. a connection assembly; 201. a connection layer; 202. a second adhesive layer; 203. a second connecting groove; 204. perforating; 3. jacking materials; 301. a copper foil layer; 302. a third adhesive layer; 4. electroplating a copper layer; 5. a positive electrode; 6. a negative electrode; 7. a heat dissipation assembly; 701. copper columns; 702. a first fixing ring; 703. a second fixing ring; 704. a heat dissipation pin; 705. placing a plate; 706. placing a pad; 707. a fixing plate; 708. a connection hole; 8. a component; 9. a connection line; 10. an aluminum base layer; 11. and (5) mounting holes.
Detailed Description
The embodiment of the application solves the problems in the prior art by providing the high-heat-dissipation copper column composite metal-based PCB.
The technical scheme in the embodiment of the application aims to solve the problems, and the overall thought is as follows:
1-6, a high heat dissipation copper pillar composite metal-based PCB board includes: the substrate 1, substrate 1 includes copper basic unit 101, copper basic unit 101's bottom is provided with aluminium basic unit 10, copper basic unit 101's top is provided with coupling assembling 2, coupling assembling 2's top is provided with top material 3, top material 3 includes copper foil layer 301, copper foil layer 301's upper surface is provided with electroplated copper layer 4, electroplated copper layer 4 and copper foil layer 301's surface all is provided with a plurality of mounting hole 11, every mounting hole 11 all runs through electroplated copper layer 4 and copper foil layer 301, every the inside heat dissipation subassembly 7 that all is provided with of mounting hole 11.
In some examples, the upper surface of the copper base layer 101 is provided with four first connection grooves 103, the four first connection grooves 103 are respectively located at four corners of the upper surface of the copper base layer 101, the upper surface of the copper base layer 101 is provided with a first adhesive layer 102, the surface of the copper base layer 101 is provided with a plurality of heat dissipation holes 104, each heat dissipation hole 104 penetrates through the copper base layer 101 and extends to the surface of the aluminum base layer 10, the number of the heat dissipation holes 104 is the same as the number of the mounting holes 11, and each heat dissipation hole 104 corresponds to the position of the mounting hole 11.
In some examples, the connection assembly 2 includes a connection layer 201, the connection layer 201 is located above the copper base layer 101, four connection blocks are disposed at the bottom of the connection layer 201, the four connection blocks are located at four corners of the bottom of the connection layer 201, each connection block is connected with each first connection groove 103 in a matching manner, second connection grooves 203 are disposed at four corners of the top of the connection layer 201, second adhesive layers 202 are disposed at the top and bottom of the connection layer 201, the second adhesive layers 202 at the bottom of the connection layer 201 are connected with the first adhesive layers 102 in a matching manner, through holes 204 are formed in the surface of the connection layer 201, the through holes 204 penetrate through the connection layer 201, the number of each through hole 204 is the same as that of the mounting holes 11, and the positions of each through hole 204 and the mounting holes 11 are mutually corresponding, and the connection layer 201 is connected with the first connection grooves 103 on the upper surface of the copper base layer 101 through the connection blocks at the bottom of the connection layer 201, so that the second adhesive layers 202 at the bottom of the connection layer 201 are connected with the first adhesive layers 102 on the upper surface of the copper base layer 101, and the connection layer 201 is connected with the copper base layer 101.
In some examples, four connection blocks are disposed at the bottom of the copper foil layer 301, the four connection blocks are located at four corners of the bottom of the copper foil layer 301, the connection blocks at the bottom of the copper foil layer 301 are respectively connected with the second connection grooves 203 in a matching manner, a third adhesive layer 302 is disposed at the bottom of the copper foil layer 301, the third adhesive layer 302 is connected with the second adhesive layer 202 at the top of the connection layer 201 in a matching manner, the two sides of each mounting hole 11 are respectively provided with a positive electrode 5 and a negative electrode 6, the surface of the electroplated copper layer 4 is provided with components 8, the components 8 are connected through connection lines 9, then the connection blocks at the bottom of the copper foil layer 301 are connected with the second connection grooves 203 on the upper surface of the connection layer 201 in a matching manner, and the third adhesive layer 302 at the bottom of the copper foil layer 301 is connected with the second adhesive layer 202 on the upper surface of the connection layer 201 in a matching manner, so that the copper foil layer 301 and the connection layer 201 are connected, and the connection between the copper foil layers is more tightly improved.
In some examples, the heat dissipation assembly 7 includes a copper pillar 701, the copper pillar 701 is located inside the mounting hole 11 and passes through the through hole 204, and the bottom of the copper pillar 701 is located inside the heat dissipation hole 104, a first fixing ring 702 and a second fixing ring 703 are provided on the surface of the copper pillar 701, the first fixing ring 702 is in sealing connection with the mounting hole 11, the second fixing ring 703 is in sealing connection with the through hole 204, a plurality of heat dissipation pins 704 are provided on the bottom of the copper pillar 701, one end of each heat dissipation pin 704 is fixedly connected with the copper pillar 701, the other end of each heat dissipation pin 704 is connected with the inner side of the heat dissipation hole 104 of the copper base layer 101, a placing plate 705 is provided on the top of the copper pillar 701, a placing pad 706 is provided on the upper surface of the placing plate 705, an electrical element is provided on the surface of the placing pad 706, a fixing plate 707 is provided on the side of the placing plate 705, the surface of the fixing plate 707 is provided with a connecting hole 708, the copper column 701 is placed in the mounting hole 11 and passes through the through hole 204, so that the bottom of the copper column 701 is positioned in the heat dissipation hole 104 and is in contact with the aluminum profile, the copper column 701 is in sealing connection with the mounting hole 11 through the first fixing ring 702 on the surface of the copper column 701, and then in sealing connection with the through hole 204 through the second fixing ring 703, thereby facilitating the mounting of the copper column 701, the heat of the electric element is guided by the copper column 701 and finally dispersed through the heat dissipation pins 704, the heat dissipation efficiency of the device is improved, the electric element is mounted on the surface of the placing plate 705 and is supported by the placing pad 706, then the electric element can be more conveniently mounted through the fixing plate and the connecting hole 708, and the electric element is respectively connected with the anode 5 and the cathode 6 on the surface of the electroplated copper layer 4, the whole installation of the device is more convenient.
In a specific application scenario, the connection block at the bottom of the connection layer 201 is connected with the first connection groove 103 on the upper surface of the copper base layer 101, so that the second adhesive layer 202 at the bottom of the connection layer 201 is connected with the first adhesive layer 102 on the upper surface of the copper base layer 101, so that the copper base layer 101 is connected with the connection layer 201, then the connection block at the bottom of the copper foil layer 301 is connected with the second connection groove 203 on the upper surface of the connection layer 201 in a matching manner, and the third adhesive layer 302 at the bottom of the copper foil layer 301 is connected with the second adhesive layer 202 on the upper surface of the connection layer 201 in a matching manner, so that the copper foil layer 301 is connected with the connection layer 201, then the copper pillars 701 are placed in the mounting holes 11 and pass through the through holes 204, the bottom of the copper column 701 is positioned in the heat radiation hole 104 and is in contact with the aluminum profile, the first fixing ring 702 on the surface of the copper column 701 is in sealing connection with the mounting hole 11, then the second fixing ring 703 is in sealing connection with the through hole 204, so that the mounting of the copper column 701 is more convenient, the heat of an electric element is guided by the copper column 701 and finally dispersed by the heat radiation pins 704, the heat radiation efficiency of the device is improved, the electric element is mounted on the surface of the placing plate 705 and supported by the placing pad 706, and then the electric element can be mounted more conveniently by the aid of the fixing plate 707 and the connecting hole 708, and the electric element is respectively connected with the anode 5 and the cathode 6 on the surface of the electroplated copper layer 4, so that the device is integrally mounted.
By adopting the technical scheme: the heat dissipation performance of the device can be improved more tightly by connecting the layers of the device, the copper column 701 can be installed more conveniently, and the installation efficiency and the overall heat dissipation performance of the device are improved.
Finally, it should be noted that: it is apparent that the above examples are only illustrative of the present invention and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (4)
1. The utility model provides a high heat dissipation copper post composite metal base PCB board, includes substrate (1), its characterized in that: the substrate (1) comprises a copper base layer (101), aluminum base layer (10) is arranged at the bottom of the copper base layer (101), a connecting component (2) is arranged above the copper base layer (101), a top material (3) is arranged above the connecting component (2), the top material (3) comprises a copper foil layer (301), an electroplated copper layer (4) is arranged on the upper surface of the copper foil layer (301), a plurality of mounting holes (11) are formed in the surfaces of the electroplated copper layer (4) and the copper foil layer (301), each mounting hole (11) penetrates through the electroplated copper layer (4) and the copper foil layer (301), a heat radiating component (7) is arranged inside each mounting hole (11), each heat radiating component (7) comprises a copper column (701), the copper column (701) is positioned inside the mounting holes (11) and penetrates through a perforation (204), the bottom of the copper column (701) is positioned inside the heat radiating holes (104), a first fixing ring (702) and a second fixing ring (703) are arranged on the surface of the copper column (701), a second fixing ring (703) is connected with the first fixing ring (103) and the second fixing ring (103) in a sealing mode, the fixing ring (703) is connected with the second fixing ring (103) and the second fixing ring (103) are connected with the second fixing ring (101), four first connecting grooves (103) are respectively positioned at four corners of the upper surface of the copper base layer (101), a first adhesive layer (102) is arranged on the upper surface of the copper base layer (101), the connecting component (2) comprises a connecting layer (201), the connecting layer (201) is positioned above the copper base layer (101), four connecting blocks are arranged at the bottom of the connecting layer (201) respectively, each connecting block is respectively positioned at four corners of the bottom of the connecting layer (201), each connecting block is respectively connected with each first connecting groove (103) in a matching way, second connecting grooves (203) are respectively arranged at four corners of the top of the connecting layer (201), four connecting blocks are arranged at four corners of the bottom of the copper foil layer (301) respectively, the connecting blocks at the bottom of the copper foil layer (301) are respectively connected with the second connecting grooves (203) in a matching way, a third adhesive layer (302) is arranged at the bottom of the connecting layer (301), each third adhesive layer (302) is connected with a second copper layer (202) at the top of the connecting layer (201) in a matching way, each copper pin (704) is fixedly connected with one end of each copper base layer (704) in a matching way, each copper pin (104) is fixedly connected with one end (101) of the heat dissipation post, the top of copper post (701) is provided with places board (705), the upper surface of placing board (705) is provided with places pad (706), place pad (706) surface and be provided with electric elements, the side of placing board (705) is provided with fixed plate (707), connecting hole (708) have been seted up on the surface of fixed plate (707).
2. The high heat dissipation copper pillar composite metal-based PCB of claim 1, wherein: a plurality of radiating holes (104) are formed in the surface of the copper base layer (101), each radiating hole (104) penetrates through the copper base layer (101) and extends to the surface of the aluminum base layer (10), the number of the radiating holes (104) is the same as that of the mounting holes (11), and the positions of each radiating hole (104) and the mounting hole (11) are mutually corresponding.
3. The high heat dissipation copper pillar composite metal-based PCB of claim 1, wherein: the top and the bottom of tie layer (201) all are provided with second and paste layer (202), second paste layer (202) and first paste layer (102) matchedly of tie layer (201) bottom, perforation (204) have been seted up on tie layer (201) surface, perforation (204) run through tie layer (201), every the quantity of perforation (204) is the same with the quantity of mounting hole (11), and every perforation (204) each other corresponds with the position of mounting hole (11).
4. The high heat dissipation copper pillar composite metal-based PCB of claim 1, wherein: each of the two sides of the mounting hole (11) is provided with a positive electrode (5) and a negative electrode (6) respectively, the surface of the electroplated copper layer (4) is provided with components (8), and the components (8) are connected through a connecting circuit (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311367813.XA CN117119676B (en) | 2023-10-23 | 2023-10-23 | High heat dissipation copper post composite metal base PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311367813.XA CN117119676B (en) | 2023-10-23 | 2023-10-23 | High heat dissipation copper post composite metal base PCB board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117119676A CN117119676A (en) | 2023-11-24 |
| CN117119676B true CN117119676B (en) | 2024-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311367813.XA Active CN117119676B (en) | 2023-10-23 | 2023-10-23 | High heat dissipation copper post composite metal base PCB board |
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| CN (1) | CN117119676B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN115151025A (en) * | 2022-07-05 | 2022-10-04 | 诚亿电子（嘉兴）有限公司 | High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof |
| CN217904731U (en) * | 2022-07-07 | 2022-11-25 | 江苏兆瑞电子科技有限公司 | High heat conduction PCB board |
-
2023
- 2023-10-23 CN CN202311367813.XA patent/CN117119676B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN115151025A (en) * | 2022-07-05 | 2022-10-04 | 诚亿电子（嘉兴）有限公司 | High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof |
| CN217904731U (en) * | 2022-07-07 | 2022-11-25 | 江苏兆瑞电子科技有限公司 | High heat conduction PCB board |
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| Publication number | Publication date |
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| CN117119676A (en) | 2023-11-24 |
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