CN105047440A - Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor - Google Patents
Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor Download PDFInfo
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- CN105047440A CN105047440A CN201510488346.5A CN201510488346A CN105047440A CN 105047440 A CN105047440 A CN 105047440A CN 201510488346 A CN201510488346 A CN 201510488346A CN 105047440 A CN105047440 A CN 105047440A
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Abstract
The invention discloses a terminal pin flattening device for a chip aluminum electrolytic capacitor capable of increasing the superficial area of a soldering contact surface of a lead flattening segment. The terminal pin flattening device comprises a pellet and a group of pressure blocks, wherein the pellet is arranged between two terminal pins of the aluminum electrolytic capacitor; the group of pressure blocks corresponds to the pellet; the terminal pin flattening device is characterized in that a pellet bump and a pellet recess are formed in the surface of one side, which contacts the terminal pins, of the pellet; the group of pressure blocks is driven to move towards the pellet by power; in a squeezing process, the terminal pins are flattened; two surfaces with the largest area on the flattened terminal pins are a seat plate contact surface and the soldering contact surface; a terminal pin recess and a terminal pin bump are formed in the soldering contact surface; the terminal pin recess corresponds to the pellet bump in the pellet; and the terminal pin bump corresponds to the pellet recess. The production method comprises an element preparation step, an assembling step, a terminal pin flattening step, an ageing step and a seat plate assembling process. The terminal pin flattening device is reasonable and simple in technology; the superficial area of the soldering contact surface can be increased by over 10%; the adhesive force between the terminal pins and soldering tin is increased by over 10%; the problem of stock fall in a reflow soldering process is solved; and the reject ratio is reduced to below 0.1%.
Description
Technical field
The present invention relates to a kind of aluminium electrolytic capacitor, specifically SMD aluminium electrolytic capacitor lead pin flattens device and a capacitor production method, particularly relates to a kind of SMD aluminium electrolytic capacitor lead pin increasing the lead-in wire section of flattening scolding tin contact-making surface surface area and flattens device and capacitor production method.
Background technology
In electronic product is produced, high for realizing packaging density, reduce volume, the weight of electronic product, normal use surface installation technique (SMT), it requires that electronic component is surface mount elements, and after general employing SMT, electronic product reliability is high, vibration resistance is strong, welding point defect rate is low, high frequency characteristics is good, decreases electromagnetism and radio frequency interference, easily is automated, enhance productivity, save material, the energy, equipment, manpower, time etc.
At present, in paster electrolytic capacitor is produced, after terminal pin is flattened, the maximum face of two areas is seat board contact-making surface and scolding tin contact-making surface.In reflow soldering process, due to its scolding tin contact-making surface smooth surface and surface area is little, thus lead-in wire is also corresponding little to the contact-making surface of scolding tin, when running into high vibration or abnormal external force, or when there is failure welding, capacitor can be made to drop from circuit board, fraction defective is 5 ﹪ ~ 10 ﹪.
Summary of the invention
The object of this invention is to provide a kind of SMD aluminium electrolytic capacitor lead pin increasing the lead-in wire section of flattening scolding tin contact-making surface surface area and flatten device and capacitor production method.
The present invention adopts following technical scheme to realize its goal of the invention, a kind of SMD aluminium electrolytic capacitor lead pin flattens device, it comprises and is arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, and it is protruding with pellet recess that described pellet contacts side surface with terminal pin is provided with pellet; Power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, described scolding tin contact-making surface has corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess.
For easy to process, pellet projection of the present invention is pellet raised line, and described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
For easy to process, pellet raised line of the present invention and pellet groove are arranged along the radial direction of pellet.
The radial cross-sectional shape of pellet groove of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
For the terminal pin of positioning aluminium electrolytic capacitor, briquetting of the present invention is provided with terminal pin locating piece.
A kind of SMD production method of aluminum electrolytic capacitor, it comprises the following steps:
(1) prepare sub-prime: after nail riveting being had the anode aluminium foil of positive guide pin and nail riveting to have the cathode aluminum foil of negative guide pin to clip membrane winding, make sub-prime;
(2) group is vertical: sub-prime step (1) prepared puts micelle or rubber plug sealing is loaded in aluminum hull;
(3) terminal pin is flattened: for ease of assembling seat board, flattens device terminal pin and positive guide pin, negative guide pin are flattened by the root of sub-prime one end by terminal pin; Described terminal pin is flattened device and is comprised and be arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, described pellet contacts side surface with terminal pin is provided with pellet projection and pellet recess, power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, described scolding tin contact-making surface has corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess;
For easy to process, the present invention step (3) in, described pellet projection is pellet raised line, and described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
For easy to process, pellet raised line of the present invention and pellet groove are arranged along the radial direction of pellet.
The radial cross-sectional shape of pellet groove of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
For the terminal pin of positioning aluminium electrolytic capacitor, the present invention step (3) in, briquetting is provided with terminal pin locating piece.
(4) aging;
(5) seat board assembling: by the aluminium electrolytic capacitor fit on seat board after (4) processing through step.
Owing to adopting technique scheme, the present invention achieves goal of the invention preferably, its rational technology, simple, projection and recess is provided with at the scolding tin contact-making surface of SMD aluminium electrolytic capacitor lead pin, the surface area of scolding tin contact-making surface can increase by 10 more than ﹪, adhesive force between terminal pin and scolding tin increases 10 more than ﹪, improves to fall material problem in reflow soldering process, makes fraction defective be reduced to below one thousandth.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art;
Fig. 2 is the A place enlarged diagram of Fig. 1;
Fig. 3 is the structural representation of the embodiment of the present invention 1;
Fig. 4 is the B place enlarged diagram of Fig. 3;
Fig. 5 is the structural representation that the embodiment of the present invention 1 flattens device;
Fig. 6 is the part enlarged diagram of pellet 9 in Fig. 5;
Fig. 7 is the structural representation of the embodiment of the present invention 2;
Fig. 8 is the C place enlarged diagram of Fig. 7;
Fig. 9 is the structural representation that the embodiment of the present invention 2 flattens device;
Figure 10 is the part enlarged diagram of pellet 9 in Fig. 9;
Figure 11 is the structural representation of the embodiment of the present invention 3;
Figure 12 is the D place enlarged diagram of Figure 11;
Figure 13 is the structural representation that the embodiment of the present invention 3 flattens device;
Figure 14 is the part enlarged diagram of pellet 9 in Figure 13;
Figure 15 is the structural representation of the embodiment of the present invention 4;
Figure 16 is the E place enlarged diagram of Figure 15;
Figure 17 is the structural representation that the embodiment of the present invention 4 flattens device;
Figure 18 is the part enlarged diagram of pellet 9 in Figure 17.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
As seen from Figure 1, Figure 2, a kind of terminal pin 2(of SMD aluminium electrolytic capacitor 1 and positive guide pin, negative guide pin) flatten after be flat, the face that wherein two areas are maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, be assemblied on seat board 3, as shown in Figure 2, its scolding tin contact-making surface 4 smooth surface.In reflow soldering process, due to its scolding tin contact-making surface 4 smooth surface and surface area is little, thus terminal pin 2 is also corresponding little to the contact-making surface of scolding tin, when running into high vibration or abnormal external force, or when there is failure welding, aluminium electrolytic capacitor 1 can be made to drop from circuit board, and fraction defective is 5 ﹪ ~ 10 ﹪.
Embodiment 1:
From Fig. 3, Fig. 4, Fig. 5, Fig. 6, a kind of SMD aluminium electrolytic capacitor lead pin flattens device, it comprises and is arranged on the pellet 9 between aluminium electrolytic capacitor 1 liang of terminal pin 2, corresponding with pellet 9 one group of briquetting 8, and it is protruding with pellet recess that described pellet 9 contacts side surface with terminal pin 2 is provided with pellet; Power drives one group of briquetting 8 to move to pellet 9, in extrusion process, terminal pin 2 is flattened, the face flattening on rear terminal pin 2 two areas maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, described scolding tin contact-making surface 4 has corresponding terminal pin recess protruding with the pellet on pellet 9 and the terminal pin projection corresponding with pellet recess.
For easy to process, pellet projection of the present invention is pellet raised line 11, and described pellet recess is pellet groove 12, and pellet raised line 11 is alternate with pellet groove 12 to be arranged on pellet 9 into strips.
For easy to process, pellet raised line 11 of the present invention is arranged along the radial direction of pellet 9 with pellet groove 12.
The radial cross-sectional shape of pellet groove 12 of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
For the terminal pin 2 of positioning aluminium electrolytic capacitor 1, briquetting 8 of the present invention is provided with terminal pin locating piece 10.
The radial cross-sectional shape of the present embodiment pellet groove 12 is square, and the radial cross-sectional shape of pellet raised line 11 is also square.
A kind of SMD production method of aluminum electrolytic capacitor, it comprises the following steps:
(1) prepare sub-prime: after nail riveting being had the anode aluminium foil of positive guide pin and nail riveting to have the cathode aluminum foil of negative guide pin to clip membrane winding, make sub-prime;
(2) group is vertical: sub-prime step (1) prepared puts micelle or rubber plug sealing is loaded in aluminum hull;
(3) terminal pin is flattened: for ease of assembling seat board, flattens device terminal pin 2 i.e. positive guide pin, negative guide pin are flattened by the root of sub-prime one end by terminal pin; Described terminal pin is flattened device and is comprised and be arranged on the pellet 9 between aluminium electrolytic capacitor 1 liang of terminal pin 2, corresponding with pellet 9 one group of briquetting 8, described pellet 9 contacts side surface with terminal pin 2 is provided with pellet projection and pellet recess, power drives one group of briquetting 8 to move to pellet 9, in extrusion process, terminal pin 2 is flattened, the face flattening on rear terminal pin 2 two areas maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, described scolding tin contact-making surface 4 has corresponding terminal pin recess protruding with the pellet on pellet 9 and the terminal pin projection corresponding with pellet recess;
For easy to process, the present invention step (3) in, described pellet projection is pellet raised line 11, and described pellet recess is pellet groove 12, and pellet raised line 11 is alternate with pellet groove 12 to be arranged on pellet 9 into strips.
For easy to process, pellet raised line 11 of the present invention is arranged along the radial direction of pellet 9 with pellet groove 12.
The radial cross-sectional shape of pellet groove 12 of the present invention be square or trapezoidal or triangle semicircle or fan-shaped.
For the terminal pin 2 of positioning aluminium electrolytic capacitor 1, the present invention step (3) in, briquetting 8 is provided with terminal pin locating piece 10.
(4) aging;
(5) seat board assembling: by the aluminium electrolytic capacitor 1 fit on seat board 3 after (4) processing through step.
The radial cross-sectional shape of the present embodiment pellet groove 12 is square, and the radial cross-sectional shape of pellet raised line 11 is also square, and the length that terminal pin 2 is flattened is 5 more than ㎜.Power drives one group of briquetting 8 to move to pellet 9, by the terminal pin 2 of the terminal pin locating piece 10 positioning aluminium electrolytic capacitor 1 on briquetting 8, in extrusion process, terminal pin 2 is flattened, the face flattening on rear terminal pin 2 two areas maximum is seat board contact-making surface 5 and scolding tin contact-making surface 4, described scolding tin contact-making surface 4 there are the terminal pin groove 7 corresponding with the pellet raised line 11 on pellet 9 and the terminal pin raised line 6 corresponding with pellet groove 12, the radial cross-sectional shape of terminal pin raised line 6 is square, and the radial cross-sectional shape of terminal pin groove 7 is also square.
Present invention process rationally, simply, terminal pin raised line 6 and terminal pin groove 7 is processed with at the scolding tin contact-making surface 4 of SMD aluminium electrolytic capacitor lead pin 2, the surface area of scolding tin contact-making surface 4 can increase by 40 ﹪ ~ 80 ﹪, adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪, improve and fall material problem in reflow soldering process, make fraction defective be reduced to below one thousandth.
Embodiment 2:
From Fig. 7, Fig. 8, Fig. 9, Figure 10, the radial cross-sectional shape of the present embodiment pellet groove 12 is trapezoidal, the radial cross-sectional shape of pellet raised line 11 is also trapezoidal, the radial cross-sectional shape that terminal pin 2 flattens the terminal pin raised line 6 of rear correspondence is trapezoidal, and the radial cross-sectional shape of terminal pin groove 7 is also trapezoidal; The surface area of scolding tin contact-making surface 4 can increase by 30 ﹪ ~ 60 ﹪, and the adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪.
Remaining with embodiment 1.
Embodiment 3:
From Figure 11, Figure 12, Figure 13, Figure 14, the radial cross-sectional shape of the present embodiment pellet groove 12 is triangle, the radial cross-sectional shape of pellet raised line 11 is trapezoidal, the section shape that terminal pin 2 flattens the terminal pin raised line 6 of rear correspondence is triangle, the section shape of terminal pin groove 7 is trapezoidal, the surface area of scolding tin contact-making surface 4 can increase by 10 ﹪ ~ 20 ﹪, and the adhesive force between terminal pin and scolding tin increases 10 ﹪ ~ 15 ﹪.
Remaining with embodiment 1.
Embodiment 4:
From Figure 15, Figure 16, Figure 17, Figure 18, the radial cross-sectional shape of the present embodiment pellet groove 12 is semicircle, terminal pin 2 flattens the section shape of the terminal pin raised line 6 of rear correspondence also for semicircle, the surface area of scolding tin contact-making surface 4 can increase by 25 ﹪ ~ 55 ﹪, and the adhesive force between terminal pin 2 and scolding tin increases 15 ﹪ ~ 20 ﹪.
Remaining with embodiment 1.
Claims (10)
1. a SMD aluminium electrolytic capacitor lead pin flattens device, it comprises and is arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, it is characterized in that described pellet contacts side surface with terminal pin is provided with pellet protruding with pellet recess; Power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, described scolding tin contact-making surface has corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess.
2. SMD aluminium electrolytic capacitor lead pin according to claim 1 flattens device, and it is characterized in that described pellet projection is pellet raised line, described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
3. SMD aluminium electrolytic capacitor lead pin according to claim 2 flattens device, it is characterized in that described pellet raised line and pellet groove are arranged along the radial direction of pellet.
4. SMD aluminium electrolytic capacitor lead pin according to claim 3 flattens device, it is characterized in that the radial cross-sectional shape of described pellet groove be square or trapezoidal or triangle semicircle or fan-shaped.
5. the SMD aluminium electrolytic capacitor lead pin according to claim 1 or 2 or 3 or 4 flattens device, it is characterized in that briquetting is provided with terminal pin locating piece.
6. a SMD production method of aluminum electrolytic capacitor, is characterized in that it comprises the following steps:
(1) prepare sub-prime: after nail riveting being had the anode aluminium foil of positive guide pin and nail riveting to have the cathode aluminum foil of negative guide pin to clip membrane winding, make sub-prime;
(2) group is vertical: sub-prime step (1) prepared puts micelle or rubber plug sealing is loaded in aluminum hull;
(3) terminal pin is flattened: for ease of assembling seat board, flattens device terminal pin and positive guide pin, negative guide pin are flattened by the root of sub-prime one end by terminal pin; Described terminal pin is flattened device and is comprised and be arranged on the pellet between aluminium electrolytic capacitor two terminal pin, corresponding with pellet one group of briquetting, described pellet contacts side surface with terminal pin is provided with pellet projection and pellet recess, power drives one group of briquetting to move to pellet, in extrusion process, terminal pin is flattened, the face flattening on rear terminal pin two areas maximum is seat board contact-making surface and scolding tin contact-making surface, described scolding tin contact-making surface has corresponding terminal pin recess protruding with the pellet on pellet and the terminal pin projection corresponding with pellet recess;
(4) aging;
(5) seat board assembling: by the aluminium electrolytic capacitor fit on seat board after (4) processing through step.
7. SMD production method of aluminum electrolytic capacitor according to claim 6, it is characterized in that step (3) in, described pellet projection is pellet raised line, and described pellet recess is pellet groove, and pellet raised line is alternate with pellet groove to be arranged on pellet into strips.
8. SMD production method of aluminum electrolytic capacitor according to claim 7, is characterized in that described pellet raised line and pellet groove are arranged along the radial direction of pellet.
9. SMD production method of aluminum electrolytic capacitor according to claim 8, it is characterized in that the radial cross-sectional shape of described pellet groove be square or trapezoidal or triangle semicircle or fan-shaped.
10. the SMD production method of aluminum electrolytic capacitor according to claim 6 or 7 or 8 or 9, it is characterized in that step (3) in, briquetting is provided with terminal pin locating piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488346.5A CN105047440A (en) | 2015-08-11 | 2015-08-11 | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488346.5A CN105047440A (en) | 2015-08-11 | 2015-08-11 | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor |
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| CN105047440A true CN105047440A (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510488346.5A Pending CN105047440A (en) | 2015-08-11 | 2015-08-11 | Terminal pin flattening device for chip aluminum electrolytic capacitor and production method of capacitor |
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| CN (1) | CN105047440A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107632221A (en) * | 2017-10-27 | 2018-01-26 | 南通南铭电子有限公司 | A kind of capacitor lead-out wire forming detection device and method of work |
| CN111922236A (en) * | 2020-07-21 | 2020-11-13 | 深圳江浩电子有限公司 | Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device |
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| JP2006237195A (en) * | 2005-02-24 | 2006-09-07 | Sanyo Electric Co Ltd | Solid-state electrolytic capacitor |
| CN1961624A (en) * | 2004-06-03 | 2007-05-09 | 松下电器产业株式会社 | Electronic component |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN102347134A (en) * | 2011-05-19 | 2012-02-08 | 湖南艾华集团股份有限公司 | Method for producing paster electrolytic capacitor |
| CN203367022U (en) * | 2013-08-08 | 2013-12-25 | 株洲宏达电子有限公司 | Chip-type solid electrolytic tantalum capacitor |
| CN204834364U (en) * | 2015-08-11 | 2015-12-02 | 湖南艾华集团股份有限公司 | Device is flattened to SMD aluminium electrolytic capacitor lead wire foot |
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2015
- 2015-08-11 CN CN201510488346.5A patent/CN105047440A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1961624A (en) * | 2004-06-03 | 2007-05-09 | 松下电器产业株式会社 | Electronic component |
| JP2006237195A (en) * | 2005-02-24 | 2006-09-07 | Sanyo Electric Co Ltd | Solid-state electrolytic capacitor |
| CN201402746Y (en) * | 2009-04-22 | 2010-02-10 | 珠海华冠电容器有限公司 | Flattening device for plate seating machine |
| CN102347134A (en) * | 2011-05-19 | 2012-02-08 | 湖南艾华集团股份有限公司 | Method for producing paster electrolytic capacitor |
| CN203367022U (en) * | 2013-08-08 | 2013-12-25 | 株洲宏达电子有限公司 | Chip-type solid electrolytic tantalum capacitor |
| CN204834364U (en) * | 2015-08-11 | 2015-12-02 | 湖南艾华集团股份有限公司 | Device is flattened to SMD aluminium electrolytic capacitor lead wire foot |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107632221A (en) * | 2017-10-27 | 2018-01-26 | 南通南铭电子有限公司 | A kind of capacitor lead-out wire forming detection device and method of work |
| CN107632221B (en) * | 2017-10-27 | 2024-05-10 | 南通南铭电子有限公司 | Forming detection device for outgoing line of capacitor and working method |
| CN111922236A (en) * | 2020-07-21 | 2020-11-13 | 深圳江浩电子有限公司 | Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device |
| CN111922236B (en) * | 2020-07-21 | 2022-06-03 | 深圳江浩电子有限公司 | Precise control device for flattening and bending point of aluminum capacitor and use method of precise control device |
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