JPH08162502A - Electronic part mounter - Google Patents

Electronic part mounter

Info

Publication number
JPH08162502A
JPH08162502A JP6299530A JP29953094A JPH08162502A JP H08162502 A JPH08162502 A JP H08162502A JP 6299530 A JP6299530 A JP 6299530A JP 29953094 A JP29953094 A JP 29953094A JP H08162502 A JPH08162502 A JP H08162502A
Authority
JP
Japan
Prior art keywords
mounting
flip chip
substrate
delivery
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6299530A
Other languages
Japanese (ja)
Other versions
JP3152091B2 (en
Inventor
Yasuto Onizuka
安登 鬼塚
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP29953094A priority Critical patent/JP3152091B2/en
Publication of JPH08162502A publication Critical patent/JPH08162502A/en
Application granted granted Critical
Publication of JP3152091B2 publication Critical patent/JP3152091B2/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17873800&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH08162502(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To provide an electronic part mounter which shortens the work time required for mounting of a flip chip. CONSTITUTION: An electronic part mounter has a board positioning part E, which positions a board 3, a part supply part A, which holds a flip chip 1 face- down, a deliver means G, which receives the flip chip 1 face-down from the part supply part A and delivers it to a mounting means H, and a mounting means H which mounts the flip chip face-down receiving it from the deliver means G, on the board 3 positioned in the board positioning part E.

Description

【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、フリップチップを基板
に自動実装する電子部品実装装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for automatically mounting a flip chip on a substrate.
【0002】[0002]
【従来の技術】電子部品の一種として、ダイに半田など
からなるバンプ(突出電極)を突設したフリップチップ
が知られている。ここで本出願人は先にフリップチップ
を自動的に基板に実装できる電子部品実装装置を提案し
た(特開平2−56946号公報)。次に図5を参照し
ながらこの従来の電子部品実装装置について説明する。
図5中、Aはフリップチップ1をそのバンプ2が上を向
く姿勢(以下フェイスアップという)でストックする部
品供給部、Bは位置決めされた基板3にバンプ2が下を
向く姿勢(以下フェイスダウンという)でフリップチッ
プ1を実装する実装部である。ここで、フリップチップ
1はそのバンプ2が基板3に形成された回路パターンに
電気的に接続されるようにするため、フェイスダウンの
状態で実装を行う必要がある。
2. Description of the Related Art A flip chip in which bumps (protruding electrodes) made of solder or the like are provided on a die is known as a type of electronic component. Here, the present applicant previously proposed an electronic component mounting apparatus capable of automatically mounting a flip chip on a substrate (Japanese Patent Laid-Open No. 2-56946). Next, this conventional electronic component mounting apparatus will be described with reference to FIG.
In FIG. 5, A is a component supply unit that stocks the flip chip 1 with its bumps 2 facing upward (hereinafter referred to as face-up), and B is a position with the bumps 2 facing downward on the positioned substrate 3 (hereinafter referred to as face-down). It is a mounting unit for mounting the flip chip 1. Here, in order to electrically connect the bumps 2 to the circuit patterns formed on the substrate 3, the flip chip 1 needs to be mounted face down.
【0003】[0003]
【発明が解決しようとする課題】ところで従来の電子部
品実装装置では、部品供給部Aにおいてフェイスアップ
の状態でフリップチップ1をストックしていたので、部
品供給部Aと実装部Bとの間に、フリップチップ1をフ
ェイスアップの状態からフェイスダウンの状態に反転さ
せる反転装置Cを設けていた。より具体的には先端部に
フリップチップ1を保持する保持ヘッド4が設けられた
アーム5をモータMを駆動して矢印N1方向に回転させ
ることにより、フリップチップ1の反転を行っていた。
By the way, in the conventional electronic component mounting apparatus, since the flip chip 1 is stocked in the component supply section A in a face-up state, it is placed between the component supply section A and the mounting section B. A flip device C for flipping the flip chip 1 from the face-up state to the face-down state is provided. More specifically, the flip chip 1 is inverted by driving the motor M to rotate the arm 5 having the holding head 4 for holding the flip chip 1 at the tip thereof in the direction of the arrow N1.
【0004】しかしながら、このような構成では、フリ
ップチップの反転に要する時間が不可欠となり、実装動
作全体のタクトタイムが長くなるという問題点があっ
た。
However, in such a structure, the time required for flip chip inversion becomes indispensable, and there is a problem that the takt time of the entire mounting operation becomes long.
【0005】そこで本発明は、フリップチップをより短
い時間で実装できる電子部品実装装置を提供することを
目的とする。
Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of mounting a flip chip in a shorter time.
【0006】[0006]
【課題を解決するための手段】本発明の電子部品実装装
置は、基板を位置決めする基板位置決め部と、フリップ
チップをフェイスダウンの状態で保持する部品供給部
と、部品供給部からフリップチップをフェイスダウンの
状態で受取り実装手段に受渡す受渡手段と、受渡手段か
らフェイスダウンの状態で受取ったフリップチップをフ
ェイスダウンの状態で基板位置決め部に位置決めされた
基板に実装する実装手段とを有する。
An electronic component mounting apparatus according to the present invention includes a board positioning portion for positioning a board, a component supply portion for holding a flip chip in a face-down state, and a flip chip from the component supply portion. It has a delivery means for delivering to the receiving and mounting means in the down state, and a mounting means for mounting the flip chip received from the delivery means in the face down state on the substrate positioned in the substrate positioning portion in the face down state.
【0007】[0007]
【作用】上記構成により、フリップチップは、部品供給
部、受渡手段、実装手段及び基板のいずれに位置すると
きもフェイスダウンの状態となっており、フリップチッ
プを反転させる必要がないので、従来の電子部品実装装
置におけるフリップチップの反転に要する時間を節約す
ることができ、実装全体におけるタクトタイムを短縮す
ることができる。
With the above structure, the flip chip is in a face-down state when it is located on any of the component supply unit, the delivery unit, the mounting unit, and the substrate, and it is not necessary to invert the flip chip. The time required to flip the flip chip in the electronic component mounting apparatus can be saved, and the takt time in the entire mounting can be shortened.
【0008】[0008]
【実施例】次に図面を参照しながら本発明の実施例を説
明する。
Embodiments of the present invention will now be described with reference to the drawings.
【0009】図1は本発明の一実施例における電子部品
実装装置の側面図、図2は本発明の一実施例における電
子部品実装装置の平面図、図3は本発明の一実施例にお
けるチップ取出部の拡大図、図4は本発明の一実施例に
おける実装位置の拡大図である。なお従来の電子部品実
装装置を示す図5の構成要素と同様の構成要素について
は同一符号を付すことにより説明を省略する。
FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is a chip according to an embodiment of the present invention. FIG. 4 is an enlarged view of the take-out portion, and FIG. 4 is an enlarged view of the mounting position in one embodiment of the present invention. The same components as those of the conventional electronic component mounting apparatus shown in FIG. 5 are designated by the same reference numerals, and the description thereof will be omitted.
【0010】図1において、10は他の構成要素を支持
する基台であり、部品供給部Aのうち、11は下面にフ
リップチップ1がフェイスダウンの状態で貼着される粘
着シート12が張設されるホルダであり、粘着シート1
2の下面の個々のフリップチップ1は、一定のピックア
ップ位置(後述するエジェクタ32の軸線上にある)に
チップ位置決め部Dによって位置決めされる。
In FIG. 1, 10 is a base for supporting other constituent elements, and 11 of the component supply section A is an adhesive sheet 12 to which the flip chip 1 is attached face down on the lower surface. It is a holder to be installed and is an adhesive sheet 1.
The individual flip chips 1 on the lower surface of 2 are positioned by a chip positioning portion D at a fixed pickup position (on the axis of an ejector 32 described later).
【0011】チップ位置決め部Dのうち、13は基台1
0上に載置されXモータ14により駆動されるXテーブ
ル、15はXテーブル13上に載置されYモータ16に
より駆動されるYテーブル、17はYテーブル15上に
立設されホルダ11を水平に支持するブラケットであ
る。従って、Xモータ14、Yモータ16を駆動すると
ホルダ11はXY方向へ水平移動する。
Of the chip positioning portion D, 13 is the base 1.
0 is placed on the X table and is driven by the X motor 14, 15 is a Y table placed on the X table 13 and is driven by the Y motor 16, and 17 is standing on the Y table 15 so that the holder 11 is horizontal. It is a bracket that supports. Therefore, when the X motor 14 and the Y motor 16 are driven, the holder 11 moves horizontally in the XY directions.
【0012】次に基板位置決め部Eのうち、18は基台
10上に載置されXモータ19により駆動されるXテー
ブル、20はXテーブル18上に載置されYモータ21
により駆動されるYテーブル、22は上面で基板3の下
面略中央を吸着して保持するθテーブルである。
Next, in the substrate positioning section E, 18 is an X table placed on the base 10 and driven by an X motor 19, and 20 is placed on the X table 18 and a Y motor 21.
The Y table 22 driven by the above is a θ table which holds the upper surface of the substrate 3 by adsorbing and holding the approximate center of the lower surface of the substrate 3.
【0013】さて粘着シート12の上方の上述したピッ
クアップ位置には、チップ取出部Fが配置されている。
このうち、30は基台10と一体的にしかもそのロッド
31が下向きになるように固定されるシリンダ、32は
ロッド31の下端部に連結され、昇降自在に支持される
エジェクタである。エジェクタ32は、図3に示すよう
に図示しない昇降手段によって昇降するロッド32a
と、このロッド32aの下端部に下向きに固定される針
状のピン32bを有する。そして、ロッド32aを下降
させると、ピン32bが粘着シート12を貫通してフェ
イスダウン状態で粘着シート12に貼着されていたフリ
ップチップ1の底面(バンプ2と反対の面)を押し出す
ことにより、フリップチップ1を粘着シートから取り外
すようになっている。
At the above-mentioned pickup position above the adhesive sheet 12, a chip take-out portion F is arranged.
Of these, 30 is a cylinder that is fixed integrally with the base 10 so that its rod 31 faces downward, and 32 is an ejector that is connected to the lower end of the rod 31 and is supported so as to be able to move up and down. As shown in FIG. 3, the ejector 32 is a rod 32a that is moved up and down by an elevating means (not shown).
And a needle pin 32b fixed downward at the lower end of the rod 32a. Then, when the rod 32a is lowered, the pin 32b penetrates the adhesive sheet 12 and pushes out the bottom surface (the surface opposite to the bump 2) of the flip chip 1 attached to the adhesive sheet 12 in a face-down state. The flip chip 1 is designed to be removed from the adhesive sheet.
【0014】図1において、Gは粘着シート12から取
り外されたフリップチップ1をフェイスダウンの状態で
受取り、隣接する実装手段Hへ渡す受渡手段である。受
渡手段Gは、図2に示すように複数本放射状に設けら
れ、先端部に受渡ヘッド35を備えたアーム33を有
し、受渡ヘッド35の上端部には、上向きにフリップチ
ップ1のバンプ2が形成された面を吸着する吸着ノズル
36が設けられている。34はアーム33を軸34aを
中心にインデックス回転させるインデックス機構部であ
り、フリップチップ1を吸着した吸着ノズル36を受渡
位置Qで待機する吸着ノズル43の下方へ移動させる。
40は軸41aを中心に放射状に複数本設けられたアー
ム、41はアーム40を軸41aを中心にインデックス
回転させるインデックス機構部、42は下端部にフリッ
プチップを吸着する吸着ノズル43を備えた実装ヘッド
であり、アーム40の先端部に取り付けられている。な
お、受渡手段Gと実装手段Hが交差する受渡位置Qにお
いて、フリップチップ1は下面(バンプ2の形成面)を
受渡手段Gの吸着ノズル36により保持されているの
で、実装手段Hの吸着ノズル43は下向きに開口し、フ
リップチップ1の上面(バンプ2の反対の面)を吸着す
るようになっている。50は、ピックアップ位置に設け
られフリップチップ1の位置やフリップチップ1に付さ
れたバッドマークを認識するためのチップ認識カメラ、
51は基板3の実装位置を下から観察し、フリップチッ
プ1のバンプ2とガラス製の基板3の電極3aとの位置
ずれ量などの情報を取得するための実装監視カメラであ
る。また基板3の実装位置の下面を下受けするための基
板下受部Iが、Yテーブル20の端部に設けられてい
る。図4に示すように、基板下受け部Iは、ロッド61
が上向きになるようにYテーブル20に固定されるシリ
ンダ60、ロッド61の上端部に固定され、基板3の下
面に押当する押当部63をY方向に水平移動させるシリ
ンダ62を備えている。
In FIG. 1, G is a delivery means for receiving the flip chip 1 detached from the adhesive sheet 12 in a face-down state and delivering it to the adjacent mounting means H. As shown in FIG. 2, the transfer means G has a plurality of radially arranged arms 33, and has an arm 33 having a transfer head 35 at the tip thereof. The upper end of the transfer head 35 has the bumps 2 of the flip chip 1 facing upward. A suction nozzle 36 for suctioning the surface on which is formed is provided. Reference numeral 34 denotes an index mechanism portion that causes the arm 33 to perform an index rotation about the shaft 34a, and moves the suction nozzle 36 that has suctioned the flip chip 1 below the suction nozzle 43 that stands by at the delivery position Q.
Reference numeral 40 is an arm radially provided around a shaft 41a, 41 is an index mechanism unit for index-rotating the arm 40 around the shaft 41a, and 42 is a mounting provided with a suction nozzle 43 for sucking a flip chip at a lower end portion. The head is attached to the tip of the arm 40. At the transfer position Q where the transfer means G and the mounting means H intersect, the lower surface (the surface on which the bumps 2 are formed) of the flip chip 1 is held by the suction nozzle 36 of the transfer means G, and therefore the suction nozzle of the mounting means H is used. Reference numeral 43 indicates a downward opening so that the upper surface of the flip chip 1 (the surface opposite to the bump 2) is adsorbed. Reference numeral 50 denotes a chip recognition camera provided at a pickup position for recognizing a position of the flip chip 1 and a bad mark attached to the flip chip 1,
Reference numeral 51 denotes a mounting monitoring camera for observing the mounting position of the substrate 3 from below and acquiring information such as the amount of positional deviation between the bump 2 of the flip chip 1 and the electrode 3a of the glass substrate 3. In addition, a board lower receiving portion I for receiving the lower surface of the mounting position of the board 3 is provided at an end of the Y table 20. As shown in FIG. 4, the substrate lower receiving portion I includes the rod 61.
A cylinder 60 is fixed to the Y table 20 so that it is directed upward, and a cylinder 62 that is fixed to the upper end of the rod 61 and horizontally moves a pressing portion 63 that presses the lower surface of the substrate 3 in the Y direction. .
【0015】次に本発明の電子部品実装装置の動作を説
明する。まず予めシリンダ30を駆動して、エジェクタ
32を粘着シート12上に接触させておく。次にチップ
認識カメラ50でピックアップしようとしているフリッ
プチップ1を撮像し、バッドマークの有無やフリップ位
置を認識する。バッドマークがなかったらチップ位置決
め部Dを駆動して、このフリップチップ1をエジェクタ
32の真下に位置決めする。なおチップ認識カメラ50
でフリップチップ1を撮像する場合は、受渡ヘッド35
を撮像の妨げにならない位置へ退避させておく。次に受
渡ヘッド35をエジェクタ32の下方に位置決めされた
フリップチップ1の真下へ移動させ、吸着ノズル36を
上昇してこのフリップチップ1を吸着する。そして吸着
ノズル36を下降させる際に、エジェクタ32のピン3
2bを下降させて、フリップチップ1を粘着シート12
から取り外して吸着ノズル36で保持する。次にインデ
ックス機構部34を駆動してこの受渡ヘッド35を受渡
位置Qへ移動させ、受渡位置Qで待機していた実装ヘッ
ド42の吸着ノズル43を下降させて、吸着ヘッド36
上のフリップチップ1を吸着する。次にインデックス機
構部41を駆動して、フリップチップ1を吸着した実装
ヘッド42を基板3の上方へ移動させ、実装監視カメラ
51でフリップチップ1のバンプ2と基板3の電極3a
の位置ずれを認識し、基板位置決め部Eを駆動して両者
の位置合わせを行う。位置合わせが完了したならば、シ
リンダ60及びシリンダ62を駆動して基板下受け部I
の押当部63を基板3の下面に当接させて基板3を下受
けする。その後、吸着ノズル43を下降させてフリップ
チップ1を基板3へ実装する。
Next, the operation of the electronic component mounting apparatus of the present invention will be described. First, the cylinder 30 is driven in advance to bring the ejector 32 into contact with the adhesive sheet 12. Next, the chip recognition camera 50 picks up an image of the flip chip 1 to be picked up and recognizes the presence or absence of a bad mark and the flip position. If there is no bad mark, the chip positioning portion D is driven to position the flip chip 1 directly below the ejector 32. The chip recognition camera 50
When picking up an image of the flip chip 1 with, the delivery head 35
Is retracted to a position where it does not interfere with imaging. Next, the delivery head 35 is moved to a position right below the flip chip 1 positioned below the ejector 32, and the suction nozzle 36 is raised to suck the flip chip 1. When the suction nozzle 36 is lowered, the pin 3 of the ejector 32 is
2b is lowered to put the flip chip 1 on the adhesive sheet 12
It is detached from and held by the suction nozzle 36. Next, the index mechanism unit 34 is driven to move the delivery head 35 to the delivery position Q, and the suction nozzle 43 of the mounting head 42 waiting at the delivery position Q is lowered to move the suction head 36.
Adsorb the upper flip chip 1. Next, the index mechanism unit 41 is driven to move the mounting head 42 that has attracted the flip chip 1 to above the substrate 3, and the mounting monitoring camera 51 causes the bump 2 of the flip chip 1 and the electrode 3a of the substrate 3 to move.
Is recognized, and the board positioning portion E is driven to align the two. When the alignment is completed, the cylinder 60 and the cylinder 62 are driven to drive the lower board receiving portion I.
The pressing portion 63 is brought into contact with the lower surface of the substrate 3 to receive the substrate 3. Then, the suction nozzle 43 is lowered to mount the flip chip 1 on the substrate 3.
【0016】[0016]
【発明の効果】本発明の電子部品実装装置は、基板を位
置決めする基板位置決め部と、フリップチップをフェイ
スダウンの状態で保持する部品供給部と、部品供給部か
らフリップチップをフェイスダウンの状態で受取り実装
手段に受渡す受渡手段と、受渡手段からフェイスダウン
の状態で受取ったフリップチップをフェイスダウンの状
態で基板位置決め部に位置決めされた基板に実装する実
装手段とを有するので、フリップチップは常にフェイス
ダウンの状態で移送され基板上に実装される。したがっ
て、従来必要であったフリップチップの反転のための時
間を省略することによりタクトタイムを短縮できる。
According to the electronic component mounting apparatus of the present invention, a board positioning section for positioning a board, a component supply section for holding a flip chip in a face-down state, and a flip chip from the component supply section in a face-down state. Since the flip-chip has the delivery means for delivering to the receiving and mounting means and the mounting means for mounting the flip chip received in the face-down state from the delivery means on the substrate positioned in the substrate positioning portion in the face-down state, the flip chip is always provided. It is transferred face down and mounted on a substrate. Therefore, the tact time can be shortened by omitting the time required for flip chip inversion, which is conventionally required.
【図面の簡単な説明】[Brief description of drawings]
【図1】本発明の一実施例における電子部品実装装置の
側面図
FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention.
【図2】本発明の一実施例における電子部品実装装置の
平面図
FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
【図3】本発明の一実施例におけるチップ取出部の拡大
FIG. 3 is an enlarged view of a chip take-out portion according to an embodiment of the present invention.
【図4】本発明の一実施例における実装位置の拡大図FIG. 4 is an enlarged view of a mounting position according to an embodiment of the present invention.
【図5】従来の電子部品実装装置の動作説明図FIG. 5 is an operation explanatory diagram of a conventional electronic component mounting apparatus.
【符号の説明】 1 フリップチップ 3 基板 A 部品供給部 E 基板位置決め部 G 受渡手段 H 実装手段[Explanation of reference numerals] 1 flip chip 3 substrate A component supply unit E substrate positioning unit G delivery means H mounting means

Claims (3)

    【特許請求の範囲】[Claims]
  1. 【請求項1】基板を位置決めする基板位置決め部と、フ
    リップチップをフェイスダウンの状態で保持する部品供
    給部と、前記部品供給部からフリップチップをフェイス
    ダウンの状態で受取り実装手段に受渡す受渡手段と、前
    記受渡手段からフェイスダウンの状態で受取ったフリッ
    プチップをフェイスダウンの状態で前記基板位置決め部
    に位置決めされた基板に実装する実装手段とを有するこ
    とを特徴とする電子部品実装装置。
    1. A substrate positioning unit for positioning a substrate, a component supply unit for holding a flip chip in a face-down state, and a delivery unit for delivering a flip chip from the component supply unit in a face-down state to a mounting unit. And an electronic component mounting device for mounting the flip chip received from the delivery means in a face-down state on a substrate positioned in the substrate positioning portion in a face-down state.
  2. 【請求項2】前記受渡手段は、放射状に複数設けられた
    アームと、前記アームのそれぞれの先端部に設けられた
    受渡ヘッドと、前記アームを水平面内でインデックス回
    転させるインデックス機構部とを有することを特徴とす
    る請求項1記載の電子部品実装装置。
    2. The delivery means has a plurality of arms radially provided, a delivery head provided at each tip of the arms, and an index mechanism portion for index-rotating the arms in a horizontal plane. The electronic component mounting apparatus according to claim 1, wherein:
  3. 【請求項3】前記実装手段は、放射状に複数設けられた
    アームと、前記アームのそれぞれの先端部に設けられた
    実装ヘッドと、前記アームを水平面内でインデックス回
    転させるインデックス機構部とを有することを特徴とす
    る請求項1記載の電子部品実装装置。
    3. The mounting means has a plurality of arms radially provided, a mounting head provided at a tip of each of the arms, and an index mechanism section for index-rotating the arms in a horizontal plane. The electronic component mounting apparatus according to claim 1, wherein:
JP29953094A 1994-12-02 1994-12-02 Electronic component mounting equipment Expired - Fee Related JP3152091B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29953094A JP3152091B2 (en) 1994-12-02 1994-12-02 Electronic component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29953094A JP3152091B2 (en) 1994-12-02 1994-12-02 Electronic component mounting equipment

Publications (2)

Publication Number Publication Date
JPH08162502A true JPH08162502A (en) 1996-06-21
JP3152091B2 JP3152091B2 (en) 2001-04-03

Family

ID=17873800

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29953094A Expired - Fee Related JP3152091B2 (en) 1994-12-02 1994-12-02 Electronic component mounting equipment

Country Status (1)

Country Link
JP (1) JP3152091B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069241A1 (en) * 1999-05-06 2000-11-16 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method therefor
JP2003273167A (en) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd Electronic component loading device and electronic component loading method
JP2008078217A (en) * 2006-09-19 2008-04-03 Shibaura Mechatronics Corp Mounting apparatus and method of electronic component
CN100386014C (en) * 2002-01-30 2008-04-30 西门子公司 Chip removal apparatus, fitting system and method of removing chips from a wafer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069241A1 (en) * 1999-05-06 2000-11-16 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method therefor
EP1194029A1 (en) * 1999-05-06 2002-04-03 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method therefor
US6839959B1 (en) 1999-05-06 2005-01-11 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
EP1194029A4 (en) * 1999-05-06 2006-08-30 Matsushita Electric Ind Co Ltd Component mounting apparatus and method therefor
CN100386014C (en) * 2002-01-30 2008-04-30 西门子公司 Chip removal apparatus, fitting system and method of removing chips from a wafer
EP1470747B1 (en) * 2002-01-30 2014-05-14 ASM Assembly Systems GmbH & Co. KG Chip removal device chip, placing system and method for removing chips from a wafer
JP2003273167A (en) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd Electronic component loading device and electronic component loading method
JP2008078217A (en) * 2006-09-19 2008-04-03 Shibaura Mechatronics Corp Mounting apparatus and method of electronic component

Also Published As

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