CN219981138U

CN219981138U - Backlight lamp plate structure

Info

Publication number: CN219981138U
Application number: CN202321711309.2U
Authority: CN
Inventors: 张�杰; 曾一鑫
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2023-07-03
Filing date: 2023-07-03
Publication date: 2023-11-07
Anticipated expiration: 2033-07-03

Abstract

The utility model relates to a backlight lamp panel structure, which comprises a substrate, wherein a copper circuit pattern layer is arranged on the substrate, an electronic component binding position is arranged on the copper circuit pattern layer, a nickel-depositing layer is arranged on the binding position, a tin paste layer is printed on the copper circuit pattern layer, and the electronic component is bound on the tin paste layer. The copper circuit pattern layer is a coating layer after the surface oxide is air-dried after being washed by weak acid. The solder paste layer is a coating prepared by printing under the inert gas environment. The thickness of the copper circuit pattern layer is 1-4 um. The binding bits include a plurality of, a plurality of binding bit interval settings. The backlight lamp panel provided by the utility model is not provided with the nickel-gold-deposited layer, can also complete the binding of electronic elements, can improve the production efficiency, and simultaneously reduces the production cost. Specifically, when the structure is prepared, weak acid cleaning is performed to treat oxides on the copper surface after the copper circuit pattern is finished, and the copper circuit pattern is in an inert gas environment to prevent copper from being oxidized after the weak acid cleaning and air drying are performed to a solder paste printing flow.

Description

Backlight lamp plate structure

Technical Field

The utility model relates to the technical field of backlight, in particular to a backlight lamp panel structure.

Background

Electronic products are inseparable from the current life, and provide great convenience for our lives. The electronic product is used without a plurality of electronic units such as a driving plate/a MINI backlight lamp plate, and the electronic units are welded and spliced by a plurality of electronic components to realize the functions. At present, the subsequent welding and binding of electronic components can be completed only by depositing nickel and gold on the manufactured copper circuit pattern, and a plurality of tiny posts such as microetching, acid washing, DI water washing, nickel deposition, gold deposition and the like are needed in the nickel and gold deposition posts, so that the production flow is long and the manufacturing defective products are easy to produce in the flow. If the electronic and electronic components are directly welded on the copper circuit pattern, the copper surface is easy to oxidize, the pin positions are small, and the welding is easy to fall off.

Disclosure of Invention

The utility model provides a backlight lamp panel structure, which optimizes and saves the operation flows of nickel-gold deposition and the like, can improve the production efficiency, and simultaneously reduces the production cost.

Specifically, the technical scheme of the utility model is as follows: the utility model provides a backlight lamp plate structure, includes the base plate, is equipped with copper circuit pattern layer on the base plate, is equipped with the electronic components and binds the position on the copper circuit pattern layer, wherein, binds the position and is equipped with the heavy nickel layer, and it has the solder paste layer to bind the position on copper circuit pattern layer, binds electronic components and components on the solder paste layer.

As a preferable technical scheme, the copper circuit pattern layer is a coating layer after the surface oxide is air-dried after being washed by weak acid.

As a preferred technical scheme, the solder paste layer is a coating prepared in an inert gas environment.

As a preferable technical scheme, the thickness of the copper circuit pattern layer is 1-4 um.

As a preferable technical scheme, the binding bits comprise a plurality of binding bit interval settings.

As the preferable technical scheme, the device also comprises a drive IC, wherein the drive IC is electrically connected with the binding bit.

As the preferable technical scheme, the LED lamp beads are bound on the binding position, and the LED lamp beads are welded on the binding position.

As the preferable technical scheme, the LED lamp bead position area is provided with a resin adhesive layer.

As the preferable technical scheme, the solder paste layer of the corresponding position area of the LED lamp bead is coated by the resin adhesive layer.

As a preferred technical scheme, the resin adhesive layer is a thixotropic resin adhesive layer with the fluidity of being more than or equal to 4500 Pa.s/25 ℃ after being solidified.

Compared with the prior art, the utility model has the following technical effects: the backlight lamp panel provided by the technical scheme of the utility model is not provided with the nickel-gold-deposited layer, can also finish the binding of electronic elements, can improve the production efficiency, and simultaneously reduces the production cost. Specifically, when the structure is prepared, weak acid cleaning is performed to treat oxide on the copper surface after the copper circuit pattern is completed, and the copper circuit pattern is in an inert gas environment to prevent copper from being oxidized after the weak acid cleaning and air drying are performed to a solder paste printing process. And connecting the weak acid cleaning copper oxide post with the printing solder paste post, and simultaneously placing the copper oxide post and the printing solder paste post in a non-oxygen sealing environment, etching and cleaning copper oxide on the surface of a copper pad by using the weak acid, and then printing and welding electronic components of the solder paste.

Description of the drawings:

FIG. 1 shows a schematic diagram of a backlight panel structure according to an embodiment of the present utility model;

reference numerals illustrate:

a substrate 1; copper line pattern layer 2; binding a bit 3; LED lamp beads 4; and a resin adhesive layer 5.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments of the present utility model and corresponding drawings. In the description of the present utility model, it should be noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In addition, in the description of the present utility model, the terms "first," "second," "upper," "lower," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.

Examples

As shown in fig. 1, a schematic diagram of a backlight lamp panel structure according to the present embodiment is provided, the structure includes a substrate 1, a copper circuit pattern layer 2 is disposed on the substrate 1, an electronic component binding bit 3 is disposed on the copper circuit pattern layer 2, the binding bit 3 does not include a nickel-deposition layer, a solder paste layer is printed on the copper circuit pattern layer 2 by the binding bit 3, and an electronic component is bound on the solder paste layer.

Preferably, the copper circuit pattern layer 2 is a coating layer after the surface oxide is air-dried by washing with weak acid. Further, the solder paste layer is a coating prepared in an inert gas environment.

When the structure is prepared, the weak acid is used for cleaning copper oxide posts and printing solder paste posts to connect, and meanwhile, the weak acid is used for etching and cleaning copper oxide on the surfaces of copper pads in a non-oxygen sealing environment, and then, solder paste is printed and welded on components. The structure is optimized, the operation flow of depositing nickel and gold is saved, the production efficiency can be improved, and meanwhile, the production cost is reduced.

Preferably, the thickness of the copper wiring pattern layer 2 is 1 to 4um.

In some preferred embodiments, the binding bits 3 include a plurality of binding bits 3 that are spaced apart. Binding components and parts on the binding position 3, further, binding LED lamp beads 4 on the binding position 3, and welding the LED lamp beads 4 on the binding position 3, providing brightness for backlight. Any solder paste layer under each LED lamp bead 4 can also be square or elliptical or other shapes. In one embodiment, the solder paste may be a lead-containing solder paste or a lead-free solder paste.

Further, a resin adhesive layer 5 is arranged in the position area of the LED lamp beads 4. The resin adhesive layer 5 is a thixotropic resin adhesive layer 5 with a fluidity of 4500mpa.s/25 ℃ or more after curing. The binding position 3 on the LED lamp bead 4 attached substrate 1 is set, in the process that the LED lamp bead 4 is attached to the binding position 3, the LED lamp bead 4 simultaneously extrudes the resin adhesive layer 5 to enable the resin adhesive layer 5 to diffuse all around, meanwhile, the resin adhesive layer 5 between the LED lamp bead 4 and the solder paste point layer in the corresponding area is extruded and flows to the periphery of the LED lamp bead 4, namely, the bottom and the soldering leg of the LED lamp bead 4 are completely covered by the resin adhesive layer 5, the solder paste layer in the corresponding position area of the LED lamp bead 4 is covered by the resin adhesive layer 5, the LED lamp bead 4 and the solder paste layer of the LED display screen after encapsulation cannot be detained, and the problem of cold joint of the lamp leg is avoided. Meanwhile, the welding legs of the LED lamp beads 4 are completely covered by the resin adhesive layer 5, so that the packaged LED display screen has good moisture isolation effect, moisture is prevented from entering the welding legs and the bottoms of the LED lamp beads 4, and the problems of circuit short circuit inside the LED display screen and breakage of the bent gold wires and the welding legs of the chip are solved. Further, the device also comprises a drive IC, and the drive IC is electrically connected with the binding bit 3.

It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the utility model, are within the scope of the utility model based on the embodiments of the utility model.

Claims

1. The utility model provides a backlight lamp plate structure, its characterized in that includes the base plate, be equipped with copper circuit pattern layer on the base plate, be equipped with electronic components on the copper circuit pattern layer and bind the position, wherein, bind the position and do not be equipped with the heavy nickel layer, bind the position and be in print on the copper circuit pattern layer and have the solder paste layer, bind electronic components on the solder paste layer.

2. A backlight board structure according to claim 1, wherein the copper line pattern layer is a coating layer after the surface oxide has been air-dried by a weak acid cleaning.

3. A backlight board structure according to claim 2, wherein the solder paste layer is a coating layer produced under an inert gas atmosphere.

4. A backlight board structure according to claim 1, wherein the copper line pattern layer has a thickness of 1-4 um.

5. The backlight lamp structure of claim 1, wherein the binding bits comprise a plurality of binding bit spaces, the plurality of binding bit spaces being arranged.

6. The backlight panel structure of claim 5, further comprising a driver IC in electrical communication with the bonding bit.

7. The backlight lamp panel structure of claim 6, wherein the binding sites have LED beads bonded thereto, the LED beads being welded to the binding sites.

8. The backlight panel structure of claim 7, wherein the LED bead location area is provided with a resin glue layer.

9. A backlight panel structure according to claim 8, wherein the solder paste layer of the LED bead corresponding location area is covered by the resin glue layer.

10. A backlight panel arrangement according to claim 9, wherein the resin glue layer is a thixotropic resin glue layer having a cured flowability of greater than or equal to 4500mpa.s/25 ℃.