CN112483923A - Waterproof LED lamp strip and manufacturing method thereof - Google Patents
Waterproof LED lamp strip and manufacturing method thereof Download PDFInfo
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- CN112483923A CN112483923A CN201910813127.8A CN201910813127A CN112483923A CN 112483923 A CN112483923 A CN 112483923A CN 201910813127 A CN201910813127 A CN 201910813127A CN 112483923 A CN112483923 A CN 112483923A
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- circuit board
- lamp strip
- waterproof
- film
- light
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- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000001746 injection moulding Methods 0.000 claims abstract description 6
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 239000003292 glue Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000004831 Hot glue Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
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- 239000011248 coating agent Substances 0.000 description 3
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- 230000003064 anti-oxidating effect Effects 0.000 description 2
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- 239000010959 steel Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a waterproof LED lamp strip and a manufacturing method thereof, in particular to a double-sided circuit board which is manufactured by adhering and welding a component containing an LED lamp on the front surface of the circuit board by an SMT (surface mount technology) process, manufacturing a light transmission film containing a plurality of cups by adopting a plastic suction or injection molding mode, applying an adhesive on all other positions avoiding the LED position on the front component surface of the circuit board, then adhering the light transmission film cups on the component surface of the circuit board in a downward and opposite mode, covering each component with the cups, adhering a waterproof film on the back surface of the circuit board, and cutting the waterproof film into single strips by a cutting machine to manufacture the single waterproof LED lamp strip.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a waterproof LED lamp strip and a manufacturing method thereof.
Background
At present, waterproof LED lamp belts in the industry are generally waterproof by adopting the following two modes, firstly, glue is dripped on a front surface covering film of a single LED lamp belt circuit board and welded components to form a thick glue layer which is much higher than the components, the glue consumption of the method is large, the lamp belt circuit board can be welded by reflow soldering only by using a high-temperature-resistant expensive PI covering film, the material cost is high, and the production efficiency of single operation is low.
The other method is to adopt a mode of rubber coating or casing tube to carry out water proofing on the single LED lamp strip, the method is also that the circuit board of the lamp strip can be welded by reflow soldering only by using high-temperature resistant expensive PI as a covering film, the material cost of the rubber coating or casing tube is high, and the production efficiency of single operation is very low.
In order to overcome the defects and the defects, the LED lamp strip circuit board is adhered to the surface of the front surface on which the LED element is welded by adopting a whole-board cap cover which is manufactured by plastic suction or injection molding through a light-transmitting film, the cap cover is covered on the element corresponding to the position of the element, the back surface of the LED lamp strip circuit board is adhered with a waterproof film with glue, the adhesive is cured by heating, and then the LED lamp strip circuit board is cut into single lamp strips to manufacture the waterproof LED lamp strip, so that the waterproof LED lamp strip replaces the LED lamp strip in the current industry to be waterproof by glue dripping, waterproof by coating and wrapping the LED lamp strip with a sleeve, the material cost is low, and a plurality of lamp strip spliced plates are manufactured together, so.
Disclosure of Invention
The invention relates to a waterproof LED lamp strip and a manufacturing method thereof, in particular to a double-sided circuit board which is manufactured by adhering and welding a component containing an LED lamp on the front surface of the circuit board by an SMT (surface mount technology) process, manufacturing a light transmission film containing a plurality of cups by adopting a plastic suction or injection molding mode, applying an adhesive on all other positions avoiding the LED position on the front component surface of the circuit board, then adhering the light transmission film cups on the component surface of the circuit board in a downward and opposite mode, covering each component with the cups, adhering a waterproof film on the back surface of the circuit board, cutting the waterproof film into single strips by a cutting machine to manufacture the single waterproof LED lamp strip, wherein the cut lamp strip faces to the two side surfaces in the longitudinal direction, the side surface of the back waterproof film layer of each side surface, the side surface of the circuit board and the side surface of the light transmission film are formed on a cutter surface.
The invention provides a method for manufacturing a waterproof LED lamp strip, which comprises the steps of manufacturing a double-sided circuit board, wherein the front surface of the circuit board is provided with an ink solder mask layer, the back surface of the circuit board is provided with a bare metal circuit or an ink solder mask layer, the circuit board is provided with a plurality of independent lamp strip circuit boards, components comprising LED lamps are pasted and welded on the front surface of the circuit board by an SMT (surface mount technology), a light transmission film comprising a plurality of cups is manufactured by a plastic suction or injection molding mode, an adhesive is applied to all other positions except the LED positions (but not limited to the LED positions) on the front surface component surface of the circuit board, then the light transmission film cups are pasted on the component surface of the circuit board in an opposite position downwards, each component (but not limited to each component) is covered with a cup, a waterproof film is pasted or a waterproof adhesive film is applied to the back surface of the circuit board to form a back surface waterproof film layer, then a template, the transparent cover enters a template hole, then a flat press is used for pressing a plate, pressure is kept away from a cup to be pressed on the template, and then the pressure is transmitted to a combination area of the transparent cup, the circuit board and the glue, so that the adhesive is firmly adhered to the circuit board and the transparent cover, the template is removed, the transparent cover is cut into single strips by a cutting machine to manufacture a single waterproof LED lamp strip, the cut lamp strip faces to the two side surfaces of the longitudinal direction (the long direction), the side surface of the back waterproof film layer of each side surface, the side surface of the circuit board and the side surface of the transparent film are all formed on one cutting tool surface.
A waterproof LED strip, comprising:
a back waterproof film layer or a back waterproof film layer and a back solder mask layer;
a back side circuit layer;
an intermediate insulating layer;
a front side circuit layer;
a front side ink solder mask layer;
an element layer including an LED soldered on the front surface circuit layer;
an adhesive layer;
a light-transmitting film layer with cups;
a metal connection point;
the LED lamp strip is characterized in that a lamp strip circuit board is designed into a plurality of periodic identical circuits, the periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period, the lamp strip can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back surface of the circuit board and/or on the front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light emitting surface (but not limited to the LED light emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with a, the light-transmitting film cover cup covers the element (but not limited to the element), the waterproof of the lamp strip is composed of a back waterproof film layer, a front light-transmitting film layer and each film layer and adhesive layer on the side surface, an all-round closed waterproof structure is formed on the lamp strip, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the side surfaces of two sides of the single lamp strip facing to the longitudinal direction (the long direction) are provided, and the back waterproof film, the side surface of the circuit board and the side surface of the light-transmitting film on each side surface are arranged on the same cutting surface.
According to a preferred embodiment of the present invention, the adhesive is a thermosetting adhesive or a hot-melt adhesive.
According to a preferred embodiment of the present invention, the light-transmitting film is made of PET, PVC, PC, PE, PP, or PU.
According to a preferred embodiment of the present invention, the light-transmitting film is a colorless and completely transparent light-transmitting film, or a colored light-transmitting film, or a translucent and foggy light-transmitting film.
According to a preferred embodiment of the present invention, when there are metal connection points on the front circuit, the metal connection points are front metal connection pads, and the edge of the connection pad has solder resist and adhesive, or only solder resist, or only adhesive.
According to a preferred embodiment of the present invention, the adhesive is a thermosetting adhesive or a hot-melt adhesive.
According to a preferred embodiment of the present invention, the light-transmitting film is made of PET, PVC, PC, PE, PP, or PU.
According to a preferred embodiment of the present invention, the light-transmitting film is a colorless and completely transparent light-transmitting film, or a colored light-transmitting film, or a translucent and foggy light-transmitting film.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a double-sided wiring board.
Fig. 2 is a schematic plan view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 3 is a schematic cross-sectional view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 4 is a schematic perspective view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 5 is a schematic plan view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
FIG. 6 is a schematic cross-sectional view of a plurality of caps with one convex surface and the other concave surface formed by plastic-suction molding with a light-transmitting film.
Fig. 7 is a schematic perspective view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
Fig. 8 is a schematic perspective view showing alignment and attachment of the blister-molded cap and the component-soldered double-sided circuit board, and the back waterproof film and the component-soldered double-sided circuit board.
Fig. 9 is a schematic cross-sectional view of a waterproof LED strip formed by attaching a double-sided circuit board with a bare metal circuit on the back surface to a waterproof film and a blister-molded cap.
Fig. 10 is a schematic cross-sectional view of a waterproof LED strip formed by attaching a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a cap formed by plastic suction.
Fig. 11 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a blister formed cap attached together to form a waterproof LED strip, where solder resist and an adhesive are provided on a pad edge of a connection pad at a metal connection point.
Fig. 12 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a cap formed by plastic suction to be attached together to form a waterproof LED strip, and solder resist is provided on a pad edge of a connection pad at a metal connection point.
Fig. 13 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a blister formed cap attached together to form a waterproof LED strip, where at metal connection points, the edge of a pad connected to the pad has an adhesive.
Fig. 14 is a schematic cross-sectional view of the waterproof LED strip cut into individual strips at two cut-out locations.
Fig. 15 is a schematic perspective view of a plurality of connected waterproof LED strips cut into individual waterproof LED strips.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The double-sided circuit board 1 (as shown in figures 1 and 9) is manufactured by adopting a traditional circuit board manufacturing process, drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and developing a scene, etching, removing the film, manufacturing a front circuit 1.4 and a back circuit 1.6, then screen-printing front ink solder mask 1.3, exposing an element bonding pad 1.1 and a metal connection point 1.2, baking, characters, baking, OSP anti-oxidation surface treatment and the like.
Or drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and developing, etching, removing the film, manufacturing a front circuit 1.4 and a back circuit 1.6, then silk-screening a front ink solder mask 1.3, exposing an element bonding pad 1.1 and a metal connection point 1.2, baking, silk-screening a back ink solder mask 1.7, baking, characters, baking, OSP anti-oxidation surface treatment and other processes to manufacture the double-sided circuit board 1 (as shown in figures 1 and 10).
The method comprises the steps of printing solder paste on a component bonding pad 1.1 on the front surface of a double-sided circuit board 1 by using a steel mesh on a solder paste printing machine by adopting a traditional SMT (surface mount technology), correspondingly mounting LED lamp beads 2.1 and resistors 2.2 on the bonding pad 1.1 printed with the solder paste, welding EED lamp beads 2.1 and the resistors 2.2 on the double-sided circuit board 1 through reflow soldering, and manufacturing a plurality of spliced plates connected together into a bare lamp strip (shown in figures 2, 3 and 4) welded with LED lamps.
The light-transmitting film 3 is subjected to plastic molding processing on a plastic suction machine by using a plastic suction mold, and a plurality of caps 3.1 with one convex surface and the other concave surface are processed and manufactured (as shown in fig. 5, 6 and 7).
On the circuit board 1 welded with the LED lamp 2.1 and the resistor 2.2, a layer of adhesive 5 is applied at the positions avoiding the LED lamp 2.1, the resistor 2.2 and the metal connection point 1.2, then the cap 3.1 of the light transmission film 3 is aligned and attached to the double-sided circuit board 1 corresponding to the LED lamp 2.1 and the resistor 2.2, and then the back waterproof film 5 is aligned and attached to the back of the double-sided circuit board 1 (as shown in figures 8, 9 and 10), wherein figure 9 is a schematic plane diagram of the double-sided circuit board with a bare metal circuit on the back, the back waterproof film and the cap formed by plastic suction, the cap formed by plastic suction is attached together, figure 10 is a schematic plane diagram of the double-sided circuit board with a solder mask and the back waterproof film and the cap formed by plastic suction, then a manufactured template with a plurality of holes is covered on the conjoined lamp band with the light transmission cup, the light transmission cover enters into the template holes, and then a flat press is used, the pressure avoids the cup pressing on the template, and then is transmitted to the combination area of the light-transmitting cup, the circuit board and the glue, so that the adhesive firmly adheres to the circuit board and the light-transmitting cover, the template is removed, the cap cover 3 is tightly and firmly adhered to the circuit board 1, a plurality of connected waterproof LED lamp belts are formed, at the position of the metal connection point 1.2, the pad edge of the connection pad is provided with the solder mask 1.3 and the adhesive 5 (as shown in figure 11), or at the position of the metal connection point 1.2, the pad edge of the connection pad is only provided with the solder mask 1.3 (as shown in figure 12), or at the position of the metal connection point 1.2, the pad edge of the connection pad is only provided with the adhesive 5 (as shown in figure 13), then the plurality of connected waterproof LED lamp belts are cut into single strips, and a single waterproof LED lamp belt (as shown in figures 14 and 15) is manufactured, and the two side surfaces of the single waterproof LED lamp belt facing to the longitudinal direction, namely, the side surfaces 1.8a and 1.8b, the side surface with the wiring board 1 and the side surface with the light-transmitting film 3 of each side surface are on the same cutting surface (as shown in fig. 14).
According to the invention, the LED lamp strip circuit board is adhered to the surface of the front surface on which the LED element is welded by adopting the whole board cap cover which is manufactured by plastic suction or injection molding through the light-transmitting film, the cap cover is covered on the element corresponding to the position of the element, the waterproof film with glue is adhered to the back surface of the LED lamp strip circuit board, the adhesive is cured by heating, and then the LED lamp strip is cut into single lamp strips to manufacture the waterproof LED lamp strip, so that the LED lamp strip circuit board replaces the LED lamp strip in the current industry to be waterproof by glue dripping, is waterproof by coating of the LED lamp strip and is waterproof by coating of the LED lamp strip sleeve.
The invention is described in detail above with reference to the accompanying drawings, which illustrate a specific embodiment of a waterproof LED strip. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (6)
1. A method for manufacturing a waterproof LED lamp strip comprises manufacturing a double-sided circuit board, wherein the front surface of the circuit board is provided with an ink solder mask layer, the back surface of the circuit board is provided with a bare metal circuit or an ink solder mask layer, the circuit board is provided with a plurality of independent lamp strip circuit boards, components including LED lamps are pasted and welded on the front surface of the circuit board by an SMT (surface mount technology), a light transmission film is manufactured into a light transmission film with a plurality of cups by adopting a plastic suction or injection molding mode, the front surface element surface of the circuit board is coated with an adhesive at all other positions avoiding LED positions (but not limited to the LED positions), then the light transmission film cups are pasted on the element surface of the circuit board in an opposite position downwards, each element (but not limited to each element) is covered with a cup, a waterproof film is pasted or a waterproof adhesive film is applied on the back surface of the circuit board to form a back waterproof film layer, then a template, the transparent cover enters a template hole, then a flat press is used for pressing a plate, pressure is kept away from a cup to be pressed on the template, and then the pressure is transmitted to a combination area of the transparent cup, the circuit board and the glue, so that the adhesive is firmly adhered to the circuit board and the transparent cover, the template is removed, the transparent cover is cut into single strips by a cutting machine to manufacture a single waterproof LED lamp strip, the cut lamp strip faces to the two side surfaces of the longitudinal direction (the long direction), the side surface of the back waterproof film layer of each side surface, the side surface of the circuit board and the side surface of the transparent film are all formed on one cutting tool surface.
2. A waterproof LED strip, comprising:
a back waterproof film layer or a back waterproof film layer and a back solder mask layer;
a back side circuit layer;
an intermediate insulating layer;
a front side circuit layer;
a front side ink solder mask layer;
an element layer including an LED soldered on the front surface circuit layer;
an adhesive layer;
a light-transmitting film layer with cups;
a metal connection point;
the LED lamp strip is characterized in that a lamp strip circuit board is designed into a plurality of periodic identical circuits, the periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period, the lamp strip can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back surface of the circuit board and/or on the front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light emitting surface (but not limited to the LED light emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with a, the light-transmitting film cover cup covers the element (but not limited to the element), the waterproof of the lamp strip is composed of a back waterproof film layer, a front light-transmitting film layer and each film layer and adhesive layer on the side surface, an all-round closed waterproof structure is formed on the lamp strip, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the side surfaces of two sides of the single lamp strip facing to the longitudinal direction (the long direction) are provided, and the back waterproof film, the side surface of the circuit board and the side surface of the light-transmitting film on each side surface are arranged on the same cutting surface.
3. A waterproof LED strip according to claim 1 or 2, wherein said adhesive is a thermosetting adhesive or a hot-melt adhesive.
4. A waterproof LED strip according to claim 1 or 2, wherein said light-transmissive film is made of PET, PVC, PC, PE, PP or PU material.
5. The waterproof LED lamp strip according to claim 4, wherein the light-transmitting film is a colorless fully transparent light-transmitting film, a colored light-transmitting film, or a translucent haze light-transmitting film.
6. A waterproof LED strip according to claim 1 or 2, wherein when there are metal connection points on the front side circuit, the metal connection points are front side metal connection pads, and the pad edge of the connection pads has solder resist and adhesive, or only solder resist, or only adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813127.8A CN112483923A (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp strip and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813127.8A CN112483923A (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp strip and manufacturing method thereof |
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| CN112483923A true CN112483923A (en) | 2021-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910813127.8A Pending CN112483923A (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp strip and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024016562A1 (en) * | 2022-07-18 | 2024-01-25 | 深圳市神牛摄影器材有限公司 | Fabric led lamp |
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| US20030021115A1 (en) * | 2001-07-25 | 2003-01-30 | Sloan Thomas C. | Perimeter lighting apparatus |
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| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
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| CN208138941U (en) * | 2018-04-28 | 2018-11-23 | 夏昌明 | A kind of Multifucntional linear modulation |
| CN212377809U (en) * | 2019-08-24 | 2021-01-19 | 王定锋 | Waterproof LED lamp area |
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