JP5445673B2 - Solid electrolytic capacitor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a small-capacity solid electrolytic capacitor and a method for manufacturing the same.

  Patent Document 1 discloses a conventional solid electrolytic capacitor in which a plurality of valve action metal foils are laminated. The manufacturing method of the solid electrolytic capacitor of patent document 1 is as follows. A valve metal foil having a dielectric oxide film on the surface is prepared. Next, the valve-acting metal foil functioning as the anode electrode sheet is divided into a lead portion and a cathode portion (portion on the cathode side of the anode electrode sheet), and a dielectric oxide film, a solid electrolyte layer, and a conductor layer are formed on the cathode portion surface. Form. Then, after laminating a plurality of the valve action metal foils, the laminated lead portions are bundled by welding, while the laminated cathode portions are electrically connected to each other through the conductor layer. Thereafter, external terminals are connected to the lead portion and the cathode portion, and the laminated valve action metal foil is sealed. In the solid electrolytic capacitor thus obtained, the region where the cathode portion, the dielectric oxide film, and the solid electrolyte layer are formed in the valve action metal foil contributes to the capacitance formation.

JP 2000-68158 A

However, in the conventional solid electrolytic capacitor as shown in Patent Document 1, since a part of the anode electrode sheet is used as a lead portion that does not contribute to the capacitance formation, the area for forming the capacitance is limited. There was a problem.
In addition, by stacking and bundling a plurality of lead portions, the occupation ratio of a region that does not contribute to capacity formation is increased, and the thickness of the solid electrolytic capacitor is reduced by the conductor layer formed between the plurality of anode electrode sheets. There was a problem of increasing.
Therefore, the conventional solid electrolytic capacitor described in Patent Document 1 has not been able to meet the demand for further miniaturization and large capacity accompanying the recent reduction in size and thickness of electronic devices.
Furthermore, in the conventional method for producing a solid electrolytic capacitor, since the solid electrolyte is formed for each anode electrode sheet, the production process is complicated.

  Therefore, an object of the present invention is to provide a solid electrolytic capacitor that can be easily reduced in size and increased in capacity and a method for manufacturing the same.

In order to achieve the above-described object, a solid electrolytic capacitor according to the present invention includes a plurality of valve action metal foils having a dielectric oxide film on the surface thereof stacked with a gap, and a gap between the valve action metal foils adjacent to each other in the thickness direction. A laminated capacitor part electrically connected by a partial conduction part, and an anode metal plate having an anode lead part and a joining region, the laminated capacitor part on at least one side of the joining region of the anode metal plate, A solid electrolyte layer continuously connected to the gap between the valve-acting metal foils, the gap between the anode metal plate and the multilayer capacitor, and the outer surface of the multilayer capacitor, which is electrically connected by a partial conducting part with a gap. The conductive layer is formed so as to cover the outer surface of the solid electrolyte layer and to be electrically insulated from the anode lead portion of the anode metal plate.
Since the solid electrolytic capacitor according to the present invention configured as described above can form a lead portion without using a part of the valve action metal foil by the anode lead portion of the anode metal plate, the surface of the valve action metal foil Can be effectively used to form a capacitor.
Further, in the solid electrolytic capacitor according to the present invention, since the anode-side terminal can be constituted by, for example, one lead portion, which is smaller than the number of valve-acting metal foils, The ratio can be reduced and the size can be reduced.
Furthermore, since the conductive layer is provided on the outer surface of the multilayer capacitor portion via the solid electrolyte layer without being formed between adjacent valve action metal foils, the thickness of the multilayer capacitor portion is reduced. Is possible.

  In the solid electrolytic capacitor according to the present invention, it is preferable that adjacent valve action metal foils are electrically connected (conducted) at the side surface of the laminated capacitor part. And the surface of the valve-acting metal foil can be used more effectively to form a capacitor.

  In the solid electrolytic capacitor according to the present invention, the multilayer capacitor portion includes first and second multilayer capacitor portions, and the first multilayer capacitor portion is connected to one surface of the anode metal plate, It is preferable that the second laminated capacitor portion is connected to the other surface of the anode metal plate. In this way, the capacity can be further increased.

A first method for producing a solid electrolytic capacitor according to the present invention comprises: preparing a plurality of valve action metal foils having a dielectric oxide film on a surface thereof; and a valve action metal foil preparation step; and polymerizing the plurality of valve action metal foils A laminated capacitor part is produced through a valve-acting metal foil laminating step for laminating with a gap into which liquid can enter and a conductive part forming step for electrically connecting the valve-acting metal foils adjacent in the thickness direction by a partial conducting part. A step of preparing a laminated capacitor portion, an anode metal plate preparing step of preparing an anode metal plate having an anode lead portion and a joining region, and a polymerization solution containing the laminated capacitor portion on at least one surface of the joining region of the anode metal plate. Anode metal plate and laminated capacitor portion connecting step for joining with a gap that can enter, and electrically connecting the junction region of the anode metal plate and the valve action metal foil of the laminated capacitor portion by a partial conduction portion, By immersing the electrode metal plate and the laminated capacity part together in the polymerization solution, the gap between the valve action metal foils, the gap between the anode metal plate and the laminated capacity part, and the outer surface of the laminated capacity part A solid electrolyte layer forming step of continuously forming a solid electrolyte layer;
A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed in a state of being electrically insulated from the lead portion of the anode metal plate.
In the first method for producing a solid electrolytic capacitor according to the present invention configured as described above, the anode metal plate is prepared, and a laminated capacitor portion is joined to a joining region of the anode metal plate, and the laminated capacitor is obtained. By immersing the part in the polymerization solution, a plurality of valve action metal foils can be collectively formed to form a solid electrolyte layer on the entire surface of each valve action metal foil.
In the first method for producing a solid electrolytic capacitor according to the present invention, the lead portion can be formed by the anode lead portion of the anode metal plate without using a part of the valve action metal foil.
In addition, the conductive layer can be provided on the outer surface of the multilayer capacitor part via the solid electrolyte layer without forming between adjacent valve action metal foils, and the thickness of the multilayer capacitor part can be reduced. it can.

In the first method for producing a solid electrolytic capacitor according to the present invention, the valve action metal foil preparation step and the valve action metal foil lamination step provide the valve action metal foil for a plurality of solid electrolytic capacitors, Implemented in the state of a large-sized valve action metal foil, the conduction part forming step includes a step of forming the conduction part so as to be distributed in a plurality of locations of the large-size valve action metal foil, You may make it further include the process of taking out the several said multilayer capacitor | condenser part by dividing | segmenting a large-sized valve action metal foil so that each said multilayer capacitor | condenser part may contain at least 1 said conduction | electrical_connection part.
If it does in this way, the said multilayer capacity | capacitance part can be produced in large quantities efficiently.

A second method for producing a solid electrolytic capacitor according to the present invention includes: an anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region; and a plurality of valve action metal foils having a dielectric film on the surface The valve action metal foil preparation step, and the valve action metal foil lamination step and the thickness direction in which the plurality of valve action metal foils are laminated on the joining region of the anode metal plate with a gap into which the polymerization solution can enter. A laminated capacitor part producing step through a conducting part forming step of electrically connecting the valve-acting metal foils adjacent to each other by a partially conducting part; a laminated capacitor part producing step; a joining region of the anode metal plate; An anode metal plate for electrically connecting the valve action metal foil of the capacitor part by a partial conducting part and a laminated capacitor part connecting step, and immersing the anode metal plate and the laminated capacitor part together in a polymerization solution , Each valve action gold A solid electrolyte layer forming step of continuously forming a solid electrolyte layer on the outer surface of the gap between the foil, the gap between the anode metal plate and the multilayer capacitor, and the outer surface of the multilayer capacitor, and the solid electrolyte layer is formed A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion in a state of being electrically insulated from the lead portion of the anode metal plate.
The second manufacturing method of the solid electrolytic capacitor according to the present invention configured as described above has the same effects as those of the first manufacturing method, and further manufactures the multilayer capacitor portion and the multilayer capacitor portion. It is possible to perform bonding to the bonding region of the anode metal plate at the same time, and to select a conduction method, for example, it is possible to adopt a method of conducting between adjacent valve action metal foils using side surfaces. The degree of freedom increases.

Further, in the second method for producing a solid electrolytic capacitor according to the present invention, in the multilayer capacitor part manufacturing step, a part of the side surface of the multilayer capacitor part is joined to electrically join adjacent valve action metal foils. It is preferable to make it.
If it does in this way, the area of the part which does not contribute to capacity | capacitance formation by a conduction | electrical_connection part can be reduced, and the surface of valve action metal foil can be used for formation of a capacity | capacitance more effectively.
In this case, in order to obtain stable conduction between the valve-acting metal foils, it is more preferable that the conduction is performed on each of the opposing side surfaces of the multilayer capacitor portion.

In the first and second methods for producing a solid electrolytic capacitor according to the present invention, in the anode metal plate preparation step, a plurality of the anode metal plates are juxtaposed and joined to a guide plate, and the solid electrolyte In the layer forming step, a plurality of laminated capacitor portions respectively bonded to the anode metal plate may be collectively immersed in the polymerization solution.
If it does in this way, it will become possible to form a solid electrolyte layer collectively in a lot of lamination capacity parts.

In the first and second manufacturing methods of the solid electrolytic capacitor according to the present invention, in the anode metal plate preparation step, a guide portion along one side of the large anode metal plate is formed by punching a rectangular large metal plate. Forming the plurality of anode metal plates integrated with the guide portion, and collectively forming the plurality of laminated capacitor portions respectively joined to the anode metal plate in the solid electrolyte layer forming step. You may make it soak in.
In this way, it is possible to form a solid electrolyte layer collectively in a large number of laminated capacitor parts, and reduce the number of processes by omitting the step of juxtaposing a plurality of anode metal plates on the guide plate. Can be made.

A third method for producing a solid electrolytic capacitor according to the present invention is to prepare a plurality of unformed valve action metal foils, an unformed valve action metal foil preparation step, and the plurality of unformed valve action metal foils to form a chemical liquid. And an unformed valve-acting metal foil laminating step for laminating with a gap through which the polymerization solution can enter, and a conducting part forming step for electrically connecting the unformed valve-acting metal foils adjacent to each other in the thickness direction by a partially conducting part. At least one of the bonding region of the anode metal plate, the step of preparing the unchemically laminated capacitor portion, the anode metal plate preparing step of preparing the anode metal plate having the anode lead portion and the bonding region, The unformed laminated capacity part is joined to one side with a gap through which the chemical forming solution and the polymerization solution can enter, and the joining region of the anode metal plate and the valve action metal foil of the unformed laminated capacity part are partially connected to each other. Electrically connected The step of connecting the anode metal plate and the unformed laminate capacitor part, and the anodization by immersing the unformed laminate capacitor part and the anode metal plate in the chemical solution, thereby allowing the gap between the valve action metal foils, the anode Each of the valve actions by immersing the multilayer capacitor part in a polymerization solution, and a multilayer capacitor part forming step of forming a dielectric oxide film on the gap between the metal plate and the multilayer capacitor part and on the outer surface of the multilayer capacitor part A solid electrolyte layer forming step of forming a solid electrolyte layer through the dielectric oxide film on a gap between metal foils, a gap between the anode metal plate and the multilayer capacitor part, and an outer surface of the multilayer capacitor part; and the solid electrolyte A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the layer is formed via a solid electrolyte layer.
The third manufacturing method of the solid electrolytic capacitor according to the present invention configured as described above has the same effects as the first manufacturing method, and in addition, in the unformed multilayer capacitor part manufacturing step, Since the chemical formation valve metal foils are stacked and the adjacent non-chemical valve action metal foils are connected by the conductive portion, the valve action metal foils on which the dielectric oxide film is formed are stacked and adjacent to each other. Bondability can be improved compared with the case where the chemical conversion valve metal foils are connected by a conducting portion.

In the third method for producing a solid electrolytic capacitor according to the present invention, the unformed valve action metal foil preparation step and the unformed valve action metal foil lamination step include the unformed valve action metal for a plurality of solid electrolytic capacitors. The conductive portion forming step is carried out in a state of a large-sized valve action metal foil so as to give a foil, and the conductive portion forming step includes a step of forming the conductive portion so as to be distributed at a plurality of locations of the large-size valve action metal foil, The chemical conversion multilayer capacitor part manufacturing step further includes a step of taking out a plurality of the multilayer capacitor parts by dividing the large-sized valve action metal foil so that each of the unformed multilayer capacitor parts includes at least one conduction part. You may make it.
If it does in this way, the said non-chemical formation laminated capacity part can be produced in large quantities efficiently.

A fourth method for producing a solid electrolytic capacitor according to the present invention includes an anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region, and a plurality of unformed valve action metal foils. Valve action metal foil preparation step, the plurality of unformed valve action metal foils on the joining region of the anode metal plate, between the plurality of unformed valve action metal foils, and the unformed valve action metal foil and the anode metal The valve-acting metal foil laminating step for laminating the plate and the plate so as to allow the chemical solution and the polymerization solution to enter, respectively, and the non-formed valve-acting metal foils adjacent to each other in the thickness direction are electrically connected to each other by a partial conduction portion. An unformed multilayer capacitor part and an anode metal foil connecting step, electrically connecting the unformed multilayer capacitor part and the anode metal plate with a partial conducting part, Multilayer capacitor and anode metal plate Laminating to form a dielectric oxide film on the gap between the valve metal foils, the gap between the anode metal plate and the laminated capacitor, and the outer surface of the laminated capacitor by anodic oxidation by immersion in a liquid Capacitor part production step, and by immersing the laminated capacitor part and the anode metal plate in a polymerization solution, a gap between the valve action metal foils, a gap between the anode metal plate and the laminated capacitor part, and a laminated capacitor part A solid electrolyte layer forming step for forming a solid electrolyte layer on the outer surface of the multilayer capacitor portion through the dielectric film; and a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed via the solid electrolyte layer. Forming a conductive layer to be formed.
The fourth manufacturing method of the solid electrolytic capacitor according to the present invention configured as described above has the same operational effects as the second manufacturing method. Since the chemical formation valve metal foils are stacked and the adjacent non-chemical valve action metal foils are connected by the conductive portion, the valve action metal foils on which the dielectric oxide film is formed are stacked and adjacent to each other. Bondability can be improved compared with the case where the chemical conversion valve metal foils are connected by a conducting portion.

Further, in the fourth method for producing a solid electrolytic capacitor according to the present invention, in the unformed multilayer capacitor part manufacturing step, a part of a side surface of the unformed multilayer capacitor part is joined and adjacent to the unformed valve action metal foil. It is preferable to conduct between them.
If it does in this way, the area of the part which does not contribute to capacity | capacitance formation by a conduction | electrical_connection part can be reduced, and the surface of unformed valve action metal foil can be used for formation of a capacity | capacitance more effectively.
In this case, in order to obtain stable conduction between the unformed valve-acting metal foils, it is more preferable that the conduction is performed on the opposing side surfaces of the unformed laminated capacitor portion.

In the third and fourth manufacturing methods of the solid electrolytic capacitor according to the present invention, the anode metal plate preparation step includes joining a plurality of the anode metal plates in parallel to a guide plate, In the multilayer capacitor portion manufacturing step, a plurality of unformed multilayer capacitor portions respectively bonded to the anode metal plate are collectively immersed in the chemical conversion solution, and in the solid electrolyte layer forming step, they are respectively bonded to the anode metal plate. It is preferable to immerse a plurality of laminated capacity portions in the polymerization solution all together.
If it does in this way, it will become possible to batch-process a lot of unformed lamination capacity parts, and to form a solid electrolyte layer in a lamination capacity part collectively.

In the third and fourth manufacturing methods of the solid electrolytic capacitor according to the present invention, the anode metal plate preparation step includes a guide along one side of the large anode metal plate by punching a rectangular large anode metal plate. Forming a plurality of anode metal plates integrated with each other and the guide portion, and in the multilayer capacitor portion manufacturing step, a plurality of unformed multilayer capacitor portions respectively joined to the anode metal plates are collectively In the solid electrolyte layer forming step, it is preferable to immerse the plurality of laminated capacity portions respectively immersed in the chemical conversion solution and bonded to the anode metal plate in the solid electrolyte layer forming step.
In this way, it is possible to batch-process a large amount of unformed multilayer capacitor parts and form a solid electrolyte layer in the multilayer capacitor part. Furthermore, a plurality of anode metal plates The number of steps can be reduced by omitting the step of joining the guide plate in parallel with the guide plate.

In the first to fourth manufacturing methods of the solid electrolytic capacitor according to the present invention, the method further includes a bending step of bending the anode lead portion along the multilayer capacitor portion after the conductive layer forming step, and the bending step. It is preferable that an insulating film is formed on a portion of the multilayer capacitor portion facing the bent anode lead portion between the step of forming the conductive layer and the conductive layer.
If it does in this way, it will become possible to bend an anode lead part inside along the said lamination capacity part, and it can be made more compact.

  As described above, according to the present invention, it is possible to provide a solid electrolytic capacitor having a large volume capacity ratio and capable of further miniaturizing and increasing the capacity, and a manufacturing method thereof.

It is a process flow figure of the manufacturing method of the solid electrolytic capacitor of Embodiment 1 concerning the present invention. (A1) is the top view which shows the structure of the large-sized valve action metal laminated sheet 100, The process which produces the laminated capacity part 1 in the manufacturing method of the solid electrolytic capacitor of Embodiment 1 which concerns on this invention is shown, (a2) is a cross-sectional view taken along the line AA ′ in (a1), (b1) is a top view of the multilayer capacitor section 1 cut from the large-sized valve action metal laminate 100, and (b2) is (B1) It is sectional drawing about the BB 'line | wire, (b3) is sectional drawing which expands and shows between the valve action metal foils 1a in the cross section of (b2). In the manufacturing method of Embodiment 1, the process of anodizing the laminated capacitor portion 1 is shown, (a) is a top view when a plurality of anode metal plates 2 are respectively fixed to a metal guide 50; (b) is a top view when the first mask 2a is formed on each of the plurality of anode metal plates 2 fixed to the metal guide 50, and (c1) is a view showing how the stacked capacitor portion 1 is attached to the anode metal plate 2; (C2) is a cross-sectional view taken along the line CC ′ of (c1), and (d) is a diagram at the time of an anodic oxidation process. In the manufacturing method of Embodiment 1, the process which forms the solid electrolyte layer 3 and the conductive layer 4 in the laminated capacity part 1 anodized is shown, (a) is a top view when the 2nd resist 2c is formed. (B1) is a view when the solid electrolyte layer 3 is formed, (b2) is a cross-sectional view of the multilayer capacitor portion 1 on which the solid electrolyte layer 3 is formed, and (c1) is a conductive layer It is a figure when forming the layer 4, (c2) is sectional drawing of the multilayer capacity | capacitance part 1 in which the conductive layer 4 was formed. In the manufacturing method of Embodiment 1, the process of producing a solid electrolytic capacitor from the capacitor | condenser element 10 which consists of the laminated capacity part 1 in which the conductive layer 4 was formed, and the anode metal plate 2 is shown, (a1) was produced It is a top view which shows the structure of the capacitor | condenser element 10, (a2) is a side view of the capacitor | condenser element 10, (b) is a side view when the anode lead part 2t of the capacitor | condenser element 10 is bent, (c) is a side view when the capacitor element 10 is mounted on the substrate 9, and (d) is a cross-sectional view in which the sealing portion 6 is formed on the capacitor element 10 mounted on the substrate 9. It is sectional drawing of the solid electrolytic capacitor produced by the manufacturing method of Embodiment 1 which concerns on this invention. In the manufacturing method of the solid electrolytic capacitor of Embodiment 2 concerning the present invention, after formation of conductive layer 4, it is the top view which formed insulating film 22 on conductive layer 4, respectively. In the manufacturing method of Embodiment 2, the process of producing a solid electrolytic capacitor from the capacitor element 20 is shown, (a1) is a top view of the capacitor element 20, and (a2) is a side view of the capacitor element 20. (B) is a side view when the anode lead part 2t of the capacitor element 20 is bent along the multilayer capacitor part 1, and (c) is a substrate 9 provided with the cathode terminal 7 and the anode terminal 8. 5 is a cross-sectional view in which the capacitor element 20 is mounted on the capacitor element 20 and the sealing section 6 is formed on the entire capacitor element 20 with epoxy resin or the like. It is sectional drawing of the solid electrolytic capacitor of Embodiment 2 which concerns on this invention. It is a process flow figure of the manufacturing method of the solid electrolytic capacitor of Embodiment 3 concerning the present invention. In the manufacturing method of the solid electrolytic capacitor of Embodiment 3 which concerns on this invention, the process of producing a capacitor | condenser element is shown, (a) is the top view which attached the anode metal plate 2 to the metal guide 50 at predetermined intervals. (B1) is a top view in which the laminated capacitor portion 31 is formed in the joining region 2s of the anode metal plate 2, and (b2) is a cross-sectional view taken along the line DD ′ in (b1). It is a process flow figure of the manufacturing method of the solid electrolytic capacitor of Embodiment 4 concerning the present invention. In the manufacturing method of the solid electrolytic capacitor of Embodiment 4 concerning the present invention, the process of producing multilayer capacity part 1 is shown, (a1) is a top view showing the composition of large-sized valve action metal lamination board 100, (A2) is sectional drawing about the EE 'line | wire of (a1), (b) is a top view which shows the structure of the large sized anode metal plate 40, (c) is large sized valve action metal lamination | stacking It is a top view of the multilayer capacitor part 1 cut from the plate 100, (d1) is a top view in which the multilayer capacitor part 1 is attached to the joining region 42s of each anode metal plate 42, (d2) is (d1) (E) is a top view of the metal guide part 50a separated from the large-sized anode metal plate 40. FIG. It is sectional drawing which shows the modification of the solid electrolytic capacitor produced by the manufacturing method of Embodiment 1 which concerns on this invention. In the step of producing a capacitor element of a solid electrolytic capacitor according to a comparative example, a step of anodizing the aluminum foil piece 202 is shown. (A) shows a plurality of anode metal plates 2 fixed to a metal guide 50, respectively. (B) is a top view when the first mask 202a is formed on each of the plurality of anode metal plates 2 fixed to the metal guide 50, and (c) is during the anodizing step. FIG. (D) shows a step of forming a solid electrolyte layer 203, a carbon coating layer 204a, and a silver coating layer 204b on an anodized aluminum foil piece 202 in the step of producing a capacitor element of a solid electrolytic capacitor according to a comparative example. FIG. 5 is a top view when the second resist 202c is formed, (e) is a diagram when the solid electrolyte layer 203 is formed, and (f) is a carbon film layer 204a and a silver film layer 204b formed. It is a figure when doing. In the step of producing the capacitor element of the solid electrolytic capacitor according to the comparative example, the step of producing the capacitor element from the aluminum foil piece 202 on which the solid electrolyte layer 203, the carbon film layer 204a and the silver film layer 204b are formed is shown. (F1) is a top view of the aluminum foil piece 202 on which the solid electrolyte layer 203, the carbon film layer 204a, and the silver film layer 204b are formed, and (f2) is the solid electrolyte layer 203, the carbon film layer 204a, and the silver film. (G1) is a stacking portion in which the aluminum foil pieces 202 shown in (f1) and (f2) are stacked three by three and the three sheets are stacked one by one. It is a top view which shows the laminated body which pinched | interposed the cathode lead frame and the anode lead frame. (G2) shows a stacked body in which the aluminum foil pieces 202 shown in (f1) and (f2) are stacked three by three, and the cathode lead frame 207a and the anode lead frame 202t are sandwiched between the stacked sections. It is sectional drawing. (H1) is a top view of a capacitor element according to a comparative example obtained by sealing the laminate shown in (g1) and (g2) with a sealing resin 206. FIG. (H1) is a cross-sectional view of a capacitor element according to a comparative example obtained by sealing the laminate shown in (g1) and (g2) with a sealing resin 206. FIG.

  Hereinafter, a solid electrolytic capacitor according to an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction and position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or an equivalent part.

As shown in FIG. 6, the solid electrolytic capacitor according to the embodiment of the present invention includes a laminated portion 5, and the laminated portion 5 is made up of a plurality of valve action metal foils 1 a each having a dielectric oxide film d <b> 1 on the surface. It has two laminated capacity parts 1 laminated via an electrolyte layer 3 and an anode metal plate 2 provided between the two laminated capacity parts 1.
In the laminated portion 5, the adjacent valve action metal foils 1 a and between the valve action metal foil 1 a and the anode metal plate 2 are connected by the partially conductive portion 100 b penetrating the dielectric oxide film d 1 and the solid electrolyte layer 3. Yes. In addition, the partial conduction | electrical_connection part 100b is provided in a part of valve action metal foil 1a, and points out the connection point of adjacent valve action metal foil 1a.
Further, the solid electrolyte layer 3 is continuously provided in the gap between the valve action metal foil 1 a, the gap between the valve action metal foil 1 a and the anode metal plate 2, and the outer surfaces of the two laminated capacitor portions 1. A conductive layer 4 composed of a carbon coating layer 4 a and a silver coating layer 4 b is formed on the surface of the solid electrolyte layer 3 formed on the outer surfaces of the two laminated capacitor portions 1, and the silver coating layer 4 b serves as the cathode of the substrate 9. Connected to terminal 7.

On the anode side, the anode lead portion 2t, which is one end portion of the anode metal plate 2, is insulated from the carbon coating layer 4a and the silver coating layer 4b so as to be disconnected from the laminated portion 5, and the anode of the substrate 9 Connected to terminal 8. The laminated portion 5 and the anode lead portion 2t covered with the conductor layer 4 composed of the carbon coating layer 4a and the silver coating layer 4b are sealed with a sealing resin 6.
In addition, the solid electrolytic capacitor according to the embodiment has a second resist 2c (second mask) for preventing the polymerization solution from oozing out (bleeding out) to the anode lead 2t side in the step of forming the solid electrolyte layer 3 described later. 2c).

  In the solid electrolytic capacitor of the embodiment configured in this way, the anode lead portion 2t on the anode side is constituted by a part of the common anode metal plate 2 provided separately from the valve action metal foil 1a, This is different from the conventional solid electrolytic capacitor in that the conductive layer 4 provided on the outer surface of the laminated portion 5 via the solid electrolyte layer 3 is not formed between the adjacent valve action metal foils 1a.

Due to these differences, the solid electrolytic capacitor of this embodiment can effectively and effectively use the entire surface of the valve metal foil 1a for capacity formation.
Further, in the solid electrolytic capacitor of this embodiment, since the anode-side terminal can be constituted by one anode lead part, compared with the conventional structure in which one end part of a plurality of valve action metal foils is bundled to constitute the anode-side terminal. Thus, the volume ratio occupied by the anode lead portion with respect to the total volume of the solid electrolytic capacitor can be reduced, and the size can be reduced.
Furthermore, since the conductive layer 4 is not formed in the gap between the valve action metal foils 1a, the thickness of the laminated portion 5 can be reduced.

  The solid electrolytic capacitor having such a configuration is manufactured by, for example, a manufacturing method described below. Hereinafter, the structure of the solid electrolytic capacitor according to the embodiment of the present invention will be described in detail while explaining the method for manufacturing the solid electrolytic capacitor according to the present invention.

Embodiment 1 FIG.
The manufacturing method of the solid electrolytic capacitor of Embodiment 1 which concerns on this invention includes the following processes shown in FIG.

<Step S1 (preparation of large-sized valve action metal foil)>
A large-sized valve-acting metal foil having a dielectric oxide film formed on the surface is prepared.
In addition, since the specific process of this step 1 is a general process, it is not illustrated.
Specifically, the surface area of the large-sized valve-acting metal foil is increased by forming irregularities by etching. In this etching, for example, unevenness is formed electrochemically by applying an alternating current or a direct current voltage in an etching solution.
In the present specification, the large size of the large-sized valve-acting metal foil refers to a size capable of producing a plurality of laminated portions in an assembled state.
Next, a dielectric oxide film serving as a dielectric is formed on the surface of the etched large-format valve metal foil by anodic oxidation. This anodic oxidation is performed, for example, by applying a DC voltage in the chemical conversion liquid.

<Step S2 (Laminated conduction)>
Next, as shown in FIGS. 2 (a1) and (a2), a predetermined number of large-sized valve-acting metal foils 100a are laminated, and the large-sized valve-acting metal foils 100a are electrically connected to form a large-sized valve-acting metal laminate 100. Make it. This laminated conduction treatment can be conducted in a lump by, for example, resistance welding with the laminated large-sized valve metal foil 100a sandwiched between two electrodes. As the conduction method, a method of conducting in a narrow area such as spot welding is desirable, and a known method such as spot welding using a laser instead of resistance welding can be used. FIG. 2 (a2) shows a cross section taken along the line AA ′ in FIG. 2 (a1). In addition, the partial conduction part 100b is formed at a plurality of locations in the lamination conduction process, and the position of the partial conduction part 100b is cut along the cutting line 100c in the following process to each laminated capacitance part 1. For example, the separated multilayer capacitors 1 are arranged in a matrix so that at least one partial conductive portion 100b is included in the separated multilayer capacitor 1 when separated.

<Step S3 (Cutting)>
As shown in FIG. 2 (b 1), the large-sized valve-acting metal laminate 100 is cut into a plurality of laminate capacitors 1. FIG. 2B2 illustrates a cross section taken along line BB ′ in FIG. As shown in FIG. 2 (b2), the multilayer capacitor portion 1 has a structure in which valve action metal foils 1a and dielectric oxide films d1 are alternately laminated. More specifically, the laminated portion of the two adjacent valve action metal foils 1a is formed on the surface of one valve action metal foil 1a and the one valve action metal foil 1a as shown in FIG. 2 (b3). The dielectric oxide film d1, the dielectric oxide film d1 formed on the surface of the other valve-acting metal foil 1a, and the other valve-acting metal foil 1a are laminated to form one valve-acting metal foil. A polymerization solution for forming the solid electrolyte layer 3 can enter between the dielectric oxide film d1 formed on the surface of 1a and the dielectric oxide film d1 formed on the surface of the other valve action metal foil 1a. There is a gap 3a.
The gap 3a can be naturally formed by superimposing the valve-acting metal foil 1a having unevenness formed by etching on the surface, but is also related to the stress during welding. It is also possible to adjust the size of the gap 3a by adjusting the pressing force sandwiched between the electrodes when forming 100b.

<Step PS1 (preparation of anode metal plate)>
As shown in FIG. 3A, a plurality of anode metal plates 2 constituting the anode of a solid electrolytic capacitor are prepared, and one end portions thereof are fixed to a metal guide 50 by welding or the like. The anode metal plate 2 is made of, for example, a valve-acting metal foil, and the laminated capacitor portion 1 is joined to the other end side. A joining region 2s that is an attachment region of the laminated capacitor portion 1 is a metal guide. It is fixed to the metal guide 50 so as to be separated from the predetermined distance by 50. Although various metal plates can be used as the anode metal plate 2, a metal foil, more preferably a valve action metal foil is preferably used. Moreover, the surface state of the anode metal plate 2 is not particularly limited. However, in the case of a smooth state, the bonding property at the time of laminating a laminated capacitor portion and anode terminal bonding described later is improved. In the following description, a region between one end fixed to the metal guide 50 and the joining region is referred to as a separation region 2d.

<Step PS2 (first resist formation)>
As shown in FIG. 3B, a first resist 2a (first mask 2a) for separating the anode side and the cathode side is surrounded (surrounded) around the anode metal plate 2 in the separation region 2d of the anode metal plate 2. To form. The first resist 2a is made of, for example, polyimide resin, and is formed at a predetermined interval from the bonding region 2s and one end. The first resist 2 a may be previously formed on the anode metal plate 2 and then the anode metal plate 2 may be fixed to the metal guide 50.

<Step S4 (Multilayer Capacitor Joint)>
As shown in FIGS. 3C1 and 3C2, the multilayer capacitor portion 1 is attached to the joining region 2s of the anode metal plate 2 away from the first resist 2a. FIG. 3C2 is a cross-sectional view taken along the line CC ′ in FIG.
The laminated capacitor portion 1 may be bonded to at least one of the front and back surfaces of the anode metal plate 2, but is preferably attached to both the front and back surfaces of the anode metal plate 2 as shown in FIG. .
At the time of attachment, the laminated capacitor portion 1 is joined, for example, by welding so that the valve metal foil 1a is electrically connected to the anode metal plate 2.
Here, there is a gap between the multilayer capacitor portion 1 and the anode metal plate 2 in which a polymerization solution for forming the solid electrolyte layer 3 can enter.

<Step S5 (anodic oxidation)>
As shown in FIG. 3 (d), the laminated capacitor portion 1 attached to the joining region is immersed by immersing it in the chemical conversion liquid L1 up to the first resist 2a, and the side surface of the laminated capacitor portion 1 (valve action metal foil 1a). The anodized portions of the anode metal plate 2 and the side surfaces of the anode metal plate 2 and the separation region 2d located between the bonding region 2s and the first resist 2a are anodized. In addition, when the valve action metal foil which is not anodized is used as the anode metal plate 2, in addition to the side surface of the anode metal plate 2, the surface of the joining region 2s of the anode metal plate 2 is also anodized, and the joining region The surface of 2s also contributes to capacity formation.
Further, during the anodic oxidation, an anodic oxidation separation portion 2b is formed between the junction region 2s and the first resist 2a.

<Step S6 (second resist formation)>
As shown in FIG. 4A, in the anodic oxidation separation portion 2b, the second resist 2c (first portion) is separated from the first resist 2a along the joining region 2s of the anode metal plate 2 to which the multilayer capacitor portion 1 is joined. 2 masks 2c) are formed so as to surround the anode metal plate 2. The second resist 2c prevents the polymerization liquid L2 from seeping out toward the metal guide 50 in the step of forming the solid electrolyte layer 3 described later, and the solid electrolyte layer 3 leaks from the laminated portion 5 after the product is completed. Play the role of not letting out. Similar to the first resist 2a, the second resist 2c is made of, for example, a polyimide resin.

<Step S7 (Solid Electrolyte Layer Formation)>
As shown in FIG. 4 (b1), the solid electrolyte layer 3 to be a cathode layer is formed by dipping in the polymerization liquid L2.
Examples of the method for forming the solid electrolyte layer 3 include chemical oxidation polymerization. In chemical oxidative polymerization, the polymerization liquid L2 is composed of two liquids, a monomer solution and a mixed solution of an oxidant and a dopant. After dipping in the monomer solution, the operation of immersing in the mixed solution of the oxidant and dopant is repeated. The solid electrolyte layer 3 is formed by polymerization.
Here, the second resist 2c is used as a stopper for the polymerization solution L2, and the laminated capacitor portion 1 is immersed in the polymer solution L2, so that the adjacent valve action metal foils 1a of the laminated capacitor portion 1 as shown in FIG. The solid electrolyte layer 3 is continuously formed in the gap 3 a, the gap between the multilayer capacitor 1 and the anode metal plate, and the outer surface of the multilayer capacitor 1.
In FIG. 4 (b2), only the solid electrolyte layer 3 formed on the outer surface of the multilayer capacitor 1 is shown in order to avoid making the diagram complicated, and the gap 3a, the multilayer capacitor 1 and the anode metal plate 2 are shown. Description of the solid electrolyte layer 3 is omitted in the gap between the two. See, for example, FIG. 6 for the form of these omitted parts.

<Step S8 (Conductive Layer Formation)>
As shown in FIG. 4 (c1), first, a carbon film layer 4a is formed on the outer surface of the multilayer capacitor portion 1 (the surface of the solid electrolyte layer 3) located below the second resist 2c using the carbon paste P1. Then, the silver film layer 4b is formed using the silver paste P2.
As described above, as shown in FIG. 4 (c2), the solid electrolyte layer 3 and the carbon film layer are formed outside the laminated portion composed of the anode metal plate 2 and the two laminated capacitor portions 1 provided on both sides thereof. A conductive layer 4 composed of 4a and a silver coating layer 4b is formed. Thereafter, the capacitor element shown in FIGS. 5A1 and 5A2 is manufactured by cutting the metal guide into individual pieces.
5A1 is a top view of the capacitor element 10, and FIG. 5A2 is a side view of the capacitor element 10. FIG.

<Step S9 (Anode Lead Bend)>
As shown in FIG. 5 (b), one end portion of the anode metal plate 2 (cut to a predetermined length if necessary), a portion where the first resist 2a is formed, an anodic oxidation separation portion 2b, a second resist 2c. The anode lead portion 2t composed of the portion where the capacitor is formed is bent along the multilayer capacitor portion 1, and further, the tip portion thereof is bent so as to be positioned substantially on the same plane as the lower surface of the multilayer capacitor portion 1.

<Step S10 (Board Mounting / Sealing)>
As shown in FIG. 5C, a capacitor element 10 is mounted on a substrate 9 provided with a cathode terminal 7 and an anode terminal 8, and as shown in FIG. 5D, the entire capacitor element 10 is made of epoxy resin or the like. Then, the sealing part 6 is formed.
In FIG. 5D, the conductive layer 4 and the anode lead portion 2t are not illustrated, but are electrically separated by, for example, an oxide film.
For example, the conductive layer 4 and the anode lead portion 2t of the capacitor element 10 are bonded to the cathode terminal 7 and the anode terminal 8 with a conductive adhesive, for example.

As described above, the solid electrolytic capacitor of Embodiment 1 is manufactured.
In the above description, specific embodiments have been described. However, it goes without saying that various modifications can be made without departing from the scope of the present invention.

FIG. 14 shows a modification of the solid capacitor according to the first embodiment. The capacitor element shown in FIG. 6 has one partial conductive portion 100b at the center in the left-right direction in the figure, whereas the capacitor element shown in FIG. There are a total of two partial conducting portions 100b in the vicinity. In order to achieve such a configuration, in the laminated conduction processing step of step S2, the position of the partial conduction part 100b may be arranged so that two conduction parts are respectively included in the laminated capacitor part 1 after cutting. .
Further, in the solid electrolytic capacitor of FIG. 6, the anode terminal 8 and the cathode terminal 7 are arranged with a refracting portion (in a U shape) so as to pass through the side surface of the substrate 9, but the solid electrolytic capacitor of FIG. In the capacitor, the anode terminal 8 and the cathode terminal 7 are disposed so as to penetrate the substrate 9.
With the terminal structure shown in FIG. 14, for example, in the step S10, a large substrate on which a plurality of capacitor elements 10 can be mounted is prepared, and the plurality of capacitor elements 10 are mounted on the large substrate and collectively. After sealing with resin, it can be produced by dividing into individual solid electrolytic capacitors.

Embodiment 2. FIG.
Hereinafter, the manufacturing method of the solid electrolytic capacitor of Embodiment 2 which concerns on this invention is demonstrated.
The manufacturing method of the solid electrolytic capacitor of the second embodiment is the same as that of the first embodiment up to step S7 in which the carbon film layer 4a and the silver film layer 4b are formed on the cathode portion, and the subsequent processes are the same as those of the first embodiment. Is different.
Hereinafter, steps different from those of the first embodiment will be described.

<Step 2S8 (Conductive layer and insulating film formation)>
In Step 2S8 of the second embodiment, after forming the conductive layer 4 composed of the carbon film layer 4a and the silver film layer 4b on the outer surface of the multilayer capacitor portion 1, as shown in FIG. An insulating film 22 made of, for example, polyimide resin is formed on the layer 4 by, for example, roller coating or the like, and separated from the metal guide 50 into individual pieces.
As described above, the capacitor element 20 of the second embodiment shown in FIGS. 8A1 and 8A2 is manufactured.

<Step 2S9 (Anode lead part bending)>
As shown in FIG. 8B, the anode lead portion 2 t of the anode metal plate 2 is bent along the laminated capacitor portion 1, and the tip portion thereof is bent inward along the insulating film 22.

Step 2 S10 (Board mounting / sealing)
As shown in FIG. 8C, the capacitor element 20 is mounted on the substrate 9 provided with the cathode terminal 7 and the anode terminal 8, and the entire capacitor element 20 is covered with an epoxy resin or the like to form the sealing portion 6. .

Since the solid electrolytic capacitor of the second embodiment manufactured as described above is bent inward along the insulating film 22 at the tip of the anode lead portion 2t, the solid electrolytic capacitor of the first embodiment is bent outward. In comparison, the area that does not contribute to capacity formation can be further reduced, and the volume capacity ratio can be increased.
Also in the second embodiment, for example, in the process of step 2S10, a large substrate on which a plurality of capacitor elements 20 can be mounted is prepared, and the plurality of capacitor elements 20 are mounted on a large substrate and collectively sealed with resin. Then, it may be divided into individual solid electrolytic capacitors.
In this case, for example, the conductive layer 4 of the capacitor element is connected to a cathode electrode 7a formed on the surface of the substrate 9 so as to be electrically connected to the cathode terminal 7 as shown in FIG. It is connected to an anode electrode 8 a formed on the surface of the substrate 9 so as to be electrically connected to the terminal 8.
In the embodiment of FIG. 9, the partial conducting portions 100 b are provided in total near two ends in the left-right direction.

Embodiment 3 FIG.
Hereinafter, the manufacturing method of the solid electrolytic capacitor of Embodiment 3 which concerns on this invention is demonstrated.
In the method of manufacturing the solid electrolytic capacitor according to the third embodiment, as illustrated in FIG. 10, the steps of manufacturing the multilayer capacitor section are changed from steps S1 to S4 to manufacture the multilayer capacitor section 1 of the first embodiment to steps 3S1 to S3. Other than the replacement, the second embodiment is the same as the first embodiment.
Hereinafter, steps different from those of the first embodiment will be described.

  As in step PS1 of the first embodiment, the anode metal plate 2 is attached to the metal guide 50 at a predetermined interval as shown in FIG. 11A, and the first resist is formed in the same manner as in step PS2 of the first embodiment. 2a is formed.

<Step 3S1 (Valve action metal foil piece preparation)>
A plurality of laminated valve action metal foils each having a dielectric oxide film formed on the surface and cut to the size of the laminated capacitor portion are prepared.

<Step 3S2 (valve action metal foil piece sticking)>
Then, as shown in FIGS. 11 (b1) and 11 (b2), a plurality of valves that are cut to the size of the laminated capacitor portion on at least one surface, preferably both surfaces, of the joining region 2s of the anode metal plate 2 respectively. The laminated metal part 31 is produced by stacking and pasting the working metal foil 31a.

<Step 3S3 (lamination conduction)>
The laminated portion is formed by a U-shaped (cornered U-shaped) metal fixture 32 made of, for example, a valve metal provided on the side surface of the laminated portion comprising the anode metal plate 2 and the laminated capacitor portion 31 formed on both surfaces thereof. Is sandwiched in the thickness direction, and the part is ultrasonically bonded, for example.
In this way, the laminated capacitor portion 31 in which the valve action metal foil 31a is electrically connected by the metal fixture 32 is produced. Thereafter, the multilayer capacitor 31 is joined to the joining region 2 s of the anode metal plate 2, and the metal fixture 32 also conducts between the anode metal plate 2 and the valve action metal foil 31 a.
Hereinafter, the solid electrolytic capacitor is manufactured by the same procedure as that in step S5 and subsequent steps of the first embodiment.

  Since the solid electrolytic capacitor according to the third embodiment is joined at the side surface portion using ultrasonic bonding in the conduction process for producing the multilayer capacitor portion 31, the entire main surface of the valve-acting metal foil 31a is used for capacitance formation. it can. Therefore, according to the manufacturing method of the third embodiment, the capacity per volume can be further improved as compared with the first and second embodiments.

Embodiment 4 FIG.
Hereinafter, the manufacturing method of the solid electrolytic capacitor of Embodiment 4 which concerns on this invention is demonstrated.
In the method of manufacturing the solid electrolytic capacitor according to the fourth embodiment, as shown in FIG. 12, the preparation of the metal guide and the anode metal plate and the attaching process of the laminated capacitor portion to the anode metal plate are performed in steps PS1, The second embodiment is the same as the first embodiment except that PS2 is replaced with steps 4PS1 and 4PS2 and step S4 is replaced with steps 4S4a and 4S4b, respectively.
Hereinafter, steps different from those of the first embodiment will be described.
FIGS. 13A1 and 13B show the manufacturing process of the multilayer capacitor unit 1 except that two partial conductive portions 100b are formed for one multilayer capacitor unit 1. FIG. Since this is the same as that of the first embodiment, the description thereof is omitted.

<Step 4PS1 (preparation of large-format anode metal plate)>
Here, as shown in FIG. 13B, for example, an anode metal plate made of a large-sized valve action metal foil is prepared, and a portion used as a metal guide portion 50a and a plurality of anodes are formed by punching (pressing) processing. A large-sized anode metal plate 40 integrated with the metal plate 42 is produced. Specifically, the punched portion H1 is formed so that the plurality of anode metal plates 42 are connected only on the metal guide portion 50a side and separated at other portions.

<Step 4 PS2 (resist formation)>
In the large-sized anode metal plate 40, as shown in FIG. 13B, a resist 42c corresponding to the second resist 2c in the first embodiment or the like is formed on the metal guide portion 50a side of the anode metal plate 42. Note that a bonding region 42s similar to that of the first embodiment is secured at the tip of the resist 42c.

<Step 4S4a (lamination of laminated capacity part)>
As shown in FIGS. 13D1 and 13D2, the laminated capacitor portion 1 is attached to the joining region of each anode metal plate 42 separately from the metal guide portion 50a. FIG. 13 (d2) is a cross-sectional view taken along the line FF ′ of FIG. 13 (d1).

<Step 4S4b (metal guide part separation)>
By cutting the large-sized anode metal plate 40 along the dividing line 51 shown in FIG. 13 (d1), the large-size anode metal plate 40 is separated for each metal guide portion 50a as shown in FIG. 13 (e).
Hereinafter, as shown in FIG. 13E, the solid electrolytic capacitor according to the fourth embodiment is manufactured using a metal guide portion 50a in which a plurality of multilayer capacitor portions 1 are attached. Step 5
Subsequent processes are the same as those in the first embodiment except that the first resist is formed instead of the second resist formation in step 6 in the first embodiment.
In the fourth embodiment, the anodization by the chemical conversion treatment in step S5 shown in FIG. 12 is performed before separation for each metal guide portion 50a, and after separation for each metal guide portion 50a, the solid electrolyte of step S7 is performed. Formation may be performed.

As described above in detail, in any of the solid electrolytic capacitor manufacturing methods according to Embodiments 1 to 4 according to the present invention, the gap 3a into which the polymerization liquid L2 enters is formed between the valve action metal foils 1a. The laminated capacitor portion 1 is produced and joined to the joining region of the anode metal plate 2. And by immersing the joining area | region of the laminated capacity part 1 and the anode metal plate 2 in the polymerization liquid L2, the clearance gap 3a between the valve action metal foils 1a adjacent, between the laminated capacity part 1 and the anode metal plate 2 is obtained. The solid electrolyte layer 3 is formed on the gap and the outer surface of the laminated portion 5.
As a result, the solid electrolyte layer 3 can be formed in a single polymerization step on the plurality of valve action metal foils 1a constituting the laminated portion 5, and a solid electrolyte layer is formed for each valve action metal foil 1a. Compared with the conventional manufacturing method, the polymerization process can be simplified.
Moreover, the lamination | stacking part 5 can be produced, without forming the conductive layer 4 in the clearance gap 3a between adjacent valve action metal foil 1a.
Further, conventionally, since a part of the valve metal foil is used as the anode lead, the entire surface of the valve metal foil cannot be used for capacity formation. In the method of manufacturing the solid electrolytic capacitor 4, the entire multilayer capacitor part 1 is polymerized by joining the multilayer capacitor part 1 to the joining region 2 s of the anode metal plate 2 having the anode lead part 2 t and immersing it in the polymerization liquid L 2. It becomes possible to immerse in the liquid L2, and the whole surface of several valve action metal foil 1a can be utilized for capacity | capacitance formation.
Furthermore, since the anode portion can be formed by the anode lead portion 2t of the anode metal plate without forming the anode lead by bundling one end portions of the plurality of valve action metal foils 1a, the volume occupied by the anode lead portion 2t can be reduced.

  From these things, according to the manufacturing method of the solid electrolytic capacitor of Embodiments 1-4 according to the present invention, it is possible to manufacture a solid electrolytic capacitor having a high volume capacity ratio and capable of being reduced in size and increased in capacity.

In the manufacturing method of the solid electrolytic capacitors of Embodiments 1 to 4 according to the present invention described above, the large-valve action metal foil 100a on which the dielectric oxide film is formed or the dielectric oxide film is formed and the size of the multilayer capacitor portion is increased. After preparing a plurality of cut valve action metal foils, a solid electrolytic capacitor was produced through a lamination conduction process.
However, the present invention is not limited to this, and a plurality of unformed large size metal foils having no dielectric oxide film formed thereon or a plurality of unformed sheets having a size of a laminated capacitor portion having no dielectric oxide film formed thereon. After preparing the valve action metal foil, it may be subjected to a chemical conversion treatment in an anodic oxidation process after a lamination conduction process to produce a solid electrolytic capacitor.
Hereinafter, a method for manufacturing a solid electrolytic capacitor according to a modification of the present invention will be described.

Modification 1
In the manufacturing method of the solid electrolytic capacitor of Modification 1 according to the present invention, the manufacturing method of Embodiment 1 according to the present invention is modified as follows.
In the following description, a part changed from the manufacturing process of the first embodiment is described, and a part not described is the same as the manufacturing process of the first embodiment.

First, in step S1, instead of the large-sized valve action metal foil 100a on which the dielectric oxide film is formed, a large-sized unformed valve metal foil on which the dielectric oxide film is not substantially formed is prepared.
Specifically, after forming irregularities by etching on the surface of the large unformed valve metal foil to increase the surface area, the next step S2 is performed without anodizing.

  In step S2, a predetermined number of large-sized unformed valve metal foils are laminated and the large-sized unformed valve metal foils are connected to each other to produce a large-sized unformed valve metal laminate. This laminated conduction treatment can be conducted in a lump by, for example, laminating large laminated unformed valve metal foils between two electrodes and resistance welding. Since the dielectric oxide film is not formed on the surface of the metal foil, the bondability is good and reliable conduction is easily obtained.

In step S3, the large unformed valve-acting metal laminate is cut into a plurality of unformed laminate capacitors.
At this time, in the unformed laminated capacity part, a gap into which the forming solution and the polymerization solution can enter is formed between the unformed valve action metal foils.

  Thereafter, after performing steps PS1 and PS2 similar to those of the first embodiment, an unformed multilayer capacitor portion is attached to the junction region of the anode metal plate 2 instead of the multilayer capacitor portion 1 in step S4.

  Then, in step S5, the unformed layered capacitor is immersed in the chemical conversion liquid L1, and the entire surface of the unformed valve action metal foil of the unformed layered capacitor, the side surface of the anode metal plate 2, the bonding region 2s, and the first resist. The part which becomes the anodic oxidation separation part 2b in the separation region 2d located between 2a is anodized.

Thereafter, a solid electrolytic capacitor is produced in the same manner as in the first embodiment.
The manufacturing method of the solid electrolytic capacitor of the above modification 1 has the same operation effect as the manufacturing method of Embodiment 1, and also has good bondability when the laminated large-sized unformed valve metal foil is conducted. it can.

Modification 2
In the manufacturing method of the solid electrolytic capacitor of the modification 2 which concerns on this invention, it changes as follows in the manufacturing method of Embodiment 3 which concerns on this invention.
In the following description, a part changed from the manufacturing process of the third embodiment is described, and a part not described is the same as the manufacturing process of the third embodiment.

  First, in step 3S1, instead of a plurality of valve action metal foils having a dielectric oxide film formed on the surface, a plurality of unformed valve action metal foils cut to the size of the laminated capacity portion are prepared.

  In step 3S2, a plurality of unformed valve-acting metal foils each cut to the size of the stacked capacity portion are stacked and pasted to produce an unformed stacked capacity portion.

In step 3S3, a U-shaped (corner U-shaped) metal fixing made of, for example, a valve action metal provided on the side surface of the laminated portion composed of the anode metal plate 2 and the unformed laminated capacitance portion formed on both sides thereof. The laminated portion is sandwiched in the thickness direction by the tool 32, and the portion is ultrasonically bonded, for example.
In this manner, an unformed multilayer capacitor portion in which the unformed valve action metal foil is electrically connected by the metal fixture is produced.
Thereafter, a solid electrolytic capacitor is manufactured in the same procedure as in the first modification.
The manufacturing method of the solid electrolytic capacitor of Modification 2 described above has the same function and effect as the manufacturing method of Embodiment 3, and can improve the bondability when conducting the laminated unformed valve metal foil. .

Modification 3
In the method for manufacturing a solid electrolytic capacitor of Modification 3 according to the present invention, an unformed multilayer capacitor part was produced in the same manner as in Modification 1, and the unformed multilayer capacitor part was prepared in the same manner as in Embodiment 4. A solid electrolytic capacitor is manufactured by attaching to the anode metal plate 42 of the anode metal plate in the same manner as in the first modification.
The manufacturing method of the solid electrolytic capacitor of Modification 3 described above has the same function and effect as the manufacturing method of Embodiment 4, and can further improve the bondability when conducting the laminated unformed valve metal foil. .

Examples according to the present invention will be described below.
In the following examples, Examples 1 to 4 are based on the manufacturing methods of Embodiments 1 to 4, respectively.

Example 1.
In Example 1, a large-sized chemical conversion aluminum foil (3V chemical product) previously anodized in Step S1 of Embodiment 1 was used as the large-format valve action metal foil 100a. Hereinafter, the manufacturing procedure of the solid electrolytic capacitor of Example 1 will be described.
In this example, first, three large-sized chemical conversion aluminum foils having a thickness of 110 μm were stacked and welded by resistance welding (FIGS. 2A and 2B).
Resistance welding electrodes were performed using a 1.6 mm diameter circular electrode. The area disappeared by welding was 10%.
In addition, resistance welding arrange | positioned so that one connection part may be formed in the laminated capacity part 1 after a cutting | disconnection.

The welded large-sized valve action metal laminate 100 was cut into a laminate capacity portion 1 having a width of 3.5 mm and a length of 5.5 mm.
Separately, as shown in FIG. 3B, an anode aluminum foil welded to a metal guide 50 is used as the anode metal plate 2, and a masking material (polyimide resin) that separates the anode portion and the cathode portion from the anode aluminum foil. ) Was applied in a linear form with a width of 0.8 mm at a position of 6.5 mm from the tip of the aluminum foil not fixed to the guide and dried at 180 ° C. for 1 hour to form a first resist 2a.

And as shown in FIG.3 (c), the lamination | stacking capacity | capacitance part 1 which laminated | stacked the chemical conversion aluminum foil on the anode metal plate 2 consisting of the anode aluminum foil welded to the metal guide 50 was welded to each front and back.
Next, as shown in FIG. 3 (d), anodization (current density 5 mA / cm 2 in 9 mass% ammonium adipate aqueous solution, formation voltage 3) is performed on the portion from the tip of the multilayer capacitor 1 to the first resist 2 a. 0.5 V, temperature 65 ° C. for 10 minutes), washed with water and dried.

Further, as shown in FIG. 4A, a masking material (polyimide resin) was applied linearly to a width of 0.8 mm and dried at 180 ° C. for 1 hour to form a second resist 2c.
After forming the second resist 2c, (i) immersed in an isopropanol solution (solution 1) containing 3,4-ethylenedioxythiophene, pulled up and left standing,
(Ii) immersing in an aqueous solution (solution 2) containing ammonium persulfate;
The oxidative polymerization operation was repeated 20 times,
Next, after washing with warm water of 50 ° C., the solid electrolyte layer 3 was formed by drying at 100 ° C.

Finally, a conductive layer 4 is formed with a carbon paste or a silver paste on the solid electrolyte layer 3 to be a cathode portion, and then this capacitor element is mounted on the substrate 9 and sealed with a resin 6 to thereby obtain a figure. A solid electrolytic capacitor having the configuration shown in FIG.
Specifically, the anode lead portion 2t without the solid electrolyte layer is bent, joined to the anode terminal portion and the cathode terminal portion on the printed circuit board with a conductive adhesive, and the whole is sealed with an epoxy resin. The element was cut. The device was aged by applying a voltage of 2 V at 135 ° C. to produce a total of 10 chip-type solid electrolytic capacitors.

The average volume, initial characteristics, and volume capacity ratio of the solid electrolytic capacitor elements were evaluated.
The results are shown in Table 1.

Example 2
In Example 2, a solid electrolytic capacitor was produced in the same manner as in Example 1 except for the following points.
(Differences from Example 1)
(I) After applying the silver paste, as shown in FIG. 7, a polyimide resin is applied onto one side of the surface on which the silver film layer 4b is applied, and dried at 180 ° C. for 1 hour to form the insulating film 22 Formed.
(Ii) As shown in FIG. 8, after being removed from the metal guide 50, the anode lead portion 2t is bent along the laminated capacitor portion 1 on the side where the insulating film 22 (polyimide resin) is applied, and the anode on the printed circuit board. The terminal 8 and the cathode terminal 7 were joined with a conductive adhesive.
(Iii) Thereafter, the whole was sealed with an epoxy resin and cut for each solid electrolytic capacitor.

In Example 2, after the process until the silver paste is applied, and after cutting for each solid electrolytic capacitor, a voltage of 2 V is applied at 135 ° C. and aged to obtain a total of 10 chip-type solid electrolytic capacitors. The points were the same as in Example 1.
The average volume, initial characteristics, and volume capacity ratio of the solid electrolytic capacitor elements were evaluated.
The results are shown in Table 1.

Example 3
In Example 3, ten solid electrolytic capacitors were produced according to the manufacturing method of the third embodiment.
Specifically, as shown in FIG. 11A, unformed aluminum foil was fixed to the metal guide 50 as the anode metal plate 2.
A masking material (polyimide resin) for separating the anode part and the cathode part was linearly applied to the anode aluminum foil welded to the metal guide 50 from a position of 6.5 mm from the end of the laminated part to a width of 0.8 mm, and 180 ° C. And dried for 1 hour to form a first resist 2a.
And as shown in FIG.11 (b), the joining area | region of the anode metal 2 which consists of a chemical conversion aluminum foil (valve action metal foil 31a) cut | disconnected by width 3.5mm and length 5.5mm from unconverted aluminum foil The laminated capacitor part 31 was formed by superimposing three sheets on each of the two surfaces.
And the side surface of the laminated part which consists of the anode metal plate 2 which consists of unformed aluminum foil, and the laminated capacity part 31 formed in the both surfaces was pinched | interposed with the U-shaped aluminum plate, and was joined by ultrasonic welding.

Thereafter, ten solid electrolytic capacitors of Example 3 were produced in the same manner as Example 1.
Then, in the same manner as in Example 1, after aging, the average volume, initial characteristics, and volume capacity ratio of the solid electrolytic capacitor elements were evaluated.
The results are shown in Table 1.

Example 4
In Example 4, ten solid electrolytic capacitors were produced according to the manufacturing method of the fourth embodiment.
Specifically, as in Example 1, as shown in FIGS. 13 (a1) and (a2), three large-sized chemical-formed aluminum foils are overlapped and welded by resistance welding, and the large-sized valve action metal laminate 100 is formed. Produced. And the large-sized valve action metal laminated board 100 was cut | judged, and the lamination | stacking capacity | capacitance part 1 (width 3.5mm x length 5.5mm) was produced.

  On the other hand, as shown in FIG. 13B, a large-sized aluminum foil is prepared as the large-sized anode metal plate 40, and a portion used as the metal guide portion 50a and a plurality of anode metal plates 42 are formed by punching (pressing) processing. A large-sized anode metal plate 40 in which is integrated.

In the large-sized anode metal plate 40, as shown in FIG. 13B, a second resist 42c was formed on the metal guide portion 50a side of the anode metal plate 42 in the same manner as in Example 1 or the like.
Then, as shown in FIGS. 13 (d 1) and (d 2), the multilayer capacitor portion 1 was attached to the joining region of the anode metal plate 42 separately from the metal guide portion 50 a.

And as shown in FIG.13 (e), the large-sized anode metal plate 40 was cut | disconnected for every metal guide part 50a by cut | disconnecting with the dividing line 51. FIG.
Hereinafter, 10 solid electrolytic capacitors of Example 4 were produced in the same manner as in Example 1 and the like, and after aging in the same manner as in Example 1, the average volume and initial characteristics of the produced 10 solid electrolytic capacitor elements were obtained. The volume capacity ratio of the solid electrolytic capacitor element was evaluated.

Comparative Example A solid electrolytic capacitor of a comparative example was produced as follows.
First, as shown in FIG. 15 (a), a formed aluminum foil having a thickness of 110 μm cut to a width of 3.5 mm is further cut to a length of 13 mm, and one short side portion of the formed aluminum foil piece 202 is cut. Was fixed to the metal guide 50 by welding.

  Next, prior to chemical conversion treatment of the cut surface of the chemically formed aluminum foil piece 202 cut as shown in FIG. 15 (b), a polyimide resin solution (manufactured by Ube Industries) is placed at a position 7 mm from the tip not fixed to the guide 50. Was linearly drawn to a width of 0.8 mm and dried at about 180 ° C. for 30 minutes to form a polyimide resin resist 202a.

Next, as shown in FIG. 15C, the portion from the tip of the aluminum foil piece 202 not fixed to the metal guide 50 to the applied polyimide resin resist 202a is immersed in the chemical conversion liquid L1 to anodic oxidation. Part 202b was formed.
Further, as shown in FIG. 16 (d), polyimide resin is linearly applied to a width of 0.8 mm centering on a portion 5 mm from the tip of the anodized aluminum foil piece 202 and dried at 180 ° C. for 1 hour. Thus, a second polyimide resin resist 202c was formed.

Next, as shown in FIG. 16 (e), the same polymerization liquid L2 as in Example 1 was used for the cathode portion of the aluminum foil piece 202 up to the second polyimide resin resist 202c (3.5 mm × 4.6 mm). A solid electrolyte layer 203 was formed under the same conditions.
Further, as shown in FIG. 16 (e), the carbon coating layer 204a and the silver coating layer 204b are formed on the solid electrolyte layer 203 of the cathode portion using the carbon paste P201 and the silver paste P202 under the same conditions as in Example 1. did. Thereafter, by removing from the metal guide 50, the capacitor element shown in FIGS. 17 (f1) and (f2) is manufactured.

Next, a laminated body in which three capacitor elements were stacked was produced, and as shown in FIGS. 17G1 and 17G2, both surfaces of the cathode lead frame 207a and the anode lead frame 202t were sandwiched between the laminated bodies. And it sealed with the sealing resin 206 as shown in FIG. 17 (h1) and (h2).
Here, the cathode lead frame 207a and the cathode portion 204b are joined with a silver paste, and welding is performed between the aluminum foil pieces 202 and between the aluminum foil pieces 202 and the anode lead frame 202t at portions where the solid electrolyte layer 203 is not formed. It joined by.
The completed solid electrolytic capacitor was aged in the same manner as in the Examples, and then the average volume, initial characteristics, and volume capacity ratio of the solid electrolytic capacitor elements were evaluated. The results are shown in Table 1 together with Examples 1-4.

Table 1

  As shown in Table 1, it was confirmed that all of the solid electrolytic capacitors of Examples 1 to 4 according to the present invention can reduce the volume of the element and increase the volume capacity ratio.

DESCRIPTION OF SYMBOLS 1, 31 Stacking capacity | capacitance part 1a, 31a Valve action metal foil 2, 42 Anode metal plate 2a 1st resist 2c 2nd resist 2s Joint area | region 2d Separation area | region 2b Anodization separation part 2t Anode lead part 3 Solid electrolyte layer 3a Gap | interval 4 Conduction Layer 4a Carbon coating layer 4b Silver coating layer 5 Laminating portion 6 Sealing portion 7 Cathode terminal 7a Cathode electrode 8 Anode terminal 8a Anode electrode 9 Substrate 10 Capacitor element 22 Insulating film 32 Metal fixture 50 Metal guide 50a Metal guide portion 100 Large-sized valve-acting metal laminate 100a Large-sized valve-acting metal foil 100b Partial conducting portion 100c Cutting line 202 Aluminum foil piece 202a Polyimide resin resist 202b Anodized portion 202c Second polyimide resin resist 202t Anode lead frame 203 Solid electrolyte layer 204a Carbon coating layer 204b Silver film layer 206 Sealing resin 2 7a cathode lead frame d1 dielectric oxide L1 anodizing solution L2 polymerization solution P1 carbon paste P2 silver paste P201 carbon paste P202 silver paste

Claims (18)

A plurality of valve action metal foils having a dielectric oxide film on the surface are laminated with a gap, and the valve action metal foils adjacent in the thickness direction are electrically connected by a partial conducting portion formed by spot welding . A laminated capacitor;
An anode metal plate having an anode lead portion and a joining region;
The laminated capacitor part is electrically connected to at least one surface of the joining region of the anode metal plate by a partial conduction part with a gap,
A solid electrolyte layer is continuously formed on the gap between the valve action metal foil, the gap between the anode metal plate and the laminated capacitor, and the outer surface of the laminated capacitor,
A solid electrolytic capacitor, wherein a conductive layer is formed so as to cover an outer surface of the solid electrolyte layer and to be electrically insulated from an anode lead portion of the anode metal plate.   2. The solid electrolytic capacitor according to claim 1, wherein the adjacent valve action metal foils are electrically connected at a side surface of the multilayer capacitor portion.   The multilayer capacitor portion includes first and second multilayer capacitor portions, the first multilayer capacitor portion is connected to one surface of the anode metal plate, and the other surface of the anode metal plate is The solid electrolytic capacitor according to claim 1, wherein the second multilayer capacitor is connected. Preparing a plurality of valve action metal foils having a dielectric oxide film on the surface, a valve action metal foil preparation step, and a valve action metal foil lamination step of laminating the plurality of valve action metal foils with a gap into which a polymerization solution can enter And a laminated capacitor part producing step for producing a laminated capacitor part through a conducting part forming step of electrically connecting between the valve action metal foils adjacent in the thickness direction by a partially conducting part formed by spot welding , and
An anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region;
The laminated capacity part is joined to at least one surface of the joining area of the anode metal plate with a gap through which a polymerization solution can enter, and the joining area of the anode metal plate and the valve action metal foil of the laminated capacity part are partially joined. An anode metal plate to be electrically connected by a conductive portion and a laminated capacitor portion connecting step;
By immersing the anode metal plate and the laminated capacitor part together in a polymerization solution, a gap between the valve metal foils, a gap between the anode metal plate and the laminated capacitor part, and an outer surface of the laminated capacitor part A solid electrolyte layer forming step for continuously forming a solid electrolyte layer;
A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed in a state of being electrically insulated from the lead portion of the anode metal plate;
The manufacturing method of the solid electrolytic capacitor characterized by including this. The valve action metal foil preparation step and the valve action metal foil lamination step are performed in the state of a large-size valve action metal foil so as to give the valve action metal foil for a plurality of solid electrolytic capacitors,
The conduction part forming step includes a step of forming the conduction part so as to be distributed at a plurality of locations of the large-sized valve action metal foil,
The multilayer capacitor portion manufacturing step further includes a step of taking out a plurality of the multilayer capacitor portions by dividing a large-sized valve metal foil so that each of the multilayer capacitor portions includes at least one conduction portion. Item 5. A method for producing a solid electrolytic capacitor according to Item 4. An anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region;
Preparing a plurality of valve action metal foils having a dielectric film on the surface, a valve action metal foil preparation step;
Spot welding between the valve action metal foil laminating step of laminating the plurality of valve action metal foils with a gap into which a polymerization solution can enter and the valve action metal foil adjacent in the thickness direction on the joining region of the anode metal plate A multilayer capacitor part manufacturing step of manufacturing a multilayer capacitor part through a conductive part forming step electrically connected by a partial conductive part formed by :
An anode metal plate for electrically connecting the junction region of the anode metal plate and the valve-acting metal foil of the multilayer capacitor portion by a partial conduction portion; and a multilayer capacitor portion connection step;
By immersing the anode metal plate and the laminated capacitor part together in a polymerization solution, a gap between the valve metal foils, a gap between the anode metal plate and the laminated capacitor part, and an outer surface of the laminated capacitor part A solid electrolyte layer forming step for continuously forming a solid electrolyte layer;
A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed in a state of being electrically insulated from the lead portion of the anode metal plate;
The manufacturing method of the solid electrolytic capacitor characterized by including this.   The method for manufacturing a solid electrolytic capacitor according to claim 6, wherein in the multilayer capacitor part manufacturing step, a part of a side surface of the multilayer capacitor part is joined to electrically connect adjacent valve action metal foils.   The method for manufacturing a solid electrolytic capacitor according to claim 7, wherein, in the multilayer capacitor portion manufacturing step, adjacent valve action metal foils are joined to each other on opposite side surfaces of the multilayer capacitor portion and electrically connected. The anode metal plate preparation step includes joining a plurality of the anode metal plates in parallel to a guide plate,
The solid electrolytic capacitor according to any one of claims 4 to 8, wherein, in the solid electrolyte layer forming step, a plurality of laminated capacitor portions respectively joined to the anode metal plate are collectively immersed in the polymerization solution. Manufacturing method. The anode metal plate preparation step includes forming a plurality of anode metal plates integrated with a guide portion along one side of the large-size anode metal plate and the guide portion by punching a rectangular large-size anode metal plate. Including
The solid electrolytic capacitor according to any one of claims 4 to 8, wherein a plurality of laminated capacitor portions respectively bonded to the anode metal plate are collectively immersed in the polymerization solution in the solid electrolyte layer forming step. Production method. Preparing a plurality of unformed valve action metal foil, an unformed valve action metal foil preparation step;
An unformed valve action metal foil laminating step of laminating the plurality of unformed valve action metal foils with a gap into which a chemical forming solution and a polymerization solution can enter; and
An unformed multilayer capacitor part is produced through a conducting part forming step of electrically connecting the unformed valve-acting metal foils adjacent to each other in the thickness direction by a partially conducting part formed by spot welding. Production process;
An anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region;
The unformed multilayer capacitor portion is joined to at least one surface of the joining region of the anode metal plate with a gap into which the chemical conversion solution and the polymerization solution can enter, and the junction region of the anode metal plate and the valve of the unformed laminate capacitor portion An anode metal plate for electrically connecting the working metal foil with the partially conducting portion and the unformed laminated capacitor portion connecting step;
The gap between the valve metal foils, the gap between the anode metal plate and the multilayer capacitor part, and the multilayer capacitor part are obtained by immersing the unchemically laminated capacitor part and the anode metal plate in the chemical conversion solution and performing anodization. A multilayer capacitor part manufacturing step of forming a dielectric oxide film on the outer surface of
By immersing the multilayer capacitor part in a polymerization solution, the gap between the valve action metal foils, the gap between the anode metal plate and the multilayer capacitor part, and the dielectric oxide film on the outer surface of the multilayer capacitor part. A solid electrolyte layer forming step for forming a solid electrolyte layer,
A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed via a solid electrolyte layer;
The manufacturing method of the solid electrolytic capacitor characterized by including this. The unformed valve action metal foil preparation step and the unformed valve action metal foil lamination step are performed in the state of a large format valve action metal foil so as to give the unformed valve action metal foil for a plurality of solid electrolytic capacitors. And
The conduction part forming step includes a step of forming the conduction part so as to be distributed at a plurality of locations of the large-sized valve action metal foil,
The unformed multilayer capacitor part manufacturing step includes a step of taking out a plurality of the multilayer capacitor parts by dividing the large-sized valve action metal foil so that each of the unformed multilayer capacitor parts includes at least one conduction part. The method for producing a solid electrolytic capacitor according to claim 11, further comprising: An anode metal plate preparation step of preparing an anode metal plate having an anode lead portion and a joining region;
Preparing a plurality of unformed valve action metal foil, an unformed valve action metal foil preparation step;
The plurality of unformed valve action metal foils are formed on the joining region of the anode metal plate, between the plurality of unformed valve action metal foils, and between the unformed valve action metal foil and the anode metal plate, respectively. And a valve action metal foil laminating step for laminating so as to have a gap into which the polymerization solution can enter, and
Partially forming the unformed multilayer capacitor part and the anode metal plate in which the unformed valve action metal foils adjacent to each other in the thickness direction are electrically connected to each other by a partial conducting part formed by spot welding. Electrically connecting with the conductive part, unformed multilayer capacitor part and anode metal foil connecting step,
The gap between the valve metal foils, the gap between the anode metal plate and the multilayer capacitor part, and the multilayer capacitor part are obtained by immersing the unchemically laminated capacitor part and the anode metal plate in the chemical conversion solution and performing anodization. A multilayer capacitor part manufacturing step of forming a dielectric oxide film on the outer surface of
By immersing the laminated capacity part and the anode metal plate in a polymerization solution, the gap between the valve action metal foils, the gap between the anode metal plate and the laminated capacity part, and the outer surface of the laminated capacity part A solid electrolyte layer forming step of forming a solid electrolyte layer through a dielectric film;
A conductive layer forming step of forming a conductive layer on the outer surface of the multilayer capacitor portion on which the solid electrolyte layer is formed via a solid electrolyte layer;
The manufacturing method of the solid electrolytic capacitor characterized by including this.   The method for producing a solid electrolytic capacitor according to claim 13, wherein, in the unformed multilayer capacitor part manufacturing step, a part of a side surface of the unformed multilayer capacitor part is joined and electrical conduction is established between adjacent unformed valve action metal foils. .   The method for producing a solid electrolytic capacitor according to claim 14, wherein in the unformed multilayer capacitor portion manufacturing step, adjacent unformed valve action metal foils are joined to each other on adjacent side surfaces of the unformed multilayer capacitor portion to be electrically connected. . The anode metal plate preparation step includes joining a plurality of the anode metal plates in parallel to a guide plate,
In the multilayer capacitor part manufacturing step, a plurality of unformed multilayer capacitor parts respectively bonded to the anode metal plate are collectively immersed in the chemical conversion solution,
The solid electrolytic capacitor manufacturing method according to any one of claims 11 to 15, wherein, in the solid electrolyte layer forming step, a plurality of laminated capacitor portions respectively joined to the anode metal plate are collectively immersed in the polymerization solution. Method. The anode metal plate preparation step includes forming a plurality of anode metal plates integrated with a guide portion along one side of the large-size anode metal plate and the guide portion by punching a rectangular large-size anode metal plate. Including
In the multilayer capacitor part manufacturing step, a plurality of unformed multilayer capacitor parts respectively bonded to the anode metal plate are collectively immersed in the chemical conversion solution,
The solid electrolytic capacitor according to any one of claims 11 to 15, wherein a plurality of laminated capacitor portions respectively bonded to the anode metal plate are collectively immersed in the polymerization solution in the solid electrolyte layer forming step. Production method.   A step of bending the anode lead portion along the multilayer capacitor portion after the conductive layer forming step, and the anode bent in the multilayer capacitor portion between the folding step and the conductive layer forming step The method for manufacturing a solid electrolytic capacitor according to any one of claims 4 to 17, wherein an insulating film is formed on a portion facing the lead portion.

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