CN117177448A - Be applied to printed circuit board's accurate solder paste spray printing equipment - Google Patents

Be applied to printed circuit board's accurate solder paste spray printing equipment Download PDF

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Publication number
CN117177448A
CN117177448A CN202311120946.7A CN202311120946A CN117177448A CN 117177448 A CN117177448 A CN 117177448A CN 202311120946 A CN202311120946 A CN 202311120946A CN 117177448 A CN117177448 A CN 117177448A
Authority
CN
China
Prior art keywords
solder paste
fixedly connected
spray printing
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311120946.7A
Other languages
Chinese (zh)
Inventor
张聪
吴振亚
欧锴
徐爱波
魏明
曹鹏彬
陈绪兵
李立凡
王强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fiberhome Telecommunication Technologies Co Ltd
Wuhan Institute of Technology
Wuhan Fiberhome Technical Services Co Ltd
Original Assignee
Fiberhome Telecommunication Technologies Co Ltd
Wuhan Institute of Technology
Wuhan Fiberhome Technical Services Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiberhome Telecommunication Technologies Co Ltd, Wuhan Institute of Technology, Wuhan Fiberhome Technical Services Co Ltd filed Critical Fiberhome Telecommunication Technologies Co Ltd
Priority to CN202311120946.7A priority Critical patent/CN117177448A/en
Publication of CN117177448A publication Critical patent/CN117177448A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the technical field of surface mounting, and discloses precise solder paste spray printing equipment applied to a printed circuit board, which comprises a spray printing equipment whole, a spray printing workbench, an electric cabinet, an upper computer display, an equipment rack and a shell; the whole middle part fixedly connected with installation fixed plate of spray printing equipment, the top fixedly connected with of installation fixed plate 7 spouts the seal workstation, the middle part of spouting the seal workstation vertically has set gradually X axle sharp module and X axle driving motor. The Mark point of the printed circuit board is identified and positioned through the camera, then coordinate conversion is carried out on the Mark point and the coordinate point of the position of the Gerber pad of the printed circuit board led into the upper computer, and tin spraying is carried out according to the set process path through the X, Y, Z linear module matched with the motion control injection valve, so that the printing defect caused by excessive coating amount or missing printing of tin paste in the traditional SMT production is solved, and the mechanical and electrical performances of a processed product are ensured.

Description

Be applied to printed circuit board's accurate solder paste spray printing equipment
Technical Field
The invention relates to the technical field of surface mounting, in particular to precise solder paste spray printing equipment applied to a printed circuit board.
Background
With the advent of miniaturization of electronic component packaging size and wave, the surface packing density of electronic products is increasing. Electronic products are developed in the directions of light weight, thinness, smallness and high performance, and the electronic manufacturing industry also puts more strict reliability index requirements. The surface mounting technology (Surface Mount Technology, abbreviated as SMT) is an important component of the electronic manufacturing industry, is a main processing technology in the current electronic assembly industry, and is characterized in that solder paste printing is used as a first procedure of the SMT process flow, the quality of solder paste coating has a direct influence on the subsequent mounting and welding procedures and the quality of final products, and the problem of welding spot defects exceeding two thirds is generally considered to be generated in the solder paste coating link in the current industry.
The traditional solder paste printing technology mainly adopts a steel screen printing mode, but a steel screen printer has the defects of low steel screen precision and poor coating controllability, and various coating defects such as pattern defects, offset, pull tips, edge accumulation, edge burrs, collapse, inconsistent thickness and the like are often caused in the solder paste coating process. Also, steel screen printing cannot meet the increasingly demanding small-lot, personalized customization schemes due to long period and poor flexibility of the customized steel screen, so in order to cope with the challenges of increasingly smaller size, increasing number and processing technology of electronic components, solder paste printing requires higher processing capacity, processing precision and flexibility.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides precise solder paste spray printing equipment applied to a printed circuit board, which solves the problems that the traditional solder paste printing technology mainly adopts a steel screen printing mode, but a steel screen printer has the defects of low steel screen precision and poor coating controllability, and various coating defects such as pattern defects, offset, pull tips, edge accumulation, edge burrs, collapse, inconsistent thickness and the like are often caused in the solder paste coating process. Also, since steel screen printing cannot meet small-batch and personalized customization schemes with increasingly strong demands due to long period and poor flexibility of customized steel screens, in order to cope with the continuous challenges of increasingly smaller sizes, increasing numbers and processing technologies of electronic components, solder paste printing requires higher processing capacity, processing precision and flexibility.
In order to achieve the above purpose, the invention is realized by the following technical scheme: a precision solder paste jet printing apparatus for a printed circuit board, comprising: the spray printing device comprises a spray printing device whole, a spray printing workbench, an electric cabinet, an upper computer display, a device rack and a shell;
the utility model discloses a spray printing device, including the whole middle part fixedly connected with installation fixed plate of spray printing device, the top fixedly connected with of installation fixed plate 7 spouts the seal workstation, the middle part of spouting the seal workstation vertically has set gradually X axle sharp module and X axle driving motor, it transversely has set gradually module support frame and signal wire casing to spout the rear side of seal workstation, fixedly connected with product location frock on the slide of X axle sharp module, fixedly connected with Y axle sharp module and Y axle driving motor on the module support frame in proper order, be provided with Z axle sharp module mount on the slide of Y axle sharp module, Z axle sharp module mount's front end vertically fixedly connected with Z axle sharp module and Z axle driving motor in proper order, Z axle sharp module mount's rear end is connected through horizontal towing chain with signal wire casing top, be provided with on the slide of Z axle sharp module and spout the seal and carry out the subassembly, be connected through vertical towing chain between Z axle sharp module's top and the fixed plate of spouting the seal and carrying out the subassembly.
Preferably, the middle lower part fixedly connected with structure steelframe of equipment rack and shell, the top fixedly connected with frame epitheca of structure steelframe, the right side of structure steelframe is provided with electrical component, the front end of structure steelframe is provided with the regulator cubicle and opens the door, the rear end of structure steelframe is provided with the regulator cubicle heat dissipation backshell, the front end fixedly connected with workstation overhead door of frame epitheca, the right side fixedly connected with equipment of frame epitheca opens and stops and scram operating panel, the rear end fixedly connected with workstation backshell of frame epitheca, the left and right sides of frame epitheca is fixedly connected with respectively and is decorated shell and right side and decorates shell, be provided with upper left door plant, lower left door plant, upper right door plant and lower right door plant on left side decoration shell 53 and the right side decoration shell 513 respectively.
Preferably, the electrical component uses an electrical mounting board as a bottom board, and the core hardware comprises a switching power supply, a motion control board card, a grounding bar, a filter, a solid state relay, an air switch, a wiring groove and an XYZ motor driver group.
Preferably, the execution assembly fixed plate of the spray printing execution assembly is fixed with the Z-axis linear motor sliding seat, the solder paste spray printing assembly is installed on the left side of the execution assembly fixed plate through a valve body connecting plate, the CCD fixed plate is installed on the right side of the execution assembly fixed plate, the lower end of the CCD fixed plate is fixedly connected with a CCD camera, the left side of the CCD fixed plate is fixedly connected with an adjustable light source fixed plate, the lower end of the CCD camera is fixedly connected with a CCD lens, the bottom of the adjustable annular light source fixed plate is provided with an annular light source connecting plate, and the lower end of the annular light source connecting plate is fixedly connected with an annular light source.
Preferably, the solder paste spray printing component comprises a solder paste spray valve body, a solder paste heating ring and a laser displacement sensor, wherein the solder paste spray valve body is connected to a valve body connecting plate through rear end threads, a solder paste nozzle is arranged at the bottom of the solder paste spray valve body, the solder paste heating ring is connected with a solder paste fixing frame through threads, a constant-temperature heating source is vertically arranged at the front end of the solder paste heating ring, and the laser displacement sensor is connected with an execution component fixing plate through a laser displacement sensor fixing plate.
Preferably, the product positioning tool comprises a tool fixing plate and a linear guide rail group, two positioning plates, wherein a tool side plate is fixedly connected to the side face of the tool fixing plate, linear guide rails are fixedly connected to the two sides of the tool fixing plate, positioning plates and limiting screws are fixedly connected to sliding blocks of the linear guide rails, and a spring pressing buckle assembly is arranged on the positioning plates.
Preferably, an upper computer display is arranged on the right side of the whole jet printing device.
Working principle: the invention has the advantages that the printed circuit board to be processed is fixed through the product positioning tool, the product positioning tool is moved to a CCD visual shooting range through the X-axis linear module and the Y-axis linear module, mark points of the printed circuit board are identified and positioned through the camera, then coordinate conversion is carried out on the Mark points and coordinate points of the position of a Gerber pad of the printed circuit board led into an upper computer, the actual position of the processing coordinates of the center of the pad is obtained, and tin spraying is carried out through a X, Y, Z linear module matched with a motion control injection valve according to a set process path, so that the printing defect caused by excessive coating amount or skip printing of tin paste in the existing SMT production is solved, the mechanical and electrical performances of the processed product are ensured, compared with the traditional printing technology, the invention does not need to customize a printed circuit board to print a steel mesh, the equipment motion control system is accurate and rapid in response, the injection frequency of the tin paste injection valve is high, and the processing efficiency is greatly improved.
The invention provides a precise solder paste spray printing device applied to a printed circuit board. The beneficial effects are as follows:
according to the invention, a printed circuit board to be processed is fixed through the product positioning tool, then the product positioning tool is moved to a CCD visual shooting range through the X-axis linear module and the Y-axis linear module, mark points of the printed circuit board are identified and positioned through a camera, then coordinate conversion is carried out on the Mark points and coordinate points of a Gerber pad position of the printed circuit board led into an upper computer, the actual position of the center processing coordinates of the pad is obtained, and tin spraying is carried out through a X, Y, Z linear module in combination with a motion control injection valve according to a set process path, so that the printing defect caused by excessive coating amount or missing printing of tin paste in the conventional SMT production is solved, and therefore, the mechanical and electrical performance of the processed product is ensured.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of a workbench according to the present invention;
FIG. 3 is a schematic view of the structure of the rack and housing of the present invention;
FIG. 4 is a schematic diagram of an electrical assembly of the present invention;
FIG. 5 is a schematic diagram of a jet printing execution assembly according to the present invention;
FIG. 6 is a schematic diagram of a solder paste jet printing assembly according to the present invention;
fig. 7 is a schematic structural diagram of a product positioning tool according to the present invention.
1, a jet printing device is integrated; 2. a spray printing workbench; 3. an electrical cabinet; 4. an upper computer display; 5. an equipment rack and a housing; 6. a jet printing execution assembly; 7. installing a fixing plate; 8. an X-axis linear module; 9. product positioning tool; 10. an X-axis driving motor; 11. a module support; 12. a Y-axis linear module; 13. a Y-axis driving motor; 14. a signal wire chase; 15. a horizontal drag chain; 16. a Z-axis linear module fixing frame; 17. a Z-axis straight line module; 18. a Z-axis driving motor; 19. a vertical drag chain; 51. a housing upper shell; 52. an upper left door panel; 53. a left decorative shell; 54. a left lower door panel; 55. opposite opening door plates of the electrical cabinet; 56. a door plate is opened on the workbench; 57. structural steel frame; 58. fu Ma Lunzu; 59. an electrical component; 510. a right lower door panel; 511. a heat dissipation rear shell of the electrical cabinet; 512. an upper right door panel; 513. a right decorative shell; 514. a workbench rear shell; 591. an electrical mounting plate; 592. a switching power supply; 593. a motion control board; 594. a ground row; 595. a filter; 596. a solid state relay; 597. an air switch; 598. wiring grooves; 599. XZY motor drive set; 61. an execution component fixing plate; 62. a solder paste jet printing assembly; 63. an annular light source; 64. an annular light source connecting plate; 65. a CCD lens; 66. a CCD camera; 67. a CCD fixing plate; 68. an adjustable annular light source fixing plate; 621. a solder paste ejection valve body; 622. a valve body connecting plate; 623. a solder paste holder; 624. a solder paste heating ring; 625. a constant temperature heating source; 626. a solder paste nozzle; 627. a laser displacement sensor; 628. a laser displacement sensor fixing plate; 91. a linear guide rail group; 92. a tool mounting plate; 93. a positioning plate; 94. a limit bolt; 95. a tooling side plate; 96. and the spring pressing buckle component.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples:
referring to fig. 1 to 7, an embodiment of the present invention provides a precise solder paste spray printing apparatus for a printed circuit board, which is characterized by comprising: the spray printing device comprises a spray printing device whole 1, a spray printing workbench 2, an electrical cabinet 3, an upper computer display 4, a device rack and a shell 5;
the middle part fixedly connected with installation fixed plate 7 of the whole 1 of spray printing equipment, the top fixedly connected with of installation fixed plate 7 spouts seal workbench 2, the middle part of spouting seal workbench 2 has vertically set gradually X axle sharp module 8 and X axle driving motor 10, the rear side of spouting seal workbench 2 has transversely set gradually module support frame 11 and signal wire casing 14, fixedly connected with product location frock 9 on the slide of X axle sharp module 8, fixedly connected with Y axle sharp module 12 and Y axle driving motor 13 on the module support frame 11 in proper order, be provided with Z axle sharp module mount 16 on the slide of Y axle sharp module 12, the front end of Z axle sharp module mount 16 is perpendicular fixedly connected with Z axle sharp module 17 and Z axle driving motor 18 in proper order, the rear end of Z axle sharp module mount 16 is connected through horizontal drag chain 15 with signal wire casing 14 top, be provided with spout seal execution assembly 6 on the slide of Z axle sharp module 17, be connected through vertical drag chain 19 between the top of Z axle sharp module 16 and the fixed plate of spouting seal execution assembly 6.
The equipment rack and shell 5 is supported by a structural steel frame 57 and is provided with an upper computer host and a solder paste injection valve 621 controller, the upper rack shell 51 is arranged on the structural steel frame 57 and covers the injection printing workbench 2, an electrical component 59 is arranged on the right side of the structural steel frame 57, an electrical cabinet split door 55 is arranged at the front end and is convenient for checking and maintaining the electrical component 59, a heat dissipation rear shell 511 of the electrical cabinet is arranged at the rear end, an upper workbench door 56 is arranged at the front end of the upper rack shell 51, an equipment start-stop and emergency stop operation panel is arranged on the right side, a rear workbench shell 514 is arranged at the rear end, a left decoration shell 53 and a right decoration shell 513 are respectively arranged on the left side and the right side, a left upper door plate 52, a left lower door plate 54, a right upper door plate 512 and a right lower door plate 510 are respectively arranged on the left decoration shell 513, and the design door plate can be detachably established in a feeding and discharging production line relation with other equipment.
The electrical component 59 uses an electrical mounting board 591 as a base board, and core hardware includes a switching power supply 592, a motion control board card 593, a ground bar 594, a filter 595, a solid state relay 596, an air switch 597, a wiring slot 598 and an XYZ motor driver group 599, and the electrical component completes all motion control and power supply except for an upper computer and solder paste spray printing drive.
The actuating component fixing plate 61 of the spray printing actuating component 6 is fixed with the Z-axis linear motor sliding seat, the solder paste spray printing component 62 is arranged on the left side of the actuating component fixing plate 61 through the valve body connecting plate 622, the horizontal position is adjustable, and the CCD fixing plate 67 is arranged on the right side of the actuating component fixing plate 61, the vertical position is adjustable, so that the whole spray printing actuating component is driven to move in the Z-axis direction; the lower end of the CCD fixing plate 67 is provided with a CCD camera 66, the Z-axis direction is adjustable, the CCD camera is convenient to be matched with the solder paste spray printing assembly 62, and the left side mounting ring is provided with an adjustable light source fixing plate 68 for adjusting the Z-axis direction distance of the annular light source 64; a CCD lens 65 is arranged at the lower end of the CCD camera 66; the bottom of the adjustable annular light source fixing plate 68 is provided with an annular light source connecting plate 64, and the lower end of the annular light source connecting plate 64 is provided with an annular light source 63 in parallel.
The solder paste spray printing assembly 62 comprises a solder paste spray valve body 621, a solder paste heating ring 624 and a laser displacement sensor 627, wherein the solder paste spray valve body 621 is connected to a valve body connecting plate 622 through a rear end thread, and a solder paste nozzle 626 is arranged at the bottom for executing solder paste high-frequency spray; the solder paste heating ring 624 is connected to the solder paste fixing frame 623 through threads, and a constant temperature heating source 625 is vertically arranged at the front end for heating the solder paste to maintain the fluid property thereof; the laser displacement sensor 627 is fixed on the execution component fixing plate 61 through a laser displacement sensor fixing plate 628, and is used for detecting the vertical distance and avoiding collision with other hardware on the surface of a product in the processing process of the solder paste nozzle 626.
The product positioning tool 9 comprises a tool fixing plate 92, a linear guide rail group 91 and two positioning plates 93, wherein the side surfaces of the tool fixing plate 92 are provided with tool side plates 95, and the two sides of the tool fixing plate 92 are provided with linear guide rails 91 for the linear movement of the positioning plates 93 so as to position a processing area of a product to be processed; the linear guide rail 91 is provided with a positioning plate 93 and a limit screw 94 on the slide block, and the limit screw 94 is used for limiting the movement of the positioning plate; the spring pressing buckle assembly 96 is installed on the positioning plate, and the product to be processed is fixed through the spring pressing buckle assembly 96 so as to ensure the processing stability.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A precision solder paste spray printing device for a printed circuit board, comprising: the spray printing device comprises a spray printing device whole (1), a spray printing workbench (2), an electrical cabinet (3), an upper computer display (4) and a device rack and shell (5);
the middle part fixedly connected with installation fixed plate (7) of spouting whole (1) of seal equipment, the top fixedly connected with of installation fixed plate 7 spouts seal workstation (2), the middle part of spouting seal workstation (2) vertically has set gradually X axle sharp module (8) and X axle driving motor (10), the rear side of spouting seal workstation (2) transversely has set gradually module support frame (11) and signal wire casing (14), fixedly connected with product location frock (9) on the slide of X axle sharp module (8), fixedly connected with Y axle sharp module (12) and Y axle driving motor (13) on module support frame (11) in proper order, be provided with Z axle sharp module mount (16) on the slide of Y axle sharp module (12), the front end of Z axle sharp module mount (16) vertically has fixedly connected with Z axle sharp module (17) and Z axle driving motor (18) in proper order, the rear end and signal wire casing (14) top are connected through horizontal drag chain (15), Z axle sharp module (17) are carried out on the slide of Z axle sharp module (12) and are carried out sharp module (6) and are carried out perpendicular subassembly between the top of printing plate (6).
2. The precise solder paste spray printing device applied to the printed circuit board according to claim 1, wherein: the utility model discloses a device frame, including frame and shell (5), well lower part fixedly connected with structure steelframe (57), the top fixedly connected with frame epitheca (51) of structure steelframe (57), the right side of structure steelframe (57) is provided with electrical component (59), the front end of structure steelframe (57) is provided with regulator cubicle to opening door (55), the rear end of structure steelframe (57) is provided with regulator cubicle heat dissipation backshell (511), the front end fixedly connected with workstation epitheca (56) of frame epitheca (51), the right side fixedly connected with equipment of frame epitheca (51) opens and stops and scram operating panel, the rear end fixedly connected with workstation backshell (514) of frame epitheca (51), the left side and right side of frame epitheca (51) are fixedly connected with left side decoration shell (53) and right side decoration shell (513) respectively, be provided with upper left door plant (52), lower left door plant (54), upper right door plant (512) and lower right door plant (510) on the left side decoration shell 53 and right side.
3. The precise solder paste spray printing device applied to the printed circuit board according to claim 1, wherein: the electrical component (59) uses an electrical mounting board (591) as a bottom board, and the core hardware comprises a switching power supply (592), a motion control board card (593), a grounding row (594), a filter (595), a solid state relay (596), an air switch (597), a wiring groove (598) and an XYZ motor driver group (599).
4. The precise solder paste spray printing device applied to the printed circuit board according to claim 2, wherein: the device is characterized in that an execution assembly fixing plate (61) of the spray printing execution assembly (6) is fixed with a Z-axis linear motor sliding seat, a solder paste spray printing assembly (62) is installed on the left side of the execution assembly fixing plate (61) through a valve body connecting plate (622), a CCD fixing plate (67) is installed on the right side of the execution assembly fixing plate (61), the lower end of the CCD fixing plate (67) is fixedly connected with a CCD camera (66), the left side is fixedly connected with an adjustable light source fixing plate (68), the lower end of the CCD camera (66) is fixedly connected with a CCD lens (65), and an annular light source connecting plate (64) is arranged at the bottom of the adjustable annular light source fixing plate (68), and the lower end of the annular light source connecting plate (64) is fixedly connected with an annular light source (63).
5. The precise solder paste spray printing device applied to the printed circuit board according to claim 2, wherein: the solder paste spray printing assembly (62) comprises a solder paste spray valve body (621), a solder paste heating ring (624) and a laser displacement sensor (627), wherein the solder paste spray valve body (621) is connected to a valve body connecting plate (622) through rear end threads, a solder paste nozzle (626) is arranged at the bottom of the solder paste spray valve body (621), the solder paste heating ring (624) is connected with a solder paste fixing frame (623) through threads, a constant-temperature heating source (625) is vertically arranged at the front end of the solder paste heating ring (624), and the laser displacement sensor (627) is connected with an execution assembly fixing plate (61) through a laser displacement sensor fixing plate (628).
6. The precise solder paste spray printing device applied to the printed circuit board according to claim 1, wherein: product location frock (9) are including frock fixed plate (92), linear guide group (91), two locating plates (93), the side fixedly connected with frock curb plate (95) of frock fixed plate (92), the both sides fixedly connected with linear guide (91) of frock fixed plate (92), fixedly connected with locating plate (93) and limit screw (94) on the slider of linear guide (91), install spring on locating plate (93) and press buckle subassembly (96).
7. The precise solder paste spray printing device applied to the printed circuit board according to claim 1, wherein: an upper computer display (4) is arranged on the right side of the jet printing device whole (1).
CN202311120946.7A 2023-08-30 2023-08-30 Be applied to printed circuit board's accurate solder paste spray printing equipment Pending CN117177448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311120946.7A CN117177448A (en) 2023-08-30 2023-08-30 Be applied to printed circuit board's accurate solder paste spray printing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311120946.7A CN117177448A (en) 2023-08-30 2023-08-30 Be applied to printed circuit board's accurate solder paste spray printing equipment

Publications (1)

Publication Number Publication Date
CN117177448A true CN117177448A (en) 2023-12-05

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ID=88934870

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311120946.7A Pending CN117177448A (en) 2023-08-30 2023-08-30 Be applied to printed circuit board's accurate solder paste spray printing equipment

Country Status (1)

Country Link
CN (1) CN117177448A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117412517A (en) * 2023-12-14 2024-01-16 深圳市紫宸激光设备有限公司 Composite welding quality control method and system based on visual recognition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117412517A (en) * 2023-12-14 2024-01-16 深圳市紫宸激光设备有限公司 Composite welding quality control method and system based on visual recognition
CN117412517B (en) * 2023-12-14 2024-03-12 深圳市紫宸激光设备有限公司 Composite welding quality control method and system based on visual recognition

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