CN212377817U - Closed LED lamp area - Google Patents
Closed LED lamp area Download PDFInfo
- Publication number
- CN212377817U CN212377817U CN201921446726.2U CN201921446726U CN212377817U CN 212377817 U CN212377817 U CN 212377817U CN 201921446726 U CN201921446726 U CN 201921446726U CN 212377817 U CN212377817 U CN 212377817U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- strip
- lamp
- adhesive
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000004831 Hot glue Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 16
- 239000012528 membrane Substances 0.000 abstract description 15
- 239000004033 plastic Substances 0.000 abstract description 12
- 229920003023 plastic Polymers 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000010073 coating (rubber) Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to a closed LED lamp area, particularly, make a single face or two-sided circuit board, will include the components and parts subsides of LED lamp with SMT technology and weld the circuit board openly on, take plastic uptake or the mode of moulding plastics to make the printing opacity membrane that contains a plurality of cups other all positions that keep away the LED position on the component face of circuit board and apply the adhesive with the printing opacity membrane, then with printing opacity membrane cup counterpoint down paste circuit board component face on, all be covered with the cup on every component, be cut into the list with the cutting machine branch, make into the closed LED lamp area of monoblock.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to closed LED lamp area.
Background
At present, waterproof LED lamp belts in the industry are generally waterproof by adopting the following two modes, firstly, glue is dripped on a front surface covering film of a single LED lamp belt circuit board and welded components to form a thick glue layer which is much higher than the components, the glue consumption of the method is large, the lamp belt circuit board can be welded by reflow soldering only by using a high-temperature-resistant expensive PI covering film, the material cost is high, and the production efficiency of single operation is low.
The other method is to adopt a mode of rubber coating or casing tube to carry out water proofing on the single LED lamp strip, the method is also that the circuit board of the lamp strip can be welded by reflow soldering only by using high-temperature resistant expensive PI as a covering film, the material cost of the rubber coating or casing tube is high, and the production efficiency of single operation is very low.
In order to overcome above defect and not enough, the utility model discloses a carry out plastic uptake or mould plastics with the printing opacity membrane and make the whole board bonnet of component position assorted with many LED lamp areas of makeup together, the counterpoint subsides are pasted on the makeup LED lamp area circuit board together, the bonnet corresponds component position cover on components and parts, then with the hot press pressfitting, make the bonnet membrane closely firmly paste on the circuit board, make closed LED lamp area, it is waterproof to replace LED lamp area glue dripping in the present trade, LED lamp area rubber coating is waterproof, it is waterproof with LED lamp area cover pipe, low material cost, and be many lamp area makeup and production together, the production efficiency height has been improved greatly.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a closed LED lamp area, particularly, make a single face or two-sided circuit board, will include the components and parts subsides of LED lamp with SMT technology and weld the circuit board openly on, take the mode of plastic uptake or moulding plastics to make the printing opacity membrane that contains a plurality of cups with the printing opacity membrane, on the component face of circuit board, avoid other all positions of LED position to apply the adhesive, then with printing opacity membrane cup counterpoint down paste circuit board component face on, all be covered with the cup on every component, be cut into the list with the cutting machine branch, make into the solitary closed LED lamp area.
According to the utility model provides a closed LED lamp area, include: a single-sided or double-sided lamp belt circuit board; an element layer including an LED soldered on the lamp strip circuit board; an adhesive layer; a light-transmitting film layer with cups; a metal connection point; the LED lamp strip circuit board is characterized in that the lamp strip circuit board is designed into a plurality of periodic identical circuits, the plurality of periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period and can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back of the circuit board and/or on front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light-emitting surface (but not limited to the LED light-emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with, the light-transmitting film cups are covered on the elements (but not limited to the elements) and are adhered to the light-transmitting films on the lamp strips by the adhesive, so that the lamp strips become LED (light-emitting diode) closed lamp strips, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the side faces of two sides of the single lamp strip facing to the longitudinal direction (the longitudinal direction) are arranged on the same cutting face, and the side face of the circuit board of each side face and the side face of the light-transmitting film are.
According to a preferred embodiment of the present invention, the LED strip is a closed LED strip, wherein the adhesive is a thermosetting adhesive or a hot-melt adhesive.
According to a preferred embodiment of the present invention, the closed LED strip is characterized in that the transparent film is made of PET, PVC, PC, PE, PP, or PU.
According to the utility model discloses a preferred embodiment, a closed LED lamp area, its characterized in that, printing opacity membrane be colorless complete transparent printing opacity membrane, or colored printing opacity membrane, or translucent vaporific printing opacity membrane.
According to the utility model discloses a preferred embodiment, a closed LED lamp area, its characterized in that, when having the metal tie point on the positive circuit, the metal tie point is positive metal connection pad, the pad limit of connection pad has solder resist and adhesive, or only solder resist, or only adhesive.
According to the utility model discloses a preferred embodiment, a closed LED lamp area, its characterized in that can add the one deck double faced adhesive tape at the LED lamp area back to in LED lamp area towards vertical (length direction) both sides side, lamp area circuit board side, printing opacity membrane side and double faced adhesive tape side all are on same knife face of cutting.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of an LED strip circuit board.
Fig. 2 is a schematic plan view of an LED lamp on a circuit board of the LED lamp strip after the LED lamp is welded.
Fig. 3 is a schematic cross-sectional view of an LED lamp soldered on a circuit board of the LED lamp strip.
Fig. 4 is a schematic three-dimensional view of an LED lamp soldered on a circuit board of the LED lamp strip.
Fig. 5 is a schematic plan view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
FIG. 6 is a schematic cross-sectional view of a plurality of caps with one convex surface and the other concave surface formed by plastic-suction molding with a light-transmitting film.
Fig. 7 is a schematic perspective view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
Fig. 8 is a schematic three-dimensional view of alignment and attachment of the blister-formed cap and the lamp strip circuit board welded with the element.
Fig. 9 is a schematic cross-sectional view of a blister formed cap attached to a single-sided tape circuit board with components soldered thereto.
Fig. 10 is a schematic cross-sectional view of a blister formed cap attached to a double-sided tape circuit board with components soldered thereto.
Fig. 11 is a schematic cross-sectional view of solder resist and adhesive on the edge of the pad connected to the pad at the metal connection point after the blister formed cap is attached to the double-sided lamp strip circuit board with the components soldered.
Fig. 12 is a schematic cross-sectional view of solder resist on the edge of the bonding pad connected to the bonding pad at the metal connection point after the blister formed cap is attached to the double-sided lamp strip circuit board welded with the component.
Fig. 13 is a schematic cross-sectional view of the bonding pad edge of the connection bonding pad having an adhesive at the metal connection point after the blister formed cap and the double-sided lamp tape circuit board welded with the element are attached together.
Fig. 14 is a schematic cross-sectional view of the LED strip cut into individual closed pieces at two cut-out locations.
Fig. 15 is a schematic perspective view of a plurality of connected closed LED strips cut into single strips.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The LED lamp strip circuit board 1 is manufactured by adopting a traditional circuit board manufacturing process, namely, a flexible copper clad plate is subjected to processes of silk-screen circuit anti-corrosion ink, baking and curing, etching, film stripping, silk-screen front ink solder mask 1.3, element bonding pads 1.1 and metal connecting points 1.2 exposure, baking, character printing, baking and curing, OSP anti-oxidation surface treatment and the like (as shown in figures 1 and 9), wherein the lamp strip circuit board 1 shown in figure 1 is a single-sided lamp strip circuit board 1a or a double-sided lamp strip circuit board 1 b.
Or drilling, copper deposition, copper plating, dry film pasting, scene exposure and display, etching, film stripping, silk-screen printing of front ink solder mask 1.3 to expose element bonding pads 1.1 and metal connection points 1.2, baking, silk-screen printing of back ink solder mask, baking, character baking, OSP anti-oxidation surface treatment and other processes are carried out on the double-sided flexible copper-clad plate to manufacture the LED lamp strip circuit board 1 (as shown in figures 1 and 10), wherein the lamp strip circuit board 1 shown in figure 1 is a single-sided lamp strip circuit board 1a or a double-sided lamp strip circuit board 1 b.
The method comprises the steps of printing solder paste on an element bonding pad 1.1 of a lamp strip circuit board 1 by using a steel mesh on a solder paste printing machine by adopting a traditional SMT (surface mount technology), correspondingly mounting LED lamp beads 2.1 and resistors 2.2 on the bonding pad 1.1 printed with the solder paste, welding EED lamp beads 2.1 and the resistors 2.2 on the lamp strip circuit board 1 through reflow soldering, and manufacturing a bare lamp strip welded with an LED lamp (as shown in figures 2, 3 and 4).
The light-transmitting film 3 is subjected to plastic molding processing on a plastic suction machine by using a plastic suction mold, and a plurality of caps 3.1 with one convex surface and the other concave surface are processed and manufactured (as shown in fig. 5, 6 and 7).
On a bare lamp strip welded with an LED lamp 2.1 and a resistor 2.2, avoiding the positions of the LED lamp 2.1, the resistor 2.2 and a connecting welding spot 1.2, applying a layer of adhesive 4, aligning and pasting a cap cover 3.1 of a light-transmitting film 3 on the lamp strip circuit board 1 corresponding to the LED lamp 2.1 and the resistor 2.2 (as shown in figures 8, 9 and 10), wherein figure 9 is a plane schematic diagram of pasting a plastic-suction formed cap cover and a single-sided lamp strip circuit board welded with elements together, figure 10 is a plane schematic diagram of pasting the plastic-suction formed cap cover and the double-sided lamp strip circuit board welded with elements together, then covering the manufactured conjoined lamp strip pasted with light-transmitting cups with a template with a plurality of holes, enabling the light-transmitting cover to enter the holes of the template, then pressing the plate by a flat press, keeping pressure from the cups to press on the template, and transmitting the pressure to the combination area of the light-transmitting cups, the circuit board and the adhesive, so as to firmly stick the circuit board, the template is removed, the cap cover 3 is tightly and firmly stuck on the circuit board 1 to form a plurality of closed LED lamp belts which are connected together, the solder mask 1.3 and the adhesive 4 are arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 11), or only the solder mask 1.3 is arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 12), or only the adhesive 4 is arranged at the pad edge of the connecting pad at the position of the metal connecting point 1.2 (as shown in figure 13), then, the plurality of connected closed LED strips are cut into single strips, so as to manufacture single closed LED strips (as shown in fig. 14 and 15), wherein on the two side surfaces of the single strip facing to the longitudinal direction (long direction), namely, the side surfaces 1.4a and 1.4b, the side surface with the wiring board 1 and the side surface with the light-transmitting film 3 of each side surface are on the same cutting surface (as shown in fig. 14).
Or the double-sided adhesive tape can be adhered to the back surfaces of a plurality of connected closed LED lamp belts, and then the LED lamp belts are cut into single strips to manufacture the single closed LED lamp belts, and the side surfaces of two sides of the LED lamp belts facing to the longitudinal direction (the long direction), the side surfaces of the lamp belt circuit board, the side surfaces of the light-transmitting film and the side surfaces of the double-sided adhesive tape are all arranged on the same cutting tool surface.
The utility model discloses a carry out plastic uptake or mould plastics with the printing opacity membrane and make the whole board bonnet of component position assorted with many LED lamp areas of makeup together, the subsides of counterpointing are pasted the makeup on LED lamp area circuit board together, the bonnet corresponds component position cover on components and parts, then with the hot press pressfitting, make the bonnet membrane closely firmly paste on the circuit board, make closed LED lamp area, it is waterproof to replace LED lamp area glue dripping in the trade now, LED lamp area rubber coating is waterproof, it is waterproof with LED lamp area sleeve pipe, the material cost is low, and it produces to be many lamp area makeup together, the production efficiency height has been improved greatly.
The present invention has been described in detail with reference to the accompanying drawings. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (6)
1. An enclosed LED strip comprising:
a single-sided or double-sided lamp belt circuit board;
an element layer including an LED soldered on the lamp strip circuit board;
an adhesive layer;
a light-transmitting film layer with cups;
a metal connection point;
the LED lamp strip circuit board is characterized in that the lamp strip circuit board is designed into a plurality of periodic identical circuits, the plurality of periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period and can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back of the circuit board and/or on front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light-emitting surface from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with a plurality of circuits, the light-transmitting film cups are covered on the elements and are bonded to the light-transmitting films on the lamp strips by the adhesive, so that the lamp strips become LED closed lamp strips, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into pieces, the side faces of two longitudinal sides of the single lamp strip are arranged on the same cutter face, and the side face of the circuit board of each side face and the side face of the light-transmitting film are arranged on the same cutter face.
2. The enclosed LED strip according to claim 1, wherein said adhesive is a thermosetting adhesive or a hot-melt adhesive.
3. The enclosed LED strip according to claim 1, wherein said light-transmissive film is made of PET, PVC, PC, PE, PP, or PU material.
4. The enclosed LED strip as claimed in claim 3, wherein the transparent film is a colorless and transparent film, a colored film, or a translucent and foggy film.
5. An enclosed LED strip as claimed in claim 1, wherein when the front side circuit has metal connection points, the metal connection points are front side metal connection pads, and the edge of the connection pads has solder resist and adhesive, or only solder resist, or only adhesive.
6. The enclosed LED strip of claim 1, wherein a double-sided adhesive tape is applied to the back of the LED strip, and the two sides of the LED strip facing the longitudinal direction, the side of the strip circuit board, the side of the transparent film and the side of the double-sided adhesive tape are all on the same cutting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921446726.2U CN212377817U (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921446726.2U CN212377817U (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212377817U true CN212377817U (en) | 2021-01-19 |
Family
ID=74156574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921446726.2U Expired - Fee Related CN212377817U (en) | 2019-08-24 | 2019-08-24 | Closed LED lamp area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212377817U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112432072A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Closed LED lamp strip and manufacturing method thereof |
-
2019
- 2019-08-24 CN CN201921446726.2U patent/CN212377817U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112432072A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Closed LED lamp strip and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210119 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |