CN103426643A - Stack type solid electrolytic capacitor packaging structure with multiple negative electrode lead-out pins and manufacturing method thereof - Google Patents
Stack type solid electrolytic capacitor packaging structure with multiple negative electrode lead-out pins and manufacturing method thereof Download PDFInfo
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- CN103426643A CN103426643A CN2013102998906A CN201310299890A CN103426643A CN 103426643 A CN103426643 A CN 103426643A CN 2013102998906 A CN2013102998906 A CN 2013102998906A CN 201310299890 A CN201310299890 A CN 201310299890A CN 103426643 A CN103426643 A CN 103426643A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 114
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 78
- 239000007787 solid Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000003466 welding Methods 0.000 claims description 46
- 210000002683 foot Anatomy 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
A stack type solid electrolytic capacitor package structure having a plurality of negative electrode lead-out pins, comprising: a capacitor unit, a package unit and a conductive unit. The capacitor unit comprises a plurality of stack-type capacitors which are sequentially stacked and electrically connected with each other, and each stack-type capacitor is provided with a positive electrode part and a negative electrode part. The packaging unit comprises a packaging body which covers the capacitor unit. The conductive unit comprises a first conductive terminal and a second conductive terminal. The first conductive terminal is provided with a first embedded part which is electrically connected with the positive electrode part of the stack type capacitor and is wrapped in the packaging body and a first exposed part which is connected with the first embedded part. The second conductive terminal has a second embedded portion electrically connected to the negative electrode portion of the stacked capacitor and wrapped in the package, a second side exposed portion, a second front exposed portion and a second rear exposed portion.
Description
Technical field
Present invention is directed to a kind of stacked-type solid electrolytic capacitor encapsulating structure and preparation method thereof, espespecially a kind of stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots and preparation method thereof.
Background technology
Capacitor is used in consumer electrical home appliances, computer motherboard and periphery thereof, power supply unit, communication product, and the basic module of automobile etc. widely, and its main effect comprises: filtering, bypass, rectification, coupling, decoupling, phase inversion etc.It is one of indispensable assembly in electronic product.Capacitor, according to different materials and purposes, has different kenels.Comprise aluminium matter electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc.
In look-ahead technique, solid electrolytic capacitor has the advantages such as small size, high capacitance, frequency characteristic be superior, and the decoupling zero cooperation that can be used in the power circuit of central processing unit is used.Generally speaking, can utilize the storehouse of a plurality of capacitor cells, and the solid electrolytic capacitor of formation high-capacitance, known stack-type solid electrolytic capacitor comprises a plurality of capacitor cells and lead frame, wherein each capacitor cell comprises anode portion, negative pole part and insulation division, and this insulation division is electrically insulated anode portion and negative pole part each other.Particularly, the negative pole part of capacitor cell is storehouse each other, and by between adjacent capacitor cell, conductor layer being set, so that be electrically connected to each other between a plurality of capacitor cell.Yet known solid electrolytic capacitor is merely able to provide 1 only to have 1 anodal leading foot that exposes welding section and 1 and only have 1 negative pole leading foot that exposes welding section.
Summary of the invention
The embodiment of the present invention is to provide a kind of stacked-type solid electrolytic capacitor encapsulating structure and preparation method thereof, and it can provide a plurality of negative pole leading foots simultaneously.
The present invention's a kind of stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots that wherein an embodiment provides, it comprises: a capacitor cell, an encapsulation unit and a conductive unit.Described capacitor cell comprises a plurality of sequentially storehouses and the stacked-type capacitor be electrically connected to each other, and wherein each described stacked-type capacitor has at least one anodal section and at least one negative pole section.Described encapsulation unit comprises the packaging body of the described capacitor cell of a coating, and wherein said packaging body has one first side surface, one and the second side surface, of corresponding to each other of described the first side surface is connected in that front surface, between described the first side surface and described the second side surface is connected between described the first side surface and described the second side surface and and the rear surface that corresponds to each other of described front surface, an and basal surface be connected between described the first side surface, described the second side surface, described front surface and described rear surface.Described conductive unit comprises at least one the first conducting terminal and at least one and at least one described the first conducting terminal the second conducting terminal separated from one another, wherein at least one described the first conducting terminal has one and is electrically connected at least one described anodal section of described stacked-type capacitor and is covered by first in described packaging body and bury the first exposed section that section and is connected in described first section of burying, and it is outer and along described first side surface and the extension of described basal surface of described packaging body that described first exposed open ground is arranged on described packaging body, wherein at least one described the second conducting terminal has one and is electrically connected at least one described negative pole section of described stacked-type capacitor and is covered by second in described packaging body and bury section, one is connected in described second the second exposed section of side of the section of burying, one is connected in described second the second front exposed section of the section of burying, and second a rear exposed section that is connected in described second section of burying, it is outer and along described second side surface and the extension of described basal surface of described packaging body that exposed open ground of described the second side is arranged on described packaging body, it is outer and along the described front surface and the extension of described basal surface of described packaging body that the described second front exposed open ground is arranged on described packaging body, and it is outer and along the described rear surface and the extension of described basal surface of described packaging body that the described second rear exposed open ground is arranged on described packaging body.
A kind of manufacture method with stacked-type solid electrolytic capacitor encapsulating structure of a plurality of negative pole leading foots that the other embodiment of the present invention provides, at first it comprise the following steps:, a plurality of stacked-type capacitors electrically are connected between at least one the first conducting terminal and at least one the second conducting terminal, wherein each described stacked-type capacitor has at least one anodal section and at least one negative pole section, at least one described the first conducting terminal have one be electrically connected at described stacked-type capacitor at least one described anodal section first in bury the first exposed section that section and is connected in described first section of burying, at least one described the second conducting terminal have one be electrically connected at described stacked-type capacitor at least one described negative pole section second in bury section, one is connected in described second the second exposed section of side of the section of burying, one is connected in described second the second front exposed section of the section of burying, and second a rear exposed section that is connected in described second section of burying, then, form a packaging body to coat described capacitor cell, at least one described the first conducting terminal described first in bury section and at least one described the second conducting terminal described second in bury section, wherein said packaging body has one first side surface, one the second side surface corresponded to each other with described the first side surface, one is connected in the front surface between described the first side surface and described the second side surface, one rear surface that is connected between described the first side surface and described the second side surface and corresponds to each other with described front surface, reach one and be connected in described the first side surface, described the second side surface, basal surface between described front surface and described rear surface, and the described first exposed section, described the second exposed section of side, the described second front exposed and the described second rear exposed section all open ground is arranged on outside described packaging body, finally, bend the described first exposed section, described the second exposed section of side, the described second front exposed and the described second rear exposed section, the wherein said first exposed section extends along described the first side surface and the described basal surface of described packaging body, described the second exposed section of side extends along described the second side surface and the described basal surface of described packaging body, the described second front exposed section extends along described front surface and the described basal surface of described packaging body, and the described second rear exposed section is along described rear surface and the extension of described basal surface of described packaging body.
Beneficial effect of the present invention can be, stacked-type solid electrolytic capacitor encapsulating structure that the embodiment of the present invention provides and preparation method thereof, it can see through, and " the described first exposed section extends along described the first side surface and the described basal surface of described packaging body, described the second exposed section of side extends along described the second side surface and the described basal surface of described packaging body, the described second front exposed section extends along described front surface and the described basal surface of described packaging body, and the described second rear exposed section extends along the described rear surface of described packaging body and described basal surface " design, so that stacked-type solid electrolytic capacitor encapsulating structure of the present invention and preparation method thereof can provide a plurality of negative pole leading foots simultaneously, and then effectively promote equivalent series inductance of the present invention (Equivalent Series Inductance, ESL), especially at high-frequency region.
For enabling further to understand the present invention's feature and technology contents, refer to the following detailed description about the present invention and accompanying drawing, yet appended graphic only provide with reference to and explanation use, not be used for to the present invention's limitr in addition.
The accompanying drawing explanation
Fig. 1 creates the generalized section of the capacitor cell of the first embodiment for this;
Fig. 2 for this before creating the first conducting terminal of the first embodiment and the second conducting terminal and bending on look schematic diagram;
A wherein schematic side view before the first conducting terminal that Fig. 3 A is first embodiment of the invention and the second conducting terminal bend;
A wherein schematic side view after the first conducting terminal that Fig. 3 B is first embodiment of the invention and the second conducting terminal are bent;
An other schematic side view before the first conducting terminal that Fig. 4 A is first embodiment of the invention and the second conducting terminal bend;
An other schematic side view after the first conducting terminal that Fig. 4 B is first embodiment of the invention and the second conducting terminal are bent;
Fig. 5 looks schematic diagram in the end after creating the first conducting terminal of the first embodiment and the second conducting terminal and being bent for this;
Fig. 6 creates the flow chart of manufacture method of the stack-type solid electrolytic capacitor encapsulating structure of the first embodiment for this;
Fig. 7 is wherein schematic side view after creating the first conducting terminal of the second embodiment and the second conducting terminal and being bent for this.
[primary clustering symbol description]
Valve metal paillon foil 100
Around zone 1010
Elargol layer 104
Around shape insulating barrier 105
Conducting resinl 11
The P of positive pole section
The N of negative pole section
The first side surface 201
The second side surface 202
Bury section 310 in first
First exposed 311
The first extension 3110
The first welding section 3111
The second conducting terminal 32
Bury section 320 in second
Exposed 321 of the second side
The second side extension 3210
The second side welding section 3211
Second first exposed 322
The second front extension 3220
The second front welding section 3221
Second latter exposed 323
The second rear extension 3230
The second rear welding section 3231
Embodiment
(the first embodiment)
Refer to shown in Fig. 1 to Fig. 5, this is created the first embodiment a kind of stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots is provided, and it comprises: a capacitor cell 1, an encapsulation unit 2 and a conductive unit 3.
At first, as shown in Figure 1, capacitor cell 1 provides a plurality of stacked-type capacitor 10(Fig. 1 only to show wherein 1 stacked-type capacitor 10), it has at least one anodal P of section and at least one negative pole N of section.For instance, each stacked-type capacitor 10 comprise electroconductive polymer layer 102 that a valve metal paillon foil 100, coats the oxide layer 101 of valve metal paillon foil 100, fully and coat the part of oxide layer 101, a complete coated with conductive macromolecule layer 102 carbon paste layer 103, reach the elargol layer 104 of a complete carbon coated glue-line 103.In addition, each stacked-type capacitor 10 comprise one be arranged on the outer surface of oxide layer 101 and around oxide layer 101 around shape insulating barrier 105, and the length of the electroconductive polymer layer 102 of stacked-type capacitor 10, the length of carbon paste layer 103 and the length of elargol layer 104 are limited around shape insulating barrier 105.Further, have one on the outer surface of oxide layer 101 around zone 1010, and stacked-type capacitor 10 around shape insulating barrier 105 around ground, be arranged on oxide layer 101 on zone 1010 and contact the end 1020 of electroconductive polymer layer 102, the end 1030 of carbon paste layer 103 and the end 1040 of elargol layer 104 simultaneously.Yet, stacked-type capacitor 10 used in the present invention not with above-mentioned the first embodiment for example be limited.
Moreover, coordinate shown in Fig. 2 to Fig. 5, wherein Fig. 2 be the first conducting terminal and the second conducting terminal before bending on look schematic diagram, Fig. 3 A is the wherein schematic side view before the first conducting terminal and the second conducting terminal bend, Fig. 3 B is the wherein schematic side view after the first conducting terminal and the second conducting terminal are bent, Fig. 4 A is the other schematic side view before the first conducting terminal and the second conducting terminal bend, Fig. 4 B is the other schematic side view after the first conducting terminal and the second conducting terminal are bent, Fig. 5 looks schematic diagram in the end after the first conducting terminal and the second conducting terminal are bent.
Coordinate above-mentioned graphic known, at first, capacitor cell 1 comprises a plurality of sequentially storehouses and the stacked-type capacitor 10 be electrically connected to each other, wherein two N of negative pole section of every two adjacent stacked-type capacitors 10 can see through conducting resinl 11 with the stack up that mutually changes, and two anodal P of section of every two adjacent stacked-type capacitors 10 can see through weld layer 12 with the stack up (as shown in Fig. 3 A and Fig. 3 B) that mutually changes.Moreover, encapsulation unit 2 comprises the packaging body 20 of a coating capacitor cell 1, and wherein packaging body 20 has that the second side surface 202, that one first side surface 201, the one and first side surface 201 correspond to each other is connected in that front surface 203, between the first side surface 201 and the second side surface 202 is connected between the first side surface 201 and the second side surface 202 and and the rear surface 204 that corresponds to each other of front surface 203, an and basal surface 205 be connected between the first side surface 201, the second side surface 202, front surface 203 and rear surface 204.
In addition, conductive unit 3 comprises at least one the first conducting terminal 31 and the second conducting terminal 32 at least one and that the first conducting terminal 31 is separated from one another.The first conducting terminal 31 has one and is electrically connected at the anodal P of section of stacked-type capacitor 10 and is covered by first in packaging body 20 and bury section 310 and and be connected in first first exposed 311 of the section of burying 310, and first exposed 311 open ground to be arranged on packaging body 20 outer and extend with basal surface 205 along the first side surface 201 of packaging body 20.The second conducting terminal 32 has one and is electrically connected at the N of negative pole section of stacked-type capacitor 10 and is covered by second in packaging body 20 and bury section 320, one is connected in second exposed 321 of second side of the section of burying 320, one is connected in second second first exposed 322 of the section of burying 320, and one be connected in second second latter exposed 323 of the section of burying 320, it is outer and extend with basal surface 205 along the second side surface 202 of packaging body 20 that wherein exposed 321 open grounds of the second side are arranged on packaging body 20, it is outer and extend with basal surface 205 along the front surface 203 of packaging body 20 that the second front exposed 322 open grounds are arranged on packaging body 20, and the second rear exposed 323 open grounds are arranged on outside packaging body 20 and along the rear surface 204 of packaging body 20 and extend with basal surface 205.
For instance, as shown in Figure 3 B, the first welding section 3111 that there is in one from first section of burying 310 bending downwards for first exposed 311 and bend inwards from the first extension 3110 along the first extension 3110 and that the first side surface 201 of packaging body 20 extends and extend along the basal surface 205 of packaging body 20, and the second side welding section 3211 that exposed 321 of the second side has in from second section of burying 320 bending downwards and bend inwards from the second side extension 3210 along the second side extension 3210 and that the second side surface 202 of packaging body 20 extends and extend along the basal surface 205 of packaging body 20.As shown in Figure 4 B, second front exposed 322 have one in second, bury section 320 bending downwards and along the second front surface 203 of packaging body 20, extend second extension 3220 from second, extension 3220 and the second front welding section 3221 of bending inwards and extending along the basal surface 205 of packaging body 20, and second rear exposed 323 have one in second, bury section 320 bending downwards and along the second rear surface 204 of packaging body 20, extend second extension 3230 from second, extension 3230 and the second rear welding section 3231 of bending inwards and extending along the basal surface 205 of packaging body 20.In addition, as shown in Figure 5, the second front welding section 3221 and the second rear welding section 3231 are arranged between the first welding section 3111 and the second side welding section 3211, and the second front welding section 3221 and the second rear welding section 3231 are all away from the first welding section 3111 and contiguous the second side welding section 3211.Negative pole pad area of the present invention is used as the negative pole weld pad owing to the invention provides the rear welding section 3231 of the front welding section 3221, second of the second side welding section 3211, second, so can effectively be raised.
Further, this is created the first embodiment a kind of manufacture method with stacked-type solid electrolytic capacitor encapsulating structure of a plurality of negative pole leading foots is provided, and it comprises the following steps:
At first, coordinate shown in Fig. 1 and Fig. 2, a plurality of stacked-type capacitors 10 are electrically connected between at least one the first conducting terminal 31 and at least one the second conducting terminal 32, wherein each stacked-type capacitor 10 has at least one anodal P of section and at least one negative pole N of section, the first conducting terminal 31 have one be electrically connected at stacked-type capacitor 10 the anodal P of section first in bury section 310 and and be connected in first first exposed 311 of the section of burying 310, the second conducting terminal 32 have one be electrically connected at stacked-type capacitor 10 the N of negative pole section second in bury section 320, one is connected in second exposed 321 of second side of the section of burying 320, one is connected in second second first exposed 322 of the section of burying 320, and second a rear exposed 323(S100 who is connected in second section of burying 320).
Then, coordinate Fig. 2, shown in Fig. 3 A and Fig. 4 A, see through compression molding (compression molding), to form a packaging body 20 to coat capacitor cell 1, the first conducting terminal 31 first in bury section 310 and the second conducting terminal 32 second in bury section 320, wherein packaging body 20 has one first side surface 201, the second side surface 202 that the one and first side surface 201 corresponds to each other, one is connected in the front surface 203 between the first side surface 201 and the second side surface 202, one rear surface 204 that is connected between the first side surface 201 and the second side surface 202 and corresponds to each other with front surface 203, reach one and be connected in the first side surface 201, the second side surface 202, basal surface 205 between front surface 203 and rear surface 204, and first exposed 311, exposed 321 of the second side, second front exposed 322 and second rear exposed 323 all open ground be arranged on packaging body 20 outer (S102).
Finally, coordinate shown in Fig. 3 B, Fig. 4 B and Fig. 5, bend first exposed 311, exposed 321, second first exposed 322 and second latter exposed 323 of the second side, wherein first exposed 311 the first side surface 201 along packaging body 20 extends with basal surface 205, exposed 321 the second side surface 202 along packaging body 20 of the second side extends with basal surface 205, the second front exposed 322 front surface along packaging body 20 203 extends with basal surface 205, and (S104) extended with basal surface 205 in the second rear exposed 323 rear surface along packaging body 20 204.
(the second embodiment)
Refer to shown in Fig. 7, this is created the second embodiment a kind of stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots is provided, and it comprises: a capacitor cell 1, an encapsulation unit 2 and a conductive unit 3.From Fig. 7 and Fig. 3 B relatively, the difference of the second embodiment and the first embodiment maximum is: in a second embodiment, wherein a part of stacked-type capacitor 10A in a plurality of stacked-type capacitors 10 is storehouse and be electrically connected to each other bury the top of section 320 in second sequentially, and the storehouse and be electrically connected to each other bury the below of section 320 in second sequentially of the other a part of stacked-type capacitor 10B in a plurality of stacked-type capacitor 10.For instance, two N of negative pole section of every two adjacent stacked-type capacitors (10A or 10B) can see through conducting resinl 11 with the stack up that mutually changes, and two anodal P of section of every two adjacent stacked-type capacitors (10A or 10B) can see through weld layer 12 with the stack up that mutually changes.
(the possible effect of embodiment)
Stacked-type solid electrolytic capacitor encapsulating structure that the embodiment of the present invention provides and preparation method thereof, it can see through, and " the described first exposed section extends along described the first side surface and the described basal surface of described packaging body, described the second exposed section of side extends along described the second side surface and the described basal surface of described packaging body, the described second front exposed section extends along described front surface and the described basal surface of described packaging body, and the described second rear exposed section extends along the described rear surface of described packaging body and described basal surface " design, so that stacked-type solid electrolytic capacitor encapsulating structure of the present invention and preparation method thereof can provide a plurality of negative pole leading foots simultaneously, and then effectively promote equivalent series inductance of the present invention (Equivalent Series Inductance, ESL), especially at high-frequency region.Following table is known to be had 2 and exposes welding section (2 PIN structure) and the present invention and have 4 and expose the comparison of welding section (4 PIN structures, it comprises the first welding section 3111, the front welding section 3221 of the second side welding section 3211, second and the second rear welding section 3231) in lower ESL (nH) value measured of different frequency (KHz):
。
The foregoing is only the present invention's better possible embodiments, the scope of the claims of non-so limitation the present invention, therefore such as use specification of the present invention and graphic content institute for it equivalence techniques change, all be contained in the present invention's scope.
Claims (10)
1. the stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots, it comprises:
One capacitor cell, it comprises a plurality of sequentially storehouses and the stacked-type capacitor be electrically connected to each other, wherein each described stacked-type capacitor has at least one anodal section and at least one negative pole section;
One encapsulation unit, it comprises the packaging body of the described capacitor cell of a coating, wherein said packaging body have one first side surface, one and the second side surface, of corresponding to each other of described the first side surface is connected in that front surface, between described the first side surface and described the second side surface is connected between described the first side surface and described the second side surface and and the rear surface that corresponds to each other of described front surface, an and basal surface be connected between described the first side surface, described the second side surface, described front surface and described rear surface; And
One conductive unit, it comprises at least one the first conducting terminal and at least one and at least one described the first conducting terminal the second conducting terminal separated from one another, wherein at least one described the first conducting terminal has one and is electrically connected at least one described anodal section of described stacked-type capacitor and is covered by first in described packaging body and bury the first exposed section that section and is connected in described first section of burying, and it is outer and along described first side surface and the extension of described basal surface of described packaging body that described first exposed open ground is arranged on described packaging body, wherein at least one described the second conducting terminal has one and is electrically connected at least one described negative pole section of described stacked-type capacitor and is covered by second in described packaging body and bury section, one is connected in described second the second exposed section of side of the section of burying, one is connected in described second the second front exposed section of the section of burying, and second a rear exposed section that is connected in described second section of burying, it is outer and along described second side surface and the extension of described basal surface of described packaging body that exposed open ground of described the second side is arranged on described packaging body, it is outer and along the described front surface and the extension of described basal surface of described packaging body that the described second front exposed open ground is arranged on described packaging body, and it is outer and along the described rear surface and the extension of described basal surface of described packaging body that the described second rear exposed open ground is arranged on described packaging body.
(2) as claimed in claim 1, having a stack of a plurality of negative electrode lead pin package type solid electrolytic capacitor, wherein: wherein said first exposed portion has a downwardly bent from said first portion buried and extending along said first side of said package body, and a surface of the first extension is bent inwardly from said first extension, and extending along the bottom surface of the first package body a welding section, the exposed portion having a second side from the second buried portion bent downward and extends along the second side of the package body side surface of the second extension, and one from inwardly bent extension of the second side and extending along the bottom surface of the package body and a second side welded section, said second portion having an exposed front of said second portion to the one from buried the bend, and a second extension extending along the front of the second front surface of the package body, and a front extension from said second inwardly bent along the package body and the said bottom surface of the second extending section before welding,and said second portion having an exposed from the rear of the second buried portion bent downward, and a second extension extending along the rear of the rear surface of the package body, and a second section from the after two and a second extension is bent inwardly after the weld section extending along a bottom surface of the package body.
3. the stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots as claimed in claim 2, it is characterized in that: the wherein said second front welding section and the described second rear welding section are arranged between described the first welding section and described the second side welding section, and the described second front welding section and the described second rear welding section are all away from described the first welding section and contiguous described the second side welding section.
4. the stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots as claimed in claim 1, it is characterized in that: wherein each described stacked-type capacitor comprises a valve metal paillon foil, one coats the oxide layer of described valve metal paillon foil fully, one coats the electroconductive polymer layer of the part of described oxide layer, one coats the carbon paste layer of described electroconductive polymer layer fully, an and elargol layer that coats described carbon paste layer fully, wherein two of every two adjacent described stacked-type capacitors described negative pole sections see through conducting resinl with stack up repeatedly mutually, and two described anodal sections of every two adjacent described stacked-type capacitors see through weld layer with the stack up that mutually changes.
5. the stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots as claimed in claim 4, it is characterized in that: wherein each described stacked-type capacitor comprise one be arranged on the outer surface of described oxide layer and around described oxide layer around the shape insulating barrier, and the length of the described electroconductive polymer layer of described stacked-type capacitor, the length of described carbon paste layer and the length of described elargol layer are limited around the shape insulating barrier by described.
6. the stacked-type solid electrolytic capacitor encapsulating structure with a plurality of negative pole leading foots as claimed in claim 5, it is characterized in that: have one around zone on the described outer surface of wherein said oxide layer, and described stacked-type capacitor described be arranged on described oxide layer around the shape insulating barrier around ground described on zone and contact the end of the end of described electroconductive polymer layer, described carbon paste layer and the end of described elargol layer simultaneously.
7. the manufacture method with stacked-type solid electrolytic capacitor encapsulating structure of a plurality of negative pole leading foots, it comprises the following steps:
A plurality of stacked-type capacitors electrically are connected between at least one the first conducting terminal and at least one the second conducting terminal, wherein each described stacked-type capacitor has at least one anodal section and at least one negative pole section, at least one described the first conducting terminal have one be electrically connected at described stacked-type capacitor at least one described anodal section first in bury the first exposed section that section and is connected in described first section of burying, at least one described the second conducting terminal have one be electrically connected at described stacked-type capacitor at least one described negative pole section second in bury section, one is connected in described second the second exposed section of side of the section of burying, one is connected in described second the second front exposed section of the section of burying, and second a rear exposed section that is connected in described second section of burying,
Form a packaging body to coat described capacitor cell, at least one described the first conducting terminal described first in bury section and at least one described the second conducting terminal described second in bury section, wherein said packaging body has one first side surface, one the second side surface corresponded to each other with described the first side surface, one is connected in the front surface between described the first side surface and described the second side surface, one rear surface that is connected between described the first side surface and described the second side surface and corresponds to each other with described front surface, reach one and be connected in described the first side surface, described the second side surface, basal surface between described front surface and described rear surface, and the described first exposed section, described the second exposed section of side, the described second front exposed and the described second rear exposed section all open ground is arranged on outside described packaging body, and
Bend the described first exposed section, described the second exposed section of side, the described second front exposed and the described second rear exposed section, the wherein said first exposed section extends along described the first side surface and the described basal surface of described packaging body, described the second exposed section of side extends along described the second side surface and the described basal surface of described packaging body, the described second front exposed section extends along described front surface and the described basal surface of described packaging body, and the described second rear exposed section is along described rear surface and the extension of described basal surface of described packaging body.
8 as claimed in claim 7, a negative electrode having a plurality of pin-out type stack manufacturing method of solid electrolytic capacitor of the package structure, characterized in that: said first exposed portion has a first portion from buried bent downward and extends along the first side of the package body surface of the first extension, and an inwardly bent from the first extension and the package along the first weld section of the bottom surface extends, the second side having an exposed portion from said second buried portion bent downward, and extending along said second side of said package body side surface of the second extension and bent inwardly from a side of the second extension, and extending along the bottom surface of the second package body side welded section,the exposed portion having a second front from the second buried portion bent downward, and a second extension extending along the front of the second front surface of the package body, and a section from the bent inwardly before the second extension, and the second weld section extending along the front of the bottom surface of the package body, and the exposed portion of the second bend having a downwardly from said second buried portion fold, and a second extension extending along the said second rear surface of the package body, and a second inwardly bent from the rear and along the extension of the bottom surface of the package body a second section extending welding.
9. the manufacture method with stacked-type solid electrolytic capacitor encapsulating structure of a plurality of negative pole leading foots as claimed in claim 8, it is characterized in that: the wherein said second front welding section and the described second rear welding section are arranged between described the first welding section and described the second side welding section, and the described second front welding section and the described second rear welding section are all away from described the first welding section and contiguous described the second side welding section.
10. require the 7 described manufacture methods with stacked-type solid electrolytic capacitor encapsulating structure of a plurality of negative pole leading foots as power, it is characterized in that: wherein each described stacked-type capacitor comprises a valve metal paillon foil, one coats the oxide layer of described valve metal paillon foil fully, one coats the electroconductive polymer layer of the part of described oxide layer, one coats the carbon paste layer of described electroconductive polymer layer fully, an and elargol layer that coats described carbon paste layer fully, wherein two of every two adjacent described stacked-type capacitors described negative pole sections see through conducting resinl with stack up repeatedly mutually, and two described anodal sections of every two adjacent described stacked-type capacitors see through weld layer with the stack up that mutually changes, wherein each described stacked-type capacitor comprise one be arranged on the outer surface of described oxide layer and around described oxide layer around the shape insulating barrier, and the length of the described electroconductive polymer layer of described stacked-type capacitor, the length of the length of described carbon paste layer and described elargol layer is limited around the shape insulating barrier by described, have one around zone on the described outer surface of wherein said oxide layer, and described stacked-type capacitor described is arranged on described oxide layer around the shape insulating barrier around ground described on zone and contact the end of described electroconductive polymer layer simultaneously, the end of the end of described carbon paste layer and described elargol layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101126773A TWI478188B (en) | 2012-07-25 | 2012-07-25 | Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same |
| TW101126773 | 2012-07-25 |
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| Publication Number | Publication Date |
|---|---|
| CN103426643A true CN103426643A (en) | 2013-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102998906A Pending CN103426643A (en) | 2012-07-25 | 2013-07-17 | Stack type solid electrolytic capacitor packaging structure with multiple negative electrode lead-out pins and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN103426643A (en) |
| TW (1) | TWI478188B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104299788A (en) * | 2014-10-28 | 2015-01-21 | 钰邦电子（无锡）有限公司 | Manufacturing method of solid electrolytic capacitor packaging structure for improvement of conductive terminals |
| CN105810439A (en) * | 2015-10-27 | 2016-07-27 | 钰邦电子（无锡）有限公司 | Matrix arrangement type stack solid electrolytic capacitor packaging structure and manufacturing method thereof |
| CN105810440A (en) * | 2015-10-27 | 2016-07-27 | 钰邦电子（无锡）有限公司 | Stack type solid electrolytic capacitor packaging structure and manufacturing method thereof |
| CN106067380A (en) * | 2016-06-06 | 2016-11-02 | 钰邦电子（无锡）有限公司 | Solid electrolytic capacitor packaging structure for improving electrical performance, capacitor unit and manufacturing method thereof |
| CN107958786A (en) * | 2016-10-14 | 2018-04-24 | 钰邦电子（无锡）有限公司 | Stacked solid electrolytic capacitor encapsulating structure and preparation method thereof |
| CN110942917A (en) * | 2018-09-21 | 2020-03-31 | 钰冠科技股份有限公司 | Capacitor packaging structure, capacitor and polymer composite layer |
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| US20020015277A1 (en) * | 1999-12-10 | 2002-02-07 | Hiroshi Nitoh | Solid electrolytic multilayer capacitor |
| TWM393775U (en) * | 2010-06-18 | 2010-12-01 | Apaq Technology Co Ltd | Stacked solid electrolytic condenser |
| CN102024567A (en) * | 2010-12-07 | 2011-04-20 | 钰邦电子（无锡）有限公司 | Stack type solid electrolytic capacitor with multi-end product lead-out pin |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299788A (en) * | 2014-10-28 | 2015-01-21 | 钰邦电子（无锡）有限公司 | Manufacturing method of solid electrolytic capacitor packaging structure for improvement of conductive terminals |
| CN105810439A (en) * | 2015-10-27 | 2016-07-27 | 钰邦电子（无锡）有限公司 | Matrix arrangement type stack solid electrolytic capacitor packaging structure and manufacturing method thereof |
| CN105810440A (en) * | 2015-10-27 | 2016-07-27 | 钰邦电子（无锡）有限公司 | Stack type solid electrolytic capacitor packaging structure and manufacturing method thereof |
| CN106067380A (en) * | 2016-06-06 | 2016-11-02 | 钰邦电子（无锡）有限公司 | Solid electrolytic capacitor packaging structure for improving electrical performance, capacitor unit and manufacturing method thereof |
| CN107958786A (en) * | 2016-10-14 | 2018-04-24 | 钰邦电子（无锡）有限公司 | Stacked solid electrolytic capacitor encapsulating structure and preparation method thereof |
| CN110942917A (en) * | 2018-09-21 | 2020-03-31 | 钰冠科技股份有限公司 | Capacitor packaging structure, capacitor and polymer composite layer |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI478188B (en) | 2015-03-21 |
| TW201405608A (en) | 2014-02-01 |
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