CN115151025A - High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof - Google Patents
High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof Download PDFInfo
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- CN115151025A CN115151025A CN202210793530.0A CN202210793530A CN115151025A CN 115151025 A CN115151025 A CN 115151025A CN 202210793530 A CN202210793530 A CN 202210793530A CN 115151025 A CN115151025 A CN 115151025A
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- copper
- heat dissipation
- layer
- pcb
- composite metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a high-heat-dissipation copper pillar composite metal-based PCB (printed circuit board), which sequentially comprises an aluminum base layer, a copper base layer, a PP (polypropylene) bonding sheet layer, a gum layer, a copper foil layer and an electroplated copper layer from bottom to top, wherein a heat-dissipation empty groove is formed above the copper base layer and penetrates to the outer side of the electroplated copper layer, a heat-dissipation copper pillar is arranged in the heat-dissipation empty groove, and a heating component is arranged on the surface of the heat-dissipation copper pillar.
Description
Technical Field
The invention belongs to the semi-technical field of PCBs, and particularly relates to a high-heat-dissipation copper cylinder composite metal base PCB and a preparation process thereof.
Background
In recent years, metal-based PCBs have been widely used, and compared with conventional FR-4 materials, the heat dissipation of metal-based PCBs has been widely recognized. The heat conductivity coefficient of the metal substrate is high and reaches 400W/m.K, but the heat conductivity coefficient of the insulating layer can only reach 2-4W/m.K, so that the heat conductivity of the insulating layer determines that the overall heat conductivity of the metal-based PCB is low, the high heat conductivity of the metal substrate cannot be fully utilized, the heat of the heating component cannot be conducted out in time, and the service life, the performance and the like of the product are greatly reduced.
In order to improve the problem, the PCB design can adopt the copper column design to directly communicate the heating element and the copper substrate, therefore, heat generated by the heating element can be directly transmitted to the copper substrate through the copper column and is timely dissipated.
Referring to the attached drawing 1, the design comprises a copper base, a PP bonding sheet, a back adhesive, a copper foil and an electroplated copper, and an integrated heat dissipation copper column protruding upwards is arranged on a copper base layer, so that although the heat dissipation effect is good, 3 obvious defects exist at the same time; 1. the manufacturing material cost is high, expensive copper is needed to be used as a metal substrate material, copper columns on a copper substrate are manufactured by etching, and taking the PCB design shown in the attached drawing 2 as an example, the heat dissipation copper column area accounts for less than 5% of the total area of the PCB, which means that more than 95% of copper needs to be etched and thinned; 2. the manufacturing process is complex, firstly, the heat dissipation copper column needs to be etched, then the RCC and the PP bonding sheet which are windowed at the position of the copper column are aligned and matched with the copper column plate, after vacuum pressing, the glue overflowing on the surface of the copper column needs to be polished completely, and finally electroplating and circuit pattern manufacturing can be carried out; 3. the product yield is low, and because the excessive glue is transparent and because the height uniformity of the etched copper pillar has difference, the excessive glue amount on different plates is different, the short circuit scrapping caused by incomplete polishing and the open circuit scrapping caused by excessive polishing are easy to occur during polishing.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the copper-pillar copper substrate with high heat dissipation performance, and the copper-pillar copper substrate has the characteristics of simple manufacturing process flow, low cost and excellent quality.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a high heat dissipation copper post composite metal base PCB board includes aluminium basic unit, copper basic unit, PP bonding lamella, gum layer, copper foil layer and copper plating layer from bottom to top in proper order, copper basic unit top seted up the heat dissipation dead slot, the heat dissipation dead slot runs through to the copper plating layer outside, be provided with the heat dissipation copper post in the heat dissipation dead slot, heat dissipation copper post surface has the components and parts that generate heat.
Further, the bottom of the heat dissipation empty groove is electroplated with a thin copper layer, and the heat dissipation copper column starts to fill the heat dissipation empty groove from the thin copper layer.
A preparation process of a high-heat-dissipation copper column composite metal base PCB comprises the following steps:
s1, cutting, namely cutting the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board according to a preset size;
s2, pressing, namely pressing the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board into a PCB;
s3, controlling depth drilling/milling, namely drilling/milling a heat dissipation empty slot at the preset position on the PCB in the step 2;
and S4, filling copper into the copper columns, and conveying the PCB into a copper filling electroplating line for electroplating to ensure that the copper filling in the heat dissipation empty groove is full and an electroplating copper layer is formed on the surface of the copper foil.
Further, in step S3, a numerical control drilling machine or milling machine having a Z-axis depth control function is used.
Further in step S4, the heat dissipation empty slot is processed by using the polymer conductive adhesive or copper deposition, and then a thin copper layer is electroplated on the bottom of the heat dissipation empty slot, and then copper is filled.
Further in step S4, a flash or full plate plating line is used to plate a thin copper layer.
Compared with the prior art, the invention has the beneficial effects that:
1. the manufacturing material cost is low, the copper-aluminum composite plate is adopted to replace a copper substrate, the radiating copper column is manufactured by positive electroplating growth to replace the conventional negative etching, and the material cost is reduced by 60-70%;
2. the manufacturing process is simple, the production cycle time is short, the production cost is lower, the production cycle of the PCB is shortened by 20% -30%, and the production cost is reduced by 40% -50%. The comparison of the manufacturing process is as follows,
the conventional preparation process comprises the following steps: (1) material cutting → (2) copper pillar pattern making → (3) copper pillar etching making → (4) rcc windowing → (5) pp bonding sheet windowing → (6) pressing → (7) grinding plate → (8) electroplating → (9) line making → r resistance welding →
Surface treatment →
Molding →
Test →
Packaging;
the preparation process of the invention comprises the following steps: (1) cutting material → (2) pressing → (3) depth control drilling/milling → (4) copper column filling → (5) line manufacturing → (6) solder resist → (7) surface treatment → (9) molding → inspection → r
Packaging;
3. the product quality is better, the manufacturing method of the invention is to manufacture the copper column after pressing, thus improving the open circuit and short circuit rejection problems of the product caused by the glue overflow problem of the position of the copper column after the copper column is manufactured and pressed by the conventional manufacturing method.
Drawings
FIG. 1 is a schematic structural diagram of a copper-based PCB in the prior art;
FIG. 2 is a top view of a metal based PCB board;
fig. 3 is a schematic structural view of the high heat dissipation copper pillar composite metal-based PCB of the present invention.
Reference numerals: 1. an aluminum base layer; 2. a copper base layer; 3. a PP bonding sheet layer; 4. a back glue layer; 5. a copper foil layer; 6. electroplating a copper layer; 7. and a heat dissipation copper column.
Detailed Description
An embodiment of the high heat dissipation copper pillar composite metal matrix PCB and the manufacturing process thereof according to the present invention will be further described with reference to fig. 3.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.
The utility model provides a high heat dissipation copper post composite metal base PCB board, includes aluminium basic unit 1, copper base 2, PP bonding lamella 3, gum layer 4, copper foil layer 5 and copper plate 6 from bottom to top in proper order, copper basic unit top seted up the heat dissipation dead slot, the heat dissipation dead slot runs through to the copper plate outside, be provided with heat dissipation copper post 7 in the heat dissipation dead slot, heat dissipation copper post 7 surface has the components and parts that generate heat.
The aluminum base layer 1 and the copper base layer 2 are composed of copper-aluminum composite plates, wherein the copper base layer 2 is positioned above the aluminum base layer 1.
Preferably, the bottom of the heat dissipation empty groove is electroplated with a thin copper layer, and the heat dissipation copper column starts to fill the heat dissipation empty groove from the thin copper layer.
The invention relates to a preparation process of a high-heat-dissipation copper pillar composite metal base PCB, which comprises the following specific process flows of: cutting material → pressing → depth control drilling/milling → copper column filling → circuit making → solder resisting → surface processing → forming → checking → packaging.
The method specifically comprises the following steps:
s1, cutting, namely cutting the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board according to a preset size.
S2, pressing, namely pressing the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board at a certain high temperature and high pressure by using a vacuum press to produce a PCB (printed Circuit Board) board;
s3, depth control drilling/milling, namely drilling/milling a heat dissipation empty slot of the heat dissipation copper column at a preset position on the PCB board after the step 2 by adopting a numerical control drilling machine or milling machine with a Z-axis depth control function;
and S4, filling copper in the copper columns, treating empty grooves of the heat dissipation copper columns by adopting high-molecular conductive adhesive or copper deposition, transferring to a flash plating or full-plate electroplating line, and electroplating a layer of thin copper with the thickness of about 3 micrometers in the empty grooves. Then the PCB is sent into a copper-filled electroplating line for electroplating, pulse electroplating parameters are comprehensively adjusted according to parameters such as the size, the depth and the area of a copper column, and the thickness of an electroplated copper layer on the surface of the PCB is reduced as much as possible on the premise that the copper column is fully filled for packaging, so that the electroplating cost is controlled;
and S5, circuit manufacturing, solder resistance, surface treatment, forming, inspection and packaging are completely consistent with the conventional PCB manufacturing method.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to those skilled in the art without departing from the principles of the present invention should also be considered as within the scope of the present invention.
Claims (6)
1. The utility model provides a high heat dissipation copper post composite metal base PCB board which characterized in that: include aluminium basic unit, copper basic unit, PP bonding lamella, gum layer, copper foil layer and copper plating layer from bottom to top in proper order, copper basic unit top seted up the heat dissipation dead slot, the heat dissipation dead slot runs through to the copper plating layer outside, be provided with the heat dissipation copper post in the heat dissipation dead slot, heat dissipation copper post surface has heating components and parts.
2. The high heat dissipation copper pillar composite metal matrix PCB of claim 1, wherein: the bottom of the heat dissipation empty groove is electroplated with a thin copper layer, and the heat dissipation copper column starts to fill the heat dissipation empty groove from the thin copper layer.
3. A preparation process of a high-heat-dissipation copper column composite metal base PCB is characterized by comprising the following steps of:
s1, cutting, namely cutting the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board according to a preset size;
s2, pressing, namely pressing the back adhesive copper foil, the PP bonding sheet and the copper-aluminum composite board into a PCB;
s3, controlling depth drilling/milling, namely drilling/milling a heat dissipation empty slot at the preset position on the PCB in the step 2;
and S4, filling copper into the copper columns, and conveying the PCB into a copper filling electroplating line for electroplating to ensure that the copper filling in the heat dissipation empty groove is full and an electroplating copper layer is formed on the surface of the copper foil.
4. The preparation process of the high heat dissipation copper pillar composite metal matrix PCB as recited in claim 3, wherein: in step S3, a numerical control drilling machine or milling machine having a Z-axis depth control function is used.
5. The preparation process of the high-heat-dissipation copper cylinder composite metal-based PCB board as claimed in claim 4, wherein the preparation process comprises the following steps: in step S4, the heat dissipation empty slot is first processed by using the polymer conductive adhesive or copper deposition, and then a layer of thin copper is electroplated on the bottom of the heat dissipation empty slot, and then copper is filled.
6. The preparation process of the high heat dissipation copper pillar composite metal matrix PCB as recited in claim 5, wherein: in step S4, a flash or full plate plating line is used to plate a thin copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210793530.0A CN115151025A (en) | 2022-07-05 | 2022-07-05 | High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210793530.0A CN115151025A (en) | 2022-07-05 | 2022-07-05 | High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115151025A true CN115151025A (en) | 2022-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210793530.0A Pending CN115151025A (en) | 2022-07-05 | 2022-07-05 | High-heat-dissipation copper pillar composite metal base PCB and preparation process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117119676A (en) * | 2023-10-23 | 2023-11-24 | 连云港中彩科技有限公司 | High heat dissipation copper post composite metal base PCB board |
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2022
- 2022-07-05 CN CN202210793530.0A patent/CN115151025A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117119676A (en) * | 2023-10-23 | 2023-11-24 | 连云港中彩科技有限公司 | High heat dissipation copper post composite metal base PCB board |
| CN117119676B (en) * | 2023-10-23 | 2024-02-06 | 连云港中彩科技有限公司 | High heat dissipation copper post composite metal base PCB board |
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