CN212377809U - Waterproof LED lamp area - Google Patents
Waterproof LED lamp area Download PDFInfo
- Publication number
- CN212377809U CN212377809U CN201921414130.4U CN201921414130U CN212377809U CN 212377809 U CN212377809 U CN 212377809U CN 201921414130 U CN201921414130 U CN 201921414130U CN 212377809 U CN212377809 U CN 212377809U
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- China
- Prior art keywords
- circuit board
- lamp strip
- waterproof
- light
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 230000000737 periodic effect Effects 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract description 20
- 238000007639 printing Methods 0.000 abstract description 18
- 229920003023 plastic Polymers 0.000 abstract description 16
- 239000004033 plastic Substances 0.000 abstract description 16
- 238000000465 moulding Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000010073 coating (rubber) Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model relates to a waterproof LED lamp area, particularly, make a double-sided circuit board, will include on the circuit board openly with the component subsides that the SMT technology will include the LED lamp, take the plastic uptake or the mode of moulding plastics to make the printing opacity membrane that contains a plurality of cups with the printing opacity membrane, on the positive component face of circuit board, avoid all other positions of LED position to apply the adhesive, then on pasting circuit board component face to the position downwards with the printing opacity membrane cup, all be covered with the cup on every component, paste the one deck waterproof membrane at the back of circuit board, divide with the cutting machine and be cut into the list, make a waterproof LED lamp area of strip.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to waterproof LED lamp area.
Background
At present, waterproof LED lamp belts in the industry are generally waterproof by adopting the following two modes, firstly, glue is dripped on a front surface covering film of a single LED lamp belt circuit board and welded components to form a thick glue layer which is much higher than the components, the glue consumption of the method is large, the lamp belt circuit board can be welded by reflow soldering only by using a high-temperature-resistant expensive PI covering film, the material cost is high, and the production efficiency of single operation is low.
The other method is to adopt a mode of rubber coating or casing tube to carry out water proofing on the single LED lamp strip, the method is also that the circuit board of the lamp strip can be welded by reflow soldering only by using high-temperature resistant expensive PI as a covering film, the material cost of the rubber coating or casing tube is high, and the production efficiency of single operation is very low.
In order to overcome above defect and not enough, the utility model discloses with LED lamp area circuit board, the adoption carries out the whole board hat shield subsides that the plastic uptake was made through the printing opacity membrane and pastes and to openly weld which one side of LED component, the hat shield corresponds the components and parts position cover on components and parts, LED lamp area circuit board back paste takes gluey water proof membrane, the heating makes the adhesive solidification, then cut into single lamp area, make waterproof LED lamp area, it is waterproof to replace LED lamp area glue dripping in the present trade, LED lamp area rubber coating is waterproof, it is waterproof with LED lamp area cover pipe, low material cost, and it produces to be many lamp area makeup together, the production efficiency is high greatly improved.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a waterproof LED lamp area, particularly, make a double-sided circuit board, will include on the circuit board openly with the component subsides that SMT technology will include the LED lamp, take the mode of plastic uptake to make the printing opacity membrane plastic uptake contain the printing opacity membrane of a plurality of cups with the printing opacity membrane plastic uptake, on the positive component face of circuit board, avoid other all positions of LED position to apply the adhesive, then on pasting the circuit board component face to the printing opacity membrane cup counterpoint down, all be covered with the cup on every component, one deck waterproof membrane is pasted at the back of circuit board, divide with the cutting machine and cut into the list, make a strip waterproof LED lamp area, lamp area after cutting is towards vertical (length direction) both sides side, the side of the back waterproof rete of every side, and the side of circuit board, and the side of printing opacity membrane, all form on a cutting tool face.
According to the utility model provides a waterproof LED lamp area, include: a back waterproof film layer or a back waterproof film layer and a back solder mask layer; a back side circuit layer; an intermediate insulating layer; a front side circuit layer; a front side ink solder mask layer; an element layer including an LED soldered on the front surface circuit layer; an adhesive layer; a light-transmitting film layer with cups; a metal connection point; the LED lamp strip is characterized in that a lamp strip circuit board is designed into a plurality of periodic identical circuits, the periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period, the lamp strip can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back surface of the circuit board and/or on the front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light emitting surface (but not limited to the LED light emitting surface) from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with a, the light-transmitting film cover cup covers the element (but not limited to the element), the waterproof of the lamp strip is composed of a back waterproof film layer, a front light-transmitting film layer and each film layer and adhesive layer on the side surface, an all-round closed waterproof structure is formed on the lamp strip, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, the back waterproof film and the side surface of the circuit board and the side surface of the light-transmitting film on each side surface are on the same cutter surface on the two side surfaces of the lamp strip facing to the longitudinal direction (the long direction).
According to a preferred embodiment of the present invention, the waterproof LED strip is characterized in that the adhesive is a thermosetting adhesive or a hot-melt adhesive.
According to the utility model discloses a preferred embodiment, a waterproof LED lamp area, its characterized in that, the printing opacity membrane is the printing opacity membrane that PET, or PVC, or PC, or PE, or PP, or PU material made.
According to the utility model discloses a preferred embodiment, a waterproof LED lamp area, its characterized in that, printing opacity membrane be colorless complete transparent printing opacity membrane, or colored printing opacity membrane, or translucent vaporific printing opacity membrane.
According to the utility model discloses a preferred embodiment, a waterproof LED lamp area, its characterized in that, when having the metal tie point on the positive circuit, the metal tie point is positive metal connection pad, the pad limit of connection pad has solder resist and adhesive, or only solder resist, or only adhesive.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The specification is read in connection with the following drawings; the features, objects, and advantages of the present invention will become more apparent from the brief description of the drawings that follows.
Fig. 1 is a schematic plan view of a double-sided wiring board.
Fig. 2 is a schematic plan view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 3 is a schematic cross-sectional view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 4 is a schematic perspective view of a double-sided circuit board with an LED lamp soldered thereon.
Fig. 5 is a schematic plan view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
FIG. 6 is a schematic cross-sectional view of a plurality of caps with one convex surface and the other concave surface formed by plastic-suction molding with a light-transmitting film.
Fig. 7 is a schematic perspective view of a plurality of caps with one convex surface and the other concave surface formed by plastic suction molding with a light-transmitting film.
Fig. 8 is a schematic perspective view showing alignment and attachment of the blister-molded cap and the component-soldered double-sided circuit board, and the back waterproof film and the component-soldered double-sided circuit board.
Fig. 9 is a schematic cross-sectional view of a waterproof LED strip formed by attaching a double-sided circuit board with a bare metal circuit on the back surface to a waterproof film and a blister-molded cap.
Fig. 10 is a schematic cross-sectional view of a waterproof LED strip formed by attaching a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a cap formed by plastic suction.
Fig. 11 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a blister formed cap attached together to form a waterproof LED strip, where solder resist and an adhesive are provided on a pad edge of a connection pad at a metal connection point.
Fig. 12 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a cap formed by plastic suction to be attached together to form a waterproof LED strip, and solder resist is provided on a pad edge of a connection pad at a metal connection point.
Fig. 13 is a schematic cross-sectional view of a double-sided circuit board with solder resist on a back metal circuit, a back waterproof film, and a blister formed cap attached together to form a waterproof LED strip, where at metal connection points, the edge of a pad connected to the pad has an adhesive.
Fig. 14 is a schematic cross-sectional view of the waterproof LED strip cut into individual strips at two cut-out locations.
Fig. 15 is a schematic perspective view of a plurality of connected waterproof LED strips cut into individual waterproof LED strips.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The double-sided circuit board 1 (as shown in figures 1 and 9) is manufactured by adopting a traditional circuit board manufacturing process, drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and developing a scene, etching, removing the film, manufacturing a front circuit 1.4 and a back circuit 1.6, then screen-printing front ink solder mask 1.3, exposing an element bonding pad 1.1 and a metal connection point 1.2, baking, characters, baking, OSP anti-oxidation surface treatment and the like.
Or drilling a double-sided flexible copper-clad plate, depositing copper, plating copper, pasting a dry film, exposing and developing, etching, removing the film, manufacturing a front circuit 1.4 and a back circuit 1.6, then silk-screening a front ink solder mask 1.3, exposing an element bonding pad 1.1 and a metal connection point 1.2, baking, silk-screening a back ink solder mask 1.7, baking, characters, baking, OSP anti-oxidation surface treatment and other processes to manufacture the double-sided circuit board 1 (as shown in figures 1 and 10).
The method comprises the steps of printing solder paste on a component bonding pad 1.1 on the front surface of a double-sided circuit board 1 by using a steel mesh on a solder paste printing machine by adopting a traditional SMT (surface mount technology), correspondingly mounting LED lamp beads 2.1 and resistors 2.2 on the bonding pad 1.1 printed with the solder paste, welding EED lamp beads 2.1 and the resistors 2.2 on the double-sided circuit board 1 through reflow soldering, and manufacturing a plurality of spliced plates connected together into a bare lamp strip (shown in figures 2, 3 and 4) welded with LED lamps.
The light-transmitting film 3 is subjected to plastic molding processing on a plastic suction machine by using a plastic suction mold, and a plurality of caps 3.1 with one convex surface and the other concave surface are processed and manufactured (as shown in fig. 5, 6 and 7).
On the circuit board 1 welded with the LED lamp 2.1 and the resistor 2.2, a layer of adhesive 5 is applied at the positions avoiding the LED lamp 2.1, the resistor 2.2 and the metal connection point 1.2, then the cap 3.1 of the light transmission film 3 is aligned and attached to the double-sided circuit board 1 corresponding to the LED lamp 2.1 and the resistor 2.2, and then the back waterproof film 5 is aligned and attached to the back of the double-sided circuit board 1 (as shown in figures 8, 9 and 10), wherein figure 9 is a schematic plane diagram of the double-sided circuit board with a bare metal circuit on the back, the back waterproof film and the cap formed by plastic suction, the cap formed by plastic suction is attached together, figure 10 is a schematic plane diagram of the double-sided circuit board with a solder mask and the back waterproof film and the cap formed by plastic suction, then a manufactured template with a plurality of holes is covered on the conjoined lamp band with the light transmission cup, the light transmission cover enters into the template holes, and then a flat press is used, the pressure avoids the cup pressing on the template, and then is transmitted to the combination area of the light-transmitting cup, the circuit board and the glue, so that the adhesive firmly adheres to the circuit board and the light-transmitting cover, the template is removed, the cap cover 3 is tightly and firmly adhered to the circuit board 1, a plurality of connected waterproof LED lamp belts are formed, at the position of the metal connection point 1.2, the pad edge of the connection pad is provided with the solder mask 1.3 and the adhesive 5 (as shown in figure 11), or at the position of the metal connection point 1.2, the pad edge of the connection pad is only provided with the solder mask 1.3 (as shown in figure 12), or at the position of the metal connection point 1.2, the pad edge of the connection pad is only provided with the adhesive 5 (as shown in figure 13), then the plurality of connected waterproof LED lamp belts are cut into single strips, and a single waterproof LED lamp belt (as shown in figures 14 and 15) is manufactured, and the two side surfaces of the single waterproof LED lamp belt facing to the longitudinal direction, namely, the side surfaces 1.8a and 1.8b, the side surface with the wiring board 1 and the side surface with the light-transmitting film 3 of each side surface are on the same cutting surface (as shown in fig. 14).
The utility model discloses with LED lamp area circuit board, the adoption carries out whole board cap cover subsides that plastic uptake was made through the printing opacity membrane and pastes and to openly weld which one side of LED component, the cap cover corresponds components and parts position cover on components and parts, the waterproof membrane of a tape glue is pasted at LED lamp area circuit board back, the heating makes the adhesive solidification, then the branch is cut into single lamp area, make waterproof LED lamp area, it is waterproof to replace LED lamp area glue dripping in the trade now, LED lamp area rubber coating is waterproof, it is waterproof with LED lamp area sleeve pipe, the material cost is low, and be many lamp area makeup preparation production together, the production efficiency height has been improved greatly.
The present invention has been described in detail with reference to the accompanying drawings. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (5)
1. A waterproof LED strip, comprising:
a back waterproof film layer or a back waterproof film layer and a back solder mask layer;
a back side circuit layer;
an intermediate insulating layer;
a front side circuit layer;
a front side ink solder mask layer;
an element layer including an LED soldered on the front surface circuit layer;
an adhesive layer;
a light-transmitting film layer with cups;
a metal connection point;
the LED lamp strip circuit board is characterized in that the lamp strip circuit board is designed into a plurality of periodic identical circuits, the plurality of periodic circuits are combined together to form a long lamp strip circuit board, components welded on each period of the lamp strip are identical, the lamp strip is a long lamp strip consisting of a plurality of periodic short lamp strips, a shearing position is arranged between each period and can be sheared at any shearing position for independent use, metal connecting points are arranged beside each shearing position and used for interconnection between the lamp strips or used for connecting the lamp strip with a power supply, the metal connecting points are arranged on the back surface of the circuit board and/or on the front circuit metal of the circuit board, the light-transmitting film and the circuit board are firmly bonded together by an adhesive, an adhesive layer for bonding the light-transmitting film avoids an LED light emitting surface from being bonded to all other positions on the lamp strip, and the lamp strip is provided with the light-transmitting film with a plurality of circuits, the light-transmitting film cups are covered on the elements, the waterproof function of the lamp strip is realized by a back waterproof film layer, a front light-transmitting film layer, each film layer and each glue layer on the side surface, an all-round closed waterproof structure is formed on the lamp strip, each lamp strip is a single lamp strip formed by cutting a plurality of connected lamp strips into sections, and the back waterproof film, the side surface of the circuit board and the side surface of the light-transmitting film on each side surface are on the same cutter surface on the side surfaces of the two longitudinal sides of the lamp strip.
2. The waterproof LED lamp strip according to claim 1, wherein the adhesive is a thermosetting adhesive or a hot-melt adhesive.
3. The waterproof LED lamp strip according to claim 1, wherein said light-transmitting film is made of PET, PVC, PC, PE, PP or PU material.
4. The waterproof LED lamp strip according to claim 3, wherein the light-transmitting film is a colorless fully transparent light-transmitting film, a colored light-transmitting film, or a translucent haze light-transmitting film.
5. The waterproof LED strip of claim 1, wherein when the front side circuit has metal connection points, the metal connection points are front side metal connection pads, and the pad edge of the connection pads has solder resist and adhesive, or only solder resist, or only adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921414130.4U CN212377809U (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921414130.4U CN212377809U (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212377809U true CN212377809U (en) | 2021-01-19 |
Family
ID=74156543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921414130.4U Expired - Fee Related CN212377809U (en) | 2019-08-24 | 2019-08-24 | Waterproof LED lamp area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212377809U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112483923A (en) * | 2019-08-24 | 2021-03-12 | 王定锋 | Waterproof LED lamp strip and manufacturing method thereof |
-
2019
- 2019-08-24 CN CN201921414130.4U patent/CN212377809U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112483923A (en) * | 2019-08-24 | 2021-03-12 | 王定锋 | Waterproof LED lamp strip and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210119 |