JP5415827B2 - Surface mount devices - Google Patents

Surface mount devices Download PDF

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Publication number
JP5415827B2
JP5415827B2 JP2009121303A JP2009121303A JP5415827B2 JP 5415827 B2 JP5415827 B2 JP 5415827B2 JP 2009121303 A JP2009121303 A JP 2009121303A JP 2009121303 A JP2009121303 A JP 2009121303A JP 5415827 B2 JP5415827 B2 JP 5415827B2
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terminal
device
terminal electrode
electrodes
electrode
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JP2010272591A (en
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拓也 宮原
哲夫 柴
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ルビコン株式会社
ルビコン・カーリット株式会社
日本カーリット株式会社
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Priority claimed from TW099116008A external-priority patent/TWI520165B/en
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Description

  The present invention relates to a mounting device incorporating a capacitor element employed in various electronic devices.

  Patent Document 1 discloses a technique for providing a chip-type solid electrolytic capacitor that can improve ESL characteristics and further reduce ESL, with respect to the chip-type solid electrolytic capacitor. The chip-type solid electrolytic capacitor of Patent Document 1 includes an anode lead frame in which a capacitor element and an anode junction part to which an anode part of the capacitor element is joined are provided at one end of a flat part and an anode terminal part for mounting is provided on a lower surface. A cathode lead provided with a cathode portion of the capacitor element mounted thereon and bonded, and a flat portion placed on the planar portion of the anode lead frame via an insulating layer, and a cathode terminal portion for mounting on the lower surface It is a structure consisting of frames. In this chip-type solid electrolytic capacitor, the direction of the current flowing in the cathode lead frame and the direction of the current flowing in the anode lead frame are reversed and cancel each other, so that ESL can be greatly reduced.

  Patent Document 2 discloses a technique for providing a small and large-capacity chip capacitor. In Patent Document 2, in a method of manufacturing a solid electrode capacitor in which an anode lead is led out at one end and a capacitor element having a cathode formed on an outer peripheral surface is sealed with a resin, the volume ratio of the capacitor element to the finished capacitor is improved. For this purpose, a capacitor element is bonded to the inner surface of a circuit board having a positive electrode and a negative electrode on both the inner and outer surfaces, and the same polarity is connected through a through hole, and the negative electrode on the surface and the cathode of the capacitor element are electrically connected. It is disclosed that after the connection and the anode lead of the capacitor element is joined to the positive electrode, the outer surface of the circuit board is exposed and the capacitor element is sealed with resin.

JP 2006-80423 A JP 2001-102252 A

  Along with the higher frequency of electronic equipment, a capacitor that is one of the electronic components is also required to have excellent impedance characteristics in the high frequency region. Solid electrolytic capacitors are often used around the CPU of personal computers. Capacitors used around CPUs in electronic devices are small in size and large capacity. In addition, in order to achieve high frequency, excellent noise removal and transient response, low ESR (equivalent series resistance) ) And low ESL (equivalent series inductance).

  Solid electrolytic capacitors are one type of capacitors that are small in size and have a large capacity. A dielectric oxide film is formed on the surface of a metal foil such as aluminum having a valve action to separate it into an anode part and a cathode part. In this case, a solid electrolyte layer made of a conductive polymer and a cathode electrode are sequentially laminated on the dielectric oxide film of the portion. One method for reducing the ESL in a chip-type surface-mounted device including a capacitor element such as a solid electrolytic capacitor is to provide an anode terminal and a cathode terminal on the same surface, and arrange them close to each other within an insulating range. This is to shorten the current path (to suppress the loop area). One of the other methods for reducing the ESL is to diversify the direction of current flow by increasing the number of terminals.

One embodiment of the present invention is a surface-mounting device that includes a substrate and a capacitor element mounted on a surface on the mounting side of the substrate, and is integrally formed with the exterior resin including the substrate and the capacitor element. is there. Substrate of the device includes the surface of the mounting side, a first connection electrode electrically connected to the anode of the capacitor element, and a second connection electrode electrically connected to the cathode of the capacitor element, The mounting surface includes a first terminal electrode and a second terminal electrode connected to the first connection electrode and the second connection electrode by a through electrode, respectively. The first terminal electrode and the second terminal electrode are: Each of the electrodes includes peripheral electrodes that are closely arranged over the entire circumference of the mounting surface of the device, and the peripheral electrodes of the second terminal electrode are arranged on all sides of the mounting surface, A second portion connected to the cathode, covering the entire circumference of the mounting surface excluding the electrode, and further including at least one of the second connection electrode and the second terminal electrode including a central portion electrode covering the central portion of the substrate. Of the connection electrode and the second terminal electrode Without even shield covering continuously the central portion and the peripheral portion of the substrate by any is formed. That is, the first terminal electrode and the second terminal electrode appear so as to be externally connectable along the entire circumference of the mounting surface of the device, and the first terminal electrode and the second terminal electrode The entire circumference of the mounting surface of this device is substantially formed by at least one of them.

  In this device, the entire circumference of the device mounting surface, that is, in the case of a square or rectangular device, substantially the entire rectangular ring-shaped peripheral portion including the four sides and corners of the rectangular mounting surface is a terminal. The ring-shaped terminal electrode portion is divided into a first terminal electrode, typically an anode terminal, and a second terminal electrode, typically a cathode terminal. Since the terminal electrodes are arranged close to each other around the entire periphery of the device, the current path can be shortened, and the direction of the current flowing in the device can be diversified. Therefore, ESL of the device can be suppressed. Further, since the terminal electrodes are arranged over the entire circumference of the device, the flexibility with respect to the wiring pattern of the printed wiring board on which the device is mounted is high.

  In one form of the device in which the first and second terminal electrodes are arranged along the entire circumference of the mounting surface of the device, the plurality of first terminal electrodes and the plurality of second terminal electrodes are arranged along the entire circumference. It is a device that appears alternately. An example is a device in which a plurality of first terminal electrodes appear at portions including four corners of the mounting surface, and a plurality of second terminal electrodes appear at four sides of the mounting surface, respectively. The corner portion of the mounting surface can also be used as a terminal electrode. Another example is a device in which a plurality of second terminal electrodes respectively appear at portions including two opposite sides and four corners of the mounting surface. In a typical device, the first electrode is the anode of the capacitor element, the second electrode is the cathode of the capacitor element, the first terminal electrode is the anode terminal, and the second terminal electrode is the cathode terminal. is there. If the second terminal electrode is a cathode terminal, it is easy to dispose the cathode terminal across the power supply line by disposing the cathode terminal on opposite sides across the anode terminal.

  In another embodiment of the device in which the first and second terminal electrodes are arranged along the entire circumference of the mounting surface of the device, the second terminal electrode appears continuously along the entire circumference, In this device, the first terminal electrode appears inside the two terminal electrodes. An example is a device in which a plurality of first terminal electrodes appear to be surrounded by a second terminal electrode. If the second terminal electrode is a cathode terminal, the anode terminal is surrounded by the cathode terminal, so that noise generated on the substrate to be mounted can be easily shielded.

  A device in which the first terminal electrode and the second terminal electrode are arranged close to each other over at least the entire circumference of the surface on the mounting side of the substrate is preferable. That is, with the first terminal electrode and the second terminal electrode being adjacent to each other along at least the entire circumference of the mounting side surface of the substrate, the first terminal electrode and the second terminal electrode are It is desirable to form so as to substantially cover the entire circumference of the surface on the mounting side. Although the substrate may be of a lead frame type, a lead frame having a complicated shape may be required in order to arrange the first and second terminal electrodes along the entire circumference of the device mounting surface. If the substrate is a printed wiring type, the first and second terminal electrodes appearing along the entire circumference of the device mounting surface can be easily formed by patterning the electrodes formed along the entire circumference of the substrate.

Face the first terminal electrode of the mounting side surface of the substrate to (correspond) to the surface of the mounting side of the substrate, a first connection electrode for connecting to the first electrode of the capacitor element is formed. In addition, a second connection electrode for connecting to the second electrode of the capacitor element is formed on the surface on the mounting side of the substrate opposite to (corresponding to) the second terminal electrode on the surface on the mounting side of the substrate. It is desirable. The first terminal electrode and the first connection electrode can be connected to the second terminal electrode and the second connection electrode by through electrodes (through holes) penetrating the substrate, respectively. The capacitor element mounted on the substrate and the first and second connection electrodes on the mounting surface of the substrate can be connected by a conductive member such as wire bonding or conductive paste.

The second terminal electrode is a cathode terminal, and the area of the second terminal electrode is larger than the area of the first terminal electrode. The shielding effect by the second terminal electrode is obtained . The second terminal electrode extends in the center direction of the substrate . The second terminal electrode on the mounting side surface of the substrate may be covered with an exterior resin or an insulating masking member except for the periphery of the substrate. If the second terminal electrode is a cathode, it is also effective to form the second terminal electrode continuously along the peripheral edge of the substrate.

  The capacitor element is typically a solid electrolytic capacitor element having aluminum as a valve action base (valve action metal). However, the valve action base may be another valve action base such as tantalum, and an electrolyte solution. It may be a type capacitor element, a ceramic type capacitor element, or a film type capacitor element.

  Another aspect of the present invention is a printed wiring board on which the above device is mounted and an electronic apparatus having the printed wiring board. The above device can provide a large-capacity, low ESR and low ESL surface mount type (chip type) and can be used as a decoupling capacitor or a bypass capacitor together with a semiconductor device such as a CPU to suppress the generation of noise. Moreover, the said device is suitable for various uses including the smoothing capacitor of a DC / DC power supply.

The perspective view which shows the outline | summary of a device. The top view (bottom view) which shows the mounting surface of a device. The perspective view which shows a device in the state which remove | excluded mold resin. The figure which developed the device on a substrate and a capacitor element. Sectional drawing of a device. Sectional drawing which shows a part of printed wiring board carrying a device. The figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device. Furthermore, the figure which shows the mounting surface of a different device.

  FIG. 1 shows an appearance of an example of a device according to the present invention. The device 1 includes a substrate 10 and a capacitor element 20 mounted on a surface 11 on the mounting side of the substrate 10, and includes a substrate 10 and the capacitor element 20 with a resin (molding resin) 30 for exterior or square shape. It is a device for surface mounting that is integrally formed to be rectangular.

  FIG. 2 shows the mounting surface 2 of the device 1. In this device 1, the surface 12 on the mounting side of the substrate 10 is not covered with the exterior resin 30 and appears as the mounting surface 2. A first terminal electrode 51 and a second terminal electrode 52 are arranged on the mounting surface 2 of the device 1, that is, the surface 12 on the mounting side of the substrate 10, over the entire circumference 13. That is, the first terminal electrode 51 and the second terminal 14 are formed over the four sides 14a, 14b, 14c and 14d of the surface 12 on the mounting side of the substrate 10 and the four corners (four corners) 15a, 15b, 15c and 15d. Are formed so as to be adjacent to each other via an insulating gap (gap) 59. For this reason, the entire circumference 13 of the surface 12 on the mounting side of the substrate 10 is substantially covered with the first terminal electrodes 51 and the second terminal electrodes 52 formed alternately. Furthermore, the mounting surface 2 of the device 1 is formed by the first terminal electrode 51 and the second terminal electrode 52 over the entire circumference (in this example, the entire circumference 13 of the substrate 10). 52 appear so as to be adjacent to each other through a gap 59 for insulation, and can be electrically connected to a connection terminal or the like provided on an external printed wiring board.

  The first terminal electrode 51 of the device 1 is an anode terminal connected to the first electrode (anode) of the capacitor element 20. The device 1 includes four anode terminals 51 and is formed at each of the four corners 15 a to 15 d of the mounting surface 12 of the substrate 10. The second terminal electrode 52 of the device 1 is a cathode terminal connected to the second electrode (cathode) of the capacitor element 20, and is disposed on the surface 12 on the mounting side of the substrate 10 except for the anode terminal 51. Has been. That is, the cathode terminal 52 is formed so as to cover the central portion 16 of the surface 12 on the mounting side of the substrate 10 and the surrounding four sides 14a to 14d. The anode terminal 51 and the cathode terminal 52 are separated by an insulating gap 59. The insulating gap 59 is about 0.1 mm to 2 mm, and more preferably about 0.2 mm to 1 mm. The gap 59 may be a space or may be filled with an insulating resin.

  FIG. 3 shows a state where the mold resin 30 of the device 1 is removed. FIG. 4 shows a state where the substrate 10 and the capacitor element 20 are separated. FIG. 5 shows a cross-sectional view of the device 1. The substrate 10 of the device 1 is a glass cloth / epoxy resin copper clad laminate (glass epoxy substrate) cut into a substantially square shape. The copper foils on the mounting surface 11 and the mounting surface 12 of the substrate 10 are patterned by etching or the like, and the same electrode pattern is formed on both surfaces 11 and 12. Therefore, a plurality of connection electrodes having the same shape as the anode terminal 51 are formed on the mounting surface 11 of the substrate 10 at positions facing the plurality of anode terminals 51 on the mounting surface 12. An anode connection electrode 56 for connection to the anode 21 is provided. Further, a connection electrode having the same shape as the cathode terminal 52 is formed on the mounting surface 11 of the substrate 10 at a position facing the cathode terminal 52 of the mounting surface 12, and is connected to the cathode 22 of the capacitor element 20. It is a cathode connection electrode 57 for connection.

  In other words, the anode connection electrode 56 and the cathode connection electrode 57 are arranged along the entire circumference 13 on the surface 11 on the mounting side of the substrate 10, and the four anode connection electrodes 56 have four corners 15 a on the surface 11 on the mounting side. To 15d. The cathode connection electrode 57 is disposed on the surface 11 on the mounting side of the substrate 10 except for the anode connection electrode 56. That is, the cathode connection electrode 57 is formed so as to cover the central portion 16 of the surface 11 on the mounting side of the substrate 10 and the surrounding four sides 14a to 14d. The anode connection electrode 56 and the cathode connection electrode 57 are separated by an insulating gap 59 in the same manner as the surface 12 on the mounting side.

  Further, each anode terminal 51 and the anode connection electrode 56 are electrically connected by a through electrode (through hole, via hole) 55 penetrating the substrate 10. The cathode terminal 52 and the cathode connection electrode 57 are also electrically connected by a through electrode 55 that penetrates the substrate 10. The through electrode 55 is provided at an appropriate pitch with an appropriate number so as to suppress electrical resistance (connection resistance) between the anode terminal 51 and the anode connection electrode 56 and between the cathode terminal 52 and the cathode connection electrode 57. ing.

  The capacitor element (capacitor core) 20 of the device 1 is a solid electrolytic capacitor (solid electrolytic capacitor element), and has a thin film-like valve action base 23 cut into a substantially square shape. A dielectric oxide film 24 and a solid electrolyte layer 25 are laminated on 23b. On the solid electrolyte layer 25, a conductive paste layer 26 to be the cathode 22 is further laminated. The conductive paste layer 26 on the front surface 23 a and the back surface 23 b of the valve action base 23 is electrically supplied by a through electrode 27 formed at the center (center) of the valve action base 23 or in the vicinity thereof so as to penetrate the valve action base 23. It is connected. The through electrode 27 is obtained by filling a through hole penetrating the valve action base 23 with a conductive paste 28 such as a silver paste. The capacitor element 20 is mounted with the back surface 23 b facing the substrate 10. The valve action base 23 appears on the surface 23a of the valve action base 23, that is, the periphery (all circumferences) including the four sides and the four corners of the surface opposite to the mounting side, and the anode 21 is formed. Yes. On the other hand, the periphery of the back surface 23b of the valve action base 23 is covered with an insulating film 29 such as polyimide resin or epoxy resin.

  Examples of the valve action base 23 include an etched aluminum foil, a tantalum sintered body, a niobium sintered body, and a titanium sintered body. In consideration of forming a thin device 1 for surface mounting, a capacitor element 20 using an etched aluminum foil is suitable. Aluminum oxide is formed as a dielectric oxide film 24 on the surface of the etched aluminum foil 23. The solid electrolyte layer 25 can be formed by laminating a conductive polymer such as polypyrrole, polythiophene, or polyaniline on the dielectric oxide film 24 by electrolytic polymerization or the like. The exterior resin (mold resin) 30 that covers the capacitor element 20 includes a sealing resin such as an epoxy resin.

  In this capacitor element 20, the cathode 22 appears at the center portion of the back surface 23 b, and the portion corresponding to the anode around the back surface 23 b is covered with an insulating film 29. Therefore, by placing the capacitor element 20 through the element fixing conductive paste 61 with the back surface 23b facing the mounting surface 11 of the substrate 10, the cathode 22 of the capacitor element 20 and the cathode connection electrode 57 of the substrate 10 Can be electrically connected.

  Furthermore, the anode 21 appearing around the surface 23a of the capacitor element 20 and the anode connection electrode 56 of the substrate 10 are bonded by a conductive metal wire 62 such as a gold wire, a copper wire, or an aluminum wire. Can be electrically connected. Since the anode 21 appears along the entire circumference of the surface 23a of the capacitor element 20 having a square shape in plan view, the anode connection electrode 56 of the substrate 10 is not limited to the corner portion, but around the surface 11 on the mounting side of the substrate 10. If it is provided at the position along, it can be connected by wire bonding 62. Therefore, this type of capacitor element 20 can flexibly cope with various electrode arrangements of the substrate 10. The capacitor element 20 may be polygonal or circular in plan view, but the surface view of the device 1 for surface mounting is almost square, and considering the space efficiency for providing a large-capacity capacitor device, the capacitor element 20 It is desirable that the element 20 also has a square shape in plan view.

  In FIG. 6, a part of the printed wiring board 70 on which the device 1 is mounted is shown in cross section. The CPU 75 is mounted on the upper surface 71 of the printed wiring board (printed circuit board) 70, and the capacitor device 1 of this example is mounted on the lower surface 72 of the printed wiring board 70 at a position facing the power supply terminal 76 in the central portion of the CPU 75. Has been. The power terminal 76 of the CPU 75 and the terminal electrodes 51 and 52 on the mounting surface 2 of the device 1 are electrically connected by a plurality of through electrodes 79 that penetrate the printed wiring board 70, and the device 1 functions as a decoupling capacitor or a bypass capacitor. To do.

  The device 1 is, for example, a thin and compact capacitor chip for surface mounting having a side length of about 10 mm and a thickness of about 2 to 4 mm. The device 1 has a large low ESR and low ESL with a built-in solid electrolytic capacitor element 20. It is a thin and compact capacitor device. For this reason, the space required for mounting the device 1 is small. In addition, since the device 1 is a multipolar device in which a plurality of anode terminals 51 are provided on the mounting surface 2, one or a few devices 1 can cover applications in which a plurality of capacitors are conventionally mounted. Therefore, it is suitable for electronic devices such as information processing terminals such as notebook personal computers, which are becoming more compact, and portable information processing terminals such as mobile phones and PDAs.

  Furthermore, as shown in FIG. 2, since all the anode terminals 51 and cathode terminals 52 are arranged close to each other, the current path can be shortened, the loop area can be reduced, and ESL can be suppressed. Further, the anode terminal 51 and the cathode terminal 52 are arranged on the four sides of the device 1 along the periphery of the device 1, so that the directions of the current flowing inside the device 1 are various, and the magnetic field due to the current is easily canceled. For this reason, ESL can be further suppressed and a device more suitable for noise removal in a high frequency region can be provided.

  The anode terminal 51 and the cathode terminal 52 are connected to the anode 21 and the cathode 22 of the capacitor element 20 at a short distance. In the capacitor element 20, the through electrode 27 is arranged in the center, and the distance between the anode 21 and the cathode 22 is short. It is comprised so that it may become. Therefore, ESR can be further suppressed. For this reason, it is possible to cope with rapid charge / discharge, and it is possible to provide a device more suitable for backup of a CPU such as a personal computer. As described above, the device 1 can provide a more compact, low ESR, low ESL, and large-capacity capacitor device, and can provide a more suitable device for portable electronic devices and the like.

  Further, as shown in FIG. 2, the anode terminal 51 and the cathode terminal 52 appear on the mounting surface 2 of the device 1 in a state in which external connection can be alternately performed over the entire circumference 13. Therefore, it is easy to respond flexibly to various arrangements of the power supply terminals 76 of the CPU 75 and wiring patterns of the printed wiring board 70. Moreover, the terminal electrode 51 or 52 is arrange | positioned over the perimeter 13 of the mounting surface 2 of the device 1, In particular, the area or length in which the cathode terminal 52 is arrange | positioned along the perimeter 13 can be increased. For this reason, the cathode terminal 52 can be utilized as a shield electrode, and noise leakage can be suppressed. Further, since the anode terminal 51 is in contact with (close to) the cathode terminal 52 in at least two directions, the anode terminal 51 is easily shielded by the cathode terminal 52. Furthermore, the cathode terminal 52 is formed so as to widely cover the central portion 16 of the substrate 10. For this reason, the capacitor element 20 is easily shielded by the cathode terminal 52. Thus, this device 1 is easy to mount on the printed wiring board 70 and is also a device suitable for noise removal.

  7 to 14 show examples of different devices according to the present invention. In the following example, the arrangement of the mounting surface 2 of the device is changed, and the capacitor element 20 mounted on the substrate 10 is common, so the description thereof is omitted. FIG. 7 shows the mounting surface 2 of the different device 81. In this device 81, the central portion 16 of the mounting surface 2 is covered with an insulating sheet (masking member) 35 of polyimide resin or epoxy resin, and the anode terminal 51 and the cathode terminal 52 are provided only on the portion along the entire circumference 13 of the mounting surface 2. To appear. That is, the anode terminal 51 appears at the four corners 15 a to 15 d of the mounting surface 2, and the cathode terminal 52 appears at the four sides 14 a to 14 d of the mounting surface 2. Therefore, the anode terminal 51 and the cathode terminal 52 appear alternately on the entire circumference 13 of the mounting surface 2 so as to constitute a frame or an edge of the mounting surface 2.

  By reducing the area where the anode terminal 51 and the cathode terminal 52 appear on the mounting surface 2, the amount of solder or the like required for connection with the wiring of the printed wiring board 70 can be reduced, and a device more suitable for mounting can be obtained. In each of the embodiments described below, similar to the example shown in FIG. 7, the same effect can be obtained by covering the central portion of the mounting surface 2 with an insulating sheet or an insulating film.

  FIG. 8 shows a mounting surface 2 of a different device 82 and a mounting surface 12 of the substrate 10. In this device 82, the cathode terminal 52 is continuously formed so as to surround the mounting side surface 12 along the entire circumference 13 of the mounting side surface 12 of the substrate 10. Further, each of the four anode terminals 51 is provided inside the continuous cathode terminal 52 so as to be surrounded by the cathode terminal 52. Therefore, also on the mounting surface 2 of the device 82, the cathode terminal 52 continuously appears so as to surround the mounting surface 2 along the entire circumference 13 of the mounting surface 2. Further, each of the four anode terminals 51 appears inside the continuous cathode terminal 52 so as to be surrounded by the cathode terminal 52 and can be externally connected. In this device 1, since each anode terminal 51 is surrounded by the cathode terminal 52, noise leakage can be further suppressed.

  FIG. 9 shows a mounting surface 2 of a different device 83 and a mounting surface 12 of the substrate 10. In this device 83, the anode terminal 51 is formed in an L shape along each corner 15 a to 15 d at each corner 15 a to 15 d of the surface 12 on the mounting side of the substrate 10. Therefore, also on the mounting surface 2 of the device 83, the L-shaped anode terminal 51 appears in each of the corners 15a to 15d, and can be externally connected. As in this example, the shape of the terminal formed on the mounting surface 12 of the device substrate 10 and appearing on the device mounting surface 2 is not limited to a square, and may be L-shaped.

  FIG. 10 shows the mounting surface 2 of a different device 84 and the mounting surface 12 of the substrate 10. In this device 84, the cathode terminal 52 is continuously formed so as to surround the mounting side surface 12 along the entire circumference 13 of the mounting side surface 12 of the substrate 10, and an L-shaped anode terminal 51 is formed inside thereof. The corners 15a to 15d are formed. Therefore, also on the mounting surface 2 of the device 84, the cathode terminal 52 appears continuously so as to surround the mounting surface 2 along the entire circumference 13 of the mounting surface 2, and the four L-shaped anode terminals 51 are the cathode terminals 52. Appears so as to be surrounded by the cathode terminal 52 and can be externally connected. The anode terminal 51 arranged inside the cathode terminal 52 is not limited to a square, and may be L-shaped as in this example, or may be circular.

  FIG. 11 shows a mounting surface 2 of a different device 85 and a mounting surface 12 of the substrate 10. In this device 85, the cathode terminal 52 is formed on each of the two sides 14b and 14d on the mounting side surface 12 of the substrate 10 and the portions including the four corners 15a to 15d. Four anode terminals 51 are formed with the cathode terminals 52 sandwiched between the sides 14a and 14c sandwiched between the cathode terminals 52 extending along the two sides 14b and 14d. Therefore, also on the mounting surface 2 of the device 85, the cathode terminal 52 appears to include the four corners 15a to 15d along the two sides 14b and 14d, and the four anode terminals 51 appear on the sides 14a and 14c of the mounting surface 2. Appear across the cathode terminal 52. In this type of device 85, the power supply wiring connected to the anode terminal 51 can be sandwiched between the cathode terminals 52 arranged along the sides 14b and 14d, and noise leakage can be easily suppressed.

  FIG. 12 shows a mounting surface 2 of a different device 86 and a surface 12 on the mounting side of the substrate 10. In this device 86, the anode terminal 51 is continuously disposed along the entire circumference 13 of the surface 12 on the mounting side of the substrate 10, and the cathode terminal 52 is disposed along the four sides 14a to 14d on the inner side. It arrange | positions so that the anode terminal 51 may be adjoined. Therefore, on the mounting surface 2 of the device 86, the anode terminal 51 appears along the entire circumference 13, and the cathode terminal 52 appears along the four sides 14 a to 14 d so as to be close to the anode terminal 51. In this way, the anode terminal 51 and the cathode are covered by the single continuous anode terminal 51 and the single continuous cathode terminal 52 over the entire circumference 13 of the mounting surface 2 of the device 86 and the surface 12 on the mounting side of the substrate 10. The terminal 52 can be disposed close to the terminal 52.

  FIG. 13 shows a mounting surface 2 of a different device 87 and a mounting surface 12 of the substrate 10. In this device 87, the cathode terminal 52 is formed on the two sides 14 b and 14 d facing each other on the mounting side surface 12 of the substrate 10, and further on portions including the four corners 15 a to 15 d. Also, six anode terminals 51 are formed with the cathode terminals 52 sandwiched between the sides 14a and 14c sandwiched between the cathode terminals 52 extending along the two sides 14b and 14d. Therefore, also on the mounting surface 2 of the device 87, the cathode terminal 52 appears to include the four corners 15a to 15d along the two sides 14b and 14d, and the six anode terminals 51 have the sides 14a and 14c of the mounting surface 2. Appear across the cathode terminal 52. In this type of device 87, power supply wiring connected to a large number of anode terminals 51 can be sandwiched by the cathode terminals 52 arranged along the sides 14b and 14d, and noise leakage can be easily suppressed. Thus, in the device 87, even a combination of terminals including five or more anode terminals 51 can be easily arranged along the entire circumference 13 of the mounting surface 2 and the mounting surface 12 of the substrate 10.

  FIG. 14 shows a mounting surface 2 of a different device 88 and a mounting surface 12 of the substrate 10. In this device 88, one or a plurality of anode terminals 51 are arranged on each side 14a to 14d, and a cathode terminal 52 is arranged on the remaining part of the entire circumference 13. Therefore, also on the mounting surface 2 of the device 88, one or more anode terminals 51 appear on each side 14a to 14d, and the cathode terminals 52 appear on the remaining part of the entire circumference 13. Thus, in the device 88, a plurality of anode terminals 51 are arranged. The cathode terminal 52 appears along the two sides 14b and 14d so as to include four corners 15a to 15d, and the six anode terminals 51 appear across the sides 14a and 14c of the mounting surface 2 with the cathode terminal 52 interposed therebetween. In this type of device 88, the cathode terminals 52 arranged along the sides 14b and 14d can sandwich the power supply wiring connected to the large number of anode terminals 51, and it is easy to suppress noise leakage. Thus, in the device 88, even a combination of terminals including five or more anode terminals 51 can be easily arranged along the entire circumference 13 of the mounting surface 2 and the mounting surface 12 of the substrate 10.

  In addition, the device provided with the anode terminal 51 and the cathode terminal 52 arranged as described above is some examples of devices included in the present invention, and the present invention is not limited to the above. The capacitor element may also be a stacked solid electrolytic capacitor element in which a valve action base is stacked. The capacitor element may also be other types of capacitor elements such as non-solid electrolytic capacitors, ceramic type capacitors, film time capacitors and the like. The device for surface mounting according to the present invention can be used not only in combination with a CPU but also in combination with other circuit elements, and can be applied to a smoothing circuit of a DC-DC converter, for example.

1 Device for surface mounting (chip type capacitor)
2 Device mounting surface 10 Substrate, 11 Substrate mounting surface, 12 Substrate mounting surface, 13 Whole circumference 20 Capacitor element 30 Mold resin 51 Anode terminal, 52 Cathode terminal

Claims (11)

  1. A device for mounting on a surface having a substrate and a capacitor element mounted on a surface on the mounting side of the substrate, which is integrally formed with an exterior resin including the substrate and the capacitor element,
    The substrate, the surface of the mounting side includes a first connection electrode electrically connected to the anode of the capacitor element, and a second connection electrode electrically connected to the cathode of the capacitor element ,
    Including a first terminal electrode and a second terminal electrode, which are connected to the first connection electrode and the second connection electrode by a through electrode, respectively, on a mounting surface ;
    The first terminal electrode and the second terminal electrodes each comprise electrodes of the peripheral portion which is arranged close over the entire circumference of the mounting surface of the device, the peripheral portion of the electrode of the second terminal electrodes are the It is arranged on all sides of the mounting surface, covers the entire circumference of the mounting surface excluding the peripheral electrodes of the first terminal electrode, and further includes at least one of the second connection electrode and the second terminal electrode Includes a central portion electrode that widely covers the central portion of the substrate, and the central portion and the peripheral portion of the substrate are continuously connected by at least one of the second connection electrode and the second terminal electrode connected to the cathode. The device has a shield that covers it.
  2. The device according to claim 1, further comprising an insulating layer covering a central portion of the mounting surface .
  3. 3. The device according to claim 1 , wherein the second terminal electrode is formed continuously along a peripheral edge of the substrate.
  4. 3. The device according to claim 1 , wherein the first terminal electrode includes a plurality of electrodes in the peripheral portion, the second terminal electrode includes a plurality of electrodes in the peripheral portion, and the entire circumference of the mounting surface of the device. The plurality of peripheral electrodes of the first terminal electrode and the peripheral electrodes of the second terminal electrode appear alternately along the line.
  5. 3. The first terminal electrode according to claim 1 , wherein the first terminal electrode includes a plurality of electrodes in the peripheral portion, the second terminal electrode includes a plurality of electrodes in the peripheral portion, and the plurality of the first terminal electrodes. In the device, the peripheral electrodes of each of the second terminal electrodes appear at portions including four corners, and the plurality of peripheral electrodes of the second terminal electrode appear at four sides of the mounting surface, respectively.
  6. 3. The second terminal electrode according to claim 1 , wherein the second terminal electrode includes a plurality of peripheral electrodes, and the plurality of peripheral electrodes of the second terminal electrode includes two opposing sides and 4 of the mounting surface. Devices appearing in the corners.
  7. In Claim 1 or 2 , the second terminal electrode appears continuously along the entire circumference of the mounting surface of the device, and the first terminal electrode appears inside the second terminal electrode. Is the device.
  8. 8. The device according to claim 7 , wherein the first terminal electrode includes a plurality of peripheral electrodes, and the plurality of peripheral electrodes of the first terminal electrode appear to be surrounded by the second terminal electrodes. Is the device.
  9. 9. The device according to claim 1 , wherein the capacitor element is a solid electrolytic capacitor element.
  10. Printed wiring board device is mounted according to any one of claims 1 to 9.
  11. An electronic device comprising the printed wiring board according to claim 10 .
JP2009121303A 2009-05-19 2009-05-19 Surface mount devices Active JP5415827B2 (en)

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JP2009121303A JP5415827B2 (en) 2009-05-19 2009-05-19 Surface mount devices
TW099116008A TWI520165B (en) 2009-05-19 2010-05-19 Surface mount components, printed wiring board and electronic equipment
PCT/JP2010/003373 WO2010134335A1 (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
CN201080022003.5A CN102428530B (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
KR20117030066A KR20120023099A (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
SG10201402429XA SG10201402429XA (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
CN201410175722.0A CN103956267A (en) 2009-05-19 2010-05-19 Surface mounting device, capacitor element, printed circuit board, and electronic equipment
US13/321,049 US8803000B2 (en) 2009-05-19 2010-05-19 Device for surface mounting and capacitor element
EP20100777572 EP2434507A1 (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
SG2011084936A SG176134A1 (en) 2009-05-19 2010-05-19 Surface mounting device and capacitor element
US14/336,518 US9006585B2 (en) 2009-05-19 2014-07-21 Device for surface mounting and capacitor element

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JP2011009683A (en) * 2009-05-22 2011-01-13 Nippon Chemicon Corp Capacitor
JP5687890B2 (en) 2010-12-07 2015-03-25 ルネサスエレクトロニクス株式会社 Semiconductor device
US9241408B2 (en) 2010-12-28 2016-01-19 Murata Manufacturing Co., Ltd. Electronic component
JPWO2018235849A1 (en) * 2017-06-22 2019-11-14 株式会社村田製作所 High frequency power supply

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JP2000150290A (en) * 1998-09-11 2000-05-30 Kyocera Corp Capacitor
JP2001244145A (en) * 2000-02-25 2001-09-07 Rohm Co Ltd Solid electrolytic capacitor
JP4599653B2 (en) * 2000-04-20 2010-12-15 パナソニック株式会社 Sheet capacitor
JP4478695B2 (en) * 2007-03-19 2010-06-09 ニチコン株式会社 Solid electrolytic capacitor element and solid electrolytic capacitor including the same
JP4803744B2 (en) * 2007-05-22 2011-10-26 Necトーキン株式会社 Thin solid electrolytic capacitor
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