CN112432072A - Closed LED lamp strip and manufacturing method thereof - Google Patents
Closed LED lamp strip and manufacturing method thereof Download PDFInfo
- Publication number
- CN112432072A CN112432072A CN201910835514.1A CN201910835514A CN112432072A CN 112432072 A CN112432072 A CN 112432072A CN 201910835514 A CN201910835514 A CN 201910835514A CN 112432072 A CN112432072 A CN 112432072A
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- China
- Prior art keywords
- circuit board
- light
- strip
- led
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000007666 vacuum forming Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 35
- 239000003292 glue Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000010073 coating (rubber) Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a closed LED lamp belt and a manufacturing method thereof, in particular to a single-sided or double-sided circuit board which is manufactured, a component containing an LED lamp is adhered and welded on the front surface of the circuit board by an SMT (surface mount technology), a light-transmitting film is manufactured into the light-transmitting film containing a plurality of cups by adopting a plastic suction or injection molding mode, an adhesive is applied to all other positions avoiding the LED position on the component surface of the circuit board, then the light-transmitting film cups are downward and oppositely adhered on the component surface of the circuit board, each component is covered with the cup, and the components are cut into single strips by a cutting machine to manufacture the single-strip closed LED lamp belt.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a closed LED lamp strip and a manufacturing method thereof.
Background
At present, waterproof LED lamp belts in the industry are generally waterproof by adopting the following two modes, firstly, glue is dripped on a front surface covering film of a single LED lamp belt circuit board and welded components to form a thick glue layer which is much higher than the components, the glue consumption of the method is large, the lamp belt circuit board can be welded by reflow soldering only by using a high-temperature-resistant expensive PI covering film, the material cost is high, and the production efficiency of single operation is low.
The other method is to adopt a mode of rubber coating or casing tube to carry out water proofing on the single LED lamp strip, the method is also that the circuit board of the lamp strip can be welded by reflow soldering only by using high-temperature resistant expensive PI as a covering film, the material cost of the rubber coating or casing tube is high, and the production efficiency of single operation is very low.
In order to overcome the defects and the defects, the light-transmitting film is subjected to plastic suction or injection molding to form a whole-plate cap cover matched with the positions of the elements of the LED lamp strips jointed together, the whole-plate cap cover is aligned and adhered to the circuit board of the LED lamp strips jointed together, the positions of the cap cover corresponding to the elements are covered on the elements, and then the cap cover is pressed by a hot press to enable the cap cover film to be tightly and firmly adhered to the circuit board to form the closed LED lamp strip, so that the closed LED lamp strip is produced, the LED lamp strip is coated with rubber to prevent water dripping, the LED lamp strip is prevented from water when being coated with a sleeve pipe, the material cost is low, the multiple lamp strips jointed.
Disclosure of Invention
The invention relates to a closed LED lamp belt and a manufacturing method thereof, in particular to a single-sided or double-sided circuit board which is manufactured, a component containing an LED lamp is adhered and welded on the front surface of the circuit board by an SMT (surface mount technology), a light-transmitting film is manufactured into the light-transmitting film containing a plurality of cups by adopting a plastic suction or injection molding mode, an adhesive is applied to all other positions avoiding the LED position on the component surface of the circuit board, then the light-transmitting film cups are downward and oppositely adhered on the component surface of the circuit board, each component is covered with the cup, and the components are cut into single strips by a cutting machine to manufacture the single-strip closed LED lamp belt.
The invention provides a method for manufacturing a closed LED lamp strip, which comprises the steps of manufacturing a single-sided or double-sided circuit board, wherein the circuit board comprises a plurality of independent lamp strip circuit boards, bonding components comprising LED lamps on the front surface of the circuit board by using an SMT (surface mount technology), manufacturing a light transmission film into a light transmission film comprising a plurality of cups by adopting a plastic suction or injection molding mode, applying an adhesive on all other positions avoiding LED positions (but not limited to LED positions) on the component surface of the circuit board, facing down the light transmission film cups to be bonded on the component surface of the circuit board, covering each component (but not limited to each component) with a cup, covering a manufactured template with a plurality of holes on a lamp connecting strip bonded with the light transmission cups, enabling the light transmission cover to enter into holes of the template, pressing the plate by using a flat press, keeping pressure from the cups to be pressed on the template, and transmitting the light transmission cup to a bonding area of the circuit board and the adhesive, and firmly sticking the adhesive on the circuit board and the light-transmitting cover, removing the template, and cutting into single strips by using a cutting machine to manufacture the single-strip closed LED lamp strip, wherein the side surfaces of the two sides of the lamp strip facing to the longitudinal direction (the long direction), each side of the side surface of the circuit board and the side surface of the light-transmitting film, and each side of the lamp strip is cut by one knife to form a knife cutting surface.
According to the present invention, there is also provided a closed LED strip, comprising: a single-sided or double-sided lamp belt circuit board; an element layer including an LED soldered on the lamp strip circuit board; an adhesive layer; a light-transmitting film layer with cups; a metal connection point; the LED lamp strip circuit board is characterized in that the lamp strip circuit board is designed into a plurality of periodic identical circuits, the plurality of periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period and can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back of the circuit board and/or on front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light-emitting surface (but not limited to the LED light-emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with, the light-transmitting film cups are covered on the elements (but not limited to the elements) and are adhered to the light-transmitting films on the lamp strips by the adhesive, so that the lamp strips become LED (light-emitting diode) closed lamp strips, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the side faces of two sides of the single lamp strip facing to the longitudinal direction (the longitudinal direction) are arranged on the same cutting face, and the side face of the circuit board of each side face and the side face of the light-transmitting film are.
According to a preferred embodiment of the present invention, the enclosed LED strip is characterized in that the adhesive is a thermosetting adhesive or a hot-melt adhesive.
According to a preferred embodiment of the present invention, the enclosed LED strip is characterized in that the light-transmitting film is made of PET, PVC, PC, PE, PP, or PU.
According to a preferred embodiment of the present invention, the enclosed LED strip is characterized in that the transparent film is a colorless and completely transparent film, or a colored transparent film, or a translucent and foggy transparent film.
According to a preferred embodiment of the present invention, the enclosed LED strip is characterized in that when the front circuit has metal connection points, the metal connection points are front metal connection pads, and the edge of the connection pad has solder resist and adhesive, or only solder resist, or only adhesive.
According to a preferred embodiment of the present invention, the enclosed LED strip is characterized in that a layer of double-sided adhesive tape is added on the back surface of the LED strip, and the side surfaces of two longitudinal sides (longitudinal direction) of the LED strip, the side surface of the strip circuit board, the side surface of the transparent film and the side surface of the double-sided adhesive tape are all on the same cutting surface.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of an LED strip circuit board.
Fig. 2 is a schematic plan view of an LED lamp on a circuit board of the LED lamp strip after the LED lamp is welded.
Fig. 3 is a schematic cross-sectional view of an LED lamp soldered on a circuit board of the LED lamp strip.
Fig. 4 is a schematic three-dimensional view of an LED lamp soldered on a circuit board of the LED lamp strip.
Fig. 5 is a schematic plan view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
FIG. 6 is a schematic cross-sectional view of a plurality of caps with one convex surface and the other concave surface formed by plastic-suction molding with a light-transmitting film.
Fig. 7 is a schematic perspective view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
Fig. 8 is a schematic three-dimensional view of alignment and attachment of the blister-formed cap and the lamp strip circuit board welded with the element.
Fig. 9 is a schematic cross-sectional view of a blister formed cap attached to a single-sided tape circuit board with components soldered thereto.
Fig. 10 is a schematic cross-sectional view of a blister formed cap attached to a double-sided tape circuit board with components soldered thereto.
Fig. 11 is a schematic cross-sectional view of solder resist and adhesive on the edge of the pad connected to the pad at the metal connection point after the blister formed cap is attached to the double-sided lamp strip circuit board with the components soldered.
Fig. 12 is a schematic cross-sectional view of solder resist on the edge of the bonding pad connected to the bonding pad at the metal connection point after the blister formed cap is attached to the double-sided lamp strip circuit board welded with the component.
Fig. 13 is a schematic cross-sectional view of the bonding pad edge of the connection bonding pad having an adhesive at the metal connection point after the blister formed cap and the double-sided lamp tape circuit board welded with the element are attached together.
Fig. 14 is a schematic cross-sectional view of the LED strip cut into individual closed pieces at two cut-out locations.
Fig. 15 is a schematic perspective view of a plurality of connected closed LED strips cut into single strips.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The LED lamp strip circuit board 1 is manufactured by adopting a traditional circuit board manufacturing process, namely, a flexible copper clad plate is subjected to processes of silk-screen circuit anti-corrosion ink, baking and curing, etching, film stripping, silk-screen front ink solder mask 1.3, element bonding pads 1.1 and metal connecting points 1.2 exposure, baking, character printing, baking and curing, OSP anti-oxidation surface treatment and the like (as shown in figures 1 and 9), wherein the lamp strip circuit board 1 shown in figure 1 is a single-sided lamp strip circuit board 1a or a double-sided lamp strip circuit board 1 b.
Or drilling, copper deposition, copper plating, dry film pasting, scene exposure and display, etching, film stripping, silk-screen printing of front ink solder mask 1.3 to expose element bonding pads 1.1 and metal connection points 1.2, baking, silk-screen printing of back ink solder mask, baking, character baking, OSP anti-oxidation surface treatment and other processes are carried out on the double-sided flexible copper-clad plate to manufacture the LED lamp strip circuit board 1 (as shown in figures 1 and 10), wherein the lamp strip circuit board 1 shown in figure 1 is a single-sided lamp strip circuit board 1a or a double-sided lamp strip circuit board 1 b.
The method comprises the steps of printing solder paste on an element bonding pad 1.1 of a lamp strip circuit board 1 by using a steel mesh on a solder paste printing machine by adopting a traditional SMT (surface mount technology), correspondingly mounting LED lamp beads 2.1 and resistors 2.2 on the bonding pad 1.1 printed with the solder paste, welding EED lamp beads 2.1 and the resistors 2.2 on the lamp strip circuit board 1 through reflow soldering, and manufacturing a bare lamp strip welded with an LED lamp (as shown in figures 2, 3 and 4).
The light-transmitting film 3 is subjected to plastic molding processing on a plastic suction machine by using a plastic suction mold, and a plurality of caps 3.1 with one convex surface and the other concave surface are processed and manufactured (as shown in fig. 5, 6 and 7).
On a bare lamp strip welded with an LED lamp 2.1 and a resistor 2.2, avoiding the positions of the LED lamp 2.1, the resistor 2.2 and a connecting welding spot 1.2, applying a layer of adhesive 4, aligning and pasting a cap cover 3.1 of a light-transmitting film 3 on the lamp strip circuit board 1 corresponding to the LED lamp 2.1 and the resistor 2.2 (as shown in figures 8, 9 and 10), wherein figure 9 is a plane schematic diagram of pasting a plastic-suction formed cap cover and a single-sided lamp strip circuit board welded with elements together, figure 10 is a plane schematic diagram of pasting the plastic-suction formed cap cover and the double-sided lamp strip circuit board welded with elements together, then covering the manufactured conjoined lamp strip pasted with light-transmitting cups with a template with a plurality of holes, enabling the light-transmitting cover to enter the holes of the template, then pressing the plate by a flat press, keeping pressure from the cups to press on the template, and transmitting the pressure to the combination area of the light-transmitting cups, the circuit board and the adhesive, so as to firmly stick the circuit board, the template is removed, the cap cover 3 is tightly and firmly stuck on the circuit board 1 to form a plurality of closed LED lamp belts which are connected together, the solder mask 1.3 and the adhesive 4 are arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 11), or only the solder mask 1.3 is arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 12), or only the adhesive 4 is arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 13), then, the plurality of connected closed LED strips are cut into single strips, so as to manufacture single closed LED strips (as shown in fig. 14 and 15), wherein on the two side surfaces of the single strip facing to the longitudinal direction (long direction), namely, the side surfaces 1.4a and 1.4b, the side surface with the wiring board 1 and the side surface with the light-transmitting film 3 of each side surface are on the same cutting surface (as shown in fig. 14).
Or the double-sided adhesive tape can be adhered to the back surfaces of a plurality of connected closed LED lamp belts, and then the LED lamp belts are cut into single strips to manufacture the single closed LED lamp belts, and the side surfaces of two sides of the LED lamp belts facing to the longitudinal direction (the long direction), the side surfaces of the lamp belt circuit board, the side surfaces of the light-transmitting film and the side surfaces of the double-sided adhesive tape are all arranged on the same cutting tool surface.
The invention adopts the technical scheme that a light-transmitting film is subjected to plastic suction or injection molding to manufacture an integral plate cap cover matched with the positions of elements of a plurality of LED lamp belts jointed together, the integral plate cap cover is aligned and adhered to the LED lamp belt circuit board jointed together, the cap cover covers the elements corresponding to the positions of the elements, and then the cap cover is pressed by a hot press to enable the cap cover film to be tightly and firmly adhered to the circuit board to manufacture the closed LED lamp belt, so that the LED lamp belt can replace the LED lamp belt in the current industry to be waterproof by glue dripping, waterproof by encapsulation and waterproof by wrapping of an LED lamp belt sleeve, the material cost is low, and the production is realized by combining a plurality of lamp belt jointed plates together.
The invention is described in detail above with reference to the accompanying drawings, which show a specific embodiment of an enclosed LED strip. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (7)
1. A method for manufacturing a closed LED lamp belt comprises manufacturing a single-sided or double-sided circuit board, wherein the circuit board comprises a plurality of independent lamp belt circuit boards, bonding components comprising LED lamps on the front surface of the circuit board by SMT process, manufacturing a light transmission film comprising a plurality of cups by vacuum forming or injection molding, applying adhesive on all other positions avoiding LED positions (but not limited to LED positions) on the component surface of the circuit board, facing the light transmission film cups downwards to the component surface of the circuit board, covering each component (but not limited to each component) with the cups, covering the prepared integral lamp belt with the light transmission cups with a template having a plurality of holes, allowing the light transmission cover to enter the holes of the template, pressing the plate with a flat press to avoid the cups to press on the template, and transferring the pressure to the bonding area of the light transmission cups, the circuit board and the adhesive, and firmly sticking the adhesive on the circuit board and the light-transmitting cover, removing the template, and cutting into single strips by using a cutting machine to manufacture the single-strip closed LED lamp strip, wherein the side surfaces of the two sides of the lamp strip facing to the longitudinal direction (the long direction), each side of the side surface of the circuit board and the side surface of the light-transmitting film, and each side of the lamp strip is cut by one knife to form a knife cutting surface.
2. An enclosed LED strip comprising:
a single-sided or double-sided lamp belt circuit board;
an element layer including an LED soldered on the lamp strip circuit board;
an adhesive layer;
a light-transmitting film layer with cups;
a metal connection point;
the LED lamp strip circuit board is characterized in that the lamp strip circuit board is designed into a plurality of periodic identical circuits, the plurality of periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period and can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back of the circuit board and/or on front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light-emitting surface (but not limited to the LED light-emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with, the light-transmitting film cups are covered on the elements (but not limited to the elements) and are adhered to the light-transmitting films on the lamp strips by the adhesive, so that the lamp strips become LED (light-emitting diode) closed lamp strips, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the side faces of two sides of the single lamp strip facing to the longitudinal direction (the longitudinal direction) are arranged on the same cutting face, and the side face of the circuit board of each side face and the side face of the light-transmitting film are.
3. An enclosed LED strip according to claim 1 or 2, wherein said adhesive is a thermosetting adhesive or a hot-melt adhesive.
4. An enclosed LED strip according to claim 1 or 2, wherein said light-transmissive film is made of PET, PVC, PC, PE, PP or PU material.
5. The enclosed LED strip as claimed in claim 4, wherein the transparent film is a colorless transparent film, a colored transparent film, or a translucent haze transparent film.
6. An enclosed LED strip as claimed in claim 1 or 2, wherein when there are metal connection points on the front side circuit, the metal connection points are front side metal connection pads, and the pad edge of the connection pads has solder resist and adhesive, or only solder resist, or only adhesive.
7. The enclosed LED strip according to claim 1 or 2, wherein a double-sided adhesive tape is applied on the back of the LED strip, and the side surfaces of the LED strip facing the longitudinal direction (longitudinal direction), the side surface of the strip circuit board, the side surface of the transparent film and the side surface of the double-sided adhesive tape are all on the same cutting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910835514.1A CN112432072A (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp strip and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910835514.1A CN112432072A (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp strip and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112432072A true CN112432072A (en) | 2021-03-02 |
Family
ID=74689871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910835514.1A Withdrawn CN112432072A (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp strip and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112432072A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112747284A (en) * | 2021-03-05 | 2021-05-04 | 深圳市银宝山新科技股份有限公司 | Rhythm product and manufacturing process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200944276Y (en) * | 2006-08-31 | 2007-09-05 | 田志辉 | Ultra-thin pad pasting LED display module |
| CN103094268A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof |
| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
| CN207080843U (en) * | 2017-07-19 | 2018-03-09 | 江西凯强实业有限公司 | A kind of transparent FPC lamp bars |
| CN212377817U (en) * | 2019-08-24 | 2021-01-19 | 王定锋 | Closed LED lamp area |
-
2019
- 2019-08-24 CN CN201910835514.1A patent/CN112432072A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200944276Y (en) * | 2006-08-31 | 2007-09-05 | 田志辉 | Ultra-thin pad pasting LED display module |
| CN103094268A (en) * | 2011-11-04 | 2013-05-08 | 杭州华普永明光电股份有限公司 | Light-emitting diode (LED) module used for commercial lighting and manufacturing method thereof |
| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
| CN207080843U (en) * | 2017-07-19 | 2018-03-09 | 江西凯强实业有限公司 | A kind of transparent FPC lamp bars |
| CN212377817U (en) * | 2019-08-24 | 2021-01-19 | 王定锋 | Closed LED lamp area |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112747284A (en) * | 2021-03-05 | 2021-05-04 | 深圳市银宝山新科技股份有限公司 | Rhythm product and manufacturing process thereof |
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