TWI485730B - Winding-type solid electrolytic capacitor package structure without using lead frames and method of manufacturing the same - Google Patents

Description

Winding type solid electrolytic capacitor package structure without using lead frame and its maker law

The invention relates to a solid electrolytic capacitor package structure and a manufacturing method thereof, in particular to a wound type solid electrolytic capacitor package structure and a manufacturing method thereof, which do not need to use a lead frame.

The wound solid electrolytic capacitor includes a capacitor element, a housing member, and a sealing member. The capacitor element is wound with an anode foil connected to the anode terminal and a cathode foil connected to the cathode terminal via a separator, and an electrolyte layer is formed between the anode foil and the cathode foil. The housing member has an opening and can accommodate the capacitor element. The sealing member has a through hole through which the anode terminal and the cathode terminal are inserted, and an opening portion through which the receiving member can be sealed. Further, a predetermined interval exists between the sealing member and the capacitor element, and at least one of the anode terminal and the cathode terminal is provided with a stopper for securing a gap. However, the conventional wound type solid electrolytic capacitor is not subjected to any packaging, and the wound type solid electrolytic capacitor is limited in the design and electrical connection manner of the conductive pins.

The embodiment of the invention provides a packaged solid-state electrolytic capacitor package structure and a manufacturing method thereof without using a lead frame.

A winding type solid electrolytic capacitor package structure that does not require a lead frame is provided in one embodiment of the present invention, and includes: a capacitor unit and a package unit. The capacitor unit includes at least one wound capacitor, wherein at least one of the wound capacitors has a winding body, a positive conductive pin extending from one side end of the winding body, and a a negative electrode conductive pin extending from the other side end of the wound body. Place The package unit includes a package covering the winding body, wherein the package has a first side, a second side corresponding to the first side, and a first side connected to the first side a bottom surface between the second sides. Wherein the positive conductive lead has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, and The first exposed portion extends along the first side and the bottom surface of the package. Wherein the negative conductive pin has a second embedded portion covered in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body, and The second exposed portion extends along the second side of the package and the bottom surface.

According to another embodiment of the present invention, a method for fabricating a wound solid-state electrolytic capacitor package structure that does not require a lead frame includes the following steps: First, at least one wound capacitor is provided, wherein at least one of the windings is provided The capacitor has a winding body, a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body And forming a package to cover the wound body, wherein the positive conductive lead has a first embedded portion encapsulated in the package and a first embedded portion And exposing the first exposed portion outside the package body, and the negative conductive pin has a second embedded portion wrapped in the package body and a second buried portion connected to the second embedded portion a second exposed portion outside the package; then, bending the first exposed portion and the second exposed portion such that the first exposed portion and the second exposed portion are along the package body The outer surface extends.

The beneficial effects of the present invention may be provided by the embodiments of the present invention. Winding type solid electrolytic capacitor package structure and manufacturing method thereof, the permeable type "winding type capacitor has a winding body, a positive electrode conductive pin and a negative electrode conductive pin", and "the positive electrode conductive pin has a covered a first embedded portion in the package body and a first exposed portion exposed outside the package body, and the first exposed portion extends along an outer surface of the package body" and "the negative electrode conductive pin has a coating in the package body a second embedded portion and a second exposed portion exposed outside the package, and the second exposed portion extends along the outer surface of the package, so that the wound type solid electrolytic capacitor package structure of the present invention and the manufacturing method thereof No need to use leadframes, which can effectively reduce production costs, increase production speed (increasing production) and increase product yield.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[First Embodiment]

Referring to FIG. 1 to FIG. 7 , FIG. 1 is a flowchart of a manufacturing method of the present invention, and FIG. 2 is a flattened first exposed portion 101B of the positive conductive pin 101 and the second exposed portion 102B of the negative conductive pin 102 . 3 is a schematic perspective view of the winding body 100, FIG. 4A is a cross-sectional view of the 4A-4A cut line of FIG. 2, and FIG. 4B is a cross-sectional view of the 4B-4B cut line of FIG. 5 is a front view of the package body 20 after being packaged by the package body 20. FIG. 6 is a front view of the first exposed portion 101B of the positive electrode conductive pin 101 and the second exposed portion 102B of the negative electrode conductive pin 102 being flattened. FIG. 7 is a front view showing the positive conductive pin 101 and the negative conductive pin 102 being bent. As can be seen from the above figures, the first embodiment of the present invention provides a wound type solid electrolytic capacitor that does not require the use of a lead frame. The manufacturing method of the package structure Z includes the following steps. First, as shown in FIG. 1 and FIG. 2, at least one wound capacitor 10 is provided. The wound capacitor 10 has a winding body 100 and a winding body. A positive conductive pin 101 extending from one end of the 100, and a negative conductive pin 102 extending from the other end of the winding body 100 (step S100). Furthermore, in the above-described step of providing the wound capacitor 10, the winding capacitor 10 is further subjected to carbonization treatment, chemical conversion treatment, and impregnation polymer treatment.

For example, as shown in FIG. 2 and FIG. 3, the winding body 100 can be a positive electrode foil 100A, a negative electrode foil 100B, and a release paper disposed between the positive electrode foil 100A and the negative electrode foil 100B. A rectangular parallelepiped capacitor core that is wound together with 100C. In addition, the positive electrode conductive pin 101 and the negative electrode conductive pin 102 can electrically contact the positive electrode foil 100A and the negative electrode foil 100B, respectively, wherein the positive electrode end portion of the positive electrode conductive pin 101 (shown by a broken line in FIG. 2) can be inserted into the roll. Around the body 100 and between the positive electrode foil 100A and the release paper 100C, the negative end portion of the negative electrode conductive pin 102 (shown by a broken line in FIG. 2) can be inserted into the winding body 100 and located in the negative electrode foil 100B and isolated. Between the sheets 100C, and the lengths of the positive end portion and the negative end portion may be substantially equal to the width of the wound body 100 (as shown in FIG. 2). Regarding the manufacturing method of the rectangular parallelepiped capacitor core, further, the positive electrode foil 100A, the negative electrode foil 100B, and the release paper 100C may be wound together to form a cylindrical capacitor core (not shown), and then the cylinder The bulk capacitor core is pressed (can be simultaneously heated by about 50 ° C to 300 ° C) to form a rectangular parallelepiped capacitor core (shown in FIG. 3 ), wherein the rectangular parallelepiped capacitor core has at least a flat upper surface formed by press-fitting 1001 and a flat lower surface 1002 opposite the flat upper surface 1001.

For example, as shown in FIG. 2, FIG. 4A and FIG. 4B, the positive electrode conductive pin 101 has a first positive conductive portion 1011 electrically connected to the positive electrode foil 100A, a second positive conductive portion 1012, and a The first soldering portion 1013 between the first positive electrode conductive portion 1011 and the second positive electrode conductive portion 1012, and the negative electrode conductive pin 102 is an integrally formed structure without precision soldering (ie, no solder joints and high heights thereof) Impedance) to reduce the length of the conductive leads and increase the amount of current that can be withstood. Furthermore, as shown in FIG. 4A and FIG. 4B, the first positive electrode conductive portion 1011 may be made of a pure Al (aluminum) material or an Al alloy, and the second positive electrode conductive portion 1012 may be a plurality of first material layers. The first multilayer structure composed of M1, and the negative electrode conductive pin 102 may be a second multilayer structure composed of a plurality of second material layers M2. In addition, the innermost layer M11 of the plurality of first material layers M1 may be an Fe (iron) layer or a Cu (copper) layer, and the outermost layer M12 of the plurality of first material layers M1 may surround and coat the Fe layer or Cu The Sn (tin) layer of the layer. In addition, the innermost layer M21 of the plurality of second material layers M2 may be a pure Al layer or an Al alloy layer (or any material whose surface may form an oxide layer), and the outermost layer M22 of the plurality of second material layers M2 may be one A Sn layer formed by electroless plating or electroplating and surrounding a pure Al layer or an Al alloy layer. The Sn layer of the outermost layer M22 of the second material layer M2 may directly cover the pure Al layer or the Al alloy layer of the innermost layer M21 of the second material layer M2, or the pure innermost layer M21 of the second material layer M2. A tie layer (for example, a Cu layer) may be added between the Al layer or the Al alloy layer and the Sn layer of the outermost layer M22. Since the conductivity of Al is greater than the conductivity of Fe, and the cost of Al is lower than the cost of Cu, the present invention can effectively increase the conductivity and reduce the manufacturing cost.

Next, as shown in FIG. 2 and FIG. 5, a package body 20 (eg, epoxy) is formed to wrap the wound body 100, wherein the positive electrode conductive pin 101 has a first embedded portion 101A encapsulated in the package 20 and a first exposed portion 101B connected to the first embedded portion 101A and exposed outside the package 20, and the negative conductive pin 102 has a package The second embedded portion 102A overlying the package 20 and the second exposed portion 102B connected to the second embedded portion 102A and exposed outside the package 20 (step S102). Furthermore, after the step of forming the package body 20 to cover the wound body 100, the method further includes: performing the aging treatment on the wound capacitor 10. Furthermore, the package body 20 has a first side surface 201, a second side surface 202 corresponding to and opposite (or opposite) to the first side surface 201, and a bottom surface connected between the first side surface 201 and the second side surface 202. 203.

Then, as shown in FIG. 5 and FIG. 6, the top end and the bottom end of the first exposed portion 101B and the top end and the bottom end of the second exposed portion 102B are flattened or flattened (step S104), so that the first exposed portion 101B is The top end and the bottom end respectively have a first flat surface 10101 and a second flat surface 10102, and the top end and the bottom end of the second exposed portion 102B have a first flat surface 10201 and a second flat surface 10202, respectively. . Of course, the present invention can also flatten or flatten the top end and the bottom end of the first exposed portion 101B and the top end and the bottom end of the second exposed portion 102B, and then use the package 20 to wrap the wrapped body 100.

Finally, as shown in FIG. 6 and FIG. 7 , the first exposed portion 101B and the second exposed portion 102B are bent such that the first exposed portion 101B and the second exposed portion 102B both extend along the outer surface of the package 20 (steps) S106). Furthermore, the first exposed portion 101B may extend along the first side 201 and the bottom surface 203 of the package 20, and the second exposed portion 102B may extend along the second side 202 and the bottom surface 203 of the package 20. The second flattened surface 10102 of the first exposed portion 101B can face and abut the first side of the package 20 The face 201 and the bottom face 203, and the first flattened surface 10101 of the first exposed portion 101B may face away from the first side 201 and the bottom face 203 of the package 20. The second flattened surface 10202 of the second exposed portion 102B can face and abut the second side 202 and the bottom surface 203 of the package 20, and the first flattened surface 10201 of the second exposed portion 102B can face away from the package 20 Two side faces 202 and a bottom face 203.

Therefore, as shown in FIG. 7 , the first embodiment of the present invention can provide a wound solid-state electrolytic capacitor package structure Z that does not require the use of a lead frame, and includes: a capacitor unit, through the manufacturing method of the above steps S100 to S106 1 and a package unit 2. The capacitor unit 1 includes at least one wound capacitor 10, wherein the wound capacitor 10 has a winding body 100, a positive conductive pin 101 extending from one side end of the winding body 100, and a slave coil A negative conductive pin 102 extending around the other side end of the body 100. The package unit 2 includes a package body 20 covering the winding body 100. The package body 20 has a first side surface 201, a second side surface 202 corresponding to and opposite to the first side surface 201, and a first side surface 201 connected thereto. A bottom surface 203 between the second side 202 and the second side 202. Furthermore, the positive conductive lead 101 has a first embedded portion 101A covered in the package 20 and a first exposed portion 101B connected to the first embedded portion 101A and exposed outside the package 20, and The first exposed portion 101B may extend along the first side 201 and the bottom surface 203 of the package 20 . The negative conductive pin 102 has a second embedded portion 102A wrapped in the package 20 and a second exposed portion 102B connected to the second embedded portion 102A and exposed outside the package 20, and the second exposed portion The portion 102B can extend along the second side 202 and the bottom surface 203 of the package 20.

Further, the first exposed portion 101B has a first leveling table The surface 10101 and a second flat surface 10102 opposite to the first flattening surface 10101, the second flat surface 10102 of the first exposed portion 101B faces and abuts the first side 201 and the bottom surface 203 of the package 20, and The first flattening surface 10101 of the exposed portion 101B faces away from the first side 201 and the bottom surface 203 of the package 20. In addition, the second exposed portion 102B has a first flattened surface 10201 and a second flattened surface 10202 opposite to the first flattened surface 10201, and the second flattened surface 10202 of the second exposed portion 102B faces and abuts the package The second side surface 202 and the bottom surface 203 of the body 20 and the first flat surface 10201 of the second exposed portion 102B are opposite to the second side surface 202 and the bottom surface 203 of the package body 20.

[Second embodiment]

Please refer to FIG. 8 to FIG. 10 , wherein FIG. 9 is a schematic cross-sectional view of the A-A and B-B cut lines of FIG. 8 . The second embodiment of the present invention can provide a wound type solid electrolytic capacitor package structure Z that does not require a lead frame, and includes a capacitor unit 1 and a package unit 2. 8 is a comparison between FIG. 8 and FIG. 2 and FIG. 4 and FIG. 4A and FIG. 4B, the maximum difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the positive conductive pin 101 and The negative conductive pins 102 are integrally formed without precision soldering (ie, no solder joints and high impedance generated by them) to reduce the length of the conductive leads and increase the amount of current that can be withstood. The positive conductive pin 101 may be a first multilayer structure composed of a plurality of first material layers M1, and the negative conductive pin 102 may be a second multilayer structure composed of a plurality of second material layers M2. .

For example, as shown in FIG. 8 and FIG. 9, the innermost layer M11 of the plurality of first material layers M1 and the innermost layer M21 of the plurality of second material layers M2 may be pure Al layers or Al alloy layers (or Any material that forms an oxide layer on the surface And the outermost layer M12 of the plurality of first material layers M1 and the outermost layer M22 of the plurality of second material layers M2 may be a shape formed by electroless plating or electroplating and surrounding the pure Al layer or the Al alloy layer. Floor. The Sn layer of the outermost layer M22 of the second material layer M2 may directly cover the pure Al layer or the Al alloy layer of the innermost layer M21 of the second material layer M2, or the pure innermost layer M21 of the second material layer M2. A tie layer (for example, a Cu layer) may be added between the Al layer or the Al alloy layer and the Sn layer of the outermost layer M22. Since the conductivity of Al is greater than the conductivity of Fe, and the cost of Al is lower than the cost of Cu, the present invention can effectively increase the conductivity and reduce the manufacturing cost.

[Third embodiment]

Please refer to FIG. 11 to FIG. 13 , wherein FIG. 12 is a schematic cross-sectional view of the A-A and B-B cut lines of FIG. 11 . A third embodiment of the present invention can provide a wound type solid electrolytic capacitor package structure Z that does not require a lead frame, and includes a capacitor unit 1 and a package unit 2. The comparison between FIG. 11 and FIG. 8 and the comparison between FIG. 12 and FIG. 9 shows that the greatest difference between the third embodiment of the present invention and the second embodiment is that in the third embodiment, the positive conductive pin 101 has an electric power. a first positive electrode conductive portion 1011, a second positive electrode conductive portion 1012, and a first soldering portion 1013 connected between the first positive electrode conductive portion 1011 and the second positive electrode conductive portion 1012, and a negative electrode The conductive pin 102 has a first negative conductive portion 1021 electrically contacting the negative electrode foil 100B, a second negative conductive portion 1022, and a first connection between the first negative conductive portion 1021 and the second negative conductive portion 1022. Two welded portions 1023.

For example, as shown in FIG. 11 and FIG. 12, the first positive electrode conductive portion 1011 and the first negative electrode conductive portion 1021 can be made of pure Al material or Al alloy, and the second positive electrode conductive portion 1012 can be composed of multiple First material layer The first multilayer structure composed of M1, and the second negative electrode conductive portion 1022 may be a second multilayer structure composed of a plurality of second material layers M2. In addition, the innermost layer M11 of the plurality of first material layers M1 and the innermost layer M21 of the plurality of second material layers M2 may both be an Fe layer or a Cu layer, and the outermost layers M12 and the plurality of first material layers M1 are The outermost layer M22 of the second material layer M2 may be a Sn layer surrounding the Fe layer or the Cu layer.

[Possible effects of the examples]

In summary, the packaged solid-state electrolytic capacitor package structure Z and the manufacturing method thereof are provided by the embodiment of the present invention, and the rewritable capacitor 10 has a winding body 100, a positive conductive pin 101 and a The negative conductive pin 102", "the positive conductive lead 101 has a first embedded portion 101A wrapped in the package 20 and a first exposed portion 101B exposed outside the package 20, and the first exposed portion 101B extends along the outer surface of the package body 20 and the negative electrode conductive pin 102 has a second embedded portion 102A wrapped in the package body 20 and a second exposed portion 102B exposed outside the package body 20, And the second exposed portion 102B extends along the outer surface of the package body 20, so that the wound-type solid electrolytic capacitor package structure Z of the present invention and the manufacturing method thereof do not need to use the lead frame, thereby effectively reducing the manufacturing cost and improving the production. Speed (increased production) and increased product yield.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧Wind capacitor

100‧‧‧Winding body

100A‧‧‧positive foil

100B‧‧‧Negative foil

100C‧‧‧Isolation paper

1001‧‧‧flat upper surface

1002‧‧‧ Flat lower surface

101‧‧‧ positive conductive pin

101A‧‧‧First Internal Department

101B‧‧‧First exposed department

10101‧‧‧First flat surface

10102‧‧‧Second flat surface

1011‧‧‧First positive conducting part

1012‧‧‧Second positive conducting part

1013‧‧‧First Welding Department

102‧‧‧Negative Conductive Pin

102A‧‧‧Second Internal Department

102B‧‧‧Second exposed department

10201‧‧‧First flat surface

10202‧‧‧Second flat surface

1021‧‧‧First negative conducting part

1022‧‧‧Second negative conducting part

1023‧‧‧Second welding department

M1‧‧‧ first material layer

M11‧‧‧ innermost layer

M12‧‧‧ outermost layer

M2‧‧‧Second material layer

M21‧‧‧ innermost layer

M22‧‧‧ outermost layer

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side

202‧‧‧ second side

203‧‧‧ bottom

1 is a flow chart of a manufacturing method of a first embodiment of the present invention.

2 is a front view of the first bare portion of the positive electrode conductive pin and the second exposed portion of the negative electrode conductive pin before being flattened according to the first embodiment of the present invention; Figure.

Fig. 3 is a perspective view showing the winding body of the first embodiment of the present invention.

4A is a schematic cross-sectional view of the 4A-4A cut line of FIG. 2.

4B is a schematic cross-sectional view of the 4B-4B cut line of FIG. 2.

FIG. 5 is a front elevational view showing the winding body of the first embodiment of the present invention after being packaged by a package.

6 is a front elevational view showing the first bare portion of the positive electrode conductive pin and the second bare portion of the negative electrode conductive pin being flattened according to the first embodiment of the present invention.

FIG. 7 is a front elevational view showing the positive conductive pin and the negative conductive pin of the first embodiment of the present invention being bent.

FIG. 8 is a front elevational view showing the first bare portion of the positive electrode conductive pin and the second exposed portion of the negative electrode conductive pin before being flattened according to the second embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view showing the A-A and B-B cut lines of Fig. 8.

FIG. 10 is a front elevational view showing the positive conductive pin and the negative conductive pin of the second embodiment of the present invention being bent.

FIG. 11 is a front elevational view showing the first bare portion of the positive electrode conductive pin and the second exposed portion of the negative electrode conductive pin before being flattened according to the third embodiment of the present invention.

Fig. 12 is a schematic cross-sectional view showing the A-A and B-B cut lines of Fig. 11;

FIG. 13 is a front elevational view showing the positive electrode conductive pin and the negative electrode conductive pin bent according to the third embodiment of the present invention.

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧Wind capacitor

100‧‧‧Winding body

101‧‧‧ positive conductive pin

101A‧‧‧First Internal Department

101B‧‧‧First exposed department

10101‧‧‧First flat surface

10102‧‧‧Second flat surface

102‧‧‧Negative Conductive Pin

102A‧‧‧Second Internal Department

102B‧‧‧Second exposed department

10201‧‧‧First flat surface

10202‧‧‧Second flat surface

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side

202‧‧‧ second side

203‧‧‧ bottom

Claims (14)

A wound type solid electrolytic capacitor package structure that does not require a lead frame, comprising: a capacitor unit including at least one wound type capacitor, wherein at least one of the wound type capacitors has a winding body and a winding body a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; and a packaging unit including a covering The package body of the winding body, wherein the package body has a first side surface, a second side surface corresponding to the first side surface, and a connection between the first side surface and the second side surface The bottom surface of the positive electrode has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body And the first exposed portion extends along the first side and the bottom surface of the package; wherein the negative conductive pin has a second embedded portion wrapped in the package And one connected to the second internal part a second exposed portion exposed outside the package, and the second exposed portion extends along the second side of the package and the bottom surface; wherein the positive conductive pin has an electrical contact a first positive electrode conductive portion of the positive electrode foil, a second positive electrode conductive portion, and a first soldering portion connected between the first positive electrode conductive portion and the second positive electrode conductive portion, the second The positive electrode conductive portion is a first multilayer structure composed of a plurality of first material layers, and the negative electrode conductive pin is a second multilayer structure composed of a plurality of second material layers. The wound-type solid electrolytic capacitor package structure of the first aspect of the invention, wherein the first exposed portion has a first flattening surface and a second flattening surface, The second flat surface of a bare portion faces the first side and the bottom surface of the package, and the first flat surface of the first exposed portion faces away from the package body a first side and the bottom surface, wherein the second exposed portion has a first flat surface and a second flat surface, and the second flat surface of the second exposed portion faces the package The second side surface and the bottom surface, and the first flat surface of the second exposed portion faces away from the second side surface and the bottom surface of the package body. The packaged solid-state electrolytic capacitor package structure according to the first aspect of the invention, wherein the winding body is a positive electrode foil, a negative electrode foil, and a positive electrode foil. a rectangular parallelepiped capacitor core wound together with a separator paper between the foil and the negative electrode foil, and the positive electrode conductive pin and the negative electrode conductive pin are electrically contacted with the positive electrode foil and the negative electrode, respectively Foil. The wound type solid electrolytic capacitor package structure according to claim 3, wherein the first positive electrode conductive portion is made of a pure Al material or an Al alloy, and the plurality of the first portions are The innermost layer of the material layer is an Fe layer or a Cu layer, and an outermost layer of the plurality of first material layers is an Sn layer surrounding the Fe layer or the Cu layer, and an innermost portion of the plurality of second material layers The layer is a pure Al layer or an Al alloy layer, and the outermost layers of the plurality of second material layers are Sn layers surrounding the pure Al layer or the Al alloy layer. A wound type solid electrolytic capacitor package structure that does not require a lead frame, and includes: a capacitor unit comprising at least one wound capacitor, wherein at least one of the wound capacitors has a winding body, a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; and a package unit including a package covering the wound body, wherein the package has a first side a second side corresponding to the first side, and a bottom surface connected between the first side and the second side; wherein the positive conductive pin has a cladding a first embedded portion in the package body and a first exposed portion exposed to the first embedded portion and exposed outside the package body, and the first exposed portion is along the first portion of the package body The side surface and the bottom surface extend; wherein the negative electrode conductive pin has a second embedded portion encapsulated in the package body and a second buried portion connected to the second embedded portion and exposed outside the package body a second exposed portion, and the second exposed portion is along the The second side of the package extends from the bottom surface; wherein the positive conductive pin is a first multilayer structure composed of a plurality of first material layers, and the negative conductive pin is a plurality of a second multilayer structure composed of a second material layer, wherein an innermost layer of the plurality of first material layers and an innermost layer of the plurality of second material layers are pure Al layers or Al alloy layers, and The outermost layer of the plurality of first material layers and the outermost layer of the plurality of second material layers are each a Sn layer surrounding the pure Al layer or the Al alloy layer. A wound type solid electrolytic capacitor package structure that does not require a lead frame, and includes: a capacitor unit comprising at least one wound capacitor, wherein at least one of the wound capacitors has a winding body, a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; and a package unit including a package covering the wound body, wherein the package has a first side a second side corresponding to the first side, and a bottom surface connected between the first side and the second side; wherein the positive conductive pin has a cladding a first embedded portion in the package body and a first exposed portion exposed to the first embedded portion and exposed outside the package body, and the first exposed portion is along the first portion of the package body The side surface and the bottom surface extend; wherein the negative electrode conductive pin has a second embedded portion encapsulated in the package body and a second buried portion connected to the second embedded portion and exposed outside the package body a second exposed portion, and the second exposed portion is along the The second side of the package extends to the bottom surface; wherein the positive conductive pin has a first positive conductive portion electrically contacting the positive electrode foil, a second positive conductive portion, and a connection a first soldering portion between the first positive electrode conductive portion and the second positive electrode conductive portion, and the negative electrode conductive pin has a first negative conductive portion electrically contacting the negative electrode foil, and a second portion a negative electrode conductive portion, and a second soldering portion connected between the first negative electrode conductive portion and the second negative electrode conductive portion, wherein the first positive electrode conductive portion and the first negative electrode conductive portion are both pure Made of an Al material or an Al alloy, the second positive electrode conductive portion is a plurality of first material layers a multilayer structure, the second negative electrode conductive portion is a second multilayer structure composed of a plurality of second material layers, wherein an innermost layer of the plurality of first material layers and a plurality of the second layers The innermost layer of the material layer is an Fe layer or a Cu layer, and an outermost layer of the plurality of first material layers and an outermost layer of the plurality of second material layers surround the Fe layer or the Cu layer The Sn layer. A manufacturing method of a wound type solid electrolytic capacitor package structure that does not require a lead frame, comprising the steps of: providing at least one wound type capacitor, wherein at least one of the wound type capacitors has a winding body and a winding body a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; forming a package to cover the roll Around the body, wherein the positive conductive pin has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, And the negative electrode conductive pin has a second embedded portion covered in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; and bending The first exposed portion and the second exposed portion are such that the first exposed portion and the second exposed portion both extend along an outer surface of the package body; wherein the positive conductive pin has Electrically contacting the positive electrode foil a positive electrode conductive portion, a second positive electrode conductive portion, and a first soldering portion connected between the first positive electrode conductive portion and the second positive electrode conductive portion, wherein the second positive electrode conductive portion is a plurality of a first multilayer structure composed of a first material layer, and the negative conductive pin is one A second multilayer structure composed of a plurality of second material layers. The method for manufacturing a wound type solid electrolytic capacitor package structure according to the seventh aspect of the invention, wherein the winding body is provided by a positive electrode foil, a negative electrode foil and a a rectangular parallelepiped capacitor core wound together with the separator paper between the positive electrode foil and the negative electrode foil, and the positive electrode conductive pin and the negative electrode conductive pin are electrically contacted with the positive electrode foil and The negative electrode foil. The manufacturing method of the wound type solid electrolytic capacitor package structure which does not require the use of a lead frame as described in claim 8, wherein the first positive electrode conductive portion is made of pure Al material or Al alloy, and the plurality of The innermost layer of the first material layer is an Fe layer or a Cu layer, and an outermost layer of the plurality of first material layers is a Sn layer surrounding the Fe layer or the Cu layer, and the plurality of the second material layers The innermost layer is a pure Al layer or an Al alloy layer, and the outermost layers of the plurality of second material layers are formed by electroless plating or electroplating and surround the pure Al layer or the Al alloy layer. Sn layer. The method for manufacturing a wound-type solid electrolytic capacitor package structure that does not require the use of a lead frame, as described in claim 7, wherein the step of bending the first exposed portion and the second exposed portion is further The method further includes: flattening the top end and the bottom end of the first exposed portion and the top end and the bottom end of the second exposed portion, wherein the top end and the bottom end of the first exposed portion respectively have a first end The flat surface and a second flat surface are flattened, and the top end and the bottom end of the second exposed portion respectively have a first flat surface and a second flat surface. The manufacturing method of the wound-type solid electrolytic capacitor package structure according to claim 10, wherein the package body has a first side surface and a second surface corresponding to the first side surface side And a bottom surface connected between the first side surface and the second side surface, the first bare portion extending along the first side surface and the bottom surface of the package body, and the second a bare portion extending along the second side of the package and the bottom surface, wherein the second flat surface of the first exposed portion faces the first side and the bottom surface of the package And the first flat surface of the first exposed portion faces away from the first side and the bottom surface of the package, wherein the second flat surface of the second exposed portion faces The second side of the package and the bottom surface, and the first flat surface of the second exposed portion faces away from the second side and the bottom surface of the package. The method for manufacturing a wound-type solid electrolytic capacitor package structure that does not require the use of a lead frame, as described in claim 7, wherein the step of providing at least one of the wound capacitors further comprises: at least one The winding type capacitor is sequentially subjected to carbonization treatment, chemical conversion treatment, and impregnation polymer treatment, wherein after the step of forming the package body to cover the winding body, the method further includes: winding at least one of the winding The type capacitor is aged. A manufacturing method of a wound type solid electrolytic capacitor package structure that does not require a lead frame, comprising the steps of: providing at least one wound type capacitor, wherein at least one of the wound type capacitors has a winding body and a winding body a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; forming a package to cover the roll a body around the body, wherein the positive conductive pin has a first embedded portion encapsulated in the package body and a first body attached to the first embedded portion and exposed outside the package body a bare portion, and the negative conductive pin has a second embedded portion encapsulated in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; And bending the first exposed portion and the second exposed portion such that the first exposed portion and the second exposed portion both extend along an outer surface of the package; wherein the positive conductive portion The pin is a first multilayer structure composed of a plurality of first material layers, and the negative electrode conductive pin is a second multilayer structure composed of a plurality of second material layers, the plurality of first The innermost layer of the material layer and the innermost layer of the plurality of second material layers are both a pure Al layer or an Al alloy layer, and an outermost layer of the plurality of first material layers and a plurality of the second material layers The outermost layer is an Sn layer formed by electroless plating or electroplating and surrounding the pure Al layer or the Al alloy layer. A manufacturing method of a wound type solid electrolytic capacitor package structure that does not require a lead frame, comprising the steps of: providing at least one wound type capacitor, wherein at least one of the wound type capacitors has a winding body and a winding body a positive conductive pin extending from one side end of the winding body, and a negative conductive pin extending from the other end of the winding body; forming a package to cover the roll Around the body, wherein the positive conductive pin has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, And the negative electrode conductive pin has a second embedded portion encapsulated in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; The first exposed portion and the second exposed portion are bent such that the first exposed portion and the second exposed portion both extend along an outer surface of the package body; wherein the positive conductive lead The foot has a first positive conductive portion electrically contacting the positive electrode foil, a second positive conductive portion, and a first solder connected between the first positive conductive portion and the second positive conductive portion And the negative conductive pin has a first negative conductive portion electrically contacting the negative electrode foil, a second negative conductive portion, and a first negative conductive portion and the second negative electrode a second soldering portion between the conductive portions, wherein the first positive conductive portion and the first negative conductive portion are both made of a pure Al material or an Al alloy, and the second positive conductive portion is composed of a plurality of a first multilayer structure composed of a first material layer, wherein the second negative electrode conductive portion is a second multilayer structure composed of a plurality of second material layers, wherein a plurality of the first material layers are innermost The innermost layer of the layer and the plurality of the second material layers are both an Fe layer or a Cu layer, and a plurality of Said outermost layer of the outermost layer of the plurality of the second material layer of the first material layer are all around the Sn layer or the Fe layer of the Cu layer.