CN111922236B - Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device - Google Patents
Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device Download PDFInfo
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- CN111922236B CN111922236B CN202010701624.1A CN202010701624A CN111922236B CN 111922236 B CN111922236 B CN 111922236B CN 202010701624 A CN202010701624 A CN 202010701624A CN 111922236 B CN111922236 B CN 111922236B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides an aluminum capacitor flattening and bending point accurate control device and a use method thereof. Meanwhile, a bending point convex block is arranged in the control pin positioning groove, and a corresponding bending groove can be formed at the positive and negative electrode guide pins through the bending point convex block, so that the subsequent bending process is convenient to carry out; meanwhile, the height of the flattened module can be adjusted by increasing or reducing the adjusting gaskets, so that the position of the guide pin forming the bending groove can be controlled accurately, the limited gap is reserved on the mounting surface of the bare guide pin after the top end of the bare guide pin and the seat plate are mounted, and the air resistance phenomenon during welding is prevented; the stability and the reliability of the surface mounting product of the aluminum capacitor are improved.
Description
Technical Field
The invention relates to the technical field of capacitor processing devices, in particular to an aluminum capacitor flattening and bending point accurate control device and a using method thereof.
Background
With the application of electronic products becoming more and more extensive, the overall structure of electronic equipment also becomes more and more to integrate, miniaturized trend development. In miniaturization and flat panel equipment, surface-mount technology (also called SMT) is widely used, which is a common electronic packaging technology. Surface mount technology is the mounting of electronic components, such as resistors, capacitors, transistors, integrated circuits, etc., onto a printed circuit board and the formation of electrical connections by soldering. Besides the conventional circuit board, the "double-sided mounting circuit board" is particularly a prominent example. The 'chip capacitor' is produced by adopting the 'double-sided mounting technology' on the original circuit board.
Generally, the higher the mounting speed, the higher the mounting accuracy, and it is difficult to ensure. At present, the surface mounting equipment basically adopts a daily high-speed surface mounting reflow soldering machine, the surface mounting speed reaches 0.07-0.10S, each time one element is mounted, and a welding wire track prefabricated on a circuit board and used for adhering (welding) a capacitor is narrow and thin, so that the surface mounting equipment has high requirements on the type position of two welding leading-out wires of the surface mounting capacitor and the overall height of the surface mounting capacitor. Therefore, not only the working principle of a patch reflow soldering machine needs to be researched and familiar, but also the patch capacitor product needs to be ensured to have certain special properties so as to meet the requirements of high-speed soldering, accurate positioning, high reliability and the like.
However, the Surface Mount Technology (SMT) of the aluminum capacitor manufactured in China has technical defects of inaccurate positioning control and the like in the flattening and bending process, so that the surface mount capacitor often has the phenomena of insufficient welding verticality, poor welding, even dropping and the like.
Disclosure of Invention
Aiming at the problems, the invention designs and develops an aluminum capacitor flattening bending point precise control device and a using method thereof. The accurate fool-proof design, manufacturing and control are facilitated to the flattening thickness and the bending point position of the positive and negative electrode guide pins of the battery cell, so that a quality manager and a machine adjusting operator in field production can execute strictly according to the control requirement, and all produced patch products completely meet the user requirement.
In order to solve the technical problems, the invention specifically adopts the following technical scheme:
an aluminum capacitor flattening and bending point accurate control device comprises an installation bottom plate, a flattening middle module, a flattening left module, a flattening right module, a first driving device and a second driving device, wherein the flattening middle module is used for positioning a bare capacitor, the flattening left module is arranged on the left side of the flattening middle module, the flattening right module is arranged on the right side of the flattening middle module, the first driving device is in driving connection with the flattening left module, the second driving device is in driving connection with the flattening right module, installation supports are fixedly arranged on two sides of the flattening middle module, the flattening middle module is detachably installed on the installation bottom plate through the installation supports, and adjusting gaskets are detachably arranged between the installation bottom plate and the installation supports; the pin of the bare capacitor is downward and placed on the flattening middle module, the negative electrode guide pin of the bare capacitor is positioned between the flattening middle module and the flattening left module, and the positive electrode guide pin of the bare capacitor is positioned between the flattening middle module and the flattening right module; the two ends of the side wall of the flattening left module and the side wall of the flattening right module, which are close to the flattening middle module, are respectively provided with a flattening positioning block which are symmetrical to each other, a stitch positioning groove is formed between the two flattening positioning blocks, and the stitch positioning groove is convexly provided with a bending point convex block; the first driving device drives the flattening left module to draw close to the flattening middle module and extrude a cathode guide pin of the bare capacitor, and the second driving device drives the flattening right module to draw close to the flattening middle module and extrude an anode guide pin of the bare capacitor.
Preferably, the flattening middle module is arranged in parallel with the contact working surfaces of the left side wall, the left side wall and the flat left module, the flat right module, the positive guide pin and the negative guide pin of the bare capacitor product, wherein the left side wall and the right side wall are abutted against the positive guide pin and the negative guide pin of the bare capacitor product.
Preferably, the installation side plate is provided with a return assembly, wherein the return assembly comprises installation side plates arranged on two sides of the flattening left module and the flattening right module, connecting cylinders are fixedly arranged on two sides of the flattening left module and the flattening right module, one end of each connecting cylinder is connected with a tension spring, and the other end of each tension spring is connected with the installation side plate.
Preferably, the tension spring connected with the flattening left module is parallel to the motion track of the flattening left module, and the tension spring connected with the flattening right module is parallel to the motion track of the flattening right module.
In order to solve the above problems, the application further provides a use method of the device for accurately controlling the flattening bending point of the aluminum capacitor, which comprises the following steps:
step S1, selecting proper flattening left module and flattening right module according to the thickness of the capacitance bare guide pin to be flattened and the depth of the bending groove of the capacitance bare guide pin, and installing the modules at the installation bottom plate;
step S2, mounting the flattened module on a mounting base plate through a mounting bracket, and adjusting the height of the flattened module by increasing or decreasing adjusting gaskets according to the position of a bending groove formed by the bare capacitor guide pin;
step S3, placing the pins of the bare capacitor downwards on the flattening middle module, positioning the negative electrode guide pin of the bare capacitor between the flattening middle module and the flattening left module, and positioning the positive electrode guide pin of the bare capacitor between the flattening middle module and the flattening right module;
step S4, the first driving device drives the flattening left module to draw close to the flattening middle module and extrude the cathode guide pin of the bare capacitor, and the second driving device drives the flattening right module to draw close to the flattening middle module and extrude the anode guide pin of the bare capacitor; the thickness of the flattened positive electrode guide pin and the flattened negative electrode guide pin is the same as that of the flattened positioning block, and the thickness of the formed bending groove is the same as that of the bending point bump;
and step S5, taking out the processed bare capacitor and moving to the next station.
Compared with the prior art, the invention has the following beneficial effects:
the difference of positive, negative guide pin material in traditional art, hardness and guide pin diameter etc. all can influence the actual thickness of two guide pins after flattening, if the thickness of two guide pins after flattening can not keep unanimous, will influence the finished product welding straightness that hangs down behind the dress bedplate. In this application, owing to flatten left module and flatten right module and all be provided with the locating piece of flattening, flatten left module to the negative pole guide pin of drawing close the naked article of extrusion electric capacity to flattening middle module through wherein first drive arrangement drive, second drive arrangement drive is flattened left module and is drawn close the anodal guide pin of the naked article of extrusion electric capacity to flattening middle module, can control the thickness of flattening of two guide pins to standard size (the thickness of flattening the locating piece).
In the application, a bending point convex block is also arranged in the control pin positioning groove, so that when the flattening right die and the flattening left die block move towards the flattening middle die and the positive and negative guide pins are extruded, corresponding bending grooves can be formed at the positive and negative guide pins through the bending point convex block, and the subsequent bending process is facilitated; meanwhile, the depth of the formed bending groove (the thickness of a bending point bump) can be accurately controlled, and the continuous bending times of the guide pin after being bent can be further controlled;
simultaneously in this application, the module can be through increasing or reducing adjusting shim in flattening to realize adjusting its height, then can control the position that the accurate control guide pin formed the groove of bending, the key lies in can guaranteeing that the top of naked article guide pin and bedplate installation back in addition, and its installation face remains limited clearance, and the air lock phenomenon when having prevented the welding takes place. The stability and the reliability of the surface mounting product of the aluminum capacitor are improved.
Drawings
FIG. 1 is a schematic diagram of a main structure of the present invention;
FIG. 2 is a schematic side view of the flattened left module of the present invention;
FIG. 3 is a cross-sectional view taken along section line A-A of FIG. 2;
FIG. 4 is a schematic top view of the flattened left module of the present invention;
FIG. 5 is a schematic structural view of the assembled bare capacitor and base plate after flattening and bending treatment;
description of reference numerals: the device comprises a flattening left module 1, a flattening positioning block 11, a bending point bump 12, a flattening right module 2, a flattening middle module 3, a mounting support 31, an adjusting gasket 32, a mounting bottom plate 4, a first driving device 5, a second driving device 6, a capacitor bare product 7, an anode guide pin 71, a cathode guide pin 72 and a seat plate 8.
Detailed Description
The details of the present invention will be described below with reference to the accompanying drawings and examples.
As shown in fig. 1-5, the embodiment provides an aluminum capacitor flattening and bending point precise control device, which includes a mounting base plate 4, a flattening middle module 3 for positioning a bare capacitor 7, a flattening left module 1 disposed on the left side of the flattening middle module 3, a flattening right module 2 disposed on the right side of the flattening middle module 3, a first driving device 5 in driving connection with the flattening left module 1, and a second driving device 6 in driving connection with the flattening right module 2, wherein mounting brackets 31 are fixedly disposed on both sides of the flattening middle module 3, the flattening middle module 3 is detachably mounted on the mounting base plate 4 through the mounting brackets 31, and an adjusting gasket 32 is detachably disposed between the mounting base plate 4 and the mounting brackets 31; the pin of the bare capacitor 7 faces downwards and is placed on the flattening middle module 3, the negative electrode guide pin 72 of the bare capacitor 7 is positioned between the flattening middle module 3 and the flattening left module 1, and the positive electrode guide pin 71 of the bare capacitor 7 is positioned between the flattening middle module 3 and the flattening right module 2; the two ends of the side walls, close to the flattening middle module 3, of the flattening left module 1 and the flattening right module 2 are respectively provided with a flattening positioning block 11 which are symmetrical to each other, a pin positioning groove is formed between the two flattening positioning blocks 11, and the pin positioning groove is convexly provided with a bending point convex block 12; the first driving device 5 drives the flattening left module 1 to draw close to the flattening middle module 3 and extrude the negative electrode guide pin 72 of the bare capacitor 7, and the second driving device 6 drives the flattening right module 2 to draw close to the flattening middle module 3 and extrude the positive electrode guide pin 71 of the bare capacitor 7.
The application also provides a use method of the device for accurately controlling the flattening and bending point of the aluminum capacitor, which comprises the following steps:
step S1, selecting proper flattening left module and flattening right module according to the thickness of the capacitance bare guide pin to be flattened and the depth of the bending groove of the capacitance bare guide pin, and installing the modules at the installation bottom plate;
step S2, mounting the flattened module on a mounting base plate through a mounting bracket, and adjusting the height of the flattened module by increasing or decreasing adjusting gaskets according to the position of a bending groove formed by the bare capacitor guide pin;
step S3, placing the pins of the bare capacitor downwards on the flattening middle module, positioning the negative electrode guide pin of the bare capacitor between the flattening middle module and the flattening left module, and positioning the positive electrode guide pin of the bare capacitor between the flattening middle module and the flattening right module;
step S4, the first driving device drives the flattening left module to draw close to the flattening middle module and extrude the cathode guide pin of the bare capacitor, and the second driving device drives the flattening right module to draw close to the flattening middle module and extrude the anode guide pin of the bare capacitor; the thickness of the flattened positive electrode guide pin and the flattened negative electrode guide pin is the same as that of the flattened positioning block, and the thickness of the formed bending groove is the same as that of the bending point bump;
and step S5, taking out the processed bare capacitor and moving to the next station.
The difference of positive, negative guide pin material in traditional art, hardness and guide pin diameter etc. all can influence the actual thickness of two guide pins after flattening, if the thickness of two guide pins after flattening can not keep unanimous, will influence the finished product welding straightness that hangs down behind dress bedplate 8. In this application, owing to flatten left module 1 and flatten right module 2 and all be provided with and flatten locating piece 11, flatten left module 1 and draw close the negative pole guide pin 72 of extrusion electric capacity bare item 7 to flattening middle module 3 through wherein the drive of first drive arrangement 5, second drive arrangement 6 drive flattens right module 2 and draws close the positive pole guide pin 71 of extrusion electric capacity bare item 7 to flattening middle module 3, can control the thickness of flattening of two guide pins (the thickness of flattening locating piece 11 promptly, mark L in the specific reference description attached drawing 3-4) to standard size.
In the application, a bending point bump 12 is further arranged in the control pin positioning groove, so that when the flattening left module 1 and the flattening right module 2 move to the flattening middle module 3 and press the positive and negative guide pins 72, corresponding bending grooves can be formed at the positive and negative guide pins 72 through the bending point bump 12, and the subsequent bending process is facilitated; meanwhile, the depth of the formed bending groove (the thickness of the bending point bump 12, refer to the mark H in the attached figures 3-4 of the specification) can be accurately controlled, and the continuous bending frequency of the guide pin after being bent can be controlled; meanwhile, the mark X in the attached figures 3-4 of the specification specifically refers to the height of the bending groove.
Simultaneously in this application, can be through increasing or reducing adjusting shim 32 in flattening module 3 to realize adjusting its height, then can control the position that the accurate control guide pin formed the groove of bending, the key point lies in can guaranteeing that the top of naked article guide pin and bedplate 8 installation back in addition, and its installation face remains limited clearance, and the air lock phenomenon when having prevented the welding takes place. The stability and the reliability of the surface mounting product of the aluminum capacitor are improved.
Preferably, in order to ensure that the parallelism of the two guide pins of the bare capacitor 7 is consistent after the bare capacitor 7 is inserted and after the flattening process is performed, the left and right side walls of the flattened middle module 3, which are in contact with the positive guide pin 71 and the negative guide pin 72 of the bare capacitor 7, and the contact working surfaces of the flattened left module 1, the flattened right module 2, the positive guide pin 71 and the negative guide pin 72 are arranged in parallel.
Preferably, in order to conveniently flatten left module 1 and flatten right module 2 and flatten and the return after the bend point is handled just negative pole guide pin 72, still be provided with return assembly, wherein return assembly is including setting up the installation curb plate of flattening left module 1 and flattening right module 2 both sides, wherein flatten left module 1 and flatten right module 2's both sides and all fixedly be provided with connecting cylinder (not shown in the figure), and the one end of every connecting cylinder is connected with tension spring (not shown in the figure), and tension spring's other end is connected with the installation curb plate.
Preferably, the tension spring connected with the flattening left module 1 is parallel to the motion track of the flattening left module 1, and the tension spring connected with the flattening right module 2 is parallel to the motion track of the flattening right module 2. The return accuracy can be ensured, and the next movement stroke is convenient to be correct.
In this embodiment, after the bare capacitor 77 is processed by the flattening and bending point precise control device, the height of the bending point can be precisely controlled, and the subsequent assembly between the bare capacitor 77 and the seat plate 8 can be facilitated, wherein the assembly standard should ensure that a gap (refer to the label M in fig. 5 of the specification) of about 0.05mm is left between the top end of the assembled bare capacitor and the mounting surface in the seat plate 8, and the gap serves as an air resistance gap. The air resistance gap can be adjusted by adjusting the height of the module 3 during flattening, so that the position of the bending groove is changed, the gap between the top end of a bare product and the mounting surface in the seat plate 8 is changed, and adjustment is realized. Because if the top end of the bare product is tightly attached to the mounting surface in the seat plate 8 without clearance, the contact part will be in a partial vacuum state during welding, air resistance is generated, the normal flow of soldering tin is influenced, and the welding quality is deteriorated. The control can reserve the air-resistance clearance and ensure that the outermost ends of the two guide pins are completely overlapped with the soldering tin tracks on the circuit board without producing 'cold solder', thereby greatly improving the welding quality. Thereby also improving the stability and reliability of the surface mount product of the aluminum capacitor.
After the capacitor bare product 7 and the seat plate 8 are assembled, the bending treatment is carried out, wherein the assembly standard should ensure that the two guide pins are bent to form an angle theta, the angle theta is strictly controlled to be 178-180 degrees, the outermost ends of the two welded guide pins can be completely welded in place with the narrow and thin soldering tin tracks on the circuit board, and so-called 'false soldering' is not generated. Otherwise, if the bending forming angle theta of the two guide pins is larger than 180 degrees, the thin-layer soldering tin on the circuit board cannot flow to the top end parts of the guide pins, and the soldering can generate 'false soldering', thereby seriously affecting the soldering quality.
The standard parts used by the invention can be purchased from the market, the special-shaped parts can be customized according to the description and the record of the attached drawings, and the concrete connection mode of each part adopts mature bolts and rivets in the prior art. The conventional means such as welding, machines, parts and equipment are of the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, so that the details are not described.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or through an intermediary, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases for those skilled in the art.
Claims (3)
1. An aluminum capacitor flattening and bending point accurate control device is characterized by comprising an installation bottom plate, a flattening middle module for positioning a bare capacitor, a flattening left module arranged on the left side of the flattening middle module, a flattening right module arranged on the right side of the flattening middle module, a first driving device in driving connection with the flattening left module, and a second driving device in driving connection with the flattening right module, wherein installation supports are fixedly arranged on two sides of the flattening middle module, the flattening middle module is detachably installed on the installation bottom plate through the installation supports, and adjusting gaskets are detachably arranged between the installation bottom plate and the installation supports; the pin of the bare capacitor is downward and placed on the flattening middle module, the negative electrode guide pin of the bare capacitor is positioned between the flattening middle module and the flattening left module, and the positive electrode guide pin of the bare capacitor is positioned between the flattening middle module and the flattening right module; the two ends of the side wall of the flattening left module and the side wall of the flattening right module, which are close to the flattening middle module, are respectively provided with a flattening positioning block which are symmetrical to each other, a stitch positioning groove is formed between the two flattening positioning blocks, and the stitch positioning groove is convexly provided with a bending point convex block; the first driving device drives the flattening left module to approach to the flattening middle module and extrude a negative guide pin of the bare capacitor, and the second driving device drives the flattening right module to approach to the flattening middle module and extrude a positive guide pin of the bare capacitor;
the flattening middle module is arranged in parallel with the contact working surfaces of the left module, the right module, the anode guide pin and the cathode guide pin of the bare capacitor;
wherein still be provided with the return subassembly, wherein the return subassembly is including setting up at the installation curb plate of flattening left side module and flattening right side module both sides, and wherein the both sides of flattening left side module and flattening right side module are all fixed and are provided with the connecting cylinder, and the one end of every connecting cylinder is connected with tension spring, and tension spring's other one end is connected with the installation curb plate.
2. The aluminum capacitor flattening and bending point precise control device according to claim 1, wherein the tension spring connected with the flattening left module is parallel to the motion track of the flattening left module, and the tension spring connected with the flattening right module is parallel to the motion track of the flattening right module.
3. The use method of the aluminum capacitor flattening and bending point precise control device according to claim 1 is characterized by comprising the following steps:
step S1, selecting proper flattening left module and flattening right module according to the thickness of the capacitance bare guide pin to be flattened and the depth of the bending groove of the capacitance bare guide pin, and installing the modules at the installation bottom plate;
step S2, mounting the flattened module on a mounting base plate through a mounting bracket, and adjusting the height of the flattened module by increasing or decreasing adjusting gaskets according to the position of a bending groove formed by the bare capacitor guide pin;
step S3, placing the pins of the bare capacitor downwards on the flattening middle module, positioning the negative electrode guide pin of the bare capacitor between the flattening middle module and the flattening left module, and positioning the positive electrode guide pin of the bare capacitor between the flattening middle module and the flattening right module;
step S4, the first driving device drives the flattening left module to draw close to the flattening middle module and extrude the cathode guide pin of the bare capacitor, and the second driving device drives the flattening right module to draw close to the flattening middle module and extrude the anode guide pin of the bare capacitor;
and step S5, taking out the processed bare capacitor and moving to the next station.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010701624.1A CN111922236B (en) | 2020-07-21 | 2020-07-21 | Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010701624.1A CN111922236B (en) | 2020-07-21 | 2020-07-21 | Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device |
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| CN111922236B true CN111922236B (en) | 2022-06-03 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03225913A (en) * | 1990-01-31 | 1991-10-04 | Elna Co Ltd | Aluminum electrolytic capacitor |
| JPH06215989A (en) * | 1993-10-19 | 1994-08-05 | Nichicon Corp | Manufacture of vertical aluminum electrolytic chip capacitor |
| CN2465296Y (en) * | 2001-01-16 | 2001-12-12 | 林杰夫 | Chip type capacitor |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN202930239U (en) * | 2012-11-23 | 2013-05-08 | 李莉 | Countable pin flattening device for capacitor |
| CN202930241U (en) * | 2012-11-23 | 2013-05-08 | 李莉 | Quick-positioning multi-pin capacitor flattening device |
| CN105047440A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor |
| CN105047413A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Chip aluminum electrolytic capacitor and production method |
| CN205751882U (en) * | 2016-03-24 | 2016-11-30 | 韶关富仕达电子科技有限公司 | The pin of a kind of solid-state patch-type aluminium electrolutic capacitor flattens device |
| CN212278716U (en) * | 2020-07-21 | 2021-01-01 | 深圳江浩电子有限公司 | Accurate controlling means of point of bending is flattened to aluminium capacitor surface mounting product |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05166688A (en) * | 1991-12-16 | 1993-07-02 | Nippon Chemicon Corp | Manufacture of lead for electrolytic capacitor |
| JP2000277399A (en) * | 1999-03-25 | 2000-10-06 | Nippon Chemicon Corp | Manufacturing method of chip capacitor and forming tool for lead wire |
-
2020
- 2020-07-21 CN CN202010701624.1A patent/CN111922236B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03225913A (en) * | 1990-01-31 | 1991-10-04 | Elna Co Ltd | Aluminum electrolytic capacitor |
| JPH06215989A (en) * | 1993-10-19 | 1994-08-05 | Nichicon Corp | Manufacture of vertical aluminum electrolytic chip capacitor |
| CN2465296Y (en) * | 2001-01-16 | 2001-12-12 | 林杰夫 | Chip type capacitor |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN202930239U (en) * | 2012-11-23 | 2013-05-08 | 李莉 | Countable pin flattening device for capacitor |
| CN202930241U (en) * | 2012-11-23 | 2013-05-08 | 李莉 | Quick-positioning multi-pin capacitor flattening device |
| CN105047440A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor |
| CN105047413A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Chip aluminum electrolytic capacitor and production method |
| CN205751882U (en) * | 2016-03-24 | 2016-11-30 | 韶关富仕达电子科技有限公司 | The pin of a kind of solid-state patch-type aluminium electrolutic capacitor flattens device |
| CN212278716U (en) * | 2020-07-21 | 2021-01-01 | 深圳江浩电子有限公司 | Accurate controlling means of point of bending is flattened to aluminium capacitor surface mounting product |
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| CN111922236A (en) | 2020-11-13 |
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