CN213483370U

CN213483370U - Single-point light-emitting chip repair machine for flip LED light-emitting unit

Info

Publication number: CN213483370U
Application number: CN202021298343.8U
Authority: CN
Inventors: 马新峰; 段健楠; 况朝清; 韩悦
Original assignee: Changchun Xi Long Display Technology Co ltd
Current assignee: Changchun Xi Long Display Technology Co ltd
Priority date: 2020-07-06
Filing date: 2020-07-06
Publication date: 2021-06-18
Anticipated expiration: 2030-07-06

Abstract

The utility model relates to a repair machine for a single-point luminous chip of an inverted LED luminous unit, which comprises a die bonder, a welding assembly, a test lighting tool and a pixel point identification system; the test lighting tool is arranged on a workpiece table of the die bonder and comprises a tool base, a test core card and a drive IC (integrated circuit); the test core card is electrically connected with the drive IC, and the test core card and the drive IC are fixedly arranged on the tool base; the pixel point identification system comprises a camera, a computer host and a display screen; the camera is installed above the workpiece table and is connected with the computer host through the transmission cable, and the computer host is connected with the display screen. The utility model discloses reduced and reprocessed the degree of difficulty in the flip-chip LED production process, promoted maintenance efficiency.

Description

Single-point light-emitting chip repair machine for flip LED light-emitting unit

Technical Field

The utility model belongs to the technical field of the LED display screen, a flip-chip LED luminescence unit single-point light emitting chip reprocesses machine is related to.

Background

The flip LED chip is applied in a wide range at present, and the technical development is rapid in the field of high-density integrated packaging COB small-spacing LED display screens. In the production process of the inverted LED display screen, due to the fact that the number of pixel points is large, the size of an LED light-emitting chip is small, and the maintenance of the pixel points in the process is difficult.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a machine is reprocessed to flip-chip LED luminescence unit single-point luminescence chip.

In order to solve the problems, the utility model discloses a flip-chip LED luminous unit single-point luminous chip repair machine, which comprises a die bonder, a welding assembly, a test lighting tool 4 and a pixel point identification system; the test lighting fixture 4 is arranged on a workpiece table 22 of the die bonder and comprises a fixture base 41, a test core card 43 and a drive IC 44; the test core card 43 is electrically connected with the driving IC44, and the test core card 43 and the driving IC44 are fixedly installed on the tool base 41; the pixel point identification system comprises a camera, a computer host and a display screen; the camera is installed above the workpiece table 22 and is connected with a computer host through a transmission cable, and the computer host is connected with a display screen.

The welding assembly comprises a temperature control device 31 and a hot air gun 32; the control end of the temperature control device 31 is connected with a temperature control drive board of a hot air gun 32, and the hot air gun is arranged right in front of a die bonding recognition system of the die bonder.

The welding assembly further includes a cantilever 33; one end of the cantilever 33 is mounted on the main structure of the die bonder, and the other end of the cantilever 33 is mounted with the hot air gun 32.

The test lighting tool 4 further comprises an upper cover 42; one side of the upper cover 42 is connected with the tool base 41 through a hinge, and the upper cover 42 has a transparent window.

The test lighting tool 4 further comprises a power connector 45 and a power line 46; the power connector 45 is connected to the power interface of the test core card 43 via a power line 46.

The test lighting tool 4 further comprises a circuit board adapter 47 and a signal wire 48; the signal lines 48 are connected to the test terminals of the test core card 43 through the circuit board adapter 47.

The utility model discloses can solve the maintenance that uses the integrated COB of flip-chip LED production encapsulation unit in-process pixel became invalid in the production process, including the position location of waiting to repair the point, the pixel of waiting to repair the point is reprocessed. The single pixel point die bonding and the single pixel point welding in the repair process can be realized, the repair difficulty in the flip LED production process is reduced, and the maintenance efficiency is improved.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

FIG. 1a is a schematic front view of a circuit board to be repaired; fig. 1b is a partial enlarged view of portion a of fig. 1 a.

Fig. 2 is a top view of a flip-chip LED repair machine.

Fig. 3 is a left side view of the flip-chip LED repair machine.

Fig. 4 is a right side view of the flip-chip LED repair machine.

Fig. 5 is a perspective view of the lighting test fixture.

Fig. 6 is a block diagram of a pixel point identification system.

1. A circuit board to be repaired; 11. a blue LED light-emitting chip to be repaired; 12. a green LED light-emitting chip to be repaired; 13. a red LED light-emitting chip to be repaired; 2. a die bonder; 21. a wafer stage; 22. a workpiece stage; 23. dispensing an adhesive arm; 24. dispensing a glue disc; 25. fixing a crystal and swinging the arm; 26. a die bonding optical system; 27. a suction nozzle assembly; 31. a temperature control device; 32. a hot air gun; 33. a cantilever; 4. testing and lighting the tool; 41. a tooling base; 42. an upper cover; 43. testing the core card; 44. a driver IC; 45. a power supply connector; 46. a power line; 47. a circuit board adapter; 48. a signal line; 49. and (6) testing the button.

Detailed Description

In order to make the technical problem, technical scheme and effect that the utility model solved present clearer, it is right to combine the attached drawing and implement the example below the utility model discloses further detailed description proceeds. It should be understood that the embodiments described herein are exemplary and are intended to be illustrative of the invention, but not limiting.

As shown in fig. 2, 3 and 4, the utility model discloses a flip-chip LED luminescence unit single-point luminescence chip reprocesses machine is including solid brilliant machine, welding assembly, and frock and pixel point identification system are lighted in the test.

The die bonder adopts a traditional die bonder structure and comprises a wafer table 21, a workpiece table 22, a die bonder component, a die bonder optical system 26, a die bonder identification system and a suction nozzle component 27; the die bonding component comprises; a dispensing arm 23, a dispensing disc 24 and a die bonding swing arm 25.

The welding assembly comprises; a temperature control device 31 and a heat gun 32; the temperature control device 31 adopts the existing welding table detaching device, and the control end of the temperature control device is connected with a temperature control drive plate of the hot air gun 32; the temperature control device 31 is connected with a temperature control drive card of the die bonder; the cantilever 33 is provided with a hot air gun 32, the hot air gun is arranged right in front of the die bonder identification system, and the other side of the cantilever 33 is arranged on the main structure of the die bonder.

As shown in fig. 5, the test lighting fixture 4 is disposed on the workpiece stage 22 of the die bonder, and includes a fixture base 41, an upper cover 42, a test core card 43, a driver IC44, a power connector 45, a power line 46, a circuit board adapter 47, a signal line 48, and a test button 49; one side of the upper cover 42 is connected with the tool base 41 through a hinge, and the upper cover 42 is provided with a transparent window; the test core card 43 is electrically connected to the driver IC44, and the test core card 43 and the driver IC44 are fixedly mounted on the tooling base 41. The structure of the test core card 43 and the connection mode of the test core card with the drive IC44 are the same as those of a drive hub adapter plate of the existing LED display drive circuit and the connection mode of the test core card with the drive IC; the power connector 45 is connected with a power interface of the test core card 43 through a power line 46, and the test button 49 is installed on the tool base 41 and used for switching on and off of a signal line 48 so as to realize display color self-checking control; the signal lines 48 are connected to the test terminals of the test core card 43 through the circuit board adapter 47, and are used for transmitting row and column output and color output signals.

As shown in fig. 6, the pixel point identification system includes a camera, a computer host and a display screen; the camera is installed above the workpiece table and is connected with the computer host through the transmission cable, and the computer host is connected with the display screen.

When the device works, a circuit board to be repaired is placed on the tool base and connected with the test core card, and then the upper cover is closed; and adsorbing the test lighting tool on a workpiece table of the die bonder through a suction nozzle assembly, starting the test lighting tool, and driving a pixel matrix on the circuit board to be repaired to be lighted by the drive IC and the test core card so as to display a single color. Inputting a pixel matrix image acquired by a camera into a computer host and displaying the pixel matrix image on a display screen; after the position of the failed LED light-emitting chip is observed, the workpiece platform is controlled to carry a test lighting tool to move, so that the position of the failed LED light-emitting chip is positioned below the hot air gun; and starting the temperature control equipment and the hot air gun to preheat the failure position of the pixel to be repaired according to the temperature and the preheating time set by the temperature control equipment. After the preheating is finished, the workbench carries the test lighting tool to move so that the position of the failed LED light-emitting chip is in a die bonding position; a dispensing arm in the die bonding assembly dips solder paste from a dispensing disc, the solder paste is dispensed to a die bonding pad, and then a die bonding swing arm absorbs the LED light-emitting chips with corresponding colors from a wafer table and dies the LED light-emitting chips to the position of the failed LED light-emitting chip; and finally, carrying a test lighting tool on the workbench to move, enabling the replaced LED light-emitting chip to be located below the hot air gun, and starting the temperature control equipment and the hot air gun to enable the hot air gun to carry out wire bonding connection according to the preset hot air temperature and welding time to finish the repair of the single-point LED light-emitting chip.

Claims

1. A single-point light-emitting chip repair machine for an inverted LED light-emitting unit is characterized by comprising a die bonder, a welding assembly, a test lighting tool (4) and a pixel point identification system; the test lighting tool (4) is arranged on a workpiece table (22) of the die bonder and comprises a tool base (41), a test core card (43) and a drive IC (44); the test core card (43) is electrically connected with the drive IC (44), and the test core card (43) and the drive IC (44) are fixedly arranged on the tool base (41); the pixel point identification system comprises a camera, a computer host and a display screen; the camera is installed above the workpiece table (22) and is connected with a computer host through a transmission cable, and the computer host is connected with the display screen.

2. The flip LED lighting unit single point light emitting chip rework machine of claim 1, characterized in that said soldering assembly comprises a temperature control device (31) and a heat gun (32); the control end of the temperature control device (31) is connected with a temperature control drive plate of a hot air gun (32), and the hot air gun is arranged right in front of a die bonding recognition system of the die bonder.

3. The flip LED light unit single point light emitting chip rework machine of claim 2, characterized in that said bonding assembly further comprises a cantilever (33); one end of the cantilever (33) is arranged on the main body structure of the die bonder, and the other end of the cantilever (33) is provided with a hot air gun (32).

4. The single-point light-emitting chip repair machine for the flip LED light-emitting unit according to claim 1, wherein the test lighting fixture (4) further comprises an upper cover (42); one side of the upper cover (42) is connected with the tool base (41) through a hinge, and the upper cover (42) is provided with a transparent window.

5. The single-point light-emitting chip repair machine for the flip LED light-emitting unit according to claim 4, wherein the test lighting tool (4) further comprises a power connector (45) and a power line (46); the power connector (45) is connected with a power interface of the test core card (43) through a power line (46).

6. The single-point light-emitting chip repair machine for the flip LED light-emitting unit according to claim 5, wherein the test lighting fixture (4) further comprises a circuit board adapter (47) and a signal wire (48); the signal line (48) is connected to a test terminal of the test core card (43) through a circuit board adapter (47).