CN112839448A - Single-sided circuit board forming method and blanking and laying device - Google Patents

Abstract

The invention provides a method for forming a single-sided circuit board and a blanking and laying device of the single-sided circuit board. The device comprises a base, and a carrying platform, a feeding mechanism, a receiving mechanism and a punching and pasting two-in-one mechanism which are arranged on the base, wherein the carrying platform comprises a negative pressure table, a first driving assembly and a second driving assembly, and the first driving assembly and the second driving assembly respectively drive the negative pressure table to vertically move and horizontally move; the punching and pasting two-in-one mechanism comprises a base, a lower punch, a guide post, an upper punch and a third driving assembly, wherein the third driving assembly drives the upper punch to vertically move, and the upper punch drives the lower punch to downwards punch. The device cuts and punches the metal foil material through the base through having set up two unification mechanisms of punching and pasting, or the rubber coating, cut and the punching press to laminate it to being located the base plate that carries on the platform, realize blanking and lay the integration operation. The single-sided circuit board forming method provided by the invention has the advantages of simple process, environmental protection, no pollution and low cost.

Description

Single-sided circuit board forming method and blanking and laying device

Technical Field

The invention relates to the technical field of tools for laying metal foil materials on metal substrates, in particular to a single-sided circuit board forming method and a blanking and laying device.

Background

In the preparation of non-etching aluminum substrates in the market, glue is generally brushed on copper foil needing to be adhered, and then the copper foil is stamped or adhered to the aluminum substrate. This type of sub-process operation requires the transfer of the work pieces. In the process of transporting, the glue film on the copper foil inevitably receives the environmental impact of transporting, leads to the glue film adhesion degree not high, appears in the punching press in later stage or the process of bonding to the base plate, connects insecure condition.

The chinese patent with publication number CN101472393A discloses a flexible circuit board stamping die, which comprises an upper die assembly and a lower die assembly, wherein the upper surface of the lower die assembly is provided with a circuit board appearance, the flexible circuit board stamping die further comprises a discharge plate, the discharge plate is located between the upper die assembly and the lower die assembly, the discharge plate is provided with a circuit board punching positioning hole, the circuit board punching positioning hole is sleeved on the periphery of the circuit board appearance, the front part of the discharge plate is connected with the lower die assembly in a rotating manner through a connecting piece, and the rear part of the discharge plate stretches out of the side surface of the lower die assembly. The die only discloses a corresponding stamping structure, and no mention is made of how the bonding is performed.

Therefore, how to optimally design the existing circuit board stamping device so that the circuit board stamping device can complete the integrated processes of bonding and stamping is a technical problem which needs to be solved urgently by the technical personnel in the field.

Disclosure of Invention

In order to solve the problems in the prior art, the invention provides a single-sided circuit board forming method and a blanking and laying device. This kind of blanking and laying device through having set up two unification mechanisms of punching and pasting, cuts and the punching press to the metal foil material through the base, perhaps rubber coating, cuts and the punching press to laminate it accurately to being located the base plate that carries on the platform, realize the blanking and the integrated operation of laying. The device degree of automation is high, has effectively improved the fashioned work efficiency of no etching base plate. The forming method of the single-sided circuit board by adopting the device provided by the invention has the advantages of simple flow, environmental protection, no pollution and low cost.

In order to achieve the purpose, the invention provides the following technical scheme:

a blanking and laying device comprises a base, and a carrying platform, a feeding mechanism, a receiving mechanism and a punching and pasting two-in-one mechanism which are arranged on the base, wherein the carrying platform comprises a negative pressure table, a first driving assembly and a second driving assembly, the first driving assembly drives the negative pressure table to vertically move, and the second driving assembly drives the negative pressure table to horizontally move; the punching and pasting two-in-one mechanism is positioned above the carrying platform and comprises a base, a lower punch, a guide post, an upper punch and a third driving assembly, wherein the guide post is arranged on the lower punch, the third driving assembly drives the upper punch to vertically move, and the upper punch drives the lower punch to downwards punch; the material is sent out from the feeding mechanism, passes through the base and is rolled by the material receiving mechanism.

In the blanking and laying device, on one hand, materials are sent out from a feeding mechanism and reach a base, and a receiving mechanism is matched for winding; on the other hand, the substrate coated with the heat-conducting glue is placed on a negative pressure table and is driven by a first driving assembly and a second driving assembly to move vertically and horizontally respectively, so that the substrate reaches a preset punching and pasting station; at this moment, dash and paste two unification mechanisms, cut and the punching press according to appointed shape to the material on the base, on dashing the material of foil to pasting the base plate, and the laminating is accurate, and the bonding is firm reliable.

As a further description of the technical solution of the present invention, the upper punch and the lower punch are provided in a split type.

As a further description of the technical solution of the present invention, a through hole is formed on the upper punch, and the through hole is connected with the guide post in a matching manner.

As further description of the technical scheme of the invention, the base is provided with a groove structure, and an application assembly is arranged on the base and is used for brushing glue on the bottom of the material.

As further description of the technical scheme of the invention, the material is copper foil or aluminum foil.

In the stamping process, the through hole of the upper punch is matched with the guide post of the lower punch, so that the stamping station is accurate, and then the upper punch moves downwards under the driving of the third driving assembly to further drive the lower punch to stamp the copper foil or aluminum foil material on the base. The bottom of the material can be brushed with glue by the application assembly on the base. In the punching process, the lower punch is set to a specific punching shape so as to punch the material. Consequently, in carrying out stamping process, also accomplished the material laminating in the top of base plate, its degree of automation is high, need not to transport the material of brush glue.

As a further description of the technical solution of the present invention, the feeding mechanism includes a first stepping motor, a first guiding member and a feeding roller, and the receiving mechanism includes a second stepping motor, a second guiding member and a receiving roller, wherein the material is drawn out from the feeding roller driven by the first stepping motor, and is wound by the receiving roller driven by the second stepping motor via the first guiding member, the base and the second guiding member, respectively.

The feeding mechanism and the receiving mechanism together discharge and roll the materials, so that the copper foil or aluminum foil materials pass through the base in a mode of forming a conveyor belt, and after blanking and application are completed, the rest materials are rolled by the receiving mechanism for recycling.

As further description of the technical scheme of the invention, the stamping die further comprises a shell, wherein the shell is fixed above the base, and the carrying platform and the stamping and pasting two-in-one mechanism are positioned in the shell.

As a further description of the technical scheme of the invention, the negative pressure table is provided with suction holes, and the suction holes are uniformly distributed on the surface of the negative pressure table.

The negative pressure platform is through evenly having set up the suction hole, and inside formation negative pressure can closely adsorb the base plate of negative pressure bench top, prevents its aversion to it is accurate to guarantee the punching press.

As further description of the technical scheme of the invention, the lower punch is also provided with a return spring.

The lower punch is downwards extruded by the upper punch, so that the metal foil material is punched and laid on the substrate, and the return spring is compressed; after the upper punch and the lower punch are separated, the return spring rebounds to drive the lower punch to return to the original position.

The invention also provides a method for forming the single-sided circuit board, which adopts the blanking and laying device to blank and lay the metal foil material on the aluminum substrate, and specifically comprises the following steps:

s1, cutting a substrate into a preset shape and size;

s2, coating the surface of the substrate with heat-conducting glue, and drying to form a printing glue film;

s3, placing the substrate into a carrying platform of a blanking and laying device, and cutting and stamping the metal foil material by a stamping and sticking two-in-one mechanism so as to lay the metal foil material on the insulating layer corresponding to the substrate to form an adhesive structure;

s4, assembling and welding and silk-screen characters, uniformly attaching liquid ink to the surface of the PCB through a screen plate by utilizing a mechanical principle, and printing part codes and plug-in identification codes on the surface of the substrate through the screen plate; s5, high-temperature baking and post-processing to obtain the single-sided circuit board.

The substrate is a single-sided circuit board and comprises a single-sided substrate such as an aluminum substrate, a glass fiber board or a copper substrate; the heat conducting glue is also insulating glue.

In step S3, the application assembly of the two-in-one stamping mechanism may also apply glue to the passing metal foil material, so as to apply glue, cut and stamp to the metal foil material.

Compared with the traditional forming process of the aluminum-based circuit board, the complicated production processes of 'cutting of a substrate material, grinding of a board, printing of a circuit, prebaking, circuit exposure, circuit development, circuit etching, film removal, baking, shooting of a target hole, resistance welding of the grinding board, resistance welding coating, resistance welding of the prebaking, resistance welding exposure, resistance welding development, silk printing of characters, high-temperature baking and post-transfer process' are needed. The pretreatment requirement on the substrate is not so many, so the method is simple in process, environment-friendly, pollution-free and low in cost.

Based on the technical scheme, the invention has the following technical effects:

(1) according to the blanking and laying device provided by the invention, the feeding mechanism conveys materials to the target punching and laying station, the carrying platform ensures that the position of the substrate positioned above the negative pressure table is fixed, and the punching and laying two-in-one mechanism is arranged to cut and stamp the metal foil materials passing through the base or glue coating, cutting and stamping the metal foil materials, and precisely attach the metal foil materials to the substrate positioned on the carrying platform, so that the integrated operation of blanking and laying is realized; the device degree of automation is high, has effectively improved the fashioned work efficiency of no etching base plate.

(2) According to the blanking and laying device, in the stamping process, the upper punch moves downwards under the driving of the third driving assembly, and the lower punch is further driven to stamp copper foil or aluminum foil materials on the base. The bottom of material still can be applied ointment or plaster the subassembly and brush glue, and in carrying out stamping process, also accomplished the material laminating in the top of base plate, its degree of automation is high, need not to transport the material of brush glue, avoids the brush glue separately the quality problems who brings with the punching press process.

(3) The single-sided circuit board forming method provided by the invention adopts the specific blanking and laying device to cut and punch the metal foil material, or glue coating, cutting and punching, so that the conductive wire layer is adhered to the substrate, and the pretreatment requirement on the substrate is not so many, so that the process is simple, environment-friendly and pollution-free, and the cost is low.

Drawings

Fig. 1 is a schematic view of the blanking and laying device according to the invention.

Fig. 2 is a schematic structural view of a punching and pasting two-in-one mechanism of the present invention.

Fig. 3 is a partial configuration view of the punching and laying device of the present invention.

Fig. 4 is a partial structural view of the feeding mechanism of the present invention.

Fig. 5 is a schematic structural view of an upper punch according to the present invention.

Fig. 6 is a process flow chart of the method for forming the single-sided circuit board of the present invention.

Detailed Description

In order that the invention may be more fully understood, reference will now be made to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Example 1

Fig. 1 shows a schematic structural diagram of a blanking and laying apparatus of the present embodiment, fig. 2 shows a schematic structural diagram of a punching and pasting two-in-one mechanism of the present embodiment, fig. 3 is a partial structural diagram of the blanking and laying apparatus of the present embodiment, and with reference to fig. 1 to 3, a blanking and laying apparatus includes a base 1, a carrying platform 2, a feeding mechanism 3, a receiving mechanism 4, a punching and pasting two-in-one mechanism 5, and a housing 6, wherein the base 1 serves as a main body support of the blanking and laying apparatus, the carrying platform 2, the feeding mechanism 3, the receiving mechanism 4, and the punching and pasting two-in-one mechanism 5 are mounted above the base 1, and the upper part of the base is enclosed by the housing 6. The shell 6 is also fixed above the base 1, a cavity is formed inside the shell, the carrying platform 2 and the punching and pasting two-in-one mechanism 5 are located in the cavity inside the shell 6, and the feeding mechanism 3 and the receiving mechanism 4 are located on the side wall of the shell 6. Supporting legs 11 are arranged at four corners of the base 1, and the level of the base 1 can be ensured by adjusting the height of the supporting legs 11, so that the whole device is stable in position and does not shift in the operation process.

The carrying platform 2 is used for placing a substrate, the substrate is a base material for manufacturing a single-sided circuit board, such as an aluminum substrate or a copper substrate, and the feeding mechanism 3 is used for conveying soft materials such as a metal foil, such as a copper foil or an aluminum foil. In this embodiment, an aluminum substrate is taken as a substrate, and a copper foil is taken as a metal foil material. Since the copper foil is bonded and pressed over the surface of the aluminum foil, it is necessary to fix the position of the aluminum substrate and fix the aluminum substrate at a specific pressing station. This function is realized through carrying platform 2 to this embodiment, and aluminium base board uses heat conduction glue coating on the surface of aluminium base board before putting into carrying platform, dries, forms the printing glued membrane.

As shown in fig. 1 and 3, the mounting platform 2 includes a negative pressure table 21, a first driving module 22, and a second driving module 23, wherein the negative pressure table 21 has a plurality of suction holes 211 uniformly formed on a contact plane 210 with the aluminum substrate, a negative pressure chamber 212 is formed below the suction holes 211, and the negative pressure chamber 212 is connected to a negative pressure cylinder (not shown) through a negative pressure port 213. When the negative pressure cylinder works, air is pumped from top to bottom through the suction holes 211, so that negative pressure is formed in the negative pressure cavity 212 of the negative pressure table 21, and at the moment, the aluminum substrate placed on the contact plane 210 of the negative pressure table 21 is fixed in position and cannot be displaced in the stamping process. The aluminum substrate may be placed on the negative pressure table 21 manually or by a robot.

The negative pressure table 21 is driven to move vertically by a first driving assembly 22 and to move horizontally by a second driving assembly 23. That is, before the aluminum substrate is placed, the negative pressure table 21 projects outward and is away from the punching and bonding two-in-one mechanism 5. After the aluminum substrate is placed, the second driving unit 23 drives the negative pressure table 21 to move inward, and then the first driving unit 22 drives the negative pressure table 21 to move upward to reach a target punching and laying station.

Fig. 4 is a partial structural view of the feeding mechanism of the present embodiment, and referring to fig. 1, fig. 3 and fig. 4, the copper foil P to be cut and punched is conveyed out by the feeding mechanism 3 and is wound up by the receiving mechanism 4 above the carrying platform 2. Specifically, the feeding mechanism 3 includes a feeding bracket 30, and a first stepping motor 31, a first guiding member 32 and a feeding roller 33 fixed on the feeding bracket 30, the first stepping motor 31 is drivingly connected with the feeding roller 31 through a rotating shaft 331, and the rotating shaft 311 is capable of extending and retracting inside and outside, so as to complete the driving connection or disconnection between the feeding roller 33 and the first stepping motor 31. The material receiving mechanism 4 includes a second stepping motor 41, a second guiding member 42 and a material receiving roller 43, and the material is led out from the feeding roller 33 driven by the first stepping motor 31, and is wound by the material receiving roller 43 driven by the second stepping motor 41 via the first guiding member 32 and the second guiding member 42, respectively.

It should be further noted that the punching and pasting two-in-one mechanism 5 of the present embodiment is disposed above the carrying platform 2, and includes a base 51, a lower punch 52, a guide post 53, an upper punch 54 and a third driving assembly 55, where the upper punch 54 is in driving connection with the third driving assembly 55, and the upper punch 54 is provided with a through hole 541; the lower punch 52 and the upper punch 54 are arranged in a split mode, the lower punch 52 is elastically connected with the return spring 521, the guide post 53 is arranged on the lower punch 52 and matched with the through hole 541, and when the upper punch 54 punches downwards, the lower punch 52 can be driven to punch downwards according to a specific position. The bottom of the lower punch 52 is provided with a specific structure that punches the copper foil to be punched into a specific circuit shape. After the lower punch 52 completes punching, the return spring 521 can return to the original position upward with respect to the lower punch 52.

The base 51 has a groove structure in which a punching hole 511 is opened at a position facing the lower punch 52, and an application member 511 is provided on the base 51, the application member 511 being an optional member which applies a paste to the bottom of the passing copper foil P. The applicator assembly 511 may be provided with a glue delivery pump mechanism that continuously applies glue to the copper foil as it enters the base recess. After the copper foil P is conveyed out from the first guide 32 of the feeding mechanism 3, it passes through the groove structure of the base 51, and then the bottom of the copper foil P is coated with a glue layer by the application assembly 511. Naturally, the aluminum substrate carrying the platform is already coated with glue, and the surface of the aluminum substrate in contact with the copper foil is coated with heat-conducting glue and dried, so that a printed glue film is formed on the surface of the aluminum substrate.

Fig. 5 shows a schematic structural diagram of the upper punch of the present embodiment, and with reference to fig. 2 and 5, in the blanking and laying apparatus of the present embodiment, the through hole 541 of the upper punch 54 and the guiding column 53 above the lower punch 52 cooperate with each other to make the punching station accurate, and then the upper punch 54 moves downward under the driving of the third driving assembly 55 to further drive the lower punch 52 to punch the copper foil P on the base 51, since the bottom of the material is coated with glue. Therefore, in the stamping process, the material is laid and attached above the substrate, the automation degree is high, and the working efficiency of forming the non-etched substrate is effectively improved; moreover, the materials brushed with the glue are not required to be transported, and the quality problem caused by the separation of the brushing with the stamping process is avoided.

Example 2

Fig. 6 is a process flow chart of a single-sided circuit board forming method of the present embodiment, and as shown in fig. 6, a single-sided circuit board forming method for punching and laying a copper foil material on an aluminum substrate by using the punching and laying apparatus of embodiment 1 specifically includes the following steps:

s1, cutting an aluminum substrate into preset shapes and sizes;

s2, coating the surface of the aluminum substrate with heat-conducting glue, and drying to form a printed glue film;

s3, placing the aluminum substrate into a carrying platform of a blanking and laying device, and cutting and stamping the copper foil material by a stamping and sticking two-in-one mechanism so as to lay the copper foil material on the corresponding insulating layer of the aluminum substrate to form a bonding structure;

s4, assembling and welding and silk-screen characters, uniformly attaching liquid ink to the surface of the PCB through a screen plate by utilizing a mechanical principle, and printing part codes and plug-in identification codes on the surface of the substrate through the screen plate;

s5, high-temperature baking and post-processing to obtain the single-sided circuit board.

In the step S3, the application assembly provided by the two-in-one punching and pasting mechanism may also perform gluing on the passing metal foil material, and thus, the two-in-one punching and pasting mechanism may also perform gluing, cutting and punching on the metal foil material.

The method adopts a stacked molding process to produce the aluminum-based circuit board, and in step S2, the heat-conducting glue is also insulating glue.

Compared with the traditional forming process of the aluminum-based circuit board, the complicated production processes of 'cutting of a substrate material, grinding of a board, printing of a circuit, prebaking, circuit exposure, circuit development, circuit etching, film removal, baking, shooting of a target hole, resistance welding of the grinding board, resistance welding coating, resistance welding of the prebaking, resistance welding exposure, resistance welding development, silk printing of characters, high-temperature baking and post-transfer production' are needed. The pretreatment requirement on the aluminum substrate is not so many, so the process is simple, environment-friendly and pollution-free, and the cost is low.

Compared with a subtractive etching method, the method does not need environmentally-friendly procedures such as electroplating and etching, does not use chemicals, and saves energy consumption.

The foregoing is merely exemplary and illustrative of the structures of the present invention, which are described in some detail and detail, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.

Claims (10)

1. A blanking and laying device is characterized by comprising a base (1), and a carrying platform (2), a feeding mechanism (3), a receiving mechanism (4) and a punching and pasting two-in-one mechanism (5) which are arranged on the base (1), wherein the carrying platform (2) comprises a negative pressure platform (21), a first driving assembly (22) and a second driving assembly (23), the first driving assembly (22) drives the negative pressure platform (21) to vertically move, and the second driving assembly (23) drives the negative pressure platform (21) to horizontally move; the punching and pasting two-in-one mechanism (5) is positioned above the carrying platform (2) and comprises a base (51), a lower punch (52), a guide post (53), an upper punch (54) and a third driving assembly (55), wherein the guide post (53) is arranged on the lower punch (52), the third driving assembly (55) drives the upper punch (54) to vertically move, and the upper punch (54) drives the lower punch (52) to punch downwards; the materials are sent out from the feeding mechanism (3), pass through the base (51) and are rolled by the material receiving mechanism (4).

2. Blanking and laying device according to claim 1, wherein the upper punch (54) and the lower punch (52) are provided in a split arrangement.

3. The blanking and laying device according to claim 2, characterized in that said upper punch (54) has a through hole (541) made therein, said through hole (541) being fittingly connected to said guide post (53).

4. Blanking and laying device according to claim 1, wherein said base (51) has a groove structure, said base (51) being provided with an application assembly (511), said application assembly (511) brushing the bottom of said material with glue.

5. The blanking and laying device according to claim 4, wherein the material is copper foil or aluminium foil.

6. Blanking and laying device according to claim 1, wherein the feeding mechanism (3) comprises a first stepping motor (31), a first guide (32) and a feed roller (33), and the receiving mechanism (4) comprises a second stepping motor (41), a second guide (42) and a receiving roller (43), the material being drawn from the feed roller (43) driven by the first stepping motor (31) and being taken up by the receiving roller (43) driven by the second stepping motor (41) via the first guide (32), the base (51) and the second guide (42), respectively.

7. The blanking and laying device according to claim 1, further comprising a housing (6), wherein said housing (6) is fixed above said base (1), and wherein said piggyback platform (2) and said punch-and-paste mechanism (5) are located inside said housing (6).

8. Blanking and laying device according to claim 1, wherein said negative pressure table (21) is provided with suction holes (211), said suction holes (211) being evenly distributed over the surface of said negative pressure table (21).

9. Blanking and laying device according to claim 1, characterized in that the lower punch (52) is further provided with a return spring (521).

10. A method of forming a single-sided circuit board, wherein a metal foil material is punched and laid on a substrate by using the punching and laying apparatus of any one of claims 1 to 9, comprising the steps of:

s1, cutting a substrate into a preset shape and size;

s2, coating the surface of the substrate with heat-conducting glue, and drying to form a printing glue film;

s3, placing the substrate into a carrying platform of a blanking and laying device, and cutting and stamping the metal foil material by a stamping and sticking two-in-one mechanism so as to lay the metal foil material on the insulating layer corresponding to the substrate to form an adhesive structure;

s4, assembling and welding and silk-screen characters, uniformly attaching liquid ink to the surface of the PCB through a screen plate by utilizing a mechanical principle, and printing part codes and plug-in identification codes on the surface of the substrate through the screen plate;

s5, high-temperature baking and post-processing to obtain the single-sided circuit board.

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