CN213617073U

CN213617073U - Stamping die is used in circuit board production

Info

Publication number: CN213617073U
Application number: CN202022140958.4U
Authority: CN
Inventors: 周连华; 夏先武; 贾攀
Original assignee: Zhuhai Junde Electric Co ltd
Current assignee: Zhuhai Junde Electric Co ltd
Priority date: 2020-09-26
Filing date: 2020-09-26
Publication date: 2021-07-06
Anticipated expiration: 2030-09-26

Abstract

The utility model discloses a stamping die for circuit board production, belonging to the technical field of circuit board production; the stamping die for producing the circuit board comprises a base, wherein a positioning plate is fixedly connected to the top of the base, a rotary seat is fixedly connected to the outer side wall of the base, an L-shaped support is fixedly connected to the top of the rotary seat, an installation plate arranged above the positioning plate is fixedly connected to one end, far away from the rotary seat, of the L-shaped support, a fixed rod is fixedly connected to the four corners of the bottom of the installation plate, an adsorption plate is fixedly connected to one side, close to the positioning plate, of the installation plate through the fixed rod, a stamping head is further arranged at the bottom of the installation plate, a groove matched with the stamping head is formed in the adsorption plate, and a negative pressure pumping assembly matched with the; the utility model discloses the negative pressure that negative pressure adsorption hole formed produces the appeal to the circuit board surface of stamping process, realizes the automation after the punching press is accomplished and gets the material function, helps improving machining efficiency.

Description

Stamping die is used in circuit board production

Technical Field

The utility model relates to a circuit board production technical field especially relates to stamping die is used in circuit board production.

Background

In the production process of the LED printed circuit board, some stamping processing, such as punching and stamping processing shaping, needs to be carried out on the circuit board, the working procedures need to be completed by utilizing a die, the existing die only processes corresponding through holes at the places needing to be punched, broken, punched and the like, and then the circuit board is flatly laid on the die for processing.

The circuit board is formed by laminating aluminum alloy substrate, insulating PP film and copper sheet, and thickness is thinner, at punching process through-hole or the in-process that breaks, because of grey coat or sand grain fall on the mould surface, the copper sheet circuit department is damaged in the pressure during the time of leading to the punching press, if the copper sheet circuit is damaged in the pressure, because of the insulating PP film in the circuit board is very thin, can stretch insulating PP film when damaging the circuit board, lead to copper sheet circuit and aluminum alloy substrate to switch on the short circuit, finally make the LED lamp burn out, the stamping die of prior art adopts the manual work to get the material simultaneously, inefficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem in the prior art, and the stamping die is used in circuit board production that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a stamping die is used in circuit board production, the on-line screen storage device comprises a base, the top rigid coupling of base has the locating plate, the lateral wall of base leads to the rigid coupling has the roating seat, the top fixedly connected with L type support of roating seat, the one end rigid coupling that the roating seat was kept away from to L type support has the mounting panel of arranging the locating plate top in, the bottom four corners department rigid coupling of mounting panel has the dead lever, one side that the mounting panel is close to the locating plate has the adsorption plate through the dead lever rigid coupling, the bottom of mounting panel still is equipped with the punching press head, open on the adsorption plate have with punching press head complex fluting, the top rigid coupling of mounting panel.

Further, the inner cavity of the adsorption plate is hollow, and negative pressure adsorption holes which are uniformly distributed are formed in one side, close to the positioning plate, of the adsorption plate.

Further, take out the negative pressure subassembly and include the negative pressure pump, the negative pressure pump rigid coupling is at the top of mounting panel, the negative pressure end of negative pressure pump is connected with the negative pressure pipe, the negative pressure pipe is kept away from the one end and the adsorption plate inner chamber intercommunication of negative pressure pump.

Furthermore, the slot is not communicated with the inner cavity of the adsorption plate and the negative pressure adsorption hole.

Further, the rotating seat comprises a mounting seat, the mounting seat is fixedly connected to the side wall of the base, a rotating motor is fixedly connected to the center of the top of the mounting seat, and the driving end of the rotating motor is fixedly connected with the L-shaped support.

Furthermore, the inner cavity of the base is hollow, and cooling liquid is contained in the inner cavity of the base.

Compared with the prior art, the utility model provides a stamping die is used in circuit board production possesses following beneficial effect:

1. this stamping die is used in circuit board production drives the negative pressure pipe through the negative pressure pump and makes the negative pressure adsorption hole of adsorption plate form the negative pressure, produces the appeal to the circuit board surface of punching press processing, realizes the automation after the punching press is accomplished and gets the material function, helps improving machining efficiency.

2. This stamping die is used in circuit board production has improved the cooling performance in the circuit board stamping process through the splendid attire coolant liquid in the inner chamber of base, avoids the high temperature to melt the circuit board.

Drawings

Fig. 1 is one of the schematic structural diagrams of the stamping die for producing the circuit board according to the present invention;

fig. 2 is a second schematic structural view of a stamping die for producing a circuit board according to the present invention;

fig. 3 is a third schematic structural view of the stamping die for circuit board production according to the present invention.

In the figure: 1. a base; 2. positioning a plate; 3. an L-shaped bracket; 4. mounting a plate; 5. fixing the rod; 6. an adsorption plate; 7. punching a head; 8. a negative pressure adsorption hole; 9. a negative pressure pump; 10. a negative pressure tube; 11. a mounting seat; 12. a rotating electric machine.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other; the specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-3, a stamping die is used in circuit board production, including base 1, the top rigid coupling of base 1 has locating plate 2, the lateral wall that base 1 leads to the rigid coupling has the roating seat, the top fixedly connected with L type support 3 of roating seat, the one end rigid coupling that L type support 3 kept away from the roating seat has the mounting panel 4 of arranging in locating plate 2 top in, the bottom four corners department rigid coupling of mounting panel 4 has dead lever 5, one side that mounting panel 4 is close to locating plate 2 has adsorption plate 6 through dead lever 5 rigid coupling, the bottom of mounting panel 4 still is equipped with stamping head 7, open on adsorption plate 6 have with the fluting of stamping head 7 complex, the top rigid coupling of mounting panel 4 have with 6 complex negative pressure subassemblies of taking out of adsorption.

The inner cavity of the adsorption plate 6 is hollow, and one side of the adsorption plate 6 close to the positioning plate 2 is provided with evenly distributed negative pressure adsorption holes 8.

The negative pressure pumping assembly comprises a negative pressure pump 9, the negative pressure pump 9 is fixedly connected to the top of the mounting plate 4, a negative pressure end of the negative pressure pump 9 is connected with a negative pressure pipe 10, and one end, far away from the negative pressure pump 9, of the negative pressure pipe 10 is communicated with the inner cavity of the adsorption plate 6.

The open groove is not communicated with the inner cavity of the adsorption plate 6 and the negative pressure adsorption hole 8.

The roating seat includes

mount pad

11, and 11 rigid couplings of mount pad are at the lateral wall of base 1, and the top center department rigid coupling of mount pad 11 has rotating electrical machines 12, and the drive end of rotating electrical machines 12 links to each other with L type support 3 is fixed.

During the use, punching press head 7 is marchd towards the fluting by mounting panel 4, passes fluting punching press head 7 and carries out stamping process to the circuit board of placing on locating plate 2, and after the punching press was accomplished, opens negative pressure pump 9, and negative pressure pump 9 drives negative pressure pipe 10 and makes the negative pressure adsorption hole 8 of adsorption plate 6 form the negative pressure, produces the appeal to the circuit board surface of stamping process, realizes the automatic material function of getting after the punching press is accomplished, helps improving machining efficiency.

Example 2:

referring to fig. 1-3, a circuit board production stamping die is substantially the same as that in embodiment 1, and further, an inner cavity of the base 1 is hollow, and a cooling liquid is contained in the inner cavity of the base 1, so that the cooling performance in the circuit board stamping process is improved, and the circuit board is prevented from being melted due to an over-high temperature.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A stamping die for producing a circuit board comprises a base (1) and is characterized in that, the top of the base (1) is fixedly connected with a positioning plate (2), the outer side wall of the base (1) is fixedly connected with a rotating seat, the top of the rotary seat is fixedly connected with an L-shaped bracket (3), one end of the L-shaped bracket (3) far away from the rotary seat is fixedly connected with a mounting plate (4) arranged above the positioning plate (2), the four corners of the bottom of the mounting plate (4) are fixedly connected with fixing rods (5), one side of the mounting plate (4) close to the positioning plate (2) is fixedly connected with an adsorption plate (6) through the fixing rods (5), the bottom of the mounting plate (4) is also provided with a stamping head (7), the adsorption plate (6) is provided with a slot matched with the stamping head (7), the top of the mounting plate (4) is fixedly connected with a negative pressure pumping assembly matched with the adsorption plate (6).

2. The punching die for producing the circuit board according to claim 1, wherein the inner cavity of the adsorption plate (6) is hollow, and negative pressure adsorption holes (8) are uniformly distributed on one side of the adsorption plate (6) close to the positioning plate (2).

3. The stamping die is used in circuit board production according to claim 2, characterized in that, take out negative pressure subassembly and include negative pressure pump (9), negative pressure pump (9) rigid coupling is at the top of mounting panel (4), the negative pressure end of negative pressure pump (9) is connected with negative pressure pipe (10), negative pressure pipe (10) keep away from the one end and the adsorption plate (6) inner chamber intercommunication of negative pressure pump (9).

4. The punching die for producing the circuit board according to claim 3, wherein the slot is not communicated with the inner cavity of the adsorption plate (6) and the negative pressure adsorption hole (8).

5. The punching die for producing the circuit board according to claim 4, wherein the rotating base comprises a mounting base (11), the mounting base (11) is fixedly connected to a side wall of the base (1), a rotating motor (12) is fixedly connected to the center of the top of the mounting base (11), and a driving end of the rotating motor (12) is fixedly connected to the L-shaped bracket (3).

6. The punching die for producing the circuit board according to any one of claims 1 to 5, wherein the inner cavity of the base (1) is hollow, and the inner cavity of the base (1) contains cooling liquid.