TWI478188B - Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same - Google Patents

Description

Stacked solid electrolytic capacitor package junction with multiple negative lead pins Structure and its making method

The present invention relates to a stacked solid electrolytic capacitor package structure and a manufacturing method thereof, and more particularly to a stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead legs and a manufacturing method thereof.

Capacitors have been widely used in consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automotive basic components, including: filtering, bypass, rectification, coupling, decoupling And turn equal. It is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors and so on.

In the prior art, the solid electrolytic capacitor has the advantages of small size, large capacitance, superior frequency characteristics, and the decoupling of the power supply circuit for the central processing unit. In general, a stack of a plurality of capacitor units can be utilized to form a high-capacity solid electrolytic capacitor. The conventional stacked solid-state electrolytic capacitor includes a plurality of capacitor units and a lead frame, wherein each capacitor unit includes an anode portion and a cathode portion. And the insulating portion, the insulating portion electrically insulates the anode portion from the cathode portion. In particular, the cathode portions of the capacitor unit are stacked on each other, and a plurality of capacitor units are electrically connected to each other by providing a conductor layer between adjacent capacitor units. However, the conventional solid electrolytic capacitor can only provide one positive lead pin having only one exposed welded section and one negative lead pin having only one exposed welded section.

An embodiment of the present invention provides a stacked solid-state electrolytic capacitor package structure and a manufacturing method thereof, which can simultaneously provide a plurality of negative electrode lead-out legs.

One embodiment of the present invention provides a stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins, comprising: a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of stacked capacitors stacked in series and electrically connected to each other, wherein each of the stacked capacitors has at least one positive portion and at least one negative portion. The package unit includes a package covering the capacitor unit, wherein the package has a first side surface, a second side surface corresponding to the first side surface, and a connection to the a front surface between the first side surface and the second side surface, a rear surface connected between the first side surface and the second side surface and corresponding to the front surface, and a rear surface a bottom surface connected between the first side surface, the second side surface, the front surface, and the rear surface. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal separated from at least one of the first conductive terminals, wherein at least one of the first conductive terminals has an electrical connection to the stacked type At least one of the positive electrode portions of the capacitor and covered in the first embedded portion of the package body and a first exposed portion connected to the first embedded portion, and the first exposed portion is barely disposed Extending outside the package and along the first side surface of the package and the bottom surface, wherein at least one of the second conductive terminals has at least one electrically connected to the stacked capacitor a second embedded portion of the negative electrode portion and covered in the package body, a second side exposed portion connected to the second embedded portion, and a second front portion connected to the second embedded portion a bare portion, and a second rear exposed portion connected to the second embedded portion, the second side exposed portion is barely disposed outside the package and along the second side surface of the package body Extending with the bottom surface, the second front exposed portion is bare Disposed in the package and in vitro along the front surface of the package body and The bottom surface extends and the second rear exposed portion is exposed exposed outside the package and extends along the back surface of the package and the bottom surface.

A method for fabricating a stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins according to another embodiment of the present invention includes the following steps: first, electrically connecting a plurality of stacked capacitors to at least one first conductive Between the terminal and the at least one second conductive terminal, wherein each of the stacked capacitors has at least one positive electrode portion and at least one negative electrode portion, at least one of the first conductive terminals having an electrical connection to the stacked capacitor a first embedded portion of the at least one positive electrode portion and a first exposed portion connected to the first embedded portion, at least one of the second conductive terminals having at least one electrically connected to the stacked capacitor a second embedded portion of the negative electrode portion, a second side exposed portion connected to the second embedded portion, a second front exposed portion connected to the second embedded portion, and a connection a second rear exposed portion of the second embedded portion; then, a package is formed to cover the capacitor unit, the first embedded portion of the at least one first conductive terminal, and at least one of the first Two conductive terminals The second embedded portion, wherein the package body has a first side surface, a second side surface corresponding to the first side surface, and a first side surface and the first side surface a front surface between the two side surfaces, a rear surface connected between the first side surface and the second side surface and corresponding to the front surface, and a first side surface a bottom surface between the second side surface, the front surface, and the rear surface, and the first exposed portion, the second side exposed portion, the second front exposed portion, and the first portion The exposed portions are exposed outside the package; finally, the first exposed portion, the second exposed portion, the second front exposed portion, and the second rear exposed portion are bent a portion, wherein the first exposed portion extends along the first side surface of the package body and the bottom surface, and the second side exposed portion is along the second side surface of the package body The bottom surface extends, the second front exposed portion extends along the front surface and the bottom surface of the package body, and the second rear exposed portion is along the rear surface of the package body Extending with the bottom surface.

The present invention may be provided in a stacked solid-state electrolytic capacitor package structure and a manufacturing method thereof, which are permeable to the first exposed portion along the first side surface of the package. Extending from the bottom surface, the second side exposed portion extends along the second side surface of the package body and the bottom surface, the second front exposed portion being along the package body a front surface extending from the bottom surface, and the second rear exposed portion extending along the rear surface of the package body and the bottom surface" to enable the stacked solid electrolytic capacitor package structure of the present invention The manufacturing method thereof can simultaneously provide a plurality of negative electrode lead legs, thereby effectively reducing the Equivalent Series Inductance (ESL) of the present invention, especially in a high frequency region.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[First Embodiment]

Referring to FIG. 1 to FIG. 5 , a first embodiment of the present invention provides a stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins, including: a capacitor unit 1 , a package unit 2 , and a conductive unit 3 . .

First, as shown in FIG. 1, the capacitor unit 1 provides a plurality of stacked capacitors. The device 10 (only one of the stacked capacitors 10 is shown in FIG. 1) has at least one positive electrode portion P and at least one negative electrode portion N. For example, each of the stacked capacitors 10 includes a valve metal foil 100, an oxide layer 101 completely covering the valve metal foil 100, a conductive polymer layer 102 covering a portion of the oxide layer 101, and a complete package. The carbon glue layer 103 covering the conductive polymer layer 102 and the silver glue layer 104 completely covering the carbon glue layer 103. Further, each of the stacked capacitors 10 includes a surrounding insulating layer 105 disposed on the outer surface of the oxide layer 101 and surrounding the oxide layer 101, and the length of the conductive polymer layer 102 of the stacked capacitor 10, the carbon paste layer 103 The length and length of the silver paste layer 104 are limited by the surrounding insulating layer 105. Further, the outer surface of the oxide layer 101 has a surrounding area 1010, and the surrounding insulating layer 105 of the stacked capacitor 10 is disposed around the surrounding area 1010 of the oxide layer 101 while contacting the conductive polymer layer 102. The end 1020, the end 1030 of the carbon glue layer 103, and the end 1040 of the silver glue layer 104. However, the stacked capacitor 10 used in the present invention is not limited to the example exemplified in the first embodiment described above.

2, FIG. 2 is a top view of the first conductive terminal and the second conductive terminal before being bent, and FIG. 3A is before the first conductive terminal and the second conductive terminal are bent. FIG. 3B is a side view showing the first conductive terminal and the second conductive terminal bent, and FIG. 4A is the other side before the first conductive terminal and the second conductive terminal are bent. 4B is a schematic side view of the first conductive terminal and the second conductive terminal after bending, and FIG. 5 is a bottom view of the first conductive terminal and the second conductive terminal after being bent.

As can be seen from the above figures, first, the capacitor unit 1 includes a plurality of sequential Stacked capacitors 10 stacked and electrically connected to each other, wherein two negative electrode portions N of each two adjacent stacked capacitors 10 are permeable to the conductive paste 11 to be stacked on each other, and each two adjacent stacked types The two positive pole portions P of the capacitor 10 are permeable to the solder layer 12 to be stacked on each other (as shown in Figs. 3A and 3B). Furthermore, the package unit 2 includes a package body 20 covering the capacitor unit 1. The package body 20 has a first side surface 201, a second side surface 202 corresponding to the first side surface 201, and a connection a front surface 203 between the first side surface 201 and the second side surface 202, a rear surface 204 connected between the first side surface 201 and the second side surface 202 and corresponding to the front surface 203, and a connection A bottom surface 205 between the first side surface 201, the second side surface 202, the front surface 203, and the back surface 204.

In addition, the conductive unit 3 includes at least one first conductive terminal 31 and at least one second conductive terminal 32 separated from the first conductive terminal 31 from each other. The first conductive terminal 31 has a first embedded portion 310 electrically connected to the positive electrode portion P of the stacked capacitor 10 and covered in the package 20 and a first exposed portion connected to the first embedded portion 310. 311 , and the first exposed portion 311 is exposed outside the package body 20 and extends along the first side surface 201 and the bottom surface 205 of the package body 20 . The second conductive terminal 32 has a second buried portion 320 electrically connected to the negative portion N of the stacked capacitor 10 and covered in the package 20, and a second side connected to the second embedded portion 320. a second front exposed portion 322 connected to the second embedded portion 320 and a second rear exposed portion 323 connected to the second embedded portion 320, wherein the second side exposed portion 321 is barely disposed in the package Outside the body 20 and extending along the second side surface 202 and the bottom surface 205 of the package body 20, the second front exposed portion 322 is barely disposed outside the package body 20 and along the front surface of the package body 20. The bottom surface 205 extends 203 and the second rear exposed portion 323 is exposed outside the package body 20 and extends along the back surface 204 and the bottom surface 205 of the package body 20.

For example, as shown in FIG. 3B, the first exposed portion 311 has a first extension 3110 and a slave extending downward from the first embedded portion 310 and extending along the first side surface 201 of the package 20. The first extension 3110 is bent inwardly and along the bottom surface 205 of the package 20, and the second side exposed portion 321 has a downward bend from the second embedded portion 320 and along A second side extension 3210 of the second side surface 202 of the package 20 extends and a second side weld segment 3211 that is bent inwardly from the second side extension 3210 and extends along the bottom surface 205 of the package 20. As shown in FIG. 4B, the second front exposed portion 322 has a second front extension 3220 that is bent downward from the second embedded portion 320 and extends along the second front surface 203 of the package 20, and a second from the second The front extension 3220 is bent inwardly and along the bottom front surface 205 of the package 20, and the second rear exposed portion 323 has a downward bend from the second embedded portion 320 and along A second rear extension 3230 of the second rear surface 204 of the package 20 extends and a second rear weld section 3231 extending inwardly from the second rear extension 3230 and extending along the bottom surface 205 of the package 20. In addition, as shown in FIG. 5, the second front welding section 3221 and the second rear welding section 3231 are disposed between the first welding section 3111 and the second side welding section 3211, and the second front welding section 3221 and the second rear welding section 321. The segments 3231 are all remote from the first weld segment 3111 and adjacent to the second side weld segment 3211. Since the present invention provides the second side welding section 3211, the second front welding section 3221, and the second rear welding section 3231 as the negative electrode pads, the anode pad area of the present invention can be effectively improved.

Further, the first embodiment of the present invention provides a plurality of The manufacturing method of the stacked solid-state electrolytic capacitor package structure of the negative lead pin comprises the following steps: First, the plurality of stacked capacitors 10 are electrically connected to the at least one first conductive terminal 31 and shown in FIG. 1 and FIG. The at least one second conductive terminal 32 has a positive electrode portion P and at least one negative electrode portion N. The first conductive terminal 31 has a positive electrode portion P electrically connected to the stacked capacitor 10. a first embedded portion 310 and a first exposed portion 311 connected to the first embedded portion 310. The second conductive terminal 32 has a second embedded portion 320 electrically connected to the negative portion N of the stacked capacitor 10. a second side exposed portion 321 connected to the second embedded portion 320, a second front exposed portion 322 connected to the second embedded portion 320, and a second rear exposed portion connected to the second embedded portion 320 323 (S100).

Next, as shown in FIG. 2, FIG. 3A and FIG. 4A, a package body 20 is formed to cover the capacitor unit 1, the first embedded portion 310 of the first conductive terminal 31, and the second portion by compression molding. a second embedded portion 320 of the conductive terminal 32, wherein the package body 20 has a first side surface 201, a second side surface 202 corresponding to the first side surface 201, and a first side surface 201 and a first side surface 201 a front surface 203 between the two side surfaces 202, a rear surface 204 connected between the first side surface 201 and the second side surface 202 and corresponding to the front surface 203, and a first side surface 201, a bottom surface 205 between the second side surface 202, the front surface 203, and the rear surface 204, and the first exposed portion 311, the second side exposed portion 321, the second front exposed portion 322, and the second rear exposed portion 323 are barely exposed It is disposed outside the package 20 (S102).

Finally, as shown in FIG. 3B, FIG. 4B and FIG. 5, the first exposed portion 311, the second side exposed portion 321, the second front exposed portion 322, and the second rear bare portion are bent. The exposed portion 323, wherein the first exposed portion 311 extends along the first side surface 201 and the bottom surface 205 of the package body 20, and the second side exposed portion 321 extends along the second side surface 202 and the bottom surface 205 of the package body 20, The second front exposed portion 322 extends along the front surface 203 and the bottom surface 205 of the package 20, and the second rear exposed portion 323 extends along the rear surface 204 and the bottom surface 205 of the package 20 (S104).

[Second embodiment]

Referring to FIG. 7 , a second embodiment of the present invention provides a stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins, including: a capacitor unit 1 , a package unit 2 , and a conductive unit 3 . 7 and FIG. 3B, the greatest difference between the second embodiment and the first embodiment is that, in the second embodiment, a part of the stacked capacitors 10A of the plurality of stacked capacitors 10 are sequentially stacked and mutually connected. The other part of the stacked capacitors 10B is sequentially stacked and electrically connected to each other under the second embedded portion 320. For example, two negative electrode portions N of every two adjacent stacked capacitors (10A or 10B) are permeable to the conductive paste 11 to be stacked on each other, and each two adjacent stacked capacitors (10A or 10B) The two positive electrode portions P are permeable to the solder layer 12 to be stacked on each other.

[Possible effects of the examples]

The stacked solid-state electrolytic capacitor package structure and the manufacturing method thereof are provided by the embodiment of the present invention, wherein the first exposed portion extends along the first side surface of the package body and the bottom surface The second side exposed portion extends along the second side surface of the package body and the bottom surface, and the second front exposed portion extends along the front surface and the bottom surface of the package body And the design of the second rear exposed portion extending along the rear surface of the package body and the bottom surface, so that the stacked solid electrolytic capacitor package structure of the present invention and the manufacturing method thereof can simultaneously provide more The negative electrode leads the foot, thereby effectively reducing the Equivalent Series Inductance (ESL) of the present invention, especially in the high frequency region. The following table shows that there are only 2 exposed welded segments (2 PIN structure) and the present invention has 4 exposed welded segments (4 PIN structure including first welding segment 3111, second side welding segment 3211, second front welding) Comparison of ESL (nH) values measured at different frequencies (KHz) for segment 3221 and second post-welding segment 3231:

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

1‧‧‧Capacitor unit

10, 10A, 10B‧‧‧ stacked capacitors

100‧‧‧ valve metal foil

101‧‧‧Oxide layer

1010‧‧‧ Around the area

102‧‧‧ Conductive polymer layer

End of 1020‧‧

103‧‧‧carbon layer

End of 1030‧‧

104‧‧‧Silver layer

End of 1040‧‧

105‧‧‧round insulation

11‧‧‧Conductive adhesive

12‧‧‧welding layer

P‧‧‧ positive part

N‧‧‧Negative section

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side surface

202‧‧‧Second side surface

203‧‧‧ front surface

204‧‧‧Back surface

205‧‧‧ bottom surface

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

311‧‧‧First exposed department

3110‧‧‧First extension

3111‧‧‧First welding section

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧ second side exposed part

3210‧‧‧Second extension

3211‧‧‧Second side welding section

322‧‧‧Second former exposed department

3220‧‧‧Second front extension

3221‧‧‧Second front welding section

323‧‧‧Second post exposed department

3230‧‧‧second extension

3231‧‧‧Second post welding section

1 is a schematic cross-sectional view showing a capacitor unit of a first embodiment of the present invention.

2 is a first conductive terminal and a second conductive end of the first embodiment of the present invention The top view of the child before bending.

3A is a side elevational view of the first conductive terminal and the second conductive terminal before being bent according to the first embodiment of the present invention.

FIG. 3B is a side elevational view showing the first conductive terminal and the second conductive terminal bent according to the first embodiment of the present invention. FIG.

4A is another side view of the first conductive terminal and the second conductive terminal before being bent according to the first embodiment of the present invention.

FIG. 4B is another schematic side view showing the first conductive terminal and the second conductive terminal being bent according to the first embodiment of the present invention. FIG.

FIG. 5 is a bottom plan view showing the first conductive terminal and the second conductive terminal of the first embodiment of the present invention being bent.

6 is a flow chart of a method of fabricating a stacked solid electrolytic capacitor package structure according to a first embodiment of the present invention.

FIG. 7 is a side elevational view showing the first conductive terminal and the second conductive terminal of the second embodiment of the present invention being bent.

1‧‧‧Capacitor unit

10‧‧‧Stacked capacitors

P‧‧‧ positive part

N‧‧‧Negative section

2‧‧‧Package unit

20‧‧‧Package

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

311‧‧‧First exposed department

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧ second side exposed part

322‧‧‧Second former exposed department

323‧‧‧Second post exposed department

Claims (9)

A stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins, comprising: a capacitor unit comprising a plurality of stacked capacitors sequentially stacked and electrically connected to each other, wherein each of the stacked capacitors has at least a positive electrode portion and at least one negative electrode portion; a package unit including a package covering the capacitor unit, wherein the package body has a first side surface and a first side surface corresponding to the first side surface a second side surface, a front surface connected between the first side surface and the second side surface, a connection between the first side surface and the second side surface, and the front side a rear surface corresponding to the surfaces, and a bottom surface connected between the first side surface, the second side surface, the front surface, and the rear surface; and a conductive unit including at least one a first conductive terminal and at least one second conductive terminal separated from at least one of the first conductive terminals, wherein at least one of the first conductive terminals has at least one electrically connected to the stacked capacitor The positive electrode portion is covered in the first embedded portion of the package body and a first exposed portion connected to the first embedded portion, and the first exposed portion is exposedly disposed in the package And extending along the first side surface of the package body and the bottom surface, wherein at least one of the second conductive terminals has an electrical connection to at least one of the negative electrode portions of the stacked capacitor and a second embedded portion enclosed in the package body, a second side exposed portion connected to the second embedded portion, a second front exposed portion connected to the second embedded portion, and a second rear bareness connected to the second embedded portion The second side exposed portion is exposed outside the package and extends along the second side surface of the package body and the bottom surface, and the second front exposed portion is barely disposed at the Outside the package and extending along the front surface of the package and the bottom surface, and the second rear exposed portion is exposed exposed outside the package and along the back surface of the package And the bottom surface extending; wherein each of the stacked capacitors comprises a valve metal foil, an oxide layer completely covering the valve metal foil, and a conductive polymer layer covering a portion of the oxide layer a carbon glue layer completely covering the conductive polymer layer, and a silver glue layer completely covering the carbon glue layer, wherein each of the stacked type capacitors comprises an outer surface disposed on the oxide layer a surrounding insulating layer surrounding the oxide layer, and a length of the conductive polymer layer of the stacked capacitor, a length of the carbon adhesive layer, and a length of the silver paste layer are insulated by the surrounding The layer is limited. The stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 1, wherein the first exposed portion has a downward bent portion from the first embedded portion and along the same a first extension extending from the first side surface of the package and a first weld segment bent inwardly from the first extension and extending along the bottom surface of the package, The second side exposed portion has a second side extension bent downward from the second embedded portion and extending along the second side surface of the package body and a second side extension portion extending from the second side a second side welded portion bent inwardly and extending along the bottom surface of the package, the second front exposed portion having a downward bend from the second embedded portion and along the a second front extension of the second front surface of the package and a a second front weld section that is bent inwardly and extends along the bottom surface of the package body, and the second rear exposed portion has a downward bend from the second inner buried portion And a second rear extension extending along the second rear surface of the package and a first bent from the second rear extension and extending along the bottom surface of the package After the second welding section. The stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 2, wherein the second front welding section and the second rear welding section are disposed in the first welding section Between the second side weld segments, and the second front weld segment and the second rear weld segment are both remote from the first weld segment and adjacent to the second side weld segment. The stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 1, wherein two of the negative electrode portions of each two adjacent stacked capacitors are passed through a conductive paste to overlap each other Stacked together, and two of the positive electrode portions of each two adjacent stacked capacitors are passed through a solder layer to be stacked on each other. A stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 1, wherein said outer surface of said oxide layer has a surrounding area, and said stacked capacitor A surrounding insulating layer is disposed around the surrounding area of the oxide layer and simultaneously contacts an end of the conductive polymer layer, an end of the carbon glue layer, and an end of the silver paste layer. A manufacturing method of a stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins, comprising the steps of: electrically connecting a plurality of stacked capacitors between at least one first conductive terminal and at least one second conductive terminal; Each of the stacked types of electricity The container has at least one positive electrode portion and at least one negative electrode portion, at least one of the first conductive terminals has a first embedded portion electrically connected to at least one of the positive electrode portions of the stacked capacitor, and a first embedded portion The first exposed portion of the first embedded portion, at least one of the second conductive terminals has a second embedded portion electrically connected to at least one of the negative portion of the stacked capacitor, and is connected to the first portion a second side exposed portion of the second embedded portion, a second front exposed portion connected to the second embedded portion, and a second rear exposed portion connected to the second embedded portion; forming a package The second embedded portion of the capacitor unit, the first embedded portion of the at least one first conductive terminal, and the at least one second conductive terminal, wherein the package has a first a side surface, a second side surface corresponding to the first side surface, a front surface connected between the first side surface and the second side surface, and a first surface a side surface and the second side surface and corresponding to the front surface a surface, and a bottom surface connected between the first side surface, the second side surface, the front surface, and the rear surface, and the first exposed portion and the second side exposed portion The second front exposed portion and the second rear exposed portion are all exposed outside the package; and the first exposed portion, the second side exposed portion, and the second front exposed portion are bent And the second rear exposed portion, wherein the first exposed portion extends along the first side surface of the package body and the bottom surface, and the second side exposed portion is along the package body The second side surface extends from the bottom surface, the second front exposed portion extends along the front surface and the bottom surface of the package body, and the second rear exposed portion is along The rear surface of the package extends to the bottom surface Each of the stacked capacitors includes a valve metal foil, an oxide layer completely covering the valve metal foil, a conductive polymer layer covering a portion of the oxide layer, and a complete coating. a carbon glue layer of the conductive polymer layer, and a silver glue layer completely covering the carbon glue layer, wherein each of the stacked type capacitors comprises an outer surface disposed on the oxide layer and surrounding the oxidation a surrounding insulating layer of the layer, and a length of the conductive polymer layer of the stacked capacitor, a length of the carbon adhesive layer, and a length of the silver paste layer are limited by the surrounding insulating layer. The manufacturing method of a stacked solid-state electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 6, wherein the first exposed portion has a downward bent portion from the first embedded portion a first extension extending along the first side surface of the package and a first weld segment bent inwardly from the first extension and extending along the bottom surface of the package The second side exposed portion has a second side extension bent downward from the second embedded portion and extending along the second side surface of the package body and a second from the second side a second side welded portion that is bent inwardly and extends along the bottom surface of the package, the second front exposed portion having a downward bent portion along the second embedded portion a second front extension extending from the second front surface of the package body and a second front portion bent inwardly from the second front extension portion and extending along the bottom surface of the package body a welded section, and the second rear exposed portion has a downward bend from the second embedded portion and along the package a second rear extension extending from the second rear surface and a first portion extending inwardly from the second rear extension and extending along the bottom surface of the package After the second welding section. The manufacturing method of the stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 7, wherein the second front welding section and the second rear welding section are disposed in the first Between the welded portion and the second side welded portion, and the second front welded portion and the second rear welded portion are both away from the first welded portion and adjacent to the second side welded portion. The manufacturing method of a stacked solid electrolytic capacitor package structure having a plurality of negative electrode lead pins according to claim 6, wherein two of the negative electrode portions of each two adjacent stacked capacitors pass through the conductive adhesive Stacked on each other, and two of the positive electrode portions of each two adjacent stacked capacitors are stacked on each other through a solder layer, wherein the outer surface of the oxide layer has a surrounding a region, and the surrounding insulating layer of the stacked capacitor is disposed around the surrounding region of the oxide layer while contacting an end of the conductive polymer layer, an end of the carbon adhesive layer, and The end of the silver layer is described.