TWI691982B - Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same - Google Patents

Abstract

The present invention provides a stacked-type solid electrolytic capacitor package structure, including a conductive bracket, a capacitor component, and a laser welding area. The conductive bracket includes a positive conductive terminal, and a negative terminal spaced apart from the positive conductive terminal. The capacitor component includes stacked-type capacitors. Each stacked-type capacitors includes a positive electrode portion and a negative electrode portion. The positive electrode portion electrically connects to the positive conductive terminal, and the negative electrode portion electrically connects to the negative conductive terminal. The laser welding area runs through each positive electrode portions of stacked-type capacitors and the positive conductive terminal, and the maximum width of the laser welding area is smaller than 100nm. The stacked-type solid electrolytic capacitor package structure is conducted by laser welding forming a no cavitation structure and needless to use welding bar, and can save material usage and simplify the process.

Description

Stacked solid electrolytic capacitor packaging structure and manufacturing method thereof

The invention relates to a capacitor packaging structure and a manufacturing method thereof, in particular to a stacked solid electrolytic capacitor packaging structure and a manufacturing method thereof.

Capacitors are widely used in electronic devices, such as handheld electronic devices, computer mainframes, consumer appliances, and communication products. They have become one of the indispensable components. According to different uses, capacitors also have different materials and types of design. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, excellent frequency characteristics, etc., and can be used to decouple the power supply circuit used in the central processing unit.

An existing solid electrolytic capacitor uses a plurality of capacitive elements that are sequentially stacked and electrically connected to each other. In this way, the capacitance can be effectively provided. Each capacitor element includes a positive electrode portion and a negative electrode portion. All the negative electrode portions of the capacitor element are stacked on each other and electrically connected to a negative electrode terminal, and all the positive electrode portions are also stacked on each other and electrically connected to a positive electrode terminal, wherein the negative electrode portion is usually bonded using a conductive adhesive, and the positive electrode portion It is a metal foil, and the connection to the positive terminal is usually carried out by resistance welding, ultrasonic welding, or laser welding.

When laser welding is used, a hole is smelted through the laser on the positive electrode part and the positive electrode terminal, and then a welding rod is placed in the hole, and then the welding electrode is melted to connect all the positive electrode parts and the positive electrode terminal together. However, this welding method needs to be implemented through the electrode, the material cost is higher, and the electrode needs to be melted again, which is more complicated in the manufacturing process petty. In addition, this method will produce insufficiently filled micro-cavities, which will result in insufficient connection strength between two adjacent positive electrode portions, and between the positive electrode portion and the positive electrode terminal, often requiring an additional metal frame to further package it Cover and fix, so there is a need for improvement.

The technical problem to be solved by the present invention is to provide a stacked solid electrolytic capacitor packaging structure and a manufacturing method in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a stacked solid electrolytic capacitor packaging structure, which includes a conductive support, a capacitor assembly, and a laser soldering zone. The conductive support includes a positive conductive terminal and a negative conductive terminal spaced apart. The capacitor assembly includes a plurality of stacked capacitors, wherein each of the stacked capacitors includes a positive portion and a negative portion, the positive portion is electrically connected to the positive conductive terminal, and the negative portion is electrically connected to The negative conductive terminal. The laser welding zone penetrates the positive electrode portion and the positive electrode conductive terminal of each of the stacked capacitors, and the maximum width of the laser welding zone is less than 100 microns.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a stacked solid electrolytic capacitor packaging structure, which includes a conductive support and a capacitor assembly. The conductive support includes a positive conductive terminal and a negative conductive terminal spaced apart. The capacitor assembly includes a plurality of stacked capacitors, wherein each of the stacked capacitors includes a positive portion and a negative portion, the positive portion is electrically connected to the positive conductive terminal, and the negative portion is electrically connected to The negative conductive terminal. Wherein, each of the positive electrode portion and the positive electrode conductive terminal is laser-pierced to connect each of the positive electrode portion and the positive electrode conductive terminal, and the positive electrode portion is substantially free of cavitation.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a manufacturing method of a stacked solid electrolytic capacitor packaging structure, which The method includes the following steps: providing a conductive support and a plurality of stacked capacitors, wherein the conductive support includes a positive conductive terminal and a negative conductive terminal spaced apart, each stacked capacitor includes a positive portion and a negative portion; The negative electrode portion of the stacked capacitor, and electrically connect the negative electrode portion to the negative electrode conductive terminal of the conductive support; the positive electrode portion of the stacked capacitor is stacked, and placed on the conductive support The positive conductive terminal; and a laser beam with a beam diameter of less than 100 micrometers through each of the positive electrode portion and the positive conductive terminal.

One of the beneficial effects of the present invention is that the laser beam diameter used for welding can form a welding structure that is substantially free of cavitation, so there is no need to use an additional welding rod to further connect the positive electrode portion and the positive electrode conductive terminal, which can save material and Simplify the process.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.

1‧‧‧Conducting bracket

11‧‧‧ Positive conductive terminal

111‧‧‧Positive bearing

112‧‧‧positive pin

113‧‧‧Positive connection

12‧‧‧Negative conductive terminal

121‧‧‧Negative bearing

122‧‧‧Negative pin

123‧‧‧Negative connector

2‧‧‧Capacitor assembly

21‧‧‧Stacked capacitor

211‧‧‧Valve metal foil

2111‧‧‧Oxide layer

2112‧‧‧Positive

2113‧‧‧Core

212‧‧‧Insulation

213‧‧‧ conductive polymer layer

214‧‧‧Carbon layer

215‧‧‧Silver adhesive layer

2151‧‧‧Negative

3‧‧‧Package

4‧‧‧Laser welding area

L1‧‧‧First direction

L2‧‧‧Second direction

D‧‧‧Width

FIG. 1 is a flowchart of the manufacturing method of the first embodiment of the present invention.

FIG. 2 is a schematic top view illustrating the lead frame of the first embodiment of the present invention.

3 is a schematic side cross-sectional view of the stacked capacitor according to the first embodiment of the present invention.

FIG. 4 is a schematic top view illustrating that the stacked capacitor of the first embodiment of the present invention is disposed on a lead frame.

FIG. 5 is a schematic side cross-sectional view illustrating that the stacked capacitor of the first embodiment is disposed on a lead frame.

6 is a schematic top view of the laser welding zone formed in the first embodiment.

FIG. 7 is a schematic partial cross-sectional side view of a laser welding zone formed in the first embodiment.

FIG. 8 is a schematic diagram of two laser welding zones connected to each other in the first embodiment.

9 is a schematic cross-sectional side view illustrating that the package of the first embodiment wraps the capacitor assembly and part of the conductive support.

10 is a schematic side cross-sectional view of a first embodiment of the invention.

11 is a schematic top view of the first embodiment of the present invention.

12 is a schematic side cross-sectional view of a second embodiment of the invention.

13 is a schematic top view of a third embodiment of the invention.

14 is a schematic top view of another embodiment of the third embodiment of the present invention.

FIG. 15 is a schematic top view of still another embodiment of the third embodiment of the present invention.

The following is a description of the implementation of the "stacked solid electrolytic capacitor packaging structure and its manufacturing method" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification . The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual sizes, and are declared in advance. The following embodiments will further describe the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[First embodiment]

Referring to FIG. 1, a first embodiment of the present invention provides a method for manufacturing a stacked solid electrolytic capacitor packaging structure, which includes the following steps:

Step S101: providing a conductive support 1 and a plurality of stacked capacitors 21, wherein the conductive support 1 includes a positive conductive terminal 11 and a negative conductive terminal 12 spaced apart, and each stacked capacitor 21 includes a positive portion 2112 and a The negative electrode 2151.

Referring to FIG. 2, the material of the positive conductive terminal 11 and the negative conductive terminal 12 is preferably a metal conductor, which may be selected from but not limited to aluminum (Al) or copper (Cu). The positive conductive terminal 11 of the conductive support includes a positive bearing portion 111, a positive pin portion 112, and a Cation connector 113. The positive electrode connecting part 113 connects the positive electrode carrying part 111 and the positive electrode pin part 112. The negative conductive terminal 12 includes a negative bearing portion 121, a negative pin portion 122, and a negative connecting portion 123. The positive electrode carrying portion 111 and the negative electrode carrying portion 121 are adjacent to each other.

Referring to FIG. 3, each stacked capacitor 21 includes a valve metal foil 211 (valve metal foil), an insulating layer 212, a conductive polymer layer 213, a carbon adhesive layer 214, and a silver adhesive layer 215. The valve metal foil 211 has an oxide layer 2111 formed outside. The insulating layer 212 is disposed around the oxide layer 2111, and separates the valve metal foil 211 from a positive electrode portion 2112 and a core portion 2113. The conductive polymer layer 213 completely covers the core portion 2113. The carbon adhesive layer 214 completely covers the conductive polymer layer 213. The silver glue layer 215 completely covers the carbon glue layer 214 and constitutes a negative electrode portion 2151. The stacked capacitor 21 used in the present invention is not limited to the above-mentioned examples.

Step S102: Referring to FIGS. 1, 4 and 5, the negative electrode portion 2151 of the stacked capacitor 21 is stacked, and the negative electrode portion 2151 is electrically connected to the negative electrode conductive terminal 12 of the conductive holder 1.

The negative electrode portion 2151 of the stacked capacitor 21 is stacked and electrically connected, and is mounted to the negative electrode bearing portion 121 of the negative electrode conductive terminal 12. The method of electrical connection can be exemplified by: using conductive adhesive bonding, but not limited to this. The order of laminating the negative electrode portions 2151 is not limited, and one of the negative electrode portions 2151 can be bonded to the negative conductive terminal 12 of the conductive holder 1 with conductive adhesive, and then the remaining stacked capacitors 21 can be bonded with conductive adhesive in sequence Alternatively, the negative portion 2151 of the stacked capacitor 21 may be adhered to each other with conductive adhesive, and then the negative portion 2151 on one side may be adhered to the negative conductive terminal 12 with conductive adhesive, but the stacking order is not limited to this , Can be adjusted according to actual needs. The stacked capacitors 21 stacked together constitute a capacitor assembly 2.

The stacked capacitor 21 may be provided on the same side of the conductive bracket 1, however, a part of it may be provided on one side of the conductive bracket 1 and the remaining part may be provided on the other side of the conductive bracket 1. In the first embodiment, the stacked capacitor 21 is provided on the same side of the conductive support 1 as an example, so it is a step S102 (a): Stack the negative electrode portion 2151 of the stacked capacitor 21 and electrically connect the negative electrode portion 2151 to the negative electrode conductive terminal 12 of the conductive holder 1, wherein the stacked capacitor 21 is provided on the same side of the conductive holder 1.

Step S103: the positive electrode portion 2112 of the stacked capacitor 21 is stacked and placed on the positive electrode conductive terminal 11 of the conductive holder 1.

The order of laminating the positive electrode portions 2112 is not limited, and the positive electrode portions 2112 may be sequentially laminated on the positive electrode bearing portion 111 of the positive electrode conductive terminal 11, or the positive electrode portions 2112 may be laminated on each other and then placed on the positive electrode bearing portion 111 On, but not limited to. It is worth mentioning that, because the thickness of the positive electrode portion 2112 is smaller than the thickness of the negative electrode portion 2151, when stacking, part of the positive electrode portion 2112 needs to be bent to be stacked on each other on the positive electrode bearing portion 111, so the preferred implementation In this way, the positive electrode portions 2112 closest to the positive electrode bearing portion 111 are sequentially stacked, so that the bending angle of each positive electrode portion 2112 can be adjusted correspondingly for lamination.

Step S104: Referring to FIG. 1, FIG. 6 and FIG. 7, a positive electrode portion 2112 and the positive conductive terminal 11 are penetrated by a laser with a beam diameter less than 100 microns.

In this step, the positive electrode portion 2112 and the positive conductive terminal 11 may be pressed to ensure that they are close to each other, and then the positive electrode portion 2112 and the positive conductive terminal 11 may be laser-pierced. When a laser beam with a beam diameter of less than or equal to 100 microns is used to penetrate each positive electrode portion 2112 and the positive conductive terminal 11, micro holes corresponding to the size will be formed, and because the micro hole diameter is small, the metal melted by the laser will It will stay in the pores due to its own surface tension. When the laser irradiation is stopped, the molten metal filled in the micropores gradually cools, and each positive electrode portion 2112 and positive electrode conductive terminal 11 are welded together to form a connection structure that is substantially free of cavitation, and its molten connection The range can be defined as a laser welding zone 4. Preferably, the laser diameter is between 25 and 100 microns, and because the laser welding zone 4 corresponds to the laser beam diameter, the maximum width is preferably less than 100 microns, and more preferably between 25 and 100 Micron. For example, the laser can be a pulsed laser with a pulse width of 200ns, an average output power of 1mJ, and an instantaneous power of 10kW but not limited to this.

The number of laser welding zones 4 can be one, two, or more than three, and there is no limit, and when more than one laser welding zone 4 is to be formed, it is only necessary to repeat step S104. When there are more than two laser welding zones 4, the laser welding zones 4 may be spaced apart from each other (as shown in FIG. 6) or may be connected to each other (as shown in FIG. 8), depending on the demand, There are no certain restrictions. When the laser welding zones 4 are in contact with each other, since the position of the positive electrode portion 2112 and the positive electrode conductive terminal 11 are welded at the periphery of the laser welding zone 4, the two laser welding zones 4 are at the non-overlapping periphery (i.e. The solid lines in FIG. 8) do not interfere with each other, and both can weld the positive electrode portion 2112 and the positive electrode conductive terminal 11.

When performing laser welding, only one set of lasers (not shown) can be used, or multiple sets of lasers can be used simultaneously or alternately. There are no restrictions, and the manufacturer can adjust it as needed.

Step S105: Referring to FIGS. 1 and 9, a capacitor 3 is used to encapsulate the capacitor element 2 and part of the conductive support 1.

In this step, the conductive support 1 and the capacitor assembly 2 that have been laser welded are placed in a mold (not shown), and then a sealant is poured to cover the capacitor assembly 2 and the positive support of the conductive support 1 The part 111 and the negative electrode carrying part 121 are then cured to form the package 3. The sealant may be selected from but not limited to epoxy or silicone.

Step S106: Referring to FIGS. 1, 10 and 11, the positive conductive terminal 11 and the negative conductive terminal 12 are folded so that the positive conductive terminal 11 and the negative conductive terminal 12 extend along the outer surface of the package 3.

In this step, the positive conductive terminal 11 and the negative conductive terminal 12 are bent. The way of bending is to bend the part of the positive conductive terminal 11 and the negative conductive terminal 12 exposed to the package 3 down along the side of the package 3, and then project the part protruding from the bottom side of the package 3 toward Bend inside. In this way, the positive pin portion 112 of the positive conductive terminal 11 is located on the bottom side of the package 3, the positive connection portion 113 is located on the side of the package 3, and the negative pin portion 122 is located on the bottom side of the package 3, and the negative connection portion 123 Located on the side of the package 3. After the positive conductive terminal 11 and the negative conductive terminal 12 are shaped, the stacked stacked solid electrolytic capacitor is completed.

In this way, by adjusting the diameter of the laser beam used for welding, a welding structure that is substantially free of cavitation can be formed, so there is no need to additionally use a welding rod to further connect the positive electrode portion 2112 and the positive conductive terminal 11, which can save material use and simplify the manufacturing process .

The stacked solid electrolytic capacitor packaging structure manufactured by the above method includes a conductive bracket 1, a capacitor assembly 2, a packaging member 3, and a laser welding zone 4. The conductive support includes positive electrode terminals 11 and negative electrode terminals 12 spaced apart. The capacitor assembly 2 includes a plurality of stacked capacitors 21, wherein each stacked capacitor 21 includes a positive portion 2112 and a negative portion 2151, the positive portion 2112 is electrically connected to the positive conductive terminal 11, and the negative portion 2151 is electrically connected to the negative conductive terminal 12 . The laser welding zone 4 penetrates the positive electrode portion 2112 and the positive electrode conductive terminal 11 of each stacked capacitor 21. The maximum width of the laser welding zone 4 is less than 100 μm.

By laser-piercing each positive electrode portion 2112 and the positive conductive terminal 11 with a beam diameter of less than 100 microns, a substantially cavitation-free connection structure is formed, so there is no need to further connect the positive electrode portion 2112 and the positive conductive terminal 11 with an additional welding rod. Can save materials and simplify the manufacturing process.

[Second Embodiment]

Referring to FIG. 12, the second embodiment of the present invention provides another stacked solid electrolytic capacitor packaging structure. It can be seen from the comparison between FIG. 12 and FIG. 10 that the biggest difference between the second embodiment and the first embodiment of the present invention is that a part of the stacked capacitor 21 is provided on one side of the conductive support 1, and the remaining part of the stacked capacitor 21 is provided on the conductive The other side of the bracket 1. In this way, every two adjacent positive electrode portions 2112 located on the side of the conductive support 1 are connected to each other through the laser welding zone 4, and one of the positive electrode portions 2112 is connected to the positive electrode conductive terminal 11 through the laser welding zone 4, and, Each two adjacent positive electrode portions 2112 located on the other side of the conductive support 1 are also connected to each other through a laser welding zone 4, and one of the positive electrode portions 2112 is also connected to the positive electrode guide through the laser welding zone 4 Electrical terminal 11.

Referring to FIG. 1, the difference between the manufacturing method of the second embodiment of the present invention and the first embodiment is that step S102 adopts step S102(b). Step 102 (b): stack the negative electrode portion 2151 of the stacked capacitor 21 and electrically connect the negative electrode portion 2151 to the negative electrode conductive terminal 12 of the conductive holder 1, wherein a part of the stacked capacitor 21 is provided on one side of the conductive holder 1 The remaining part of the stacked capacitor 21 is provided on the other side of the conductive bracket 1.

In this way, the second embodiment not only has the advantages of the first embodiment, but also proposes another stacked solid electrolytic capacitor packaging structure and a manufacturing method thereof. The manufacturer can choose according to their needs.

[Third Embodiment]

Referring to FIG. 13, the third embodiment of the present invention provides another stacked solid electrolytic capacitor packaging structure. It can be seen from the comparison between FIG. 13 and FIG. 6 that the biggest difference between the third embodiment of the present invention and the first embodiment is that it includes a plurality of laser welding zones 4. The laser welding zones 4 are connected to each other to form a spiral.

The manufacturing method of each laser welding zone 4 of the third embodiment is the same as that of the first embodiment. Preferably, two adjacent laser welding zones 4 partially overlap (as shown in FIG. 8). At the time of manufacture, a plurality of laser welding zones 4 are continuously produced on the positive portion 2112 of the stacked capacitor 21 by laser on a predetermined trajectory. In the third embodiment, the predetermined trajectory is a spiral extending along a first direction L1, so the laser welding zones 4 are connected to each other to form a spiral. Preferably, the width D of the spiral is defined along a second direction L2 perpendicular to the first direction L1, and the width D is less than 1 cm.

It is worth mentioning that, in other implementation aspects of the third embodiment, the predetermined trajectory may also be a ring or a concentric ring. The shape of the ring is not fixed, and it can be round or square, without any restrictions. In addition, the ring and the ring may jointly form a concentric ring. When the ring is circular, it forms a circular concentric ring (as shown in Figure 14). When the ring is rectangular, it forms a rectangular concentric ring (as shown in Figure 15). Therefore, the number of rings is not limited. Better Ground, the maximum width of the aforementioned ring and concentric ring is less than 1 cm.

In this way, the second embodiment not only has the advantages of the first embodiment, but also proposes another stacked solid electrolytic capacitor packaging structure, which can further strengthen the connection between the positive conductive terminal 11 and the positive portion 2112 of the stacked capacitor 21 strength.

In summary, by adjusting the diameter of the laser beam, a laser welding structure that is substantially free of cavitation can be obtained, and there is no need for welding by another welding rod. Therefore, the purpose of the present invention can indeed be achieved.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the scope of the patent application of the present invention, so any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.

1‧‧‧Conducting bracket

11‧‧‧ Positive conductive terminal

111‧‧‧Positive bearing

112‧‧‧positive pin

113‧‧‧Positive connection

12‧‧‧Negative conductive terminal

121‧‧‧Negative bearing

122‧‧‧Negative pin

123‧‧‧Negative connector

2‧‧‧Capacitor assembly

21‧‧‧Stacked capacitor

2112‧‧‧Positive

2151‧‧‧Negative

3‧‧‧Package

4‧‧‧Laser welding area

Claims (11)

A stacked solid electrolytic capacitor packaging structure includes: a conductive support including a positive conductive terminal and a negative conductive terminal spaced apart; a capacitor assembly including a plurality of stacked capacitors, each of which is of the stacked type The capacitor includes a positive electrode portion and a negative electrode portion, the positive electrode portion is electrically connected to the positive electrode conductive terminal, the negative electrode portion is electrically connected to the negative electrode conductive terminal; and a plurality of laser welding zones, penetrating each The positive electrode portion and the positive electrode conductive terminal of the stacked capacitor, the maximum width of the plurality of laser welding zones is less than 100 microns; the plurality of laser welding zones are connected to each other to form a spiral, a ring, and concentric At least one shape of the ring. The stacked solid electrolytic capacitor packaging structure according to claim 1, wherein the laser welding zone is a laser beam with a beam diameter of 25 to 100 microns through each of the positive electrode portion and the positive electrode conductive terminal , The two positive parts of each two adjacent stacked capacitors are connected to each other through the laser welding zone, wherein the positive part of one of the stacked capacitors passes through the laser welding zone to Connected to the positive conductive terminal; the plurality of laser welding zones are one of spaced apart and connected to each other. The stacked solid electrolytic capacitor packaging structure according to claim 1, wherein a part of the plurality of stacked capacitors is provided on one side of the conductive support, and the remaining parts of the plurality of stacked capacitors are provided on the The other side of the conductive bracket. The stacked solid electrolytic capacitor packaging structure according to claim 1, wherein the stacked capacitors are provided on the same side of the conductive holder; the positive electrode portions of the stacked capacitors are stacked on each other and are provided on the Said positive conductive terminal. The stacked solid electrolytic capacitor packaging structure according to claim 1, wherein the spiral extends along a first direction, and the width of the spiral is defined along a second direction perpendicular to the first direction, The width is less than 1 cm. A stacked solid electrolytic capacitor packaging structure includes: a conductive support including a positive conductive terminal and a negative conductive terminal spaced apart; a capacitor assembly including a plurality of stacked capacitors, each of which is of the stacked type The capacitor includes a positive electrode portion and a negative electrode portion, the positive electrode portion is electrically connected to the positive electrode conductive terminal, the negative electrode portion is electrically connected to the negative electrode conductive terminal; and a plurality of laser welding zones, which are connected to each other To form at least one of a spiral, a ring, and a concentric ring; wherein, each of the positive electrode portion and the positive electrode conductive terminal is laser-pierced to form a plurality of the laser welding zones to connect each In the positive electrode portion and the positive electrode conductive terminal, the positive electrode portion is substantially free of cavitation. The stacked solid electrolytic capacitor packaging structure according to claim 6, wherein each of the positive electrode portion and the positive electrode conductive terminal is penetrated with a laser beam having a beam diameter of 25 to 100 microns; a plurality of the stacks A part of the type capacitor is provided on one side of the conductive holder, and the remaining parts of the plurality of stacked type capacitors are provided on the other side of the conductive holder. The stacked solid electrolytic capacitor packaging structure according to claim 6, wherein each of the positive electrode portion and the positive electrode conductive terminal is penetrated with a laser beam having a beam diameter of 25 to 100 microns; the stacked capacitor It is arranged on the same side of the conductive bracket; the positive electrode portions of the stacked capacitor overlap each other and are arranged on the positive electrode conductive terminal. A method for manufacturing a stacked solid electrolytic capacitor packaging structure includes the following steps: providing a conductive support and a plurality of stacked capacitors, wherein the conductive support It includes a positive conductive terminal and a negative conductive terminal spaced apart, each stacked capacitor includes a positive part and a negative part; the negative part of the stacked capacitor is superposed, and the negative part is electrically connected to The negative conductive terminal of the conductive support; the positive electrode portion of the stacked capacitor is stacked and placed on the positive conductive terminal of the conductive support; and a laser is drilled with a beam diameter less than 100 microns Each of the positive electrode portion and the positive electrode conductive terminal forms a plurality of laser welding zones; wherein the plurality of laser welding zones are connected to each other to form at least one shape of a spiral, a ring, and a concentric ring. The method for manufacturing a stacked solid electrolytic capacitor packaging structure according to claim 9, wherein the laser beam diameter is between 25 and 100 microns; a part of the plurality of stacked capacitors is provided on the conductive support On one side, the remaining portions of the plurality of stacked capacitors are provided on the other side of the conductive support. The method for manufacturing a stacked solid electrolytic capacitor packaging structure according to claim 9, wherein the laser beam diameter is between 25 and 100 microns; the stacked capacitor is disposed on the same side of the conductive support; The positive electrode portions of the stacked capacitor overlap each other and are provided on the positive electrode conductive terminal.

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