KR20160013785A - Composite electronic component and board having the same mounted thereon - Google Patents

Abstract

According to one embodiment of the present invention, provided is a complex electronic component comprising: an insulating sheet; a tantalum capacitor which includes a main body unit including a tantalum powder pallet and a tantalum wire in which a partial area of the main body unit is laid, and is arranged on the insulating sheet; a multilayered ceramic capacitor which includes a ceramic main body including a plurality of dielectric layers, first and second internal electrodes arranged inside the ceramic main body to face each other across the dielectric layer, and first and second external electrodes arranged on the outer surface of the ceramic main body to be connected to the first and second internal electrodes, and is arranged on the insulating sheet; and a molding unit arranged to surround the tantalum capacitor and the multilayered ceramic capacitor. The first internal electrode includes a first lead unit which is drawn to upper and lower sides of the ceramic main body and a first side of a longitudinal direction of the ceramic main body. The second internal electrode includes a second lead unit which is drawn to the upper and lower sides of the ceramic main body and a second side of the longitudinal direction of the ceramic main body.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component,

The present invention relates to a composite electronic component having a plurality of passive elements and a mounting substrate therefor.

A multilayer ceramic capacitor which is one of the multilayer chip electronic components may have a structure in which a plurality of dielectric layers and internal electrodes of different polarities are alternately stacked between the dielectric layers.

Since the dielectric layer has piezoelectricity and electrostrictive properties, when a direct current or an alternating voltage is applied to the multilayer ceramic capacitor, piezoelectric phenomenon occurs between the internal electrodes and vibration may occur.

These vibrations are transmitted to the printed circuit board through the solder of the multilayer ceramic capacitor, and the entire printed circuit board becomes an acoustic radiation surface, thereby generating a noisy vibration sound.

The vibration sound may correspond to an audible frequency in the range of 20 to 20000 Hz which gives an uncomfortable feeling to a person, and an unpleasant vibration sound is called an acoustic noise.

A product in which the lower cover layer of the multilayer ceramic capacitor is increased in order to reduce the acoustic noise has been studied.

However, there is a need to further study a product having a better effect of reducing acoustic noise.

Japanese Patent Laid-Open No. 1997-326334

The present specification aims to provide a composite electronic part having excellent effect of reducing acoustic noise.

Also, the present specification aims to provide a composite electronic part having a low ESR (Equivalent Series Resistance) / ESL (Equivalent Series Inductance), an improved DC-bias characteristic, and a low chip thickness.

According to one embodiment of the present invention, there is provided a composite electronic part including a composite in which a multilayer ceramic capacitor and a tantalum capacitor are combined.

According to another embodiment of the present invention, there is provided a composite electronic part in which an inflection point of impedance occurs in a lower frequency range than a self resonant frequency (SRF) in an impedance graph of a frequency of an input signal inputted thereto.

According to another aspect of the present invention, there is provided a multilayer ceramic capacitor including a composite including a multilayer ceramic capacitor and a tantalum capacitor, wherein the internal electrode of the multilayer ceramic capacitor includes first and second internal electrodes, The second internal electrode is drawn out to the upper surface, the lower surface, and the second side of the ceramic body to form an equivalent series inductance (ESL) and an equivalent series resistance Resistance is reduced.

According to still another aspect of the present invention, there is provided a composite electronic device including a printed circuit board having an electrode pad on an upper surface thereof, the composite electronic component provided on the printed circuit board, and a solder connecting the electrode pad and the composite electronic component Thereby providing a mounting substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a composite electronic part excellent in reducing acoustic noise.

Further, according to the disclosure of the present specification, it is possible to provide a composite electronic part which can realize a high capacitance and has a low ESR (Equivalent Series Resistance) / ESL (Equivalent Series Inductance), an improved DC-bias characteristic and a low chip thickness .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a molded electronic device according to an embodiment of the present invention, viewed from a projection of a terminal electrode and a molding part. Fig.
2 is a cross-sectional view taken along line AA 'of FIG.
FIG. 3A is a sectional view of the multilayer ceramic capacitor shown in FIG. 2, taken along the line PP ', and FIG. 3B is a sectional view taken along the line QQ' of the multilayer ceramic capacitor shown in FIG.
4A and 4B are cross-sectional views of multilayer ceramic capacitors for showing modified examples of the first and second internal electrodes of the multilayer ceramic capacitor according to one embodiment of the present invention.
5 is a cross-sectional view taken along line BB 'of FIG.
6 is a cross-sectional view of a composite electronic part for showing a modified example of the connection conductor portion according to the embodiment of the present invention.
FIG. 7 is an enlarged view of the regions C1 and C2 in FIG. 5;
8 (a) and 8 (b) are graphs showing equivalent series resistance (ESR) and impedance according to a comparative example and a composite electronic component according to an embodiment of the present invention.
9 is a graph showing an output voltage versus time according to an embodiment of the present invention and a comparative example.
10 is a graph showing ESR voltage ripple (ΔV) according to the volume ratio of the multilayer ceramic capacitor and the tantalum capacitor in the composite electronic device according to an embodiment of the present invention.
11 is a perspective view showing a state in which the composite electronic component of Fig. 1 is mounted on a printed circuit board.

The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Also, throughout the specification, to be formed on "on " means not only to be formed in direct contact, but also means that it may further comprise other components.

In addition, in the entire specification, when a part is referred to as being 'connected' to another part, it may be referred to as 'indirectly connected' not only with 'directly connected' .

In order to clearly illustrate the embodiments of the present invention, when the directions of the hexahedron are defined, L, W, and T shown in the drawings indicate the longitudinal direction, the width direction, and the thickness direction, respectively.

Composite electronic parts

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a molded electronic device according to an embodiment of the present invention, viewed from a projection of a terminal electrode and a molding part. Fig.

1, a composite electronic device 100 according to an embodiment of the present invention includes an insulating sheet 140, a multilayer ceramic capacitor 110 and a tantalum capacitor 120 disposed on the insulating sheet 140, A molding part 150, and terminal electrodes 161 and 162. The composite 130 includes a plurality of terminal electrodes 161 and 162, respectively.

The terminal electrodes 161 and 162 include a positive electrode terminal 161 and a negative electrode terminal 162.

According to one embodiment of the present invention, the effect of reducing acoustic noise is excellent due to the structure of the composite electronic part including the composite 130 in which the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are combined , High capacitance, low ESR (Equivalent Series Resistance) / ESL (Equivalent Series Inductance), improved DC-bias characteristics and low chip thickness.

Tantalum capacitors can realize high capacitance, have excellent DC-bias characteristics, and have no acoustic noise when mounted on a substrate.

On the other hand, tantalum capacitors have a problem of high equivalent series resistance (ESR).

On the other hand, the multilayer ceramic capacitor has low equivalent series resistance (ESR) and equivalent series inductance (ESL), but has poor DC-bias characteristics compared with tantalum capacitors, There are disadvantages.

Further, the multilayer ceramic capacitor has a problem that acoustic noise is generated when the multilayer ceramic capacitor is mounted on a substrate.

However, since the composite electronic device 100 according to an embodiment of the present invention includes the composite 130 in which the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are combined, a high equivalent series resistance ( Equivalent Series Resistance (ESR) can be reduced.

Further, it is possible to improve the degradation of the DC-bias characteristic, which is a disadvantage of the multilayer ceramic capacitor, and to realize a thick chip thickness with a low thickness.

According to an embodiment of the present invention, a multilayer ceramic capacitor in which acoustic noise occurs in mounting on a substrate and a tantalum capacitor in which acoustic noise is not generated are combined at a predetermined ratio to form acoustic noise (acoustic noise) noise reduction effect can be excellent.

2 is a cross-sectional view taken along the line A-A 'in Fig.

1 and 2, according to one embodiment of the present invention, the multilayer ceramic capacitor 110 includes a plurality of dielectric layers 11, internal electrodes 21 and 22 disposed between the dielectric layers, And external electrodes 131 and 132 formed on an outer surface of the ceramic body to be connected to the internal electrode.

The ceramic body 111 may have a substantially hexahedral shape including upper and lower surfaces opposed to each other in the thickness direction, first and second side surfaces opposed to each other in the longitudinal direction, and third and fourth side surfaces opposed to each other in the width direction .

In an embodiment of the present invention, the upper and lower surfaces may be a mounting surface adjacent to and facing the insulating sheet 140 when the multilayer ceramic capacitor is disposed on the insulating sheet. After being disposed on the insulating sheet 140 The upper surface may be a surface opposite to the lower surface when the mounting surface facing the insulating sheet is adjacent to the upper surface.

The internal electrode may include a first internal electrode 21 and a second internal electrode 22. The first and second internal electrodes may be formed on the dielectric layer 11 with one dielectric layer 11 therebetween As shown in FIG.

The ceramic body 111 may be formed by laminating a plurality of dielectric layers and internal electrodes, followed by firing.

The dielectric layer 11 may include a ceramic powder having a high dielectric constant, for example, barium titanate (BaTiO ₃ ) or strontium titanate (SrTiO ₃ ) powder, but the present invention is not limited thereto.

The first and second inner electrodes 21 and 22 are not particularly limited and may be made of a material selected from the group consisting of noble metal such as palladium (Pd), palladium-silver (Pd-Ag) alloy, ). ≪ / RTI >

The external electrodes 131 and 132 may be disposed on the outer surface of the ceramic body 111 and electrically connected to the internal electrodes. The outer electrode may include a first outer electrode 131 and a second outer electrode 132. The first outer electrode 131 may be electrically connected to the first inner electrode 21 and the second outer electrode 132 may be electrically connected to the second inner electrode 22. [

According to an embodiment of the present invention, a nickel / tin (Ni / Sn) plating layer may not be disposed on the first and second external electrodes 131 and 132, unlike a general multilayer ceramic capacitor.

The composite electronic part includes a molding part 150 disposed to surround a composite body 130 including a multilayer ceramic capacitor 110 and a tantalum capacitor 120 disposed on an upper surface of an insulating sheet 140 as described later Therefore, it is not necessary to form a plating layer on the first and second external electrodes 131 and 132 of the multilayer ceramic capacitor 110.

Therefore, there is no problem of reliability reduction due to penetration of the plating liquid into the ceramic body 111 of the multilayer ceramic capacitor 110.

2, the tantalum capacitor 120 includes a body portion 122 and a tantalum wire 121. The tantalum wire 121 extends in a longitudinal direction May be embedded in the main body 122 to be exposed through one surface of the main body.

The main body portion 122 of the tantalum capacitor may include an anode body 122a, a dielectric layer 122b, a solid electrolyte layer 122c, a carbon layer 122d, and a cathode layer 122e .

The anode body 122a may be a porous sintered body of tantalum powder.

A dielectric layer 122b may be formed on the surface of the anode body 122a. The dielectric layer may be formed by oxidizing the surface of the anode body. For example, the dielectric layer may be formed of a dielectric material composed of tantalum oxide (Ta ₂ O ₅ ), which is an oxide of tantalum forming the anode, and may have a predetermined thickness on the surface of the anode.

A solid electrolyte layer 122c may be formed on the surface of the dielectric layer 122b. The solid electrolyte layer may include at least one of a conductive polymer or manganese dioxide (MnO ₂ ).

When the solid electrolyte layer 122c is formed of a conductive polymer, it may be formed on the surface of the dielectric layer by a chemical polymerization method or an electrolytic polymerization method. The conductive polymer material is not particularly limited as long as it is a conductive polymer material. For example, the conductive polymer material may include polypyrrole, polythiophene, polyaniline, polypyrrole, and the like.

In the case where the solid electrolyte layer 122c is formed of manganese dioxide (MnO ₂ ), an anode body having a dielectric layer formed on its surface is immersed in a manganese aqueous solution such as manganese nitrate, and then the manganese aqueous solution is heated and decomposed to form conductive manganese dioxide on the surface of the dielectric layer .

A carbon layer 122d including carbon may be disposed on the solid electrolyte layer 122c.

The carbon layer 122d may be formed of a carbon paste. A carbon paste obtained by dispersing a conductive carbon material powder such as natural graphite or carbon black in water or an organic solvent in a state of mixing with a binder or a dispersant may be used as the solid electrolyte Layer on the substrate.

A negative electrode layer 122e including a conductive metal may be disposed on the carbon layer 122d to improve electrical connection with the negative terminal, and the conductive metal included in the negative electrode layer may be silver (Ag).

The tantalum capacitor is not particularly limited, but may be connected to an external terminal in a structure without an internal lead frame, for example.

According to an embodiment of the present invention, the multilayer ceramic capacitor 110 and the tantalum capacitor 120 may be connected in parallel.

According to an embodiment of the present invention, the multilayer ceramic capacitor 110 and the tantalum capacitor 120 may be disposed on the insulating sheet 140 as shown in FIG.

The insulating sheet 140 is not particularly limited when it exhibits an insulating property, and may be manufactured using an insulating material such as a ceramic material.

The molding part 150 is formed to cover the composite 130 including the multilayer ceramic capacitor 110 and the tantalum capacitor 120 and the upper surface of the insulation sheet 140 on which the multilayer ceramic capacitor and the tantalum capacitor are disposed.

The molding part 150 may be formed of an epoxy or silica based EMC or the like so that the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are protected from the external environment, but the present invention is not limited thereto.

Due to the molding part 150, the composite electronic device according to an embodiment of the present invention can be realized as a single part in which the multilayer ceramic capacitor 110 and the tantalum capacitor 120 are combined.

An insulating layer 170 may be disposed between the multilayer ceramic capacitor 110 and the tantalum capacitor 120 to prevent electrical shorting of the elements disposed in the composite electronic component by the insulating layer 170. [ .

3A is a PP 'sectional view of the multilayer ceramic capacitor 110 shown in FIG. 2, and FIG. 3B is a QQ' sectional view of the multilayer ceramic capacitor shown in FIG.

3A and 3B, the internal electrode may include a first internal electrode 21 and a second internal electrode 22, and the first and second internal electrodes may include one dielectric layer 11 May alternately be disposed on the dielectric layer with a space therebetween.

According to an embodiment of the present invention, the first internal electrode 21 includes a first main portion 21a overlapping with the second internal electrode to form a capacitor, and a second main portion 21a connected to the first main portion, The second internal electrode 22 includes a second main portion 22a that overlaps with the first internal electrode to form a capacitance, and a second main portion 22b that overlaps with the first internal electrode 22, And a second lead portion 22b connected to the outer surface of the ceramic body.

The first lead portion 21b may be extended to the upper surface, the lower surface and the first longitudinal side surface of the ceramic body, and the second lead portion 22b may be formed on the upper surface, Two ends can be drawn out to the sides.

According to the embodiment of the present invention, since the first lead portion 21b and the second lead portion 22b are drawn out to the upper and lower surfaces of the ceramic body which can be a mounting scene, the current path formed in the multilayer ceramic capacitor The current loop can be reduced in size to reduce the equivalent series inductance (ESL) of the multilayer ceramic capacitor.

According to an embodiment of the present invention, the first and second internal electrodes 21 and 22 may be disposed perpendicularly to the upper surface or the lower surface of the ceramic body. The first and second internal electrodes may be disposed perpendicular to the insulating sheet 140.

According to an embodiment of the present invention, the first and second internal electrodes 21 and 22 may be disposed perpendicular to the substrate when the composite electronic component is mounted on the substrate.

In one embodiment of the present invention, the width direction of the ceramic body 111 may be a direction in which the internal electrodes are stacked.

The external electrodes 131 and 132 include a first external electrode 131 connected to the first internal electrode 21 and a second external electrode 132 connected to the second internal electrode 22.

The first external electrode 131 is disposed on a first longitudinal side of the ceramic body and is connected to the first lead portion 21b exposed on the top and bottom surfaces of the ceramic body, And extends to the upper and lower surfaces of the ceramic body.

The second external electrode 132 is disposed on a second longitudinal side surface of the ceramic body facing the first side surface and is connected to the second lead portion exposed on the upper surface and the lower surface of the ceramic body, And a lower surface.

The lead portions of the first and second internal electrodes 21 and 22 are drawn out to the upper and lower surfaces of the ceramic body 111 and the first and second external electrodes 131 and 132 The equivalent serial inductance (ESL) of the composite electronic component can be reduced when the ceramic body is extended to the upper and lower surfaces of the ceramic body at the first and second sides of the ceramic body.

The internal electrodes 21 and 22 of the multilayer ceramic capacitor are exposed to the mounting surface of the ceramic body 111 and the current flows through the external electrodes 131 and 132 arranged in the mounting surface of the ceramic body as in the embodiment of the present invention The size of the current loop formed in the multilayer ceramic capacitor can be reduced and the equivalent series inductance (ESL) of the multilayer ceramic capacitor can be reduced. As a result, the equivalent series inductance It is possible to reduce the equivalent series inductance (ESL).

The first lead portion 21b is exposed to the upper surface, the lower surface and the first side surface of the ceramic body and the second lead portion 22b is exposed to the upper surface, the lower surface and the second side surface of the ceramic body as in the embodiment of the present invention The equivalent series resistance (ESR) of the multilayer ceramic capacitor can be reduced by increasing the contact area between the internal electrodes 21 and 22 and the external electrodes 131 and 132, It is possible to reduce the Equivalent Series Resistance (ESR).

4A and 4B are cross-sectional views of multilayer ceramic capacitors for showing modified examples of the first and second internal electrodes of the multilayer ceramic capacitor according to one embodiment of the present invention.

Referring to FIGS. 4A and 4B, the first and second internal electrodes 21 'and 22' of the multilayer ceramic capacitor according to the present modification have first and second main parts 21a 'and 22a' And the second lead portions 21b 'and 22b', and the first lead portion 21b 'extends to the upper surface, the lower surface and the first side surface of the ceramic body 111 and the second lead portion 21b' And 22b 'are drawn to the top, bottom, and second side surfaces of the ceramic body 111, respectively.

According to this modified example, the first internal electrode 21 'has a first corner portion e1 adjacent to an upper surface and a first longitudinal side surface of the ceramic body, and a second corner portion e2 adjacent to the lower surface and the first side of the ceramic body. , And a second non-patterned portion (21c ') disposed at least on at least one of the first corner (e2) and the second internal electrode (22'), And a second non-patterned portion 22c 'disposed on at least one of the lower surface e3 of the ceramic body and the fourth corner e4 adjacent to the second side surface of the ceramic body.

The first and second non-patterned portions 21c 'and 22c' mean that the first or second internal electrode is not disposed on the dielectric.

In other words, the first and second internal electrodes 21 and 22 may not be disposed at the first to fourth corner portions e1, e2, e3 and e4 of the ceramic body.

According to the present modification, the first lead portion 21b 'is not drawn out to the upper and lower surfaces of the ceramic body and the adjacent region where the first side faces meet, and the second lead portion 22b' And is not drawn out to an area adjacent to an edge where the upper and lower surfaces of the ceramic body and the second side meet.

For example, when the first and second internal electrodes are printed on the dielectric layer, the first and second internal electrodes are not printed at the corner portions, so that the first and second lead portions 21b ' , 22b 'may not be drawn out.

The internal electrodes are not drawn out to the corner portions of the ceramic body as in the modification of the present invention so that the dielectric layers without internal electrodes are brought into contact with each other at the corners of the ceramic body, It is possible to prevent the occurrence of delamination.

In addition, according to this modification, the equivalent series inductance (ESL) of the multilayer ceramic capacitor can be reduced, thereby reducing the equivalent series inductance (ESL) of the composite electronic component.

Furthermore, it is possible to reduce the equivalent series resistance (ESR) of the multilayer ceramic capacitor by increasing the contact area between the external electrode and the internal electrode, thereby reducing the equivalent series resistance (ESR) of the composite electronic component .

5 is a cross-sectional view taken along line BB 'of FIG.

5, the composite electronic component 100 includes a positive electrode terminal 161 and a negative electrode terminal 162 electrically connected to the multilayer ceramic capacitor 110 and the tantalum capacitor 120, respectively, as shown in FIG. 5, ).

The tantalum wire 121 and the first external electrode 131 of the multilayer ceramic capacitor are connected to the anode terminal 161 and the body portion 122 of the tantalum capacitor, The second external electrode 132 of the multilayer ceramic capacitor is connected to the negative terminal 162.

The tantalum wire 121 is exposed to the longitudinal first side of the molding part 150 and connected to the positive terminal 161.

The tantalum capacitor 120 is a tantalum capacitor having no internal lead frame. The tantalum wire 121 can be exposed to the first longitudinal side of the molding part 150, .

As shown in FIG. 5, the connecting conductors 141 and 142 may be disposed on at least one of the upper surface and the lower surface of the insulating sheet 140.

The connection conductor portions 141 and 142 may include a conductive material so as to electrically connect the internal and external terminals 161 and 162 and the internal composite 130 outside the molding portion as will be described later. It is not limited.

According to an embodiment of the present invention, the cathode terminal 161 and the first external electrode 131 can be connected to each other through the first connection conductor portion 141, and the body portion 122 and the second external electrode 132 may be connected to the negative electrode terminal 162 through the second connection conductor member 142.

The second connection conductor member 142 may be formed to connect both the main body 122, the second external electrode 132, and the negative electrode terminal 162, The second external electrode 132 and the negative electrode terminal 162 may be divided into two or more portions to connect the negative electrode terminal 162 and the second external electrode 132 to the negative electrode terminal 162, respectively.

As shown in FIG. 5, the connection conductors 141 and 142 may be in the form of metal pads, but are not limited thereto.

In addition, the metal pads 141 and 142 may include copper (Cu), but are not limited thereto.

The metal pad may include a first metal pad 141 connected to the first outer electrode 131 and exposed to one side of the molding part 140 and a second metal pad 141 connected to the main body 122 and the second outer electrode And a second metal pad 142 exposed to the other side of the molding part 140.

6 is a cross-sectional view of a composite electronic part for showing a modified example of the connection conductor portion according to the embodiment of the present invention.

As shown in FIG. 6, the connection conductor portions 141 'and 142' may be a conductive resin portion formed by curing a conductive resin paste.

The conductive resin parts 141 'and 142' may include conductive particles and a base resin.

The conductive particles may be, but are not limited to, silver (Ag) particles. The base resin may be a thermosetting resin. For example, an epoxy resin may be used.

The conductive resin parts 141 'and 142' may include copper (Cu) as a conductive metal, but are not limited thereto.

Although not shown, the connection conductor portion according to an embodiment of the present invention may include both the metal pad and the conductive resin portion described above.

FIG. 7 is an enlarged view of the regions C1 and C2 in FIG. 5;

5 and 7, the terminal electrode includes a positive electrode terminal 161 and a negative electrode terminal 162.

The anode terminal 161 may be disposed on the first longitudinal side surface of the molding part 150 and the lower surface of the insulating sheet and may be connected to the tantalum wire 121 and the first external electrode 131.

The negative terminal 162 may be disposed on the second longitudinal side surface of the molding part 150 and the lower surface of the insulating sheet and may be connected to the body part 122 and the second external electrode 132.

The cathode terminal 161 and the first external electrode 131 may be connected to each other through the connection conductor 141. The anode terminal 162 and the body 122 may be separated from the connection conductor And may be connected through the connecting conductor portion 142.

The anode terminal 161 may extend from the first longitudinal side of the molding part 150 to a portion of the lower surface of the insulating sheet 140 and the anode terminal 162 may extend from the first side of the molding part 150 to the molding part 150. [ The anode terminal 161 and the anode terminal 162 may be formed to extend from the second longitudinal side of the insulating sheet 140 to a portion of the bottom surface of the insulating sheet 140.

The anode terminal 161 may include a cathode side terminal portion 161s disposed on a side surface of the molding portion 150 and an anode bottom portion 161u disposed on a lower surface of the insulating sheet 140, 162 may include a cathode side terminal portion 162s disposed on a side surface of the molding portion 150 and a cathode lower terminal portion 162u disposed on a lower surface of the insulating sheet 140. [

According to one embodiment of the present invention, the cathode terminal 161 includes a lower base layer 161a, side base layers 161b and 161c connected to the lower base layer 161a, And plating layers 161d and 161e disposed so as to surround the base layers 161b and 161c.

The negative electrode terminal 162 includes a lower base layer 162a, side base layers 162b and 162c connected to the lower base layer 162a and lower base layers 162a and 162b and 162c. And a plating layer 162d and 162e arranged to surround the plating layer 162c.

7, the base layers 161a and 162a are shown as one layer and the side base layers 161b, 161c, 162b, and 162c are shown as two layers. However, the present invention is not limited thereto. .

The cathode terminal 161 and the cathode terminal 162 may be formed by a process of sputtering at least one of Cr, Ti, Cu, Ni, Pd and Au, plating, , But is not limited thereto.

The anode terminal 161 and the anode terminal 162 are formed by first forming the lower surface base layers 161a and 162a and then forming the side base layers 161b, 161c, 162b, and 162c so as to be connected to the base layers 161a and 162a, And 162c.

The base layers 161a and 162a may be formed by etching, but the present invention is not limited thereto.

The base layers 161a and 162a are disposed on the lower surface of the insulating sheet 140. In order to form the base layers 161a and 162a after the metal thin film is coated on the lower surface of the insulating sheet 140, An etching process may be performed to form a pattern.

The base layers 161a and 162a are not particularly limited, but may include, for example, copper (Cu).

When the base layers 161a and 162a are formed using copper, they are excellent in connection with the side surface underlying layers 161b, 161c, 162b, and 162c formed by separate processes, and have excellent electrical conductivity. .

The side surface underlying layers 161b, 161c, 162b and 162c may be formed by vapor deposition, for example, by sputtering.

The side surface underlying layers 161b, 161c, 162b, and 162c are not particularly limited, but may be formed of two layers, i.e., an inner layer and an outer layer.

The inner side base layers 161b and 162b of the side base layers 161b, 161c, 162b and 162c may be formed by a sputter method including at least one of Cr and Ti, And can be connected to the first and second connection terminals 161a and 162a.

Outer side base layers 161c and 162c among the side base layers 161b, 161c, 162b and 162c may include Cu and may be formed by sputtering.

According to one embodiment of the present invention, it is possible to connect the tantalum capacitor and the multilayer ceramic capacitor in parallel on the insulating sheet 140 used for forming the positive terminal and the negative terminal of the frameless tantalum capacitor without the inner lead frame.

According to one embodiment of the present invention, it is possible to provide a composite electronic part in which the impedance of the tantalum capacitor appears in the low frequency section and the impedance of the multilayer ceramic capacitor appears in the high frequency section.

8 (a) and 8 (b) are graphs showing equivalent series resistance (ESR) and impedance according to a comparative example and a composite electronic component according to an embodiment of the present invention.

8 (a) and 8 (b), a composite electronic device according to an embodiment of the present invention has an equivalent series resistance (ESR) and an impedance graph with respect to a frequency of an input signal, An equivalent series resistance (ESR) and an inflection point of impedance occur in at least one of the frequency regions before and after the self resonant frequency (SRF).

That is, according to the embodiment of the present invention, the impedance of the tantalum capacitor appears in the low frequency region and the impedance of the multilayer ceramic capacitor in the high frequency region in the frequency versus impedance graph.

Therefore, in the graph of equivalent series resistance (ESR) and impedance of the input signal with respect to the frequency of the input signal, an equivalent serial resistance (" SRR ") is applied to at least one of the frequency regions before and after the self resonant frequency ESR) and an inflection point of impedance occur.

The inflection point of the equivalent series resistance (ESR) and the impedance may occur in at least one of the frequency regions before and after the self resonant frequency (SRF), and may occur in both the before and after frequency regions have.

Since the inflection point of the equivalent series resistance (ESR) and the impedance occurs in at least one of the frequency regions before and after the self resonant frequency (SRF), the composite electronic device according to the embodiment of the present invention Can achieve a low ESR (Equivalent Series Resistance).

9 is a graph showing an output voltage versus time according to an embodiment of the present invention and a comparative example.

Referring to FIG. 9, in the embodiment of the present invention, the voltage ripple is significantly reduced as compared with the comparative example in which only the tantalum capacitor is applied, and it is almost similar to the comparative example in which only the multilayer ceramic capacitor is used.

That is, in the comparative example using only the tantalum capacitor, the voltage ripple is 34 mV, whereas in the embodiment of the present invention, the voltage ripple is reduced to 9 mV similar to the comparative example (voltage ripple is 7 mV) using only the multilayer ceramic capacitor .

Table 1 below shows the capacitance and ESR (Equivalent Series) according to the volume of the tantalum capacitor and the volume ratio of the multilayer ceramic capacitor (the volume of the tantalum capacitor: the volume of the multilayer ceramic capacitor) in the composite electronic device according to the embodiment of the present invention. Resistance, Equivalent Series Inductance (ESL), and acoustic noise characteristics.

Sample The volume ratio of the tantalum and multilayer ceramic capacitors
(T: M) capacitance
(μF) ESR
(mΩ) ESL
(pH) Acoustic noise
(dBA) One* 10: 0 45.0 150 471 16.6 2* 9.5: 0.5 44.9 58 415 16.6 3 9: 1 44.7 26 369 16.7 4 8: 2 44.4 21 313 16.7 5 7: 3 44.1 16 281 16.8 6 6: 4 43.8 11 258 16.9 7 5: 5 43.5 9.2 240 16.9 8 4: 6 43.2 7.1 225 17.3 9 3: 7 42.9 6.4 213 17.5 10 2: 8 42.6 5.5 203 18.1 11 * 1: 9 42.3 4.1 197 26.5 12 * 0: 10 42.0 3.3 207 28.2

*: Comparative Example

Referring to Table 1, Samples 1 and 2 show that the equivalent series resistance (ESR) is increased when the combined volume ratio of the tantalum capacitors exceeds 9 in the composite electronic part.

For capacitors used in the power stage, if the equivalent series resistance (ESR) value exceeds 30 mΩ, the voltage ripple and radiation noise increase, and the power supply efficiency may decrease.

Samples 11 and 12 show that the coupling volume ratio of the tantalum capacitors is less than 2, and the effect of reducing the acoustic noise is not remarkably exhibited.

Samples 3 to 10 are examples of the present invention in which the combined volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor and the multilayer ceramic capacitor is in the range of 9: 1 to 2: 8, and the equivalent series resistance Resistance, ESR) value is low, and a composite electronic part having excellent acoustic noise improving effect can be realized.

10 is a graph showing ESR voltage ripple (ΔV) according to the volume ratio of the multilayer ceramic capacitor and the tantalum capacitor in the composite electronic device according to an embodiment of the present invention.

10, when the combined volume ratio of the tantalum capacitor and the multilayer ceramic capacitor is in the range of 5: 5 to 7: 3, the equivalent series resistance, ESR) and the voltage ripple (ΔV) are low, it is possible to realize a high-capacity electronic component.

The mounting substrate of the composite electronic component

11 is a perspective view showing a state in which the composite electronic component of Fig. 1 is mounted on a printed circuit board.

11, a mounting board 200 of a composite electronic component according to another embodiment of the present invention includes a printed circuit board 810 having electrode pads 821 and 822 on its top and a printed circuit board 810 And the solder 830 connecting the composite electronic component 100 and the electrode pads 821 and 822 to the composite electronic component 100.

The mounting board 200 of the composite electronic component according to the present embodiment includes a printed circuit board 810 on which the composite electronic component 100 is mounted and two or more electrode pads 821 and 821 formed on the upper surface of the printed circuit board 810. [ 822).

The electrode pads 821 and 822 include first and second electrode pads 821 and 822 connected to the cathode terminal 161 and the cathode terminal 162 of the composite electronic part, respectively.

The positive and negative terminals 161 and 162 of the composite electronic component are electrically connected to the printed circuit board 810 by the solder 830 in a state of being in contact with the first and second electrode pads 821 and 822, .

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

100: Composite electronic parts
110: Multilayer ceramic capacitor 111: Ceramic body
120: tantalum capacitor 121: tantalum wire
122: main body part of tantalum capacitor 130: composite 131, 132: first and second outer electrodes
140: insulating sheet 141, 142: connecting conductor portion
150: molding part 161, 162: anode and cathode terminal
200: mounting electronic component substrate 810: printed circuit board
821, 822: electrode pad 830: solder

Claims (20)

Insulating sheet;
A tantalum capacitor comprising: a body portion including a tantalum powder sintered body; and a tantalum wire partially buried in the body portion, the tantalum capacitor disposed on the insulating sheet;
A ceramic body including a plurality of dielectric layers, first and second internal electrodes disposed inside the ceramic body so as to face each other with the dielectric layer interposed therebetween, and first and second internal electrodes A multilayer ceramic capacitor including first and second external electrodes disposed on the insulating sheet, the multilayer ceramic capacitor being disposed on the insulating sheet; And
A molding part arranged to surround the tantalum capacitor and the multilayer ceramic capacitor; / RTI >
Wherein the first internal electrode includes a top surface and a bottom surface of the ceramic body, and a first lead portion extending to a first longitudinal side surface of the ceramic body, and the second internal electrode includes an upper surface, And a second lead portion extending to a second longitudinal side of the first lead portion.
The method according to claim 1,
Wherein the first and second internal electrodes are disposed perpendicular to the lower surface of the ceramic body.
The method according to claim 1,
The first internal electrode includes a first non-pattern portion disposed on at least one of a first corner portion adjacent to an upper surface and a first side surface of the ceramic body, and a second corner portion adjacent to a lower surface and a first side surface of the ceramic body Complex electronic components.
The method according to claim 1,
And the second internal electrode includes a second non-pattern portion disposed at least one of a third corner portion adjacent to the upper surface and the second side surface of the ceramic body, and a fourth corner portion adjacent to the lower surface and the second side surface of the ceramic body Complex electronic components.
The method according to claim 1,
Wherein the first and second internal electrodes are not disposed at corner portions of the ceramic body.
The method according to claim 1,
Further comprising a cathode terminal disposed on first and second longitudinal sides of the molding part, and a cathode terminal disposed on second longitudinal sides and bottom sides of the molding part.
The method according to claim 6,
Wherein the first external electrode of the multilayer ceramic capacitor and the tantalum wire of the tantalum capacitor are connected to the positive terminal.
The method according to claim 6,
Wherein the second external electrode of the multilayer ceramic capacitor and the body portion of the tantalum capacitor are connected to the negative terminal.
The method according to claim 6,
Wherein the cathode terminal and the cathode terminal include a lower base layer, a side base layer connected to the lower base layer, and a plating layer disposed so as to surround the lower base layer and the side base layer.
10. The method of claim 9,
In this case, the underlying layer is formed by etching.
10. The method of claim 9,
Wherein the lateral underlying layer is formed by deposition.
The method according to claim 1,
Wherein the tantalum wire is exposed to a longitudinal first side of the molding part.
The method according to claim 1,
In Equivalent Series Resistance (ESR) graphs of the input signal to the input signal, Equivalent Series Resistance (ESR) in at least one of the frequency regions before and after the self resonant frequency (SRF) Series Resistance, ESR).
The method according to claim 1,
Wherein an insulating layer is disposed on a coupling surface adjacent to the multilayer ceramic capacitor and the tantalum capacitor.
The method according to claim 1,
And a connection conductor portion disposed on an upper surface of the insulating sheet.
16. The method of claim 15,
Wherein the connecting conductor portion comprises a metal pad.
16. The method of claim 15,
Wherein the connection conductor portion includes a conductive resin.
The method according to claim 1,
Wherein the volume ratio (tantalum capacitor: multilayer ceramic capacitor) of the tantalum capacitor and the multilayer ceramic capacitor is 2: 8 to 9: 1.
A printed circuit board having an electrode pad thereon;
A composite electronic component mounted on the printed circuit board; And
And a solder connecting the electrode pad and the composite electronic part,
The composite electronic component includes an insulating sheet; A tantalum capacitor comprising: a body portion including a tantalum powder sintered body; and a tantalum wire partially buried in the body portion, the tantalum capacitor disposed on the insulating sheet; A ceramic body including a plurality of dielectric layers, first and second internal electrodes disposed inside the ceramic body so as to face each other with the dielectric layer interposed therebetween, and first and second internal electrodes A multilayer ceramic capacitor including first and second external electrodes disposed on the insulating sheet, the multilayer ceramic capacitor being disposed on the insulating sheet; A molding part arranged to surround the tantalum capacitor and the multilayer ceramic capacitor; / RTI >
Wherein the first internal electrode includes a top surface and a bottom surface of the ceramic body, and a first lead portion extending to a first longitudinal side surface of the ceramic body, and the second internal electrode includes an upper surface, And a second lead portion extending to a second longitudinal side of the mounting board.
20. The method of claim 19,
Wherein the first and second internal electrodes are disposed perpendicular to the lower surface of the ceramic body.

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