TWI520165B - Surface mount components, printed wiring board and electronic equipment - Google Patents

Surface mount components, printed wiring board and electronic equipment Download PDF

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Publication number
TWI520165B
TWI520165B TW099116008A TW99116008A TWI520165B TW I520165 B TWI520165 B TW I520165B TW 099116008 A TW099116008 A TW 099116008A TW 99116008 A TW99116008 A TW 99116008A TW I520165 B TWI520165 B TW I520165B
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TW
Taiwan
Prior art keywords
surface
electrode
substrate
capacitor
terminal electrode
Prior art date
Application number
TW099116008A
Other languages
Chinese (zh)
Other versions
TW201042680A (en
Inventor
Takuya Miyahara
Tetsuo Shiba
Original Assignee
Rubycon Corp
Rubycon Carlit Co Ltd
Japan Carlit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to JP2009121303A priority Critical patent/JP5415827B2/en
Priority to JP2009152193A priority patent/JP5415841B2/en
Priority to JP2009155113A priority patent/JP5415843B2/en
Application filed by Rubycon Corp, Rubycon Carlit Co Ltd, Japan Carlit Co Ltd filed Critical Rubycon Corp
Publication of TW201042680A publication Critical patent/TW201042680A/en
Application granted granted Critical
Publication of TWI520165B publication Critical patent/TWI520165B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors [EDLCs]; Processes specially adapted for the manufacture thereof or of parts thereof
    • H01G11/78Cases; Housings; Encapsulations; Mountings
    • H01G11/82Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors [EDLCs]; Processes specially adapted for the manufacture thereof or of parts thereof
    • H01G11/04Hybrid capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors [EDLCs]; Processes specially adapted for the manufacture thereof or of parts thereof
    • H01G11/74Terminals, e.g. extensions of current collectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors

Description

Surface mount components, printed wiring boards, and electronic equipment

The present invention relates to a capacitor element, a capacitor unit, and a mounting member incorporating the same in various electronic devices.

A technique relating to a chip type solid electrolytic capacitor is disclosed in Japanese Laid-Open Patent Publication No. 2006-80423 (Document 1), and aims to provide a chip type solid electrolytic capacitor which can improve ESL characteristics and can be low in ESL. The chip type solid electrolytic capacitor of Document 1 is a capacitor element; and an anode junction portion of an anode portion of the capacitor element formed at one end of a planar portion thereof, and an anode terminal portion for mounting attached thereto An anode lead frame formed; and a cathode portion mounted on the cathode portion of the capacitor element, and a planar portion where the edge layer is disposed on the flat portion of the anode lead frame, and a cathode terminal portion formed on the lower surface of the anode lead frame The cathode lead frame is constructed. In the chip type solid electrolytic capacitor, the direction of the current flowing to the cathode lead frame is opposite to the direction of the current flowing to the anode lead frame, and the ESL can be greatly reduced.

A technique disclosed in Japanese Laid-Open Patent Publication No. 2001-102252 (Document 2) provides a small-sized and large-capacity chip capacitor. Document 2 discloses a method of manufacturing a capacitor element in which a cathode lead is led at one end thereof and a cathode is formed on an outer peripheral surface thereof, and a solid electrode capacitor is sealed by a resin, in which the volume ratio of the capacitor element in the capacitor product is increased, both inside and outside. Each of the positive electrode and the negative electrode are provided, and a capacitor element is connected to the inner surface of the circuit substrate which is electrically connected between the same electrode through the through hole, so that the negative electrode of the surface is electrically connected with the cathode of the capacitor element, and the capacitor is simultaneously provided After the anode lead of the element is bonded to the positive electrode, it is exposed on the outer surface of the circuit board, and the capacitor element is sealed with a resin.

With the high frequency of electronic equipment, capacitors of one of its electronic components also require capacitors having excellent impedance characteristics in a high frequency range. At the same time, solid electrolytic capacitors are often used in the periphery of CPUs of personal computers. The solid electrolytic capacitor is a small-sized and large-capacity capacitor. The dielectric oxide film is formed on the surface of a metal foil such as aluminum having a rectifying action, and is separated into an anode portion and a cathode portion. The dielectric electrolyte film is formed by sequentially laminating a solid electrolyte layer formed of a conductive polymer and a cathode electrode. Capacitors used around the CPU of electronic equipment, in addition to small size and large capacity, must have excellent performance in eliminating noise and transient reactivity in response to high frequency. Therefore, low ESR (equivalent series connection) is required. Resistance: Equivalent series resistance) and low ESL (Equivalent series inductance).

In a sheet type surface mount module including a capacitor element such as a solid electrolytic capacitor, a method of lowering ESL is formed by forming an anode terminal and a cathode terminal on the same surface so that they are mutually insulable Closely configured, thus shortening its current path (ie, suppressing an increase in its loop area). One of the other methods of low ESL is to diversify the direction of current flow via multi-terminalization.

One of the aspects of the surface mount module of the present invention includes a substrate and a capacitor element mounted on the substrate mounting end surface, and the resin for coating includes a substrate and a capacitor element to be integrally molded.

The substrate includes a first terminal electrode electrically connected to the first electrode portion of the capacitor element and a second terminal electrode electrically connected to the second electrode portion of the capacitor element. At the same time, at least a part of the mounting end faces of the mounting end faces of the substrate are exposed on the mounting surface of the module, and the first terminal electrode and the second terminal electrode ring are all around the mounting surface of the component. Configured close to each other. In the device, the first terminal electrode and the second terminal electrode are exposed adjacent to each other along the entire periphery of the mounting surface so as to be externally coupled, and at least one of the first terminal electrode and the second terminal electrode The entire periphery of the component mounting surface is formed.

In the assembly, the entire periphery of the mounting surface of the component, that is, in a component such as a rectangle or a square, the square-shaped peripheral portion including the square of the four directions and the square of the corner on the square mounting surface The terminal electrode portion is formed substantially, and the wheel-shaped terminal electrode portion is divided into a first terminal electrode, that is, a standard anode terminal and a second terminal electrode, that is, a standard cathode terminal. Since the entire periphery of the mounting surface of the terminal electrode ring assembly is disposed close to each other, the current path can be shortened, and the direction of the current flowing in the module can be more diverse. Further, since the terminal electrode ring assembly is disposed around the entire periphery, the assembly has higher flexibility in the wiring pattern circuit of the printed wiring board to which it is mounted. In this way, the ESL of its components can be suppressed.

The substrate is preferably a laminate (printed wiring type). The substrate may be of a lead frame type. However, since the first and second terminal electrodes are disposed along the entire periphery of the mounting surface of the module, a lead frame having a complicated shape is required. When the substrate is a printed wiring type, the electrodes formed along the entire periphery of the substrate can easily form the first and second terminal electrodes exposed along the entire periphery of the mounting surface of the module by the pattern circuit. That is, at least the first terminal electrode and the second terminal electrode which are formed in the adjacent state (that is, in a state in which the first terminal electrode and the second terminal electrode are adjacent to each other) are formed on at least the entire surface of the surface on which the substrate is mounted on the substrate. Preferably, the entire periphery of the surface of the substrate mounting end is formed substantially.

The capacitor element may be, for example, a solid electrolytic capacitor element including a rectifying action, an electrolytic solution type capacitor element, a ceramic type capacitor element, or a film type capacitor element. The solid electrolytic capacitor is one type of capacitor which is small but has a large capacity, and is therefore one of the capacitor elements suitable for this assembly.

Further, the capacitor element includes a plate-like substrate having a rectifying action, a first functional layer formed on the first surface of the substrate, a second functional layer formed on the second surface of the substrate, and a first functional layer covering the first surface. It is preferable that the first insulating layer on the peripheral edge, the second insulating layer covering the peripheral edge of the second functional layer on the second surface, and at least one through hole penetrating through the substrate. The base body includes a first surface facing the opposite side of the substrate and a second surface facing the substrate. The first functional layer is a layer formed on the first surface of the substrate, and includes a dielectric oxide film, a solid electrolyte layer, and an electrode layer which are sequentially laminated on the first surface. The second functional layer is a functional layer formed on the second surface of the substrate, and includes a dielectric oxide film, a solid electrolyte layer, and an electrode layer which are sequentially laminated on the second surface. The capacitor element is further included on the inner circumferential surface of at least one of the through holes, and includes a third functional layer including a dielectric oxide film, a solid electrolyte layer, and an electrode layer which are sequentially laminated with the substrate end, and The functional layer of the 3 is electrically coupled to the electrode layer of the first functional layer and the electrode layer of the second functional layer. The first electrode portion is formed by at least a portion of the first surface of the substrate exposed on the outer peripheral end of the first insulating layer, and the second electrode portion is composed of an electrode layer of the first functional layer, an electrode layer of the second functional layer, and At least part of the electrode layer of the functional layer is formed.

The capacitor element is further electrically connected to the electrode layer of the first functional layer and the electrode layer of the second functional layer by an electrode layer of the third functional layer formed on the via hole. Therefore, the electrode layer having a rectifying action and formed on both sides of the substrate can be electrically connected via the structure in the substrate. These electrode layers constitute the standard cathode. On the other hand, the electrode layer of a standard cathode function is responsible for the function of the actual cathode by the solid electrolyte layer.

At the same time, a third functional layer is formed on the inner peripheral surface of the through hole, and a layer having a function of the solid electrolyte layer is formed on the inner peripheral surface of the through hole. Therefore, the through hole formed in the base body can suppress a decrease in capacitance due to a decrease in the capacitance area of the first surface (upper aspect) and the second surface (lower aspect). Thus, by electrically connecting the electrode layer formed on the lower surface (i.e., the standard cathode portion (cathode)) on the upper surface of the simple structure, the reduction in the capacitance area of the electrode layer can be suppressed.

The standard rectifying substrate (rectifying metal) is aluminum, and other metal substrates having rectifying action may also be used.

It is preferable that the module includes a plurality of capacitor elements which are repeatedly laminated in the vertical direction on the mounting end surface of the substrate. That is, the capacitor is preferably a capacitor unit including a plurality of capacitor elements and arranged to overlap in the first direction.

Each of the plurality of capacitor elements is a plate-shaped substrate having a rectifying action, and includes a substrate including a first surface facing the opposite substrate and a second surface facing the substrate, and a first surface of the substrate The dielectric layer including the dielectric oxide film, the first electrolyte layer of the solid electrolyte layer and the electrode layer, and the dielectric oxide film and the solid electrolyte layer which are sequentially laminated on the second surface of the substrate The second functional layer with the electrode layer. The four corner portions of the first surface of the substrate including the respective elements of the first electrode portion of each element are exposed in the vertical direction of the other elements than the plurality of capacitor elements, and the respective elements are formed. The second electrode portion is formed of at least a portion of at least the electrode layer of the first functional layer and the electrode layer of the second functional layer.

In the capacitor unit, the four corners of the first surface of each of the overlapping (i.e., laminated) elements are exposed in a vertical direction (first direction) in which the respective elements of the other elements are stacked. Therefore, the four corners of the first surface of each element can be accumulated in the vertical direction without overlapping the four corners of the other elements. In this manner, the four corners of the first surface of each element are the first electrode portions, and the first electrode portion and the substrate can be coupled to each other in various ways in the vertical direction (first direction) of the first electrode portions. Therefore, in a module in which a plurality of capacitor elements are stacked, it is easy to form an electrical connection with each element, and it is less likely to cause contact failure or the like, and thus it is possible to provide a high-capacity component which is also high in reliability at low cost. These first electrode portions form a standard anode, and the standard bonding method is wire bonding and lead frame.

At the same time, in this assembly, the four corners of the plurality of elements are exposed in different directions to form an overlap. Therefore, the current in each component flows in four directions as standard, while the current in the assembly flows in more directions. This makes it easy to offset the magnetic field therein, so components with low ESL can be easily provided.

In addition, in this assembly, each of the four corners of the plurality of elements is exposed in different directions to form an overlap. In this way, it is easy to configure a plurality of wire bonding wires and lead frames in a plurality of directions, and it is easy to form a component including a plurality of bonding electrodes.

In addition, the four corners of the plurality of elements in the assembly are exposed in different directions to form an overlap. Therefore, almost all of the portions of the matrix of each element are formed in a state of being laminated to each other. As described above, since a plurality of components in which the electrode portions are exposed at the periphery are formed, it is possible to improve the spatial effect and provide a stabilizer which exhibits a symmetrical (i.e., axisymmetric) shape in the vertical direction (first direction). Therefore, it is possible to provide a component which is micromorphized, large-capacity, low-ESR, and low-ESL, and which is also easy to form a connection with a substrate or a lead frame, and which is easy to be multi-electrode.

The substrate preferably includes a first coupling electrode that is electrically coupled to the first electrode portion of the capacitor element and a second coupling electrode that is electrically coupled to the second electrode portion of the capacitor element. The first coupling electrode is formed on the surface of the substrate mounting end and is opposed to (corresponding to) the first terminal electrode on the surface of the mounting end. The second junction electrode is formed at a position facing (corresponding to) the first terminal electrode on the surface of the mounting end. The first terminal electrode and the first coupling electrode, and the second terminal electrode and the second coupling electrode are connected by a via electrode (through hole) penetrating each substrate. The capacitor element mounted on the substrate and the first and second junction electrodes on the surface on which the substrate is mounted may be connected by a conductive material such as wire bonding or a conductive paste.

In the module, the first electrode portion and the first coupling electrode may be joined by wire bonding (welding wire). The second electrode portion and the second junction electrode can be directly or via a conductive paste.

In the standard module, the first electrode portion is an anode of the capacitor element, the second electrode portion is a cathode of the capacitor element, and the second terminal electrode is a cathode terminal. Therefore, when the area of the first terminal electrode is made larger than the area of the second terminal electrode, it is easy to obtain an electromagnetic wave shielding effect from the second terminal electrode. In order to enlarge the area, the second terminal electrode can be further expanded toward the center of the substrate. The second terminal electrode on the surface of the mounting end of the substrate may be covered with an exterior resin or an insulating coating material in addition to the periphery of the substrate. It is also effective when the second terminal electrode is continuously formed along the peripheral edge of the substrate.

The plurality of first and second terminal electrodes may be alternately exposed along the entire periphery of the module. The plurality of first terminal electrodes may be exposed at a portion including the corners of the mounting surface 4, and the plurality of second terminal electrodes may be exposed on the four sides of the mounting surface. The corner portion of the mounting surface can also be used as a terminal electrode. The plurality of second terminal electrodes may also be exposed on the mounting surface including the opposite sides and the four corners. When the second terminal electrode is a cathode terminal, when the cathode terminal is disposed on the side opposite to the anode terminal, the cathode terminal can be easily disposed across the power source line.

The second terminal electrode may be continuously exposed along the entire periphery of the module, or the first terminal electrode may be exposed inside the second terminal electrode. A plurality of first terminal electrodes may be exposed and surrounded by the second terminal electrodes. When the second terminal electrode is a cathode terminal, since the anode terminal is surrounded by the cathode terminal, noise generated by the mounted substrate can be easily shielded.

The capacitor element of the electrode layer of the first functional layer and the electrode layer of the second functional layer is bonded by the electrode layer of the third functional layer, and the electrode layer of the first functional layer and the second electrode layer and the second layer of the second functional layer are not required The electrode layers of the functional layer form an electrical bond. Therefore, the first electrode portion (standard anode portion (anode)) separated by the electrode layer and the insulating layer of the capacitor element can be intermittently disposed on the entire periphery of the peripheral edge of the substrate. This enables the capacitor element to be adapted to be mounted on the assembly. The first electrode portion can be continuously or intermittently disposed on the entire periphery of the peripheral edge of the substrate, so that the elasticity of the wiring pattern circuit on which the capacitor element substrate is mounted can be further improved.

Further, when the cathodes formed on both surfaces of the substrate are joined through the inside of the substrate (center portion or the like), and the anode is intermittently or continuously disposed at the peripheral edge of the substrate, the distance between the poles in the capacitor element can be shortened. In this way, the ESR can be easily reduced, and the direction of current flow in the capacitor element can be diversified, and the ESL can be easily reduced. Therefore, it is possible to provide a capacitor element which is small in size, low in ESL, and low in ESR, and which can flexibly and easily correspond to the arrangement of the connection terminals, and a component in which these are mounted.

Preferably, at least one of the through holes is formed in the center of the substrate. This makes it possible to suppress a large variation in the distance between the third functional layer formed on the through hole and the first electrode portion disposed along the peripheral edge of the substrate, so that the direction in which the current flows can be diversified. Therefore, it is possible to easily provide capacitor elements of low ESR and low ESL, and to mount such components. A plurality of through holes can also exert their effects when arranged in line and/or point symmetry on the substrate.

In a capacitor unit including a plurality of capacitor elements and an assembly in which the capacitor unit is mounted, an electrode layer of a first functional layer of a capacitor element at a lower end thereof and an electrode layer of a second functional layer of a capacitor element of an upper end are electrically connected Then, a plurality of capacitor elements can be connected in parallel. The junction electrode may be an electrode penetrating the substrate or an electrode formed on the side of the substrate.

In the case of the via electrode, the third functional layer formed on the inner peripheral surface of the through hole of the base of the plurality of capacitor elements can exhibit the function of the solid electrolytic capacitor on the inner peripheral surface of the through hole. When the electrode is formed on the side surface, the third functional layer formed on the side surface of the substrate of the plurality of capacitor elements allows the side surface to exhibit the function of the solid electrolytic capacitor. Therefore, by stacking the plurality of capacitor element layers, it is possible to easily provide capacitor units (element laminates) having a larger capacity, lower ESR, and lower ESL, and components in which the capacitor units are mounted.

Each element (capacitor element) of the capacitor unit (component laminate) is not limited to the four corners exposed to the first electrode portion, and may be exposed at the entire periphery of the first surface of the substrate. a first electrode portion (standardly an anode portion (ie, an anode)) exposed on the entire periphery of the first surface of the substrate, and covering the first functional layer of the first surface of the substrate (standardly, the electrode layer of the cathode portion (ie, cathode)). Therefore, it is possible to provide a capacitor element in which the anode portion and the cathode portion are disposed at opposite positions. As described above, since the distance between the poles in each of the capacitor elements is reduced, the ESR can be easily lowered, and the direction in which the current flows in each of the capacitor elements can be diversified, and the ESL can be easily reduced. Thus, capacitor units of lower ESR and lower ESL, and components in which such capacitor units are mounted can be easily provided.

A state in which four corners of a plurality of elements are overlapped and exposed in different directions, and the four corners of the first surface of each element are arranged along the circumference of the first circle (one of the circles). Each element has the same shape. For example, in a quadrangular shape, these elements are layered at a point of 1 point, so that the four corners of the elements (standardly, that is, the anode portion thereof) are formed along the circumference of the first point (around the 1 point). That is, the configuration of the in-line junction is formed. In this way, it is possible to suppress the imbalance in the stacking of a plurality of capacitor elements, and it is possible to easily provide a capacitor unit that is balanced and stable in shape, and a component in which the capacitor units are mounted.

In each element of the capacitor unit, the first electrode portion may be exposed at two sides opposite to the first surface of the substrate, in addition to the four corners. In the capacitor unit, the two sides facing the first surface of each element are oriented in a direction in which the elements of the other elements of the plurality of capacitor elements are stacked, that is, in the direction (first direction) of the surface on which the vertical substrate is mounted. Exposed.

The capacitor unit mounted on the module includes a first capacitor element and a second capacitor element which are arranged in this order in the vertical direction (first direction), and the second capacitor element is smaller than the first capacitor element. The peripheral edge of the second capacitor element substrate is disposed on the inner side of the peripheral edge of the first capacitor element substrate. In this manner, since all of the second capacitor elements are mounted in the vertical direction (first direction) of the first capacitor element, the first electrode portion can be easily stabilized by the second capacitor element.

One of the other aspects of the present invention is a printed wiring board on which the above components are mounted and an electronic device including the printed wiring board. Since the above components can provide a large-capacity, low-ESR, and low-ESL surface-mount type (chip type) capacitor, it is possible to suppress the occurrence of noise when a semiconductor component such as a CPU using a decoupling capacitor or a bias capacitor is used in common. In addition, the above components are also applicable to various applications including a filter capacitor of a DC/DC power supply and the like.

The present invention is preferably a capacitor element comprising the above components. The capacitor element includes a plate-like substrate having a rectifying action; and a first functional layer including a dielectric oxide film, a solid electrolyte layer, and an electrode layer laminated on the first surface of the substrate; and a first functional layer on the substrate The second surface includes a dielectric oxide film, a solid electrolyte layer, and a second functional layer of the electrode layer; and a first insulating layer and a second surface covering the peripheral edge of the first functional layer of the first surface a second insulating layer at a peripheral edge of the second functional layer; a first electrode portion formed by at least a portion of the first surface of the substrate exposed on the outer peripheral end of the first insulating layer; and at least one through hole penetrating through the substrate The first electrode portion. In the capacitor element, a third functional layer including a dielectric oxide film, a solid electrolyte layer, and an electrode layer is sequentially laminated on the inner circumferential surface of at least one of the through holes, and the substrate is bonded to the substrate. The electrode layer of the third functional layer is electrically connected to the electrode layer of the first functional layer and the electrode layer of the second functional layer. In the capacitor element, it is preferable that the first electrode portion is intermittently or continuously exposed along the entire periphery of the peripheral edge of the first surface. It is preferable that at least one of the through holes is formed in the center of the substrate.

The capacitor unit of the above assembly is further included in the present invention. The capacitor unit is a capacitor unit including a plurality of capacitor elements that are arranged to overlap each other in the first direction. Each of the plurality of capacitor elements includes a plate-like substrate having a rectifying action; and a first functional layer including a dielectric oxide film, a solid electrolyte layer, and an electrode layer laminated on the first surface of the substrate And comprising a dielectric layer oxide film, a solid electrolyte layer, and a second functional layer of the electrode layer sequentially laminated on the second surface of the substrate; and a portion formed by the four corners of the substrate including the first surface The first electrode portion; and the four corners of the first surface of each element are exposed in the first direction of the other elements of the plurality of capacitor elements.

The present invention further includes a method of manufacturing the above capacitor unit. Each of the plurality of capacitor elements includes a plate-like substrate having a rectifying action; and a first function of a dielectric oxide film, a solid electrolyte layer, and an electrode layer which are sequentially laminated on the first surface of the substrate And a second functional layer comprising a dielectric oxide film, a solid electrolyte layer and an electrode layer laminated in sequence on the second surface of the substrate; and a portion formed by the four corners exposed on the first surface of the substrate The first electrode portion. A method of manufacturing a capacitor unit including a plurality of capacitor elements arranged to overlap in a first direction includes exposing four corners of a first surface of each element in a first direction of a plurality of other elements of the plurality of capacitor elements to form a layer The steps of integrating the components.

Component 1.1 Summary of components

Figure 1 shows the appearance of an example of a related component of the present invention. The module 1 includes a substrate 10 and a capacitor element 20 mounted on a surface 11 of the mounting end of the substrate 10, and a rectangular or square surface including the substrate 10 and the capacitor element 20 is integrally molded by a coating resin (molding resin) 30. Mounting components.

1.1.1 substrate

Figure 2 shows the mounting surface 2 of the assembly 1. In the module 1, the surface 12 of the mounting end of the substrate 10 is not covered with the coating resin 30, and the mounting surface 2 is exposed. In the mounting surface 2 of the module 1, that is, the surface 12 of the mounting end of the substrate 10, the entire circumference 13 of the ring is disposed close to the first terminal electrode 51 and the second terminal electrode 52. That is, all four sides 14a, 14b, 14c, and 14d, and 4 corners (4 corners) 15a, 15b, 15c, and 15d on the surface 12 of the mounting end of the ring substrate 10 are formed. The first terminal electrode 51 and the second terminal electrode 52 are in a form in which the edge gaps (i.e., the intervals) 59 are adjacent to each other. In this manner, the entire periphery 13 of the surface 12 of the substrate 10 is covered with the first terminal electrode 51 and the second terminal electrode 52 which are alternately formed. At the same time, the entire periphery of the mounting surface 2 of the component 1 (in this example, the entire periphery 13 of the substrate 10) is formed by the first terminal electrode 51 and the second terminal electrode 52, wherein the terminal electrodes 51 and 52 are used for isolation. The gaps (intervals) 59 are exposed in an adjacent manner, and can be electrically connected to a connection terminal or the like formed on an external printed wiring board.

The first terminal electrode 51 of the module 1 is connected to the anode terminal of the first electrode portion (anode) of the capacitor element 20. The assembly 1 includes four anode terminals 51 which are respectively formed by four corners 15a to 15d on the surface 12 of the mounting end of the substrate 10. The second terminal electrode 52 of the module 1 is a cathode terminal that connects the second electrode portion (cathode) of the capacitor element 20, and is disposed on a surface other than the anode terminal 51 on the surface 12 of the mounting end of the substrate 10. That is, the cathode terminal 52 forms the central portion 16 and the surrounding four sides 14a to 14d on the surface 12 of the mounting end of the cover substrate 10. The anode terminal 51 and the cathode terminal 52 are further separated by an insulating gap 59. The insulating gap 59 is preferably about 0.1 mm to 2 mm, more preferably about 0.2 mm to 1 mm. The insulating gap 59 may be spaced or filled with an insulating resin.

The state in which the component 1 is removed from the molding resin 30 is shown in FIG. FIG. 4 shows a state in which the base substrate 10 is separated from the capacitor element 20. Fig. 5 is a cross-sectional view taken along line V-V of the assembly 1 (V-V section of Fig. 1). The substrate 10 of the module 1 is a laminate formed of conductors (conductive layers, electrode layers) on both sides of an insulating plate (insulating substrate). The substrate 10 is cut into a nearly square glass fiber cloth ‧ epoxy resin copper clad laminate (epoxy glass substrate). The copper foil on the substrate 10 on which the end surface 11 and the surface 12 of the mounting end are placed is patterned by etching or the like, and the surfaces 11 and 12 on both sides are formed into the same electrode circuit pattern. Therefore, a plurality of coupling electrodes having the same shape as the anode terminal 51 are formed on the surface 11 of the substrate 10 on the end surface of the substrate 10 at a position opposite (corresponding) to the plurality of anode terminals 51 of the surface 12 of the mounting end, forming a capacitor. The anode (anode portion) 21 of the element 20 is coupled to the anode junction electrode 56. On the surface 11 of the substrate 10 on which the end is mounted, a junction electrode having the same shape as the cathode terminal 52 is formed at a position opposite (corresponding) to the cathode terminal 52 of the surface 12 of the mounting end, and a cathode (cathode) of the capacitor element 20 is formed. The 22 junction cathode junction electrode 57.

That is, the anode-side electrode 56 and the cathode junction electrode 57 are disposed along the entire periphery 13 on the surface 11 on which the end of the substrate 10 is mounted, so that the four anode-coupling electrodes 56 are formed on the four corners 15a to 15d on the surface 11 of the mounting end. . The cathode junction electrode 57 is disposed on a surface of the mounting end 11 other than the anode coupling electrode 56. That is, the cathode junction electrode 57 is formed to cover the center portion 16 and the surrounding four sides 14a to 14d of the surface 11 of the mounting end of the substrate 10. The anode junction electrode 56 and the cathode junction electrode 57 are also separated from the surface 12 of the mounting end by a gap 59.

At the same time, each of the anode terminal 51 and the anode junction electrode 56 is electrically connected by a via electrode (through hole, wiring hole) 55 penetrating through the substrate 10. The cathode terminal 52 and the cathode junction electrode 57 are also electrically coupled by the via electrode 55 penetrating the substrate 10. The via electrode 55 is formed to suppress the electric resistance (coupling resistance) between the anode terminal 51 and the anode junction electrode 56 and between the cathode terminal 52 and the cathode junction electrode 57, and an appropriate number and an appropriate angle are formed.

1.1.2 Capacitor components

Fig. 6 is a plan view showing the capacitor element 20 (in the form of the first surface (upper aspect)). Fig. 7 is a bottom view of the capacitor element 20 (in the form of the second surface (lower aspect)). Fig. 8 is a sectional view taken along the line VIII-VIII of the capacitor element 20 (section VIII-VIII of Fig. 6). Further, the diagram shown in Fig. 9 is a partially enlarged cross section of the structure of the capacitor element 20.

The capacitor element (capacitor body) 20 of the module 1 is a solid electrolytic capacitor (solid electrolytic capacitor element) including a rectifying substrate 23 cut into a plate shape or a film shape close to a square. The rectifying substrate 23 includes a first surface 23a and a second surface 23b which are formed by etching or the like. In this example, the second surface 23b faces the lower end surface of the surface 11 on which the end is mounted on the substrate 10 (the lower surface), and the first surface 23a is the surface opposite to the upper end of the second surface 23b (upper aspect). These faces 23a and 23b may be opposite to each other and may be opposed to each other.

On the first surface 23a of the base 23, the first functional layer 31 is further formed. The first functional layer 31 includes a dielectric oxide film 24a, a solid electrolyte layer 25a, and an electrode layer 26a which are sequentially laminated on the first surface 23a. The rectifying substrate 23 may be, for example, an etched aluminum foil, a tantalum sintered body, a tantalum sintered body, or a titanium sintered body. It is preferable to use the capacitor element 20 which etches an aluminum foil, in consideration of the manufacture of the thin component 1 for surface mounting. The dielectric oxide film 24a is a substrate 23 which is formed on the surface when etching an aluminum foil. The solid electrolyte layer 25a is formed by electropolymerization or the like of a conductive polymer such as polypyrrole, polythiophene or polyaniline, and is laminated on the dielectric oxide film 24a. One of the electrode layers 26a is an electrically conductive paste laminated on the solid electrolyte layer 25a, and the cathode portion 22 is formed. In the first functional layer 31, the junction resistance is reduced, and a highly conductive graphite layer or the like laminated between the solid electrolyte layer 25a and the electrode layer 26a may be contained.

The second functional layer 32 is further formed on the second surface 23b of the base 23. The second functional layer 32 includes a dielectric oxide film 24b, a solid electrolyte layer 25b, and an electrode layer 26b which are sequentially laminated on the second surface 23b. The electrode layer 26b re-forms the cathode portion 22 of the capacitor element 20. Meanwhile, the electrode layer 26a functioning as the function of the cathode portion 22 and the electrode layer 26b, which are described in the present specification, form a cathode of the structure, and the function of the true cathode functions through the solid electrolyte layers 25a and 25b. The following explanations are also the same.

On the first surface 23a of the base 23, a first insulating layer 29a covering the entire periphery of the peripheral edge 31c of the first functional layer 31 of the ring is formed. On the second surface 23b of the base 23, a second insulating layer 29b covering the entire periphery of the peripheral edge 32c of the second functional layer 32 of the ring is formed. The peripheral surface (peripheral edge) 23c of the first surface 23a of the base member 23 is exposed on the outer peripheral end (outer end, outer edge end, and peripheral end) of the first insulating layer 29a, and the first electrode (anode) portion of the capacitor element 20 is formed. twenty one. An example of the insulating layers 29a and 29b is a film made of an insulating resin such as a polyimide resin or an epoxy resin.

The capacitor element 20 further includes a through hole 27 (through hole) penetrating the center of the rectifying substrate 23. The third functional layer 33 is further formed on the inner peripheral surface 27a of the through hole 27. The third functional layer 33 includes a dielectric oxide film 24c and a solid electrolyte layer 25c which are sequentially laminated with the junction of the rectifying substrate 23. The via electrode 27 is filled with a conductive paste such as a silver paste to form a via electrode 28. Therefore, the third functional layer 33 is formed by laminating the dielectric oxide film 24c, the solid electrolyte layer 25c, and the via electrode 28 from the base 23 end.

The dielectric oxide film 24c on the third functional layer 33 is integrally formed by the dielectric oxide film 24a of the first functional layer 31 and the dielectric oxide film 24b of the second functional layer 32. The solid electrolyte layer 25c on the third functional layer 33 is integrally formed by the solid electrolyte layer 25a of the first functional layer 31 and the solid electrolyte layer 25b of the second functional layer 32. The inner peripheral surface 27a of the via electrode 27 may form a solid electrolyte layer 25c simultaneously with the surface of the substrate 23 by a method such as electrolytic polymerization. The via electrode 28 of the third functional layer 33 is formed by physically and electrically connecting the electrode layer 26a of the first functional layer 31 and the electrode layer 26b of the second functional layer 32. Therefore, in the capacitor element 20, the first to third functional layers 31 to 33 are formed at the same time as the surfaces 23a and 23b at the inner peripheral surface 27a of the through hole 27, and have the function of a solid electrolytic capacitor, and the like. Layers 31 to 33 are in turn connected in parallel with the electrodes 23a, 23b, and 28 forming the cathode.

As shown in FIG. 5, in the capacitor element 20, the second functional layer 32 on the second surface 23b of the base 23 faces the substrate 10, and the assembly 1 is formed (made). As shown in Fig. 7, in the capacitor element 20, the electrode layer 26b (cathode portion 22) is exposed at the central portion of the second surface 23b, and the periphery of the second surface 23b of the base member 23 (the peripheral edge 32c of the second functional layer 32) is further The insulating layer 29b is entirely covered. Therefore, the second surface 23b on the end surface 11 of the substrate 10 is placed on the capacitor element 20 via the element-fixing conductive paste 61, and the cathode portion 22 of the capacitor element 20 and the cathode junction electrode 57 are electrically coupled.

As shown in Fig. 6, the first surface 23a of the rectifying base 23, that is, the side in the four directions and the four corners on the surface on the side opposite to the side on which the mounting is applied (the entire periphery, the periphery of the first functional layer 31) On the edge 31c), the rectifying substrate 23 is exposed at the outer peripheral end of the insulating layer 29a to form the anode portion 21. The insulating layer 29a similar to the insulating layer 29b of the second surface 23b is formed on the first surface 23a, and the insulating layer 29a is partially peeled off or cut to expose the surface 23a of the base 23, whereby the anode portion 21 can be formed.

As shown in FIG. 5, the anode portion 21 exposed on the periphery of the first surface 23a of the capacitor element 20 on the module 1 and the anode junction electrode 56 of the substrate 10 are made of a conductive metal bonding wire such as a gold wire, a copper wire or an aluminum wire. 62 welding forms an electrical connection. The anode portion 21 is exposed along the entire periphery of the first surface 23a of the planar polygonal capacitor element 20. Therefore, the anode coupling electrode 56 of the substrate 10 is not limited to the portion around the corner, and is located around the surface 11 of the mounting end of the substrate 10. When the position is formed, the wire can be welded to form a joint. The metal bonding wire 62 is included, and the capacitor element 20 is protected by a coating resin (molding resin) 30. An example of the molding resin 30 is a sealing resin such as an epoxy resin. Therefore, the capacitor element 20 of this form can elastically correspond to the various electrode arrangements of the substrate 10.

In the capacitor element 20, the first functional layer 31 is formed on the first surface 23a of the rectifying substrate 23, that is, the surface on the opposite side of the mounting end, and the electrode layer 26a on the surface thereof forms the cathode portion 22. At the same time, in the four sides of the electrode-containing layer 26a and the periphery (all the periphery) of the four corners, the pinch insulating layer 29a exposes the rectifying substrate 23 to form the first electrode (anode) portion 21. In this manner, since the anode (first electrode) portion 21 and the cathode portion 22 (electrode layer 26a) are disposed in close proximity to each other, the capacitor element 20 having a low ESL and the module 1 on which the capacitor element 20 is mounted can be easily provided. The positional relationship (i.e., the relative direction) between the anode portion 21 and the electrode layer 26a varies along the peripheral edge 31c of the first functional layer 31, and the electrode layer 26a is coupled to the via electrode 28 of the third functional layer 33 passing through the center of the substrate 23. The electrode layer 26b of the second functional layer 32 on the substrate 10 is coupled. Therefore, since the current flowing to the first functional layer 31 is various, the capacitor element 20 having a low ESL and the module 1 on which the capacitor element 20 is mounted can be easily provided.

At the same time, in the capacitor element 20, the via electrode 28 formed through the center of the substrate 23 is bonded to the cathode portion 22 (electrode layers 26a and 26b) formed on both faces 23a and 23b of the substrate 23 to form a substrate 23 The anode (first electrode) portion 21 formed by the peripheral edge is arranged next to each other. Therefore, the anode portion 21 of the cathode portion 22 including the via electrode 28 is opposed to each other, and since the via electrode 28 penetrating the center of the substrate 23 is connected to the cathode portion 22 on both sides, the electrode between the capacitor elements 20 is interposed therebetween. The distance is shortened. Therefore, the capacitor element 20 can easily reduce its ESR.

Further, since the third functional layer 33 is formed on the inner peripheral surface 27a of the through hole 27, the area of the inner peripheral surface 27a of the through hole 27 which functions as a solid electrolytic capacitor element can also be increased. Therefore, even when the through hole 27 is disposed to penetrate through the center portion of the penetrating base 23 or the vicinity thereof, the capacity reduction due to the through hole 27 (i.e., the reduction in the surface utilization ratio of the base 23) can be reduced, and thus the through hole 27 can be elasticized. The ground is disposed at a desired position on the base 23.

Since the anode portion 21 is formed around the electrode layer 26a and the entire circumference of the ring capacitor element 20, the elasticity of the wiring pattern circuit can be improved for the substrate 10 on which the capacitor element 20 capable of electrically connecting at various positions is mounted.

1.1.3 Use cases

A partial cross section of the printed wiring board 70 mounted on the component 1 is shown in FIG. The CPU 75 is mounted on the upper side 71 of the printed wiring board (printed substrate) 70. The capacitor unit 1 of this example is mounted on the lower surface 72 of the printed wiring board 70 at a position opposed to the power supply terminal 76 of the central portion of the CPU 75. The power terminal 76 of the CPU 75 and the terminal electrodes 51 and 52 of the mounting surface 2 of the module 1 are electrically coupled to a plurality of via electrodes 79 penetrating the printed wiring board 70, and the function of the component 1 is a decoupling capacitor or bias. Capacitor.

The module 1 is a thin, micro-shaped surface mount capacitor chip having a length of about 10 mm and a thickness of about 2 to 4 mm, and is low ESR, low ESL, large capacity, and thin for the capacitor element 20 to be mounted. , micro-shaped capacitor assembly. Therefore, the space required for the component 1 to be mounted is small. At the same time, since the module 1 is a multi-polarized module in which a plurality of anode terminals 51 are formed on the mounting surface 2, a single one or a small number of components 1 can be used for the purpose of mounting a plurality of conventional capacitors. Therefore, it is suitable for electronic devices such as data processing terminals such as notebook computers that are developed in the form of micro-formats, portable data processing terminals such as mobile phones and PDAs.

Further, as shown in FIG. 2, since all of the anode terminal 51 and the cathode terminal 52 are arranged close to each other, the current path can be shortened, so that the loop area can be reduced and the ESL can be suppressed. At the same time, since the anode terminal 51 and the cathode terminal 52 are arranged in the four directions of the module 1 along the periphery of the module 1, the direction of current flowing into the component 1 is varied, so that the magnetic field generated by the current can be easily eliminated. Therefore, the provided component 1 is more suitable for suppressing ESL and removing noise in the high frequency range.

The anode terminal 51 and the cathode terminal 52 are connected to the anode portion 21 and the cathode portion 22 of the capacitor element 20 at a short distance, and the anode portion 21 and the cathode portion 22 of the through-hole electrode 27 disposed at the center of the capacitor element 20 are disposed. The distance can be shortened. Therefore, ESR can be more suppressed. In this way, the emergency speed can be charged and discharged, and thus the component 1 provided is more suitable for the restoration of the CPU of a personal computer or the like. Thus, the component 1 can provide a more micronized, low ESR, low ESL, and large capacity capacitor assembly, and can provide a better component such as a portable electronic device.

As shown in FIG. 2, on the mounting surface 2 of the module 1, the entire periphery 13 of the ring exposes the anode terminal 51 and the cathode terminal 52 so as to be alternately connected to the outside. Therefore, the arrangement of the power supply terminals 76 of the various CPUs 75 and the wiring pattern circuit of the printed wiring board 70 can be easily elastically matched. The anode terminal 51 or the cathode terminal 52 disposed on the entire periphery 13 of the mounting surface 2 of the module 1 can particularly increase the area or length of the entire periphery 13 of the cathode terminal 52. Therefore, the cathode terminal 52 can be applied as an electromagnetic wave shielding electrode to suppress leakage of noise. Since the anode terminal 51 is coupled (closely coupled) to the cathode terminal 52 in at least two directions, the anode terminal 51 can be easily shielded by the cathode terminal 52. The cathode terminal 52 forms a large coating on the central portion 16 of the substrate 10. Therefore, the capacitor element 20 can be easily shielded by the cathode terminal 52. Thus, the assembly 1 can be easily mounted on the printed wiring board 70 while forming a component suitable for removing noise.

2. Examples of components

The following are examples of additional components related to the present invention, but the present invention is not limited thereto.

2.1 Mounting surface configuration

The components shown below are examples of the arrangement of the mounting surface 2 of the conversion module, that is, the surface 12 of the mounting end of the substrate 10, and the capacitor elements 20 mounted on the substrate 10 are the same, and thus the description thereof will be omitted.

Figure 11 shows the mounting surface 2 of the other component 81, i.e., the surface 12 of the mounting end of the substrate 10. The center portion 16 of the mounting surface 2 in the assembly 81 is covered with an insulating sheet (cladding material) 35 of polyimide resin or epoxy resin, and only the portion along the entire periphery 13 of the mounting surface 2 exposes the anode terminal 51. And a cathode terminal 52. That is, the anode terminals 51 are exposed at the four corners 15a to 15d of the mounting surface 2, and the cathode terminals 52 are exposed at the four corners 14a to 14d of the mounting surface 2. Therefore, the anode terminal 51 and the cathode terminal 52 are alternately exposed on the entire periphery 13 of the mounting surface 2, and constitute the frame or edge of the mounting surface 2.

By reducing the area of the anode terminal 51 and the cathode terminal 52 exposed on the mounting surface 2, the amount of the bonding material and the like necessary for the wiring of the printed wiring board 70 can be reduced, and thus it is possible to manufacture a component more suitable for mounting. In each of the following embodiments, as shown in Fig. 11, the center portion of the mounting surface 2 is covered with an insulating sheet or an insulating film, so that the same effect can be obtained.

Figure 12 shows an example of the mounting surface 2 of the additional component 82, i.e., the surface 12 of the mounting end of the substrate 10. In the assembly 82, the cathode terminal 52 is continuously formed along the entire periphery 13 of the surface 12 of the mounting end of the substrate 10, surrounding the surface 12 of the mounting end. At the same time, the four anode terminals 51 are each formed inside the continuous cathode terminal 52 and surrounded by the cathode terminal 52. Therefore, in the mounting surface 2 of the module 82, the cathode terminal 52 is continuously exposed on the ring-mounting surface 2 along the entire periphery 13 of the mounting surface 2. Further, each of the four anode terminals 51 is exposed inside the continuous cathode terminal 52, and is surrounded by the cathode terminal 52 to form an externally connectable form. In this assembly 82, since the anode terminals 51 are surrounded by the cathode terminals 52, noise leakage can also be suppressed.

Figure 13 shows the mounting surface 2 of the other component 83, i.e., the surface 12 of the mounting end of the substrate 10. In the assembly 83, the anode terminal 51 is formed in an L shape along the respective corners 15a to 15d in the respective corners 15a to 15d on the surface 12 of the mounting end of the substrate 10. Therefore, on the mounting surface 2 of the module 83, the L-shaped anode terminal 51 is exposed at each of the corners 15a to 15d to form an externally connectable form. Therefore, the shape of the terminal exposed on the mounting surface 2 of the substrate 10 of the module is not limited to a square shape and may be an L shape.

Figure 14 shows the mounting surface 2 of the additional component 84, i.e., the surface 12 of the mounting end of the substrate 10. In the assembly 84, the cathode terminal 52 continuously forms a face 12 around the mounting end on the entire periphery 13 of the surface 12 of the mounting end of the substrate 10. The L-shaped anode terminal 51 on the inner side thereof is formed by the respective corners 15a. Formed until 15d. Therefore, in the mounting surface 2 of the module 84, the cathode terminal 52 is successively exposed around the entire periphery 13 of the mounting surface 2 around the mounting surface 2, and the four L-shaped anode terminals 51 are exposed inside the cathode terminal 52. The cathode terminal 52 is surrounded to form an external bond. The anode terminal 51 disposed inside the cathode terminal 52 is not limited to a square shape, and may be formed in an L shape as in this case, or may be formed in a circular shape.

Figure 15 shows the mounting surface 2 of the other component 85, i.e., the face 12 of the mounting end of its substrate 10. The cathode terminals 52 of the module 85 are each formed on two opposite sides 14a and 14d on the face 12 of the mounting end of the substrate 10, and a portion including the four corners 15a to 15d. The four anode terminals 51 are formed by sandwiching the cathode terminals 52 between the sides 14a and 14c sandwiched by the cathode terminals 52 extending along the two sides 14b and 14d. Therefore, in the mounting surface 2 of the module 85, the cathode terminal 52 is located along the two sides 14b and 14d to expose four corners 15a to 15d, and the four anode terminals 51 are sandwiched on the sides 14a and 14c of the mounting surface 2. The cathode terminal 52 is exposed. In the module 85 of this type, the cathode terminal 52 disposed along the sides 14b and 14d can easily suppress the leakage of noise by sandwiching the power supply wiring connected to the anode terminal 51.

Figure 16 shows the mounting surface 2 of the other component 86, i.e., the surface 12 of the mounting end of the substrate 10. In the module 86, the anode terminal 51 is continuously disposed along the entire periphery 13 of the surface 12 of the mounting end of the substrate 10, and the cathode terminal 52 is disposed adjacent to the anode terminal 51 along the four sides 14a to 14d. Therefore, in the mounting surface 2 of the module 86, the anode terminal 51 is exposed along the entire periphery 13, and the cathode terminal 52 is exposed on the inner side along the four sides 14a to 14d to approach the anode terminal 51. Thus, the anode terminal 51 and the cathode terminal 52 can be provided by one continuous anode terminal 51 and one continuous cathode terminal 52, the mounting surface 2 of the ring assembly 86, and the entire periphery 13 of the surface 12 of the mounting end of the substrate 10. Configured close to each other.

Figure 17 shows the mounting surface 2 of the other component 87, i.e., the surface 12 of the mounting end of the substrate 10. In the module 87, the cathode terminals 52 are each formed at two opposite sides 14b and 14d along the surface 12 of the mounting end of the substrate 10, and a portion including four corners 15a to 15d. Further, the six anode terminals 51 are formed by sandwiching the cathode terminals 52 on the sides 14a and 14c sandwiched by the cathode terminals 52 extending along the two sides 14b and 14d. Therefore, in the mounting surface 2 of the module 87, the cathode terminal 52 is exposed along the two sides 14b and 14d, including four corners 15a to 15d, and the six anode terminals 51 are on the sides 14a and 14c of the mounting surface 2. The clip cathode terminal 52 is exposed. In the module 87 of this type, the cathode terminal 52 disposed along the sides 14b and 14d can sandwich the power supply wiring connected to the plurality of anode terminals 51, and the leakage of noise can be easily suppressed. Therefore, in the assembly 87, that is, a combination of terminals including five or more anode terminals 51, it is also possible to easily arrange along the entire periphery 13 of the surface 12 of the mounting surface 2 and the mounting end of the substrate 10.

Figure 18 shows the mounting surface 2 of the additional component 88, i.e., the surface 12 of the mounting end of the substrate 10. In the assembly 88, one or a plurality of anode terminals 51 are disposed on the respective sides 14a to 14d, and the cathode terminal 52 is disposed on the remaining portion of the entire periphery 13. Therefore, in the mounting surface 2 of the module 88, one or a plurality of anode terminals 51 are exposed on the respective sides 14a to 14d, and the remaining portions of the entire periphery 13 are exposed to the cathode terminals 52. As such, a plurality of anode terminals 51 are disposed in the assembly 88. The cathode terminal 52 is exposed along the two sides 14b and 14d, and includes four corners 15a to 15d. The two anode terminals 51 are exposed on the sides 14b and 14d of the mounting surface 2, sandwiched by the cathode terminal 52, and four anodes. The terminal 51 is exposed on the sides 14a and 14c of the mounting surface 2, and sandwiches the cathode terminal 52. In the module 88 of this type, since the cathode terminal 52 is disposed along each of the sides 14a to 14d, the power supply wiring connected to the plurality of anode terminals 51 can be sandwiched, and leakage of noise can be easily suppressed. Therefore, even in the combination of the terminals including the five or more anode terminals 51, the module 88 can be easily disposed along the entire periphery 13 of the surface 12 of the mounting surface 2 and the mounting end of the substrate 10.

2.2 Examples of capacitor components

19 through 22 are examples of additional components associated with the present invention in which the capacitor elements in their components are removed. The following examples are examples of the capacitor element 20 mounted on the conversion substrate 10, and the substrate 10 can be appropriately selected from various aspects including the above-described aspects.

Fig. 19 shows an example of a capacitor element 20 mounted on another component 91. The capacitor element 20 shown in FIG. 19 has a rectangular shape in the shape of a base 23, and a through hole 27 is formed at an intersection of the diagonal lines thereof, and the first functional layer 31 and the second functional layer 32 are coupled via the third functional layer 33. . Thus, the shape of the capacitor element 20 is not limited to a square, a rectangle or a polygon of other planes. The capacitor element 20 can also be circular. The planar shape of the surface mount component is nearly square, but in consideration of the spatial effect of providing a large-capacity capacitor component, the capacitor element is preferably in a planar shape close to a square or a square such as a rectangle.

FIG. 20 shows an example of a capacitor element 20 mounted on another component 92. Fig. 21 is a cross-sectional view taken along the line XXI-XXI of the capacitor element 20 (XXI-XXI sectional view of Fig. 20). The capacitor element 20 is also a capacitor element 20 as shown in FIG. 19, which includes a plate-like or film-like rectifying substrate 23 cut into a nearly rectangular shape, and two through holes 27 are formed in the center of the short side direction toward the long side. The two positions of the direction sandwich the symmetrical position of the center. The third functional layer 33 is formed on the inner peripheral surface 27a of each of the through holes 27, and the first functional layer 31 and the second functional layer 32 are connected by a plurality of third functional layers 33.

Capacitor components that can provide low ESL and low ESR, or capacitor components with such capacitor components, are preferably as small as possible from the anode and cathode (ground loop) of the capacitor. In particular, it is preferable that the distance between the terminals connected to the substrate 10 is short, and in this example, the cathode portion 22 on the inner surface (second surface) 23b of the substrate 10, that is, the electrode of the second functional layer 32 is used. The electrical distance between the layer 26b and the anode portion 21 is shortened to reduce the electrical resistance therebetween. A plurality of through holes 27 penetrating the base 23 are formed in the capacitor element 20, and the cross-sectional area of the through holes 27 is reduced. Due to the formation of the through holes 27, the capacitance area of the first and second faces 23a and 23b is reduced in proportion to the square of the radius, and the capacitance area of the third functional layer 33 formed on the inner peripheral surface of the through hole 27 is increased. The radius is proportional.

Since the through holes 27 are formed at two or more locations, the current path can be shortened and the current path can be more diverse, so that capacitor elements having more capacity, lower ESR, and lower ESL, and components in which the capacitor elements are mounted can be provided.

Fig. 22 is a perspective view showing the capacitor element 20 mounted in the other unit 93. The capacitor element 20 includes a first functional layer 31 formed on the first surface 23a of the rectifying substrate 23, a second functional layer 32 formed on the second surface 23b, and a third functional layer formed on the through hole 27. 33, and a fourth functional layer 34 formed on the circumferential surface (side surface) 23c of the base 23. The fourth functional layer 34 includes a dielectric oxide film 24d, a solid electrolyte layer 25d, and an electrode layer 26d which are sequentially laminated on the peripheral surface 23c.

In the capacitor element 20, in addition to the third functional layer 33, the fourth functional layer 34 is coupled to the first functional layer 31 and the second functional layer 32. That is, the electrode layer 26a of the first surface 23a of the rectifying substrate 23 and the electrode layer 26b of the second surface 23b are formed not only through the rectifying substrate 23 but also at the center (ie, the center) of the rectifying substrate 23 or its vicinity. The via electrode 28 is formed on the inner peripheral surface of the hole 27, and is electrically connected to the electrode layer 26d formed on the peripheral surface 23c. Since the fourth functional layer 34 is formed on the circumferential surface 23c, the capacity of the solid electrolytic capacitor can be more ensured.

In the four corners of the first functional layer 31 of the first surface 23a of the rectifying base 23, the peripheral edge of the formed first functional layer 31 is covered by the first insulating layer 29a due to the lack of a corner. At the same time, the first insulating layer 29a is separated from the first functional layer 31 and the fourth functional layer 34, and four corners (four corners) of the rectifying substrate 23 are exposed to form the anode portion 21. The anode portion 21 of the capacitor element 20 is intermittently exposed in four directions (four places). In this manner, the wiring pattern circuit on the substrate 10 on which the capacitor element 20 is mounted can be elastically coupled.

2.3 Summary of laminated multiple capacitor element (capacitor unit) components

Figure 23 shows an example of an additional component 111 associated with the present invention. The module 111 includes a substrate 10, a capacitor unit (element laminate) 90 mounted on the surface 11 of the mounting end of the substrate 10, and a resin (molding resin) 3 is integrally molded into the substrate 10 and the capacitor unit 90. Rectangular or square surface mount components.

The mounting surface 2 of the component 111 is shown in FIG. In the module 111, the surface 12 of the mounting end of the substrate 10 is not covered with the coating resin 3 and exposed to form the mounting surface 2. The mounting surface 2 of the module 111, that is, the surface 12 of the mounting end of the substrate 10, is disposed such that the first terminal electrode 51 and the second terminal electrode 52 are close to each other on the entire circumference 13 of the ring. The first terminal electrode 51 of the module 111 is an anode terminal that is coupled to the anode of the capacitor unit 90. The module 111 includes twelve anode terminals (terminal electrodes) 51 which are formed on the four sides 14a to 14d of the surface 12 of the mounting end of the substrate 10. The second terminal electrode 52 of the module 111 is a cathode terminal that is coupled to the cathode of the capacitor unit 90, and is disposed on a surface other than the anode terminal 51 on the surface 12 of the mounting end of the substrate 10. The anode terminal 51 and the cathode terminal (terminal electrode) 52 are further spaced apart by the insulating gap 59.

The state in which the coating member 3 is removed from the coating member 3 shown in Fig. 25 is shown. FIG. 26 shows a state in which the base substrate 10 is separated from the capacitor unit 90. Figure 27 is a cross-sectional view taken along line XXVII-XXVII of the system assembly 111 (section XXVII-XXVII of Figure 23).

The capacitor unit 90 of the module 111 is laminated, and is disposed on the surface 11 of the mounting end of the substrate 10 from the side of the substrate 10 by three capacitor elements 20a, 20b, and 20c, that is, at the mounting end of the substrate 10. The surface 11 is vertically overlapped (first direction) 99, whereby the three capacitor elements 20a, 20b, and 20c form one capacitor unit 90. The three capacitor elements 20a, 20b, and 20c have the same configuration. Therefore, the configuration of each of the following capacitor elements will be described with reference to the uppermost capacitor element 20c and the lowermost capacitor element 20a.

Fig. 28 shows a form of a capacitor unit 90 formed by laminating (overlapping) a plurality of capacitor elements. Fig. 29 is a plan view showing the upper (first direction) 99 of the capacitor unit 90, exposing the electrode layer 26a of the capacitor element 20c stacked at the uppermost end. Fig. 30 is a bottom view showing the capacitor unit 90 from the lower side of the upper side 99, exposing the electrode layer 26b of the lowermost capacitor element 20a. Fig. 31 is a cross-sectional view showing the XXXI-XXXI of the capacitor unit 90 (the XXXI-XXXI section of Fig. 26).

The capacitor elements (capacitor bodies) 20a to 20c are solid electrolytic capacitors (solid electrolytic capacitor elements). Each of the capacitor elements 20a to 20c includes a plate-like or film-like rectifying substrate 23 which is cut into a square shape. The rectifying substrate 23 includes a first surface 23a and a second surface 23b which are formed by etching or the like. In this example, the second surface 23b is a surface facing the lower end of the surface 11 of the mounting end of the substrate 10 (the lower surface), and the first surface 23a is a surface facing the upper end of the second surface 23b (upper aspect).

As shown in FIG. 31, the first functional layer 31 is formed on the first surface 23a of the base 23. The first functional layer 31 includes a dielectric oxide film 24a, a solid electrolyte layer 25a, and an electrode layer 26a which are sequentially laminated on the first surface 23a. On the second surface 23b of the base 23, a second functional layer 32 is further formed. The second functional layer 32 includes a dielectric oxide film 24b, a solid electrolyte layer 25b, and an electrode layer 26b which are sequentially laminated on the second surface 23b. The electrode layer 26b forms the cathode portion 22 of the capacitor elements 20a to 20c.

The fourth functional layer 34 is formed on the circumferential surface (side surface) 23c of the base 23. The fourth functional layer 34 includes a dielectric oxide film 24d, a solid electrolyte layer 25d, and an electrode layer 26d which are sequentially laminated on the peripheral surface 23c. The fourth functional layer 34 is formed on the circumferential surface 23c of the base 23 except for the four corners (four corners) 39a, 39b, 39c, and 39d of the base 23. Among the capacitor elements 20a to 20c, the fourth functional layer 34 is coupled to the first functional layer 31 and the second functional layer 32. That is, the electrode layer 26a on the first surface 23a of the rectifying substrate 23 and the electrode layer 26b on the second surface 23b are electrically connected via the electrode layer 26d formed on the peripheral surface 23c. The fourth functional layer 34 formed on the peripheral surface 23c can further secure the capacity of the solid electrolytic capacitor of each of the elements 20a to 20c.

The first functional layer 31 of the first surface 23a of the rectifying substrate 23 lacks four corners. The peripheral edge which is missing from the first functional layer 31 is covered by the first insulating layer 29a. In addition, the first insulating layer 29a is separated from the first functional layer 31 and the fourth functional layer 34, and four corners (four corners) 39a to 39d of the rectifying substrate 23 are exposed to form a first electrode (anode) portion 21. For example, the insulating layer 29a of the second insulating layer 29b of the second surface 23b is formed on the first surface 23a, and the portion of the insulating layer 29a is peeled off, or the surface 23a of the substrate 23 is cut to form a surface 23a. Anode portion 21.

As shown in Fig. 29, in the capacitor unit 90, the anode portion 21 is a capacitor element 20a to 20c of four terminals which are intermittently exposed at the corners 39a to 39d in four directions (4 places) around the center point thereof. 100 turns simultaneously at the same time (overlap). Meanwhile, in the capacitor unit 90, the elements 20a to 20c form the four corners 39a to 39d of the first face 23a of the respective elements 20a to 20c to the other components, such as the four corners 39a to 39d of the member 20a to the other components. 20b and 20c form a form which can be seen from the upper (first direction) 99. The same applies to the elements 20b and 20c. For example, the elements 20b to 20c are overlapped at an angle of 30 degrees each, so that the four corners 39a to 39d of all the elements 20a to 20c can be formed to form the capacitor unit 90 in the form seen from the upper side 99.

Therefore, the anode portions 21 formed on the four corners 39a to 39d of the respective elements 20a to 20c can be easily accumulated from the upper portion 99. In the example shown in Fig. 29, the anode portions 21 formed on the four corners 39a to 39d of the respective elements 20a to 20c can be connected to the twelve anodes of the surface 11 of the mounting end of the substrate 10 via the metal bonding wires 62. 56 forms a bond.

The four corners 39a to 39d of the elements 20a to 20c are again formed equidistant from the center point 100 of the elements 20a to 20c. Therefore, in the capacitor unit 90, the four corners 39a to 39d of the elements 20a to 20c are equidistant from the center point 100, forming a solid line as shown in Figs. 29 and 30 close to the imaginary circle (the first circle) 38. Circumferential configuration. Therefore, the respective portions of the capacitor unit 90 are substantially axisymmetric, so that it is possible to suppress unevenness in various physical values such as weight, current, resistance, etc. when a plurality of capacitor elements 20a to 20c are laminated, so that a circular shape close to a plane can be provided. A capacitor unit 90 having a balanced shape and stable electrical performance, and a module 111 on which the capacitor unit 90 is mounted. As shown in FIGS. 29 and 31, in the capacitor unit 90, each of the elements 20a to 20c is repeatedly laminated with a large area of the base 23. Therefore, it is possible to provide a capacitor unit in which a plurality of anode portions 21 are dispersed, and a multi-terminal capacitor unit 90 having improved spatial effect, miniaturization, and large capacity, and a module 111 on which the capacitor unit 90 is mounted.

The substrate 10 mounted on the capacitor unit 90 is also of a laminated type. As shown in Fig. 29, the substrate 10 is cut into a glass fiber cloth ‧ epoxy resin copper clad laminate (epoxy glass substrate) close to a square. The copper foil of the surface 11 of the mounting end of the substrate 10 and the surface 12 of the mounting end is patterned by etching or the like, and the surfaces 11 and 12 of the substrate 10 form the same electrode pattern circuit. Therefore, a plurality of junction electrodes having the same shape as the anode terminal 51 are formed on the surface 11 of the mounting end of the substrate 10 at a position opposite to the plurality of anode terminals 51 of the surface 12 of the mounting end, and the anode of the capacitor unit 90 is formed. The portion 21 is coupled to the anode junction electrode 56. Further, a bonding electrode having the same shape as the cathode terminal 52 is formed on the surface 11 of the mounting end of the substrate 10 at a position facing the cathode terminal 52 of the surface 12 of the mounting end, and is formed to form a cathode portion 22 of the capacitor unit 90. The coupled cathode is coupled to electrode 57.

That is, the anode junction electrode 56 and the cathode junction electrode 57 are disposed along the entire periphery 13 on the surface 11 of the mounting end of the substrate 10. In the module 111, the same number of the twelve anode-coupling electrodes 56 as the anode portion 21 of the capacitor unit 90 are formed on the four sides 14a to 14d of the surface 11 of the mounting end. The cathode junction electrode 57 is disposed on a portion of the surface 11 of the mounting end of the substrate 10 other than the anode junction electrode 56. The anode junction electrode 56 and the cathode junction electrode 57 are also separated by the insulating gap 59 as the surface 12 of the mounting end.

Each of the anode terminal 51 and the anode coupling electrode 56 is electrically connected by a via electrode (through hole, wiring hole) 55 penetrating through the substrate 10. At the same time, the cathode terminal 52 and the cathode junction electrode 57 are also electrically connected by the via electrode 55 penetrating the substrate 10. In the via electrode 55, the electric resistance (coupling resistance) between the anode terminal 51 and the anode coupling electrode 56 and between the cathode terminal 52 and the cathode coupling electrode 57 is suppressed, and an appropriate opening angle is formed by an appropriate number.

The capacitor unit 90 in the module 111 is formed by overlapping three capacitor elements 20a to 20c on the upper surface 99. As shown in FIG. 31, the upper and lower electrode layers 26a and 26b are formed directly or by a conductive material such as a conductive paste. Electrical connection. For example, in the capacitor elements 20a and 20b, the electrode layer 26a of the first functional layer 31 of the capacitor element 20a and the electrode layer 26b of the second functional layer 32 of the capacitor element 20b are electrically connected to each other. As described above, each of the elements 20a to 20c is electrically connected to the electrode layer 26a of the first functional layer 31 and the electrode layer 26b of the second functional layer 32 via the electrode layer 26d of the fourth functional layer 34. These electrode layers 26a and 26d form their cathode portions 22. Therefore, the overlapping of the capacitor elements 20a to 20c is formed in parallel with the cathode portions 22 of the capacitor elements 20a to 20c. At the same time, the electrode layer 26b of the lowermost capacitor element 20a is electrically connected to the cathode junction electrode 57 of the substrate 10 via the conductive paste 61 as shown in FIG.

On the other hand, a plurality of capacitor elements 20a to 20c stacked in the module 111 total 12 anode portions 21, and 12 anode junction electrodes 56 of the substrate 10 are passed through conductive metal bonding wires 62 such as gold wires, copper wires, and aluminum wires. Each weld forms an electrical bond. The capacitor unit 90 includes a bonding wire which is protected by a coating resin (molding resin) 3.

Therefore, via the capacitor unit 90, a capacitor assembly 111 having a plurality of twelve anode terminals 51 can be provided. The standard form of these anode terminals 51 is in parallel. The anode terminal 51, which is coupled to the anode portion 21 of each of the capacitor elements 20a to 20c, can also form a circuit group, thus providing a capacitor assembly 111 corresponding to a plurality of voltages.

Since the capacitor unit 90 can overlap a plurality of (three in this example) capacitor elements 20a to 20c in parallel, a capacitor unit 111 of a larger capacity can be provided. At the same time, the respective elements 20a to 20c of the capacitor unit 90 are coupled by the large-surface electrode layers 26a and 26b of the enlarged planar area, so that the capacitor assembly 111 of low ESR can be provided.

Further, in the capacitor unit 90, the twelve anode portions 21 are dispersed and arranged in twelve directions. In other words, in each of the elements 20a to 20c, the anode portion 21 disposed at the four corners 39a to 39d flows a current in four directions, and the capacitor unit 90 distributes a current in a total of twelve directions. Therefore, the current flows in a plurality of directions, and the magnetic field can be cancelled to lower the ESL of the capacitor unit 90. Therefore, a low ESL capacitor assembly 111 can be provided.

Further, the capacitor unit 90, with the capacitor elements 20a to 20c having the four anode portions 21, can form the capacitor unit 90 in which the twelve anode portions 21 are formed at equal intervals (equal angular intervals) along the circumference of the imaginary circle 38. Therefore, the capacitor unit 90 is mounted on the module 111 on the substrate 10, and the multi-terminal anode junction electrode 56 and the anode terminal 51 are easily used on the substrate 10, and since the anode portion 21 is dispersed and disposed in the capacitor unit 90, the substrate is opposed. The various configurations of the multi-terminal anode junction electrode 56 and the anode terminal 51 of 10 can correspond extremely elastically. Thus, the capacitor unit 90 can provide the surface mount type assembly 111 having a plurality of multi-turn electrode pattern circuits.

Further, the standard form of the capacitor unit 90 is the electrode (anode) portion 21 among the four corners 39a to 39d of the first functional layer 31 constituting the anode portion, which is visible from the upper portion 99 without shielding other elements, and thus can be The top 99 simply accumulates. That is, a total of 12 anode portions 21 of the plurality of elements 20a to 20c do not overlap each other, and 12 anode portions 21 may each be joined by a top 99 such as the metal wire 62 as in this example, or a suitable wire. The frame easily forms a joint. The twelve anode portions 21 can also be joined (directly) via metal wire 62 or lead frame. Therefore, most of the anode portions 21 can be joined in a variety of ways.

Particularly in the capacitor unit 90, it can be accumulated on the anode portion 21 from the upper portion 99, and thus is suitable for forming a joint by the metal bonding wire 62, thereby preventing the lead frame from being bent or the lead frame and the anode portion 21 from being generated. Poor gap junction. The height of the plurality of anode portions 21 disposed along the circumference of the imaginary circle 38 with respect to the substrate 10 is not necessarily constant. With the metal bonding wire 62, the difference in distance (height) between the anode portion 21 and the substrate 10 can be elastically absorbed, so that the high-stability multi-terminal capacitor assembly 111 can be provided.

In the capacitor unit 90, as shown in Fig. 27, in the uppermost capacitor element 20c, the electrode layer 26b of the second surface (lower side) 23b of the base 23 is the first surface of the base 23 of the capacitor element 20b at the lower end ( The electrode layer 26a of the above aspect 23a is in contact. Similarly, in the capacitor element 20b, the electrode layer 26b of the second surface (lower side) 23b of the base member 23 is in contact with the electrode layer 26a of the first surface (upper surface) 23a of the base 23 of the capacitor element 20a. In the capacitor element 20a of the lowermost layer, the electrode layer 26b of the second surface (lower side) 23b of the base 23 is mounted on the surface 11 of the mounting end of the substrate 10. As shown in Fig. 30, in the lower side (inner surface) 23b of each of the elements 20a to 20c, in addition to the four corners 39a to 39d, the cathode portion 22 is expanded to the central portion and the sides 102a to 102d. The inner surface of the corresponding portion of the anode portions 21 of the four corners 39a to 39d of the second surface 23b of the base 23 is entirely covered by the insulating layer 29b. Therefore, the anode portion 21 and the cathode portion 22 are hardly short-circuited, and the respective elements 20a to 20c are overlapped only on the elements of the lower end, or the elements 20a to 20c are laminated and formed on the substrate 10.

As shown in FIG. 10, the module 111 can be mounted on the printed wiring board 70. The CPU 75 is mounted on the upper side 71 of the printed wiring board (printed board) 70, and the capacitor unit 111 of this example is mounted at a position opposite to the power source terminal 76 of the central portion of the CPU 75 on the lower side 72 of the printed wiring board 70. The power terminal 76 of the CPU 75 and the terminal electrodes 51 and 52 of the mounting surface 2 of the module 111 are electrically coupled by a plurality of via electrodes 79 extending through the printed wiring board 70, so that the component 111 has a decoupling capacitor or bias. Capacitor function.

The module 111 can be formed into a capacitor sheet for miniaturized surface mount, for example, having a length of about 10 mm on one side and a large-capacity and thin, for example, a thickness of 4 to 10 mm. The capacitor unit 90 is again a built-in low ESR, low ESL, large capacity and thin micromorphic capacitor assembly. At the same time, since the module 111 is a multi-polar (multi-terminal) module in which a plurality of terminal electrodes 51 are formed on the mounting surface 2, a conventional capacitor must be mounted on a plurality of capacitors, and one or a few components 111 may be substituted. Therefore, it is suitable for data processing terminals such as notebook PCs for micro-format development, and electronic devices such as mobile phone and PDA-type data processing terminals.

2.4 Number of capacitor units

Figures 32 through 41 illustrate examples of additional components associated with the present invention. The following example is a modification of the capacitor unit (element laminate) 90 mounted on the module.

Figure 32 shows a further embodiment in which the component 112 is shown above with its molding resin removed. The capacitor unit 90 shown in FIG. 32 is angularly rotated by the three capacitor elements 20a, 20b, and 20c, and the four corners 39a to 39d of the respective elements 20a to 20c are formed to be upper than the other elements (the first direction). ) See the form. The configuration of the superposed capacitor elements 20a to 20c is the same as that of the capacitor element 20 shown in FIGS. 6 to 9, and therefore the description thereof will be omitted.

The entire periphery of the capacitor element 20a of the anode portion 21 is also rotated as a center of the through hole 27 as shown in Fig. 32, and laminated (overlapped) so that the four corners 39a to 39d of the anode portion 21 of the capacitor element 20a at the lower end are provided. The portion is exposed to the surface, so that the metal bonding wire 62 can be bonded to the substrate 10 or to the anode portion 21 of the other components. The same is true in the intermediate capacitor element 20b. Therefore, the capacitor unit 90 can also provide a stacked, high capacity, low ESR and low ESL capacitor assembly 112.

Fig. 33 shows a form in which the other component 113 is presented from above, in which the molding resin is removed. In the capacitor unit 90 shown in Fig. 33, the rectangular capacitors 80a and 80b of the two planes are vertically overlapped, and the four corners 39a to 39d of the element 20a at the lower end are not shielded by the upper end member 20b, and are formed by the upper side ( The first direction) sees the form.

Fig. 34 shows a state in which the capacitor element 20a is provided above (the first direction). The capacitor element 20a has the same configuration as the capacitor element 20a described with reference to Figs. 28 to 31, and the difference is that the outer shape of the base 23 is a rectangle. Therefore, the shape of the capacitor element 20 is not limited to a square, a rectangle or other planar polygons. The plurality of elements 20 are laminated, and the anode portions 21 are disposed on the corner portions 39a to 39d of the respective elements 20. The angled portions 39a to 39d are formed in a form which can be seen from the upper (first direction) 99, and thus can be provided. The elements 20 are combined at a separation angle to form a capacitor unit in which a plurality of anode portions 21 are dispersed, and a capacitor unit that can be easily bonded to a substrate by a bonding wire or the like can be formed. Considering the spatial effect of providing a large-capacity capacitor component, the shape of the capacitor element is preferably square in shape or close to a square such as a rectangle.

Fig. 35 shows a further embodiment in which the component 114 is presented above, in which the molding resin and the substrate 10 are removed. As shown in Fig. 35, the capacitor unit 90 contains seven capacitor elements 20a to 20g at a separation angle, for example, at an angle of 15 degrees, and the four corners 39a to 39d of the capacitor element 20 at the lower end are formed. The top (first direction) 99 sees all the forms. The number of elements constituting the capacitor unit is not limited to two or three, and the capacitor unit 90 shown in FIG. 35 may be laminated with seven or more elements. In the capacitor unit 90, 28 anode portions 21 can be disposed along the circumference of the imaginary circle 38, thus providing a multi-terminal capacitor assembly 114.

Fig. 36 shows a further embodiment in which the component 115 is presented above, in which the molding resin is removed. As shown in Fig. 36, the rectangular planar capacitor elements 20a and 20b of the capacitor unit 90 are vertically overlapped, and the four corners 39a to 39d of the lower end element 20a are not shielded by the upper end element 20b, and can be formed by the upper side. (first direction) 99 sees the form.

Fig. 37 shows a configuration in which the capacitor element 20a is presented from above. The capacitor element 20a has almost the same configuration as the capacitor element 20a described with reference to Figs. 28 to 31, except that the outer shape of the base 23 is the long sides 102a and 102c (length W2) and the short sides 102b and 102d (length W1). The rectangle formed and the anode portion 21 of the capacitor element 86a are exposed on the short sides 102b and 102d opposed to the first surface 23a of the base 23.

As shown in FIG. 36, the capacitor unit 90 is laminated (overlapped) by 90 degrees of the ring center point 100 of the capacitor elements 20a and 20b having the above-described configuration. Thus, the stacking of the two capacitor elements 20a and 20b can form the anode portion 21 on almost the entire circumference of the ring capacitor unit 90. Therefore, the capacitor unit 90 can be mounted on the substrate 10 having a variety of wiring pattern circuits.

Figure 38 shows a further embodiment of the assembly 116 from the top wherein the molding resin is removed. The capacitor unit 90 shown in Fig. 38 is a capacitor element (first capacitor element) 20a having two rectangular planes and a capacitor element (second capacitor element) 20b having a square shape, and the opposite end of the element 20a. The two sides 102b and 102d are not shielded by the upper end member 87, and are formed in a form that can be seen from the upper side (first direction) 99. The upper capacitor element (second capacitor element) 20b is smaller than the lower capacitor element (first capacitor element) 20a, and the peripheral edges 103a to 103d of the upper capacitor element 20b are disposed on the peripheral edge 102a of the lower capacitor element 20a to The inside of 102d.

The capacitor element (second capacitor element) 20b at the upper end shown in Fig. 39 is in the form of the upper side. The capacitor element 20b has almost the same configuration as the capacitor element 20 shown in Fig. 37, except that the base 23 has the same shape as the length W1 of the short sides 102b and 102d of the capacitor element 20a at the lower end, that is, the four sides 103a of the length W1. A square formed to 103d. Further, on the capacitor element 20b at the upper end, the two sides 103a and 103c opposed to the first surface 23a of the base 23 form the anode portion 21.

As shown in Fig. 38, the capacitor unit 90 is laminated on the capacitor element 20a at the lower end of the above configuration, and the capacitor element 20b at the upper end is laminated (overlapped) centering on the center point 100. As described above, since the upper capacitor element 20b is not discharged to the outside of the capacitor element 20a, the upper capacitor element 20b is entirely mounted on the lower capacitor element 20a. Therefore, the upper end capacitor element 20b is formed to overlap in a state in which the entirety is supported by the lower capacitor element 20a. As described above, since the entire upper capacitor element 20b can be stably supported, it can be easily soldered to the anode portion 21, and a structure capable of improving deterioration after long-term contact such as contact failure and reduction in production rate can be formed. At the same time, the stacking of the two capacitor elements 20a and 20b allows the anode portion 21 to be formed on the entire periphery of the ring capacitor unit 90. Therefore, the capacitor unit 90 can be mounted on the substrate 10 having a variety of wiring pattern circuits.

In the present example, the capacitor element 20b at the upper end is square, but the peripheral edges 103a to 103d of the upper capacitor element 20b are formed to be sized at the inner side of the peripheral edges 102a to 102d of the capacitor element 20a at the lower end, and the capacitor element 20b at the upper end is also It may be a rectangle or other polygonal shape, and one side may be shorter than the short side length W1.

Fig. 40 shows a configuration in which the other component 117 is presented from above, in which the molding resin and the substrate 10 are removed. The capacitor unit 90 shown in Fig. 40 is laminated (overlapped) around the central through hole 27 by the capacitor elements 20 of the four terminals described with reference to Fig. 22 . Therefore, the capacitor element 20 can be made into a capacitor having a larger capacity, and the capacitor element 90 having a multi-terminal structure of five or more terminals can be fabricated using the capacitor element 20 having four terminals. As described above, since the capacitor unit 90 is mounted on the substrate 10 and can accommodate the substrate 10 having a wide variety of wiring pattern circuits, the capacitor unit 117 having a large capacity, a low ESR, and a low ESL can be provided.

An example of another component 118 is shown in FIG. In the module 118, the capacitor element 20 is mounted on each of both sides of the substrate 10. The plurality of capacitor elements 20 can be mounted on both sides of the substrate 10, and can be mounted on both sides, thereby increasing the capacity of the capacitor.

As described above, in the same manner as the module included in the present invention, it is an assembly including a capacitor element which can be electrically connected to the cathode layer formed on the upper surface and the lower surface, and which can easily ensure the area of the cathode layer.

The technique disclosed in Japanese Laid-Open Patent Publication No. 2002-237431 (Document 3) is directed to solving the problem that the capacitor and the other electronic components are mounted on the substrate at the same time, because the wiring circuit becomes long, thereby reducing the ESR characteristics. The ESL characteristic causes a problem of lowering the high-frequency reactivity, and provides a solid electrolytic capacitor which is reduced in characteristics while reducing the coupling, and has a high-frequency reactivity and a method for producing the same. The solid electrolytic capacitor disclosed in Document 3 includes an anode body in which a plurality of through holes are formed in a thickness direction, and an anode lead portion embedded in a through hole of the anode body, and an anode terminal is formed at a portion of the exposed surface of the anode lead portion. In the portion where the cathode layer is exposed to the surface to form the cathode terminal portion, the anode and the cathode are alternately arranged on the same surface, so that the ESR can be reduced and the ESL can be eliminated, and the impedance characteristics at high frequencies can be greatly reduced, resulting in a remarkable increase in the high frequency. Reactivity.

However, in the technique disclosed in Document 3, since the number of via holes is increased, it is difficult to secure the area of the cathode layer on the capacitor element, so that it is difficult to increase the electrostatic capacitance. At the same time, in order to form an electrical connection between the upper surface of the capacitor element and the cathode layer formed on the lower surface, an additional means is required.

In the capacitor element having the through electrode disclosed above and the module having the capacitor element, the cathode layer formed on the upper surface and the lower surface of the substrate can be electrically connected, and the capacity reduction can be suppressed.

Further, the same state of the components included in the present invention is an assembly of a capacitor unit having a laminated type of large capacity, low ESR, and low ESL, and which is also easy to form a connection with a substrate or a lead frame.

Japanese Patent Publication No. 2007-116064 (Document 4) discloses an anode portion formed on one side of a flat plate-shaped rectifying metal plate having a dielectric oxide film on its surface, and a solid electrolyte layer formed on the other side. In the capacitor element substrate formed by the cathode portion formed by the cathode lead-out layer, a laminated solid-state electrolytic capacitor having a plurality of laminated layers is formed, and the anode portion is formed on the capacitor element substrate, and the anode portion is alternately laminated in the center of the cathode portion. .

The first method of increasing the capacity is to increase the number of layers in which the capacitor elements are stacked. However, it is easy to reduce the ESR, so it is easy to make ESL worse. At the same time, it is also important that a plurality of laminated capacitor elements are easily joined to a substrate or a lead frame or the like.

In the above, a capacitor unit formed by laminating a plurality of capacitor elements in a form in which a portion including four corners is formed, and a plurality of capacitor elements laminated in the module including the capacitor unit are disclosed. It is easily bonded to the substrate while improving its ESL characteristics.

The components, capacitor elements, and capacitor units disclosed above are examples of the components, capacitor elements, and capacitor units included in the present invention, but the present invention is not limited to the above. The capacitor unit may be a capacitor element such as a non-solid electrolytic capacitor, a ceramic capacitor, or a film capacitor. The surface mount component according to the present invention can be combined not only with a CPU but also with other circuit components, such as a smoothing circuit of a DC-DC rectifier.

1, 81-88, 91, 92, 93, 111-118. . . Component

2. . . Mounting surface

10. . . Substrate

11. . . Side face

12. . . Mounting surface

20, 20a-20g. . . Capacitor component

3, 30. . . Molding resin

13. . . All around

14a-14d. . . side

15a-15d, 39a-39d. . . angle

16. . . Central department

51. . . Anode terminal

52. . . Cathode terminal

59. . . Gap

twenty one. . . Anode

twenty two. . . Cathode part

twenty three. . . Matrix

23a, 23b. . . inside

26, 26a, 26b, 26d. . . Electrode layer

27. . . Through hole

28, 55, 79. . . Through hole electrode

29, 29a, 29b. . . Insulation

56. . . Anode junction electrode

57. . . Cathode junction electrode

62. . . Metal wire

24a-24d. . . Dielectric oxide coating

25a-25d. . . Solid electrolyte layer

31. . . First functional layer

32. . . Second functional layer

61. . . Conductive slurry

23c. . . Weekly

33. . . Third functional layer

31c, 32c. . . Peripheral edge

27a. . . Inner circumference

70. . . Printed wiring board

71. . . Upper aspect

72. . . The next aspect

75. . . CPU

76. . . Power terminal

35. . . Insulating sheet

90. . . Capacitor unit

99. . . Above

34. . . 4th functional layer

38. . . circle

100. . . Center point

102a, 102c. . . The long side

102b, 102d. . . Short side

Figure 1 is a perspective view of the outline of the assembly of the system.

Figure 2 shows the mounting surface of the component.

Fig. 3 is a perspective view showing the system assembly in a state where the molding resin is removed.

Figure 4 is a diagram showing the assembly of the substrate and capacitor elements.

Figure 5 is a V-V cross-sectional view of the assembly (V-V section of Figure 1).

Fig. 6 is a view showing a state in which a capacitor element is formed by a plane (first surface).

Fig. 7 is a view showing a state in which the capacitor element is formed by the bottom surface (the second surface end).

Fig. 8 is a cross-sectional view taken along the line VIII-VIII of the capacitor element structure (section VIII-VIII of Fig. 6).

Fig. 9 is an enlarged cross-sectional view showing the construction of a capacitor element.

Fig. 10 is a cross-sectional view showing a portion of a printed wiring board on which components are mounted.

Figure 11 is a diagram showing the mounting surface of a component of another example.

Figure 12 is a diagram showing the mounting surface of a component of another example.

Figure 13 is a diagram showing the mounting surface of a component of another example.

Figure 14 is a diagram showing the mounting surface of a component of another example.

Figure 15 is a diagram showing the mounting surface of a component of another example.

Figure 16 is a diagram showing the mounting surface of a component of another example.

Figure 17 is a diagram showing the mounting surface of a component of another example.

Figure 18 is a diagram showing the mounting surface of a component of another example.

Fig. 19 is a view showing a form in which a capacitor element of another example is represented by a plane (first face end).

Fig. 20 is a perspective view showing a capacitor element of another example.

Fig. 21 is a cross-sectional view taken along line XXI-XXI of the capacitor element shown in Fig. 20 (XXI-XXI cross section of Fig. 20).

Fig. 22 is a perspective view showing a capacitor element of another example.

Figure 23 is a perspective view showing an outline of an assembly of another example.

Figure 24 is a view showing the mounting surface of the assembly shown in Figure 23.

Fig. 25 is a perspective view showing the assembly shown in Fig. 23 in a state where the molding resin is removed.

Figure 26 is a diagram showing the components of Figure 23 unfolding its substrate and capacitor unit.

Figure 27 is a cross-sectional view taken along line XXVII-XXVII of the assembly shown in Figure 23 (section XXVII-XXVII of Figure 23).

Fig. 28 is a diagram showing the development of the respective stacked states of a plurality of capacitor elements.

Figure 29 is a plan view showing the capacitor unit shown in Figure 26.

Figure 30 is a bottom plan view of the capacitor unit shown in Figure 26.

Figure 31 is a cross-sectional view of the XXXI-XXXI of the capacitor unit shown in Figure 26 (the XXXI-XXXI section of Figure 26).

Fig. 32 is a plan view showing a state in which the module of another example is removed from the molding resin.

Fig. 33 is a plan view showing a state in which the module of another example is removed from the molding resin.

Figure 34 is a plan view showing the capacitor element shown in Figure 33.

Fig. 35 is a plan view showing the capacitor unit of the capacitor element shown in Fig. 34.

Fig. 36 is a plan view showing a state in which the module of another example is removed from the molding resin.

Figure 37 is a plan view showing the capacitor element shown in Figure 36.

Fig. 38 is a plan view showing a state in which the component of the other example is removed from the molding resin.

Figure 39 is a plan view showing the capacitor unit shown in Figure 38.

Fig. 40 is a plan view showing a capacitor unit of another example.

Figure 41 is a cross-sectional view showing an assembly of another example.

1. . . Component

2. . . Mounting surface

10. . . Substrate

12. . . Mounting surface

20. . . Capacitor component

13. . . All around

14a-14d. . . side

15a-15d. . . angle

16. . . Central department

51. . . Anode terminal

52. . . Cathode terminal

59. . . Gap

Claims (11)

  1. A surface mount module comprising a substrate and a capacitor element mounted on a mounting end surface of the substrate, wherein the substrate and the capacitor element are integrally molded with a resin for coating, and the substrate includes the capacitor on the mounting end surface The anode of the device forms an electrically coupled first junction electrode and a second junction electrode electrically connected to the cathode of the capacitor element, and the plurality of via electrodes and the first junction electrode are respectively disposed on the mounting surface of the device a first terminal electrode to be coupled and a second terminal electrode to be coupled to the second connection electrode, wherein the first terminal electrode and the second terminal electrode are arranged such that the entire periphery of the mounting surface of the ring assembly is close to each other In the terminal electrode portion, the terminal electrode portion of the second terminal electrode is disposed in all of the entire periphery except for the terminal electrode portion on which the first terminal electrode is disposed, and at least the second coupling electrode and the second terminal electrode a central electrode portion including a central portion covering the substrate, and a continuous The second electrode coupled to the lid 2 from the central portion of the substrate to the whole periphery of the shield electrode, the shield electrode is formed of the cathode of the capacitor element is coupled to the second terminal and the at least one electrode configuration.
  2. The surface mount component of claim 1, further comprising an insulating layer covering the central portion of the mounting surface.
  3. The surface mount module according to claim 1, wherein the second terminal electrode includes a part of the entire periphery of the substrate continuously.
  4. The surface mount module according to claim 1, wherein the first terminal electrode and the second terminal electrode each include a plurality of the terminal electrode portions in which the entire periphery of the mounting surface of the module is disposed close to each other.
  5. The surface mount module according to claim 1, wherein the first terminal electrode includes a plurality of terminal electrode portions disposed at each corner of the mounting surface, and the second terminal electrode includes the second terminal electrode a plurality of terminal electrode portions of each edge of the mounting surface.
  6. The surface mount module according to claim 1, wherein the second terminal electrode includes a plurality of terminal electrode portions disposed at each of the attachment faces and the opposite edges.
  7. The surface mount module according to claim 1, wherein the second terminal electrode includes a part of the entire periphery of the mounting surface continuously, and the first terminal electrode includes a second terminal electrode. The inner part of the above part.
  8. The surface mount module according to claim 7, wherein the first terminal electrode includes the portion disposed as the second terminal electrode The part surrounded by the branch.
  9. The surface mount component according to claim 1, wherein the capacitor element is a solid electrolyte type.
  10. A printed wiring board comprising a surface mount component as claimed in claim 1 attached thereto.
  11. An electronic machine comprising the printed wiring board of claim 10 of the patent application.
TW099116008A 2009-05-19 2010-05-19 Surface mount components, printed wiring board and electronic equipment TWI520165B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009121303A JP5415827B2 (en) 2009-05-19 2009-05-19 Surface mount devices
JP2009152193A JP5415841B2 (en) 2009-06-26 2009-06-26 Capacitor elements and devices
JP2009155113A JP5415843B2 (en) 2009-06-30 2009-06-30 Capacitor unit and device including stacked capacitor elements

Publications (2)

Publication Number Publication Date
TW201042680A TW201042680A (en) 2010-12-01
TWI520165B true TWI520165B (en) 2016-02-01

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