TWI502611B - Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same - Google Patents

Description

Solid electrolytic capacitor package structure for reducing equivalent series resistance and its fabrication method

The invention relates to a solid electrolytic capacitor package structure and a manufacturing method thereof, in particular to a solid electrolytic capacitor package structure for reducing equivalent series resistance and a manufacturing method thereof.

Capacitors have been widely used in consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automotive basic components, including: filtering, bypass, rectification, coupling, decoupling And turn equal. It is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors and so on. In the prior art, the solid electrolytic capacitor has the advantages of small size, large capacitance, superior frequency characteristics, and the decoupling of the power supply circuit for the central processing unit. In general, a stack of a plurality of capacitor units can be utilized to form a high-capacity solid electrolytic capacitor. The conventional stacked solid-state electrolytic capacitor includes a plurality of capacitor units and a lead frame, wherein each capacitor unit includes an anode portion and a cathode portion. And the insulating portion, the insulating portion electrically insulates the anode portion from the cathode portion. In particular, the cathode portions of the capacitor unit are stacked on each other, and a plurality of capacitor units are electrically connected to each other by providing a conductor layer between adjacent capacitor units. However, the design of conventional solid electrolytic capacitors still cannot effectively reduce the equivalent series resistance (equivalent Series resistance, ESR).

An embodiment of the present invention provides a solid electrolytic capacitor package structure for reducing equivalent series resistance and a manufacturing method thereof.

A solid electrolytic capacitor package structure for reducing equivalent series resistance is provided in one embodiment of the present invention, comprising: a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors stacked in series and electrically connected to each other, wherein each of the first stacked capacitors has a first positive portion and a first negative portion. The package unit includes a package that completely covers the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal separated from the first conductive terminal, wherein the first conductive terminal has an electrical connection to the first stacked capacitor a first positive electrode portion and a first embedded portion covered in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, and the second conductive terminal Having a second buried portion electrically connected to the first negative electrode portion of the first stacked capacitor and covered in the package body, and a second buried portion connected to the second embedded portion and exposed a second exposed portion outside the package; wherein the second conductive terminal has an upper surface, a lower surface corresponding to the upper surface, and a side connected between the upper surface and the lower surface a surface, and at least one through hole (or at least one through slot connected between the upper surface, the lower surface, and the side surface) connected between the upper surface and the lower surface The bottommost first stacked capacitor is electrically conductive Fixing on the upper surface of the second conductive terminal, and the conductive paste has a first stacked type capacitor disposed at a bottom end and the upper surface of the second conductive terminal a first conductive portion and a second conductive portion connected to the first conductive portion and filled in at least one of the through holes or through the slots.

Another embodiment of the present invention provides a method for fabricating a solid electrolytic capacitor package structure for reducing equivalent series resistance, which comprises the following steps: First, Providing a first conductive terminal and a second conductive terminal, wherein the second conductive terminal has an upper surface, a lower surface corresponding to the upper surface, and at least one connected to the upper surface and the lower surface a through hole between the surfaces; then, a plurality of first stacked capacitors are sequentially stacked together and electrically connected between the first conductive terminal and the second conductive terminal, wherein each of the first The stacked capacitor has a first positive electrode portion and a first negative electrode portion, and the bottommost first stacked type capacitor is fixed on the upper surface of the second conductive terminal by a conductive paste, and the conductive paste Having a first conductive portion disposed between the first stacked capacitor and the upper surface of the second conductive terminal and connected to the first conductive portion and filled in at least one of a second conductive portion in the through hole; then, a package is formed to completely cover the capacitor unit, wherein the first conductive terminal has a first positive electrode electrically connected to the first stacked capacitor And packaged a first embedded portion in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, and the second conductive terminal has an electrical connection a first buried portion of the first stacked capacitor and a second buried portion covered in the package; and a second exposed portion connected to the second embedded portion and exposed outside the package Finally, the first exposed portion and the second exposed portion are bent such that both the first exposed portion and the second exposed portion extend along an outer surface of the package.

The beneficial effects of the present invention may be that the solid electrolytic capacitor package structure and the manufacturing method thereof provided by the embodiments of the present invention are permeable to "the second conductive terminal has at least consistent perforation or through slotting" and "the conductive adhesive Having a first conductive portion disposed between the first stacked capacitor and the upper surface of the second conductive terminal and connected to the first conductive portion and filled in at least one of a design of the through hole or the second conductive portion extending through the groove to effectively reduce an equivalent series resistance (ESR) and increase the first stacked type capacitor to be fixed on the second conductive terminal The bond strength on the surface to avoid the possibility of the first stacked capacitor being disconnected from the second conductive terminal.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧First stacked capacitor

P‧‧‧First positive part

N‧‧‧First negative part

100‧‧‧ valve metal foil

101‧‧‧Oxide layer

1010‧‧‧ Around the area

102‧‧‧ Conductive polymer layer

End of 1020‧‧

103‧‧‧carbon layer

End of 1030‧‧

104‧‧‧Silver layer

End of 1040‧‧

105‧‧‧round insulation

10'‧‧‧Second stacked capacitor

P’‧‧‧Second positive part

N’‧‧‧second negative part

11‧‧‧Conductive adhesive

111‧‧‧First Conductive Department

112‧‧‧Second Conductive Department

113‧‧‧ Third Conductive Department

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side surface

202‧‧‧Second side surface

203‧‧‧ bottom surface

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

3101‧‧‧First through the glue hole

311‧‧‧First exposed department

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧Second exposed department

3200‧‧‧ upper surface

3201‧‧‧ lower surface

3202‧‧‧through holes

3203‧‧‧Second through plastic hole

3204‧‧‧ side surface

3205‧‧‧through slotting

32A‧‧‧Bronze substrate

320A‧‧‧round inner surface

32B‧‧‧ tin plating

1 is a side cross-sectional view showing a capacitor unit according to a first embodiment of the present invention.

2A is a top plan view of a first type of conductive unit in accordance with a first embodiment of the present invention.

2B is a top plan view of a second type of conductive unit according to the first embodiment of the present invention.

2C is a top plan view of a third conductive unit in accordance with a first embodiment of the present invention.

3 is a top plan view showing a capacitor unit disposed on a conductive unit according to a first embodiment of the present invention.

4 is a side elevational view showing a package structure of a solid electrolytic capacitor according to a first embodiment of the present invention.

Figure 5 is an enlarged schematic view of a portion A of Figure 4.

6 is a flow chart showing a method of fabricating a solid electrolytic capacitor package structure according to a first embodiment of the present invention.

Fig. 7 is a side elevational view showing the package structure of a solid electrolytic capacitor according to a second embodiment of the present invention.

Figure 8 is an enlarged schematic view of a portion A of Figure 7.

FIG. 9 is a top plan view showing a capacitor unit disposed on a conductive unit according to a third embodiment of the present invention.

Figure 10 is a side elevational view showing the package structure of a solid electrolytic capacitor in accordance with a third embodiment of the present invention.

[First Embodiment]

1 to FIG. 6, FIG. 1 is a side cross-sectional view of the first stacked capacitor 10 or the second stacked capacitor 10'. FIG. 2A is a schematic diagram of an upper side of one of the conductive units 3, and FIG. 2B is another 2 is a schematic view of the upper side of the conductive unit 3, FIG. 2C is a schematic view of the upper side of another conductive unit 3, and FIG. 3 is a first stacked type of electricity. FIG. 4 is a schematic side view of the solid electrolytic capacitor package structure Z, FIG. 5 is an enlarged schematic view of the portion A of FIG. 4, and FIG. 6 is a manufacturing diagram of the solid electrolytic capacitor package structure Z. Flow chart of the method. The first embodiment of the present invention provides a solid electrolytic capacitor package structure Z for reducing the Equivalent Series Resistance (ESR), which includes: a capacitor unit 1, a package unit 2, and a capacitor. Conductive unit 3.

First, as shown in FIG. 1, the capacitor unit 1 can provide a plurality of first stacked capacitors 10 (or wafer type capacitors, and currently only one of the first stacked capacitors 10 is shown in FIG. 1), wherein each of the first stacks The capacitor 10 has a first positive electrode portion P and a first negative electrode portion N. For example, each of the first stacked capacitors 10 includes a valve metal foil 100, an oxide layer 101 completely covering the valve metal foil 100, a conductive polymer layer 102 covering a portion of the oxide layer 101, and a The carbon glue layer 103 completely covering the conductive polymer layer 102 and the silver glue layer 104 completely covering the carbon glue layer 103. Further, each of the first stacked capacitors 10 includes a surrounding insulating layer 105 disposed on the outer surface of the oxide layer 101 and surrounding the oxide layer 101, and the length of the conductive polymer layer 102 of the first stacked capacitor 10, carbon Both the length of the adhesive layer 103 and the length of the silver paste layer 104 are limited by the surrounding insulating layer 105. Further, the outer surface of the oxide layer 101 has a surrounding area 1010, and the surrounding insulating layer 105 of the first stacked type capacitor 10 is disposed around the surrounding area 1010 of the oxide layer 101 while contacting the conductive polymer layer. End 1020 of 102, end 1030 of carbon glue layer 103, and end 1040 of silver glue layer 104. However, the first stacked capacitor 10 used in the present invention is not limited to the example of the first embodiment described above.

Furthermore, as shown in FIG. 2A, FIG. 3 and FIG. 4, a plurality of first stacked capacitors 10 can be sequentially stacked and electrically connected to each other, wherein two of each two adjacent first stacked capacitors 10 The first negative electrode portions N are permeable to silver paste (not labeled) to be stacked on each other, and the two first positive electrode portions P of each two adjacent first stacked capacitors 10 are permeable to the solder layer (not labeled) Stacked together. In addition, the package unit 2 includes a package body 20 that completely covers the capacitor unit 1, and the package body 20 may be Light-transmissive packaging material. In addition, the conductive unit 3 (ie, the lead frame) includes a first conductive terminal 31 and a second conductive terminal 32 separated from the first conductive terminal 31. The first conductive terminal 31 has a first positive electrode portion P electrically connected to the first stacked capacitor 10 (ie, electrically contacting the first positive electrode portion P of the first stacked capacitor 10 at the bottom end) and is The first embedded portion 310 is encapsulated in the package body 20 and the first exposed portion 311 is connected to the first embedded portion 310 and exposed outside the package body 20, and the second conductive terminal 32 has an electrical connection The first negative electrode portion N of the first stacked capacitor 10 (that is, electrically contacting the first negative electrode portion N of the first stacked capacitor 10 at the bottom end) and covered in the second embedded portion in the package body 20 320 and a second exposed portion 321 connected to the second embedded portion 320 and exposed outside the package 20 .

Furthermore, as shown in FIG. 3 and FIG. 4, the package body 20 has a first side surface 201, a second side surface 202 and a first side surface 201 opposite to each other (ie, back to back). A bottom surface 203 between the first side surface 201 and the second side surface 202. The first exposed portion 311 may extend along the first side surface 201 and the bottom surface 203 of the package body 20 to form an L-shaped folding leg, and the second exposed portion 321 may be along the first portion of the package body 20 . The side surface 201 and the bottom surface 203 are extended to form another L-shaped fold.

Furthermore, as shown in FIG. 2, FIG. 3 and FIG. 4, the second conductive terminal 32 has an upper surface 3200, a lower surface 3201 corresponding to the upper surface 3200, and at least one connected to the upper surface 3200 and below. A through hole 3202 between the surfaces 3201. The first negative electrode portion N of the first stacked capacitor 10 at the bottom end may be fixed to the upper surface 3200 of the second conductive terminal 32 by the conductive paste 11, and the conductive paste 11 has a first stacked type disposed at the bottommost end. The first conductive portion 111 between the capacitor 10 and the upper surface 3200 of the second conductive terminal 32 and the second conductive portion 112 connected to the first conductive portion 111 and filled in the through hole 3202. In addition, the first conductive terminal 31 has at least one first through-filling hole 3101, the second conductive terminal 32 has at least one second through-filling hole 3203, and the package 20 can be filled in at least one first through-filling The hole 3101 and the at least one second through-filling hole 3203, thereby increasing the coating strength of the first conductive terminal 31 and the second conductive terminal 32 by the package 20 (ie, avoiding the first conductive terminal 31 and the first The two conductive terminals 32 create the possibility of being detached from the package 20).

For example, as shown in FIG. 4 and FIG. 5, the second conductive terminal 32 includes a copper substrate 32A and a tin-plated layer 32B covering the outer surface of the copper substrate 32A. In addition, the through hole 3202 penetrates the tin plating layer 32B and the copper substrate 32A, and the copper substrate 32A has a surrounding inner surface 320A located in the through hole 3202. The second conductive portion 112 of the conductive paste 11 may contact the surrounding inner surface 320A of the copper substrate 32A, and the conductive paste 11 may be silver paste or copper paste. Furthermore, since the second conductive terminal 32 passes through the through hole 3202 to expose the surrounding inner surface 320A of the copper substrate 32A, the conductive paste 11 as silver paste or copper paste can stably contact the inner circumference of the copper substrate 32A. The surface 320A, thereby increasing the solid crystal strength of the first stacked capacitor 10 fixed on the upper surface 3200 of the second conductive terminal 32 (that is, the possibility that the first stacked capacitor 10 is prevented from being separated from the second conductive terminal 32) ).

Furthermore, with reference to FIG. 1 to FIG. 6 , a first embodiment of the present invention provides a method for fabricating a solid electrolytic capacitor package structure Z for reducing equivalent series resistance, which comprises the following steps: First, with FIG. 3 and FIG. 4 and FIG. 6, a first conductive terminal 31 and a second conductive terminal 32 are provided. The second conductive terminal 32 has an upper surface 3200, a lower surface 3201 corresponding to the upper surface 3200, and at least one connection. a through hole 3202 between the upper surface 3200 and the lower surface 3201 (step S100); then, as shown in FIG. 1, FIG. 4 and FIG. 6, the plurality of first stacked capacitors 10 are sequentially stacked and electrically connected. Connected between the first conductive terminal 31 and the second conductive terminal 32, wherein each of the first stacked capacitors 10 has a first positive electrode portion P and a first negative electrode portion N, and the bottommost first stacked capacitor 10 passes through The conductive paste 11 is fixed on the upper surface 3200 of the second conductive terminal 32, and the conductive paste 11 has a first conductive relationship between the first stacked capacitor 10 disposed at the bottommost end and the upper surface 3200 of the second conductive terminal 32. Portion 111 and one connected to the first conductive 111 and filling the second conductive portion 112 in the through hole 3202 (S102); then, as shown in FIG. 1, FIG. 4 and FIG. 6, a package body 20 is formed to completely cover the capacitor unit 1, wherein the first conductive terminal The first embedded portion 310 electrically connected to the first positive electrode portion P of the first stacked capacitor 10 and covered in the package 20 and connected to the first embedded portion 310 and exposed in the package a first exposed portion 311 outside the 20, and the second conductive terminal 32 has a second buried portion 320 electrically connected to the first negative portion N of the first stacked capacitor 10 and covered in the package 20 and a second exposed portion 321 connected to the second embedded portion 320 and exposed outside the package body 20 (S104); finally, the first exposed portion 311 and the second exposed portion 321 are bent so that the first exposed portion 311 and The second exposed portions 321 all extend along the outer surface of the package 20 (S106).

Furthermore, the present invention performs measurement of 10 sets of equivalent series resistances by the solid electrolytic capacitor package structure Z having the through holes 3202 and the solid electrolytic capacitor package structure Z having no through holes 3202, and the measurement results are as follows: The solid electrolytic capacitor package structure Z using the through holes 3202 has a lower average equivalent series resistance in units of mΩ.

Furthermore, as shown in FIG. 2B and FIG. 2C, the number of through holes 3202 may also be two or more circular perforations (as shown in FIG. 2B), or The aperture 3202 can also be an elongated perforation (as shown in Figure 2C). Accordingly, the present invention is intended to be illustrative of the number, shape, and location of the through-holes 3202, which are not intended to limit the invention. For example, the through holes 3202 may be arbitrarily shifted back and forth, and the through holes 3202 may also be triangular, rectangular, polygonal, or petal shaped or the like.

[Second embodiment]

Please refer to FIG. 7 and FIG. 8. FIG. 7 is a schematic side view of the solid electrolytic capacitor package structure, and FIG. 8 is an enlarged schematic view of a portion A of FIG. From the comparison between FIG. 7 and FIG. 4 and the comparison between FIG. 8 and FIG. 5, the greatest difference between the second embodiment of the present invention and the first embodiment is that, in conjunction with FIG. 1, FIG. 7, and FIG. 8, in the second implementation. In the example, the capacitor unit 1 includes a plurality of second stacked capacitors 10' that are sequentially stacked and electrically connected to each other. Each of the second stacked capacitors 10' has a second positive electrode portion P' and a second negative electrode portion N'. The bottommost second stacked capacitor 10' can be fixed to the second conductive terminal through the conductive adhesive 11. The lower surface 3201 of the second conductive portion 11 has a second conductive portion 11 disposed between the bottommost second stacked type capacitor 10' and the lower surface 3201 of the second conductive terminal 32 and connected to the third conductive portion 112. 113.

Furthermore, the second embodiment of the present invention can also provide a method for fabricating a solid electrolytic capacitor package structure for reducing equivalent series resistance, which is the biggest difference from the manufacturing method of the first embodiment (shown in FIG. 6). The step S102 of FIG. 6 may further include: sequentially stacking the plurality of second stacked capacitors 10 ′ and electrically connecting between the first conductive terminal 31 and the second conductive terminal 32 , wherein the bottom is The second stacked capacitor 10' at the end may be fixed on the lower surface 3201 of the second conductive terminal 32 by the conductive paste 11, and the conductive paste 11 has a second stacked capacitor 10' and a second conductive terminal disposed at the bottommost end. The lower surface 3201 of the 32 is connected to the third conductive portion 113 of the second conductive portion 112.

[Third embodiment]

Please refer to FIG. 9 and FIG. 10, FIG. 9 is a first stacked capacitor disposed in the guide. A top view on the electrical unit, and Figure 10 is a side elevational view of the solid electrolytic capacitor package structure. 9 is compared with FIG. 3 and FIG. 10 and FIG. 4, the maximum difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the second conductive terminal 32 has an upper surface. 3200, a lower surface 3201 corresponding to the upper surface 3200, a side surface 3204 connected between the upper surface 3200 and the lower surface 3201, and at least one connected to the upper surface 3200, the lower surface 3201, and the side surface 3204 There is a through slot 3205. The bottommost first stacked capacitor 10 can be fixed on the upper surface 3200 of the second conductive terminal 32 by the conductive paste 11, and the conductive paste 11 has a first stacked capacitor 10 and a second conductive terminal disposed at the bottommost end. The first conductive portion 111 between the upper surface 3200 of the 32 and the second conductive portion 112 connected to the first conductive portion 111 and filled in the through groove 3205. However, the definition of the number, shape, and location of the through-groove 3205 of the present invention is by way of example and is not intended to limit the invention.

[Possible effects of the examples]

In summary, the beneficial effects of the present invention may be that the solid electrolytic capacitor package structure and the manufacturing method thereof provided by the embodiments of the present invention are permeable to "the second conductive terminal 32 has at least a uniform through hole 3202 or a through slot 3205". And the conductive paste 11 has a first conductive portion 111 disposed between the first stacked capacitor 10 and the upper surface 3200 of the second conductive terminal 32 and is connected to the first conductive portion 111 and filled in the through hole 3202 or a design of the second conductive portion 112" extending through the slot 3205 to effectively reduce the equivalent series resistance and increase the solid crystal strength of the first stacked capacitor 10 fixed on the upper surface 3200 of the second conductive terminal 32, To avoid the possibility that the first stacked capacitor 10 is detached from the second conductive terminal 32.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧First stacked capacitor

P‧‧‧First positive part

N‧‧‧First negative part

11‧‧‧Conductive adhesive

111‧‧‧First Conductive Department

112‧‧‧Second Conductive Department

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side surface

202‧‧‧Second side surface

203‧‧‧ bottom surface

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

3101‧‧‧First through the glue hole

311‧‧‧First exposed department

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧Second exposed department

3200‧‧‧ upper surface

3201‧‧‧ lower surface

3202‧‧‧through holes

3203‧‧‧Second through plastic hole

Claims (11)

A solid electrolytic capacitor package structure for reducing equivalent series resistance, comprising: a capacitor unit comprising a plurality of first stacked capacitors stacked in series and electrically connected to each other, wherein each of said first The stacked capacitor has a first positive portion and a first negative portion; a package unit including a package that completely covers the capacitor unit; and a conductive unit including a first conductive terminal and a a second conductive terminal in which the first conductive terminals are separated from each other, wherein the first conductive terminal has a first positive electrode portion electrically connected to the first stacked capacitor and is covered in the package a first embedded portion and a first exposed portion exposed to the first embedded portion and exposed outside the package, and the second conductive terminal has a first electrical connection to the first stacked capacitor a first buried portion of the first negative electrode portion and covered in the package body, and a second exposed portion connected to the second embedded portion and exposed outside the package body; wherein the first portion Two conductive The sub-layer has an upper surface, a lower surface corresponding to the upper surface, and at least one through hole connected between the upper surface and the lower surface, and the bottommost first stacked capacitor is electrically conductive a glue is fixed on the upper surface of the second conductive terminal, and the conductive paste has a first stacked type capacitor disposed at a bottom end and the upper surface of the second conductive terminal a first conductive portion and a second conductive portion connected to the first conductive portion and filled in the at least one through hole; wherein the first conductive terminal has at least one first through-filling hole, The second conductive terminal has at least one second through-filling hole, and the package is filled in at least one of the first through-filling holes and at least one of the second through-filling holes. Solid-state electricity for reducing equivalent series resistance as described in claim 1 a capacitor unpacking structure, wherein each of the first stacked capacitors comprises a valve metal foil, an oxide layer completely covering the valve metal foil, and a conductive polymer layer covering a portion of the oxide layer a carbon glue layer completely covering the conductive polymer layer, and a silver glue layer completely covering the carbon glue layer, wherein each of the first stacked type capacitors comprises a layer disposed on the oxide layer a surrounding insulating layer on the outer surface and surrounding the oxide layer, and the length of the conductive polymer layer of the first stacked capacitor, the length of the carbon glue layer, and the length of the silver paste layer are both The surrounding insulating layer is limited, wherein the outer surface of the oxide layer has a surrounding area, and the surrounding insulating layer of the first stacked capacitor is disposed around the oxide layer Determining the end of the conductive polymer layer, the end of the carbon glue layer, and the end of the silver paste layer, wherein the package body has a first side surface, and the first Side surfaces facing each other a second side surface, a bottom surface connected between the first side surface and the second side surface, the first exposed portion along the first side surface and the bottom surface of the package body Extending, and the second exposed portion extends along the first side surface of the package body and the bottom surface. The solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 1, wherein the second conductive terminal comprises a copper substrate and a plating plate covering an outer surface of the copper substrate. a tin layer, at least one of the through holes penetrating the tin plating layer and the copper substrate, the copper substrate having a surrounding inner surface located in at least one of the through holes, the first portion of the conductive paste The two conductive portions contact the surrounding inner surface of the copper substrate, and the conductive paste is silver glue or copper glue. The solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 1, wherein the capacitor unit comprises a plurality of second stacked capacitors stacked in series and electrically connected to each other, each One of the second stacked capacitors has a second positive electrode portion and a second negative electrode portion, and the bottommost second stacked type capacitor is fixed to the second conductive terminal by the conductive paste On the lower surface, the conductive paste has a second stacked capacitor disposed at the bottommost end and the lower surface of the second conductive terminal and connected to the second conductive portion The third conductive portion. A solid electrolytic capacitor package structure for reducing equivalent series resistance, comprising: a capacitor unit comprising a plurality of first stacked capacitors stacked in series and electrically connected to each other, wherein each of said first The stacked capacitor has a first positive portion and a first negative portion; a package unit including a package that completely covers the capacitor unit; and a conductive unit including a first conductive terminal and a a second conductive terminal in which the first conductive terminals are separated from each other, wherein the first conductive terminal has a first positive electrode portion electrically connected to the first stacked capacitor and is covered in the package a first embedded portion and a first exposed portion exposed to the first embedded portion and exposed outside the package, and the second conductive terminal has a first electrical connection to the first stacked capacitor a first buried portion of the first negative electrode portion and covered in the package body, and a second exposed portion connected to the second embedded portion and exposed outside the package body; wherein the first portion Two conductive The sub-section has an upper surface, a lower surface corresponding to the upper surface, a side surface connected between the upper surface and the lower surface, and at least one connected to the upper surface and the lower surface And a through slot between the three sides of the side surface, the bottommost first stacked capacitor is fixed on the upper surface of the second conductive terminal by a conductive adhesive, and the conductive paste has a a first conductive portion disposed between the first stacked capacitor and the upper surface of the second conductive terminal and connected to the first conductive portion and filled in at least one of the through openings a second conductive portion in the trench; wherein the first conductive terminal has at least one first through-filling hole, the second conductive terminal has at least one second through-filling hole, and the package is filled And at least one of the first through-filling holes and the at least one of the second through-filling holes. The solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 5, wherein each of the first stacked capacitors comprises a valve metal foil and a valve metal foil completely covered An oxide layer of the sheet, a conductive polymer layer covering a portion of the oxide layer, a carbon glue layer completely covering the conductive polymer layer, and a silver glue layer completely covering the carbon glue layer, Each of the first stacked capacitors includes a surrounding insulating layer disposed on an outer surface of the oxide layer and surrounding the oxide layer, and the conductive polymer layer of the first stacked capacitor The length, the length of the carbon glue layer, and the length of the silver paste layer are all limited by the surrounding insulating layer, wherein the outer surface of the oxide layer has a surrounding area, and the first stack The surrounding insulating layer of the capacitor is disposed around the surrounding region of the oxide layer and simultaneously contacts an end of the conductive polymer layer, an end of the carbon glue layer, and an end of the silver paste layer Where the seal The body has a first side surface, a second side surface opposite to the first side surface, and a bottom surface connected between the first side surface and the second side surface, The first exposed portion extends along the first side surface of the package body and the bottom surface, and the second exposed portion along the first side surface and the bottom surface of the package body extend. The solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 5, wherein the capacitor unit comprises a plurality of second stacked capacitors stacked in series and electrically connected to each other, each One of the second stacked capacitors has a second positive electrode portion and a second negative electrode portion, and the bottommost second stacked capacitor is fixed to the lower surface of the second conductive terminal by the conductive paste And the conductive paste has a third conductive portion disposed between the second stacked capacitor of the bottommost end and the lower surface of the second conductive terminal and connected to the second conductive portion. System for manufacturing solid electrolytic capacitor package structure for reducing equivalent series resistance The method includes the steps of: providing a first conductive terminal and a second conductive terminal, wherein the second conductive terminal has an upper surface, a lower surface corresponding to the upper surface, and at least one connected a through hole between the upper surface and the lower surface; a plurality of first stacked capacitors are sequentially stacked together and electrically connected between the first conductive terminal and the second conductive terminal, wherein Each of the first stacked capacitors has a first positive electrode portion and a first negative electrode portion, and the bottommost first stacked type capacitor is fixed on the upper surface of the second conductive terminal by a conductive paste And the conductive paste has a first conductive portion disposed between the first stacked capacitor of the bottommost end and the upper surface of the second conductive terminal, and a first conductive portion connected to the first conductive portion Filling a second conductive portion in the at least one through hole; forming a package to completely cover the capacitor unit, wherein the first conductive terminal has a portion electrically connected to the first stacked capacitor First a first buried portion partially encased in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, and the second conductive terminal has a first conductive portion a second buried portion electrically connected to the first negative portion of the first stacked capacitor and covered in the package, and a second buried portion connected to the second embedded portion and exposed in the package a second exposed portion outside the body; and bending the first exposed portion and the second exposed portion such that the first exposed portion and the second exposed portion both extend along an outer surface of the package body Wherein the first conductive terminal has at least one first through-filling hole, the second conductive terminal has at least one second through-filling hole, and the package is filled in at least one of the first through-filling a glue hole and at least one of the second through holes. A method for fabricating a solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 8, wherein each of said first stacked type electric power The container comprises a valve metal foil, an oxide layer completely covering the valve metal foil, a conductive polymer layer covering a part of the oxide layer, and a carbon glue completely covering the conductive polymer layer. a layer, and a silver paste layer completely covering the carbon glue layer, wherein each of the first stacked type capacitors comprises a surrounding insulating layer disposed on an outer surface of the oxide layer and surrounding the oxide layer And the length of the conductive polymer layer of the first stacked capacitor, the length of the carbon glue layer, and the length of the silver paste layer are all limited by the surrounding insulating layer, wherein the oxide layer The outer surface has a surrounding area, and the surrounding insulating layer of the first stacked capacitor is disposed around the surrounding area of the oxide layer and simultaneously contacts the conductive polymer layer. An end, an end of the carbon glue layer, and an end of the silver glue layer, wherein the package body has a first side surface, a second side surface opposite to the first side surface, and a connection On the first side surface and the second side a bottom surface between the surfaces, the first exposed portion extending along the first side surface of the package body and the bottom surface, and the second bare portion along the first portion of the package body A side surface extends from the bottom surface. The method for fabricating a solid electrolytic capacitor package structure for reducing equivalent series resistance according to claim 8 , wherein the second conductive terminal comprises a copper substrate and an outer surface of the copper substrate a tin plating layer on the surface, at least one of the through holes penetrating the tin plating layer and the copper substrate, the copper substrate having a surrounding inner surface in at least one of the through holes, the conductive adhesive The second conductive portion contacts the surrounding inner surface of the copper substrate, and the conductive paste is silver glue or copper glue. The method for fabricating a solid electrolytic capacitor package structure for reducing the equivalent series resistance according to claim 8, wherein the plurality of the first stacked capacitors are sequentially stacked and electrically connected to each other. In the step of the first conductive terminal and the second conductive terminal, the method further includes: sequentially stacking the plurality of second stacked capacitors and electrically connecting to the first conductive end And between the second conductive terminals, wherein each of the second stacked capacitors has a second positive portion and a second negative portion, and the bottommost second stacked capacitor passes through the conductive paste And being fixed on the lower surface of the second conductive terminal, and the conductive paste has a second stacked capacitor disposed at a bottom end and the lower surface of the second conductive terminal connected And a third conductive portion of the second conductive portion.