CN111136359B - Automatic fixed-point tin soldering method - Google Patents
Automatic fixed-point tin soldering method Download PDFInfo
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- CN111136359B CN111136359B CN202010006181.4A CN202010006181A CN111136359B CN 111136359 B CN111136359 B CN 111136359B CN 202010006181 A CN202010006181 A CN 202010006181A CN 111136359 B CN111136359 B CN 111136359B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an automatic fixed-point tin soldering method, which comprises the following steps: presetting a moving track of the welding mechanism in a welding disc and a coordinate value corresponding to the moving track; the moving track is that the position of the tin at the starting point and the position of the tin at the end point are straight lines in the bonding pad, and the position of the tin at the end point is higher than the position of the tin at the starting point; the welding mechanism moves downwards to the position above a bonding pad on the substrate, tin is started, and the welding mechanism moves to point tin at one side in the plane of the bonding pad, and after one movement is completed; determining the deviation between the current moving target coordinate and the actual coordinate on the moving track, and interpolating the moving track by a linear interpolation method according to the deviation until the position of finishing tin melting is reached; stopping tin dispensing after the welding mechanism rises by a height A, and completing tin dispensing of the bonding pad; the method provided by the invention has the advantages of accurate alignment, automatic tin soldering and good welding effect.
Description
Technical Field
The invention relates to the technical field of mini LED lamp production, in particular to an automatic fixed-point tin soldering method.
Background
The LED (i.e. light emitting diode) has the advantages of high efficiency, energy saving, environmental protection, etc., wherein, the variety of the LED is also quite various, including SMD LED, COB, flip-chip LED, etc., with the development of LED technology, people have smaller and smaller requirements for the size of the LED, and in recent years, with the advent of mini LED, the volume of the LED is smaller, and the LED can be applied to the backlight of a large-size display screen. The mini LED can be matched with a flexible substrate to achieve a high-curved-surface backlight mode, a local dimming design is adopted, better color rendering is achieved, a liquid crystal panel can be provided with a finer HDR partition, the thickness of the mini LED is close to that of an OLED, and therefore more and more manufacturers apply the mini LED to products such as mobile phones, televisions, vehicle panels, electronic competition notebook computers and the like so as to pursue backlight sources such as power saving, thinning, HDR and special-shaped displays.
Among the prior art, the welding between the LED chip to mini LED and the base plate is generally through steel mesh printing one deck tin on the pad of base plate, then fix LED chip and base plate, but this kind of mode, can't ensure when utilizing steel mesh brush tin cream that the tin keeps thickness accurate, and the tin of brushing also can't ensure the shaping meet the requirements on the pad, tin on general pad pursues protruding form as far as possible better, because protruding form makes tin bottom and base plate fully contact, the high both sides low setting in the middle of simultaneously makes to press for LED chip and places tin when protruding form tin and spills over from both sides, thereby ensure the reliability of connecting consequently, how can be fast high-efficient and carry out the accurate positioning to the circuit board soldering tin position of LED lamp and become the problem that needs to solve.
Disclosure of Invention
The invention provides an automatic tin soldering method which is accurate in alignment and good in tin forming effect.
To achieve the above object, a method for automatic fixed-point soldering,
the method comprises the following steps of carrying out tin soldering on a substrate through a welding device, wherein the substrate comprises more than two welding pads, the welding device comprises a welding mechanism and a moving mechanism, and the tin soldering method comprises the following steps:
1): presetting a moving track of the welding mechanism in a welding disc and a coordinate value corresponding to the moving track; the moving track is that the position of the tin at the starting point and the position of the tin at the end point are straight lines in the bonding pad, and the position of the tin at the end point is higher than the position of the tin at the starting point;
2): the welding mechanism moves downwards to the position above a bonding pad on the substrate, tin is started, and the welding mechanism moves to point tin at one side in the plane of the bonding pad, and after one movement is completed;
3): determining the deviation between the current moving target coordinate and the actual coordinate on the moving track, and interpolating the moving track by a linear interpolation method according to the deviation until the position of finishing tin melting is reached;
4) stopping tin dispensing after the welding mechanism rises by a height A, and completing tin dispensing of the bonding pad;
5) judging whether the soldering of all the bonding pads on the substrate is finished or not, and if so, ending the process; if not, go to step 2).
According to the method, through the preset moving track of the welding mechanism in the pad, the deviation value between the actual walking path and the target path is calculated at each moving step, linear interpolation is carried out according to the deviation value, so that more points on the linear walking path are obtained, the walking path of the welding mechanism in the pad is more accurate, the welding mechanism is lifted upwards when spot welding is finished, and the phenomenon that tin is pulled at the tail part due to the fact that tin stops suddenly is prevented, and further the liquid tin is not accurately formed, and the electric connection is not reliable.
Further, the step 3) of determining the deviation between the current moving target coordinate and the actual coordinate on the moving track, and interpolating the moving track by a linear interpolation method according to the deviation specifically includes the following steps: 3.1) initializing the deviation F and the step number E, and obtaining the coordinate value of the initial point on the moving track;
3.2): judging the deviation value;
3.3): judging the trend in the rectangular coordinate system; determining coordinate feed;
3.4): calculating a deviation value F;
3.5): judging whether the step number E is 0 or not, wherein the step number E is E-1;
3.6): if the step number E is 0, entering the step 4), and if the step number E is not 0, entering the step 3.3);
according to the method, the deviation calculated each time in the linear interpolation algorithm is brought into the next deviation calculation, so that the deviation values can be accumulated, and the accuracy of the whole track is ensured.
Further, the step 3.2) of judging the deviation value specifically includes: judgment of FiWhether more than or equal to 0 is true or not;
judging the trend in the rectangular coordinate system in the step 3.3); determining the coordinate feed specifically includes: if the end point coordinates (X, Y) are within the first quadrant, then FiMore than or equal to 0, and the coordinate supply is Y; if Fi<0, then the coordinate supply is X; if the end point coordinates (X, Y) are in the second quadrant, then FiMore than or equal to 0, and the coordinate supply is Y; if Fi<0, then the coordinate is given as-X; if the end point coordinate (X, Y) is in the third quadrant, then FiNot less than 0, coordinate supply is-Y; if Fi<0, then the coordinate is given as-X; if the end point coordinate (X, Y) is within the fourth quadrant, then FiNot less than 0, coordinate supply is-Y; if Fi<0, then the coordinate supply is X;
the calculating of the deviation value F in step 3.4) specifically includes: if Fi≥0，F＝Fi-Y; if Fi<0, then F ═ Fi+ X, above method, according toAnd adjusting the deviation value by the coordinate of the end point in the same quadrant, so that the final track point falls on the connecting line of the target point and the starting point.
Furthermore, the welding mechanism also comprises a shell, a lifting mechanism, a welding head and a tin melting device, the base plate is arranged in the shell, the welding head is arranged above the base plate, the moving mechanism comprises a moving member and a moving frame, one end of the moving member is connected with the moving frame, the other end of the moving member is arranged on the shell in a sliding mode, a through hole is formed in the moving frame, one end of the lifting mechanism penetrates through the through hole to be connected with the tin melting device, and the other end of the tin melting device is communicated with the welding head and is positioned above the base plate; in the above, the movement of the welding head in the X-axis and Y-axis directions is realized by providing the moving mechanism on the housing, and the raising and lowering of the welding head is realized by the lifting mechanism.
Furthermore, the pad of the substrate is provided with a starting mark, so that the initial spot welding position of the pad on the substrate can be identified.
Furthermore, the moving mechanism also comprises a moving driving device, the moving part comprises an X-axis moving part and a Y-axis moving part, the moving driving device comprises a moving motor and a moving lead screw, the moving motor comprises an X-axis moving motor and a Y-axis moving motor, the moving lead screw comprises an X-axis moving lead screw and a Y-axis moving lead screw, the X-axis moving motor is fixed on the shell, the output end of the X-axis moving motor is connected with the X-axis lead screw, the X-axis is provided with a first through hole matched with the X-axis lead screw, one end of the X-axis moving part is provided with a first sliding block, the shell is provided with a first sliding groove matched with the first sliding block of the X-axis moving part, the X-axis moving part of the Y-axis moving motor is connected with the Y-axis lead screw, the Y-axis moving part is provided with a second through hole matched with the Y-axis lead screw, one end of the Y-axis moving part is provided with a second sliding block, be equipped with the second slider assorted second spout of Y axle moving member on the X axle moving member, above, through X axle motor drive X axle screw motion drive X axle moving member and carry out X axle direction on the casing and remove, through Y motor drive Y axle screw motion drive Y axle moving member and carry out Y axle on X axle moving member and remove, simple structure and reliable.
Drawings
Fig. 1 is a flow chart of a method for automatic spot soldering according to the present invention.
Fig. 2 is a schematic diagram of the movement of the welding structure according to the present invention.
Fig. 3 is a schematic view of the connection between the moving mechanism and the housing according to the present invention.
FIG. 4 is a schematic diagram of the linear interpolation method in the first quadrant according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-4, a method for automatically fixing a solder point, a substrate 5 is soldered by a soldering device, the substrate 5 includes two or more pads 4, the soldering device includes a soldering mechanism and a moving mechanism 2, the soldering mechanism includes a housing 1, a lifting mechanism 6, a soldering head 32 and a tin melting device 31, the substrate 4 is disposed in the housing 1, the soldering head 31 is disposed above the substrate 5, the moving mechanism 2 includes a moving member 21 and a moving frame 22, one end of the moving member 21 is connected to the moving frame 22, the other end of the moving member 22 is slidably disposed on the housing 1, the moving frame 22 is provided with a through hole, one end of the lifting mechanism 6 passes through the through hole to be connected to the tin melting device 31, and the other end of the tin melting device 31 is communicated with the soldering head 32 and is located above the substrate 5; in this embodiment, the tin melting device 31 has a cylindrical structure, and the tin melting device 31 stores molten tin therein.
The pad of the substrate is provided with a start mark (not shown in the figure), which can improve the initial spot welding position of the pad on the identification substrate.
In this embodiment, the moving mechanism 6 further includes a moving driving device, the moving member includes an X-axis moving member 631 and a Y-axis moving member 632, the moving driving device includes a moving motor and a moving screw rod, the moving motor includes an X-axis moving motor 611 and a Y-axis moving motor 612, the moving screw rod includes an X-axis moving screw rod 621 and a Y-axis moving screw rod 622, the X-axis moving motor 611 is fixed on the housing 1, an output end of the X-axis moving motor 611 is connected to the X-axis screw rod 621, a first through hole matched with the X-axis screw rod 621 is provided on the X-axis moving member 631, a first sliding block is provided at one end of the X-axis moving member 631, a first sliding slot 641 matched with the first sliding block of the X-axis moving member 631 is provided on the housing 1, the Y-axis moving motor 611 is fixed on the X-axis moving member 631, an output end of the Y-axis moving motor 611 is connected to the Y-axis screw rod 622, a second through hole matched with the Y-axis screw rod 622 is provided on the Y-axis moving member 632, one end of the Y-axis moving member 632 is provided with a second sliding block, the X-axis moving member 631 is provided with a second sliding block matched with a second sliding chute 642 of the Y-axis moving member 632, the X-axis motor drives the X-axis lead screw to move to drive the X-axis moving member to move in the X-axis direction on the shell, and the Y-axis motor drives the Y-axis lead screw to move to drive the Y-axis moving member to move in the Y-axis direction on the X-axis moving member.
In this embodiment, the lifting mechanism includes a lifting motor, and the output end of the lifting motor passes through the moving member and is connected with the tin melting device 31.
The tin soldering method comprises the following steps:
1): presetting a moving track of the welding mechanism in a bonding pad 4 and a coordinate value corresponding to the moving track; the moving track is that the position B of the tin at the starting point and the position C1 of the tin at the end point are straight lines in the pad, and the position of the tin at the end point is higher than that of the tin at the starting point;
2): the welding mechanism moves downwards to the position above a bonding pad on the substrate 5, tin is started, and the welding mechanism moves to one side in the plane of the bonding pad 4 to perform tin point, and after one movement is completed;
3): determining the deviation between the current moving target coordinate C1 and the actual coordinate C2 on the moving track, and interpolating the moving track by a linear interpolation method according to the deviation until the position of finishing tin melting is reached;
4) stopping tin dispensing after the welding mechanism rises by a height A, and completing tin dispensing of the bonding pad; the height of A in this example is 8-10 mm.
5) Judging whether the soldering of all the bonding pads on the substrate is finished or not, and if so, ending the process; if not, go to step 2).
In this embodiment, the determining, in step 3), a deviation between a current moving target coordinate and an actual coordinate on a moving track, and interpolating the moving track by a linear interpolation method according to the deviation specifically includes the following steps: 3.1) initializing the deviation F and the step number E, and obtaining the coordinate value of the initial point on the moving track; f is 0;
3.2): judging the deviation value;
3.3): judging the trend in the rectangular coordinate system; determining coordinate feed;
3.4): calculating a deviation value F;
3.5): judging whether the step number E is 0 or not, wherein the step number E is E-1;
3.6): if the number of steps E is 0, step 4) is entered, and if the number of steps E is not 0, step 3.3) is entered.
In this embodiment, the amount of tin required on the bonding pad is (number of steps E +2) × the amount of tin discharged each time; the amount of tin produced at each time can be determined.
In this embodiment, as shown in fig. 4, the step 3.2) of determining the deviation value specifically includes: judgment of FiWhether more than or equal to 0 is true or not;
judging the trend in the rectangular coordinate system in the step 3.3); determining the coordinate feed specifically includes: if the end point coordinates (X, Y) are within the first quadrant, then FiMore than or equal to 0, and the coordinate supply is Y; if Fi<0, then the coordinate supply is X; if the end point coordinates (X, Y) are in the second quadrant, then FiMore than or equal to 0, and the coordinate supply is Y; if Fi<0, then the coordinate is given as-X; if the end point coordinate (X, Y) is in the third quadrant, then FiNot less than 0, coordinate supply is-Y; if Fi<0, then the coordinate is given as-X; if the end point coordinate (X, Y) is within the fourth quadrant, then FiNot less than 0, coordinate supply is-Y; if Fi<0, then the coordinate supply is X; wherein the values of Y and X are coordinate values of the terminal point coordinate;
the calculating of the deviation value F in step 3.4) specifically includes: if Fi≥0，F＝Fi-Y; if Fi<0, then F ═ Fi+ X. The working principle of the linear interpolation algorithm in this embodiment is the prior art, and will not be described here.
And adjusting the deviation value according to the terminal point coordinates of different quadrants, so that the final track point falls on the connecting line of the target point and the starting point.
According to the method, through the preset moving track of the welding mechanism in the pad 4, the deviation value between the actual walking path and the target path is calculated at each moving step, linear interpolation is carried out according to the deviation value, so that more points on the linear walking path are obtained, the walking path of the welding mechanism in the pad 4 is ensured to be more accurate, and the welding mechanism is lifted upwards when spot welding is finished, so that the situation that tin is pulled at the tail part due to the fact that tin stops suddenly is prevented, and further the liquid tin is not accurately formed, and the electric connection is not reliable.
Claims (4)
1. An automatic fixed-point tin soldering method is characterized in that: the method comprises the following steps of carrying out tin soldering on a substrate through a welding device, wherein the substrate comprises more than two welding pads, the welding device comprises a welding mechanism and a moving mechanism, and the tin soldering method comprises the following steps:
1): presetting a moving track of the welding mechanism in a welding disc and a coordinate value corresponding to the moving track; the moving track is that the position of the tin at the starting point and the position of the tin at the end point are straight lines in the bonding pad, and the position of the tin at the end point is higher than the position of the tin at the starting point;
2): the welding mechanism moves downwards to the position above a bonding pad on the substrate, tin is started, and the welding mechanism moves one side to perform tin point in the plane of the bonding pad, and after one movement is completed;
3): determining the deviation between the current moving target coordinate and the actual coordinate on the moving track, and interpolating the moving track by a linear interpolation method according to the deviation until the position of finishing tin melting is reached;
3.1) initializing the deviation F and the step number E, and obtaining the coordinate value of the initial point on the moving track;
3.2): judging the deviation value; judgment of FiWhether more than or equal to 0 is true or not;
3.3): judging the trend in the rectangular coordinate system; determining the coordinate feed specifically includes:
if the end point coordinates (X, Y) are within the first quadrant, then FiNot less than 0, and the coordinate supply is X; if Fi<0, then the coordinate supply is Y; if the end point coordinates (X, Y) are in the second quadrant, then FiNot less than 0, coordinate supply is-X; if Fi<0, then the coordinate supply is Y; if the end point coordinate (X, Y) is in the third quadrant, then FiNot less than 0, coordinate supply is-X; if Fi<0, then the coordinate is given as-Y; if the end point coordinate (X, Y) is within the fourth quadrant, then FiNot less than 0, and the coordinate supply is X; if Fi<0, then the coordinate is given as-Y; determining coordinate feed;
3.4): calculating a deviation value F; if Fi≥0，F=Fi-Y; if Fi<0, then F = Fi+X；
3.5): step number E = E-1, and judging whether the step number E is 0;
3.6): if the step number E is 0, entering the step 4), and if the step number E is not 0, entering the step 3.3);
4) stopping tin dispensing after the welding mechanism rises by a height A, and completing tin dispensing of the bonding pad; the height of A is 8-10 mm;
5) judging whether the soldering of all the bonding pads on the substrate is finished or not, and if so, ending the process; if not, go to step 2).
2. The method of claim 1, wherein the step of automatically pointing solder comprises: the welding mechanism further comprises a shell, a lifting mechanism, a welding head and a tin melting device, the base plate is arranged in the shell, the welding head is arranged above the base plate, the moving mechanism comprises a moving member and a moving frame, one end of the moving member is connected with the moving frame, the other end of the moving member is arranged on the shell in a sliding mode, a through hole is formed in the moving frame, one end of the lifting mechanism penetrates through the through hole to be connected with the tin melting device, and the other end of the tin melting device is communicated with the welding head and located above the base plate.
3. The method of claim 1, wherein the step of automatically pointing solder comprises: and a starting mark is arranged on the bonding pad of the substrate.
4. The method of claim 3, wherein the step of automatically pointing solder comprises: the moving mechanism further comprises a moving driving device, the moving member comprises an X-axis moving member and a Y-axis moving member, the moving driving device comprises a moving motor and a moving lead screw, the moving motor comprises an X-axis moving motor and a Y-axis moving motor, the moving lead screw comprises an X-axis moving lead screw and a Y-axis moving lead screw, the X-axis moving motor is fixed on the shell, the output end of the X-axis moving motor is connected with the X-axis lead screw, a first through hole matched with the X-axis lead screw is formed in the X-axis moving member, a first sliding block is arranged at one end of the X-axis moving member, a first sliding block matched with a first sliding chute of the X-axis moving member is formed in the shell, the X-axis moving motor is arranged on the X-axis moving member, the output end of the Y-axis moving motor is connected with the Y-axis lead screw, a second through hole matched with the Y-axis lead screw is formed in the Y-axis moving member, a second sliding block is arranged at one end of the Y-axis moving member, and a second sliding block matched with the Y-axis moving member is arranged on the X-axis moving member.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010006181.4A CN111136359B (en) | 2020-01-03 | 2020-01-03 | Automatic fixed-point tin soldering method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010006181.4A CN111136359B (en) | 2020-01-03 | 2020-01-03 | Automatic fixed-point tin soldering method |
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| CN111136359A CN111136359A (en) | 2020-05-12 |
| CN111136359B true CN111136359B (en) | 2022-05-13 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150077277A (en) * | 2013-12-27 | 2015-07-07 | 자노메 미싱 고교가부시키가이샤 | Robot, robot control method and robot control program |
| CN205110995U (en) * | 2015-09-23 | 2016-03-30 | 武汉比天科技有限责任公司 | Planer -type vision -guided is from moving point tin laser welding equipment |
| CN205869644U (en) * | 2016-07-26 | 2017-01-11 | 河源思比电子有限公司 | Full -automatic video counterpoint laser soldering tin machine |
| CN106392242A (en) * | 2016-12-02 | 2017-02-15 | 无锡职业技术学院 | High-precision ultramicro dispensing system |
| CN206794968U (en) * | 2016-09-27 | 2017-12-26 | 武汉锐泽科技发展有限公司 | Integral type laser soldering apparatus |
| CN109732252A (en) * | 2019-01-31 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | A kind of optimization method in robot welding path |
| CN209062325U (en) * | 2018-11-15 | 2019-07-05 | 江西江铃专用车辆厂有限公司 | A kind of arc welding robot welding gun device for accurately determining |
-
2020
- 2020-01-03 CN CN202010006181.4A patent/CN111136359B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150077277A (en) * | 2013-12-27 | 2015-07-07 | 자노메 미싱 고교가부시키가이샤 | Robot, robot control method and robot control program |
| CN205110995U (en) * | 2015-09-23 | 2016-03-30 | 武汉比天科技有限责任公司 | Planer -type vision -guided is from moving point tin laser welding equipment |
| CN205869644U (en) * | 2016-07-26 | 2017-01-11 | 河源思比电子有限公司 | Full -automatic video counterpoint laser soldering tin machine |
| CN206794968U (en) * | 2016-09-27 | 2017-12-26 | 武汉锐泽科技发展有限公司 | Integral type laser soldering apparatus |
| CN106392242A (en) * | 2016-12-02 | 2017-02-15 | 无锡职业技术学院 | High-precision ultramicro dispensing system |
| CN209062325U (en) * | 2018-11-15 | 2019-07-05 | 江西江铃专用车辆厂有限公司 | A kind of arc welding robot welding gun device for accurately determining |
| CN109732252A (en) * | 2019-01-31 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | A kind of optimization method in robot welding path |
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