TW201517088A - Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit - Google Patents

Abstract

A solid electrolytic capacitor package structure and method of manufacturing the same, and a conductive unit are disclosed in the instant disclosure. The solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body. Whereby, the sealing property of the instant disclosure between the conductive terminals and the package body can be increased.

Description

Solid electrolytic capacitor package structure, manufacturing method thereof, and conductive unit

The present invention relates to a solid electrolytic capacitor package structure and a manufacturing method thereof, and a conductive unit, and more particularly to a solid electrolytic capacitor package structure for improving the sealing between a contact surface of a conductive terminal and a package body, and a manufacturing method thereof And conductive units.

Capacitors have been widely used in consumer appliances, computer motherboards and their peripherals, power supplies, communication products, and automotive basic components, including: filtering, bypass, rectification, coupling, decoupling And turn equal. It is one of the indispensable components in electronic products. Capacitors have different types according to different materials and uses. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors and so on. In the prior art, the solid electrolytic capacitor has the advantages of small size, large capacitance, superior frequency characteristics, and the decoupling of the power supply circuit for the central processing unit. In general, a stack of a plurality of capacitor units can be utilized to form a high-capacity solid electrolytic capacitor. The conventional stacked solid-state electrolytic capacitor includes a plurality of capacitor units and a lead frame, wherein each capacitor unit includes an anode portion and a cathode portion. And the insulating portion, the insulating portion electrically insulates the anode portion from the cathode portion. In particular, the cathode portions of the capacitor unit are stacked on each other, and a plurality of capacitor units are electrically connected to each other by providing a conductor layer between adjacent capacitor units. However, the sealing between the conductive terminals of the conventional solid electrolytic capacitor and the contact faces of the package is not good. Therefore, how to improve the sealing between the contact faces of the conductive terminals and the package by improving the structural design has become one of the important issues to be solved by the business.

Embodiments of the present invention provide a solid electrolytic capacitor package structure, a manufacturing method thereof, and a conductive unit, which can effectively solve the problem of poor sealing between the contact faces of the conductive terminals of the conventional solid electrolytic capacitor and the package. "The problem.

A solid electrolytic capacitor package structure according to one embodiment of the present invention includes: a capacitor unit, a package unit, and a conductive unit. The capacitor unit includes a plurality of first stacked capacitors stacked in series and electrically connected to each other, wherein each of the first stacked capacitors has a first positive portion and a first negative portion. The package unit includes a package for completely covering the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal separated from the at least one first conductive terminal by a predetermined distance, wherein the plurality of the first stacked capacitors are disposed in at least one of the first At least one of the first conductive terminals on the top end of the conductive terminal and at least one of the second conductive terminals has a first positive electrode portion electrically connected to the first stacked capacitor and is covered a first embedded portion in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body, and at least one of the second conductive terminals has an electrical connection a first buried portion of the first stacked capacitor and a second embedded portion encapsulated in the package and a second exposed to the second embedded portion and exposed outside the package Exposed part. The at least one first conductive terminal includes a first core layer and a first cladding layer covering the first core layer, and the first core layer has a bare body from the first cladding layer And a first exposed upper surface and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface having a first upper coverage area covered by the package And a first upper exposed area connected to the first upper coverage area and exposed outside the package, and the first exposed lower surface has a first lower surface covered by the package a coverage area and a first lower exposed area connected to the first lower coverage area and exposed outside the package. At least one of the second conductive terminals includes a second core layer and a second cladding layer covering the second core layer, and the second core layer has a bare core from the second cladding layer And a second exposed upper surface and a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface having a second upper coverage area covered by the package And a second upper exposed area connected to the second upper coverage area and exposed outside the package, and the second exposed lower surface has a second lower coverage area covered by the package and a Connected to the second lower coverage area and exposed to a second lower exposed area outside the package.

A conductive unit according to another embodiment of the present invention includes: at least one first conductive terminal and at least one second conductive terminal separated from each other by at least one of the first conductive terminals by a predetermined distance, wherein at least one of the The first conductive terminal and the at least one second conductive terminal are both connected to a package. The at least one first conductive terminal has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body. And at least one of the second conductive terminals has a second embedded portion encapsulated in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body. The at least one first conductive terminal includes a first core layer and a first cladding layer covering the first core layer, and the first core layer has a bare body from the first cladding layer And a first exposed upper surface and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface having a first upper coverage area covered by the package And the first exposed lower surface has a first lower coverage area covered by the package. At least one of the second conductive terminals includes a second core layer and a second cladding layer covering the second core layer, and the second core layer has a bare core from the second cladding layer And a second exposed upper surface and a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface having a second upper coverage area covered by the package And said The second exposed lower surface has a second lower footprint covered by the package.

According to still another embodiment of the present invention, a method for fabricating a solid electrolytic capacitor package structure includes the steps of: providing at least one first conductive terminal and at least one second conductive terminal; sequentially singing the plurality of first stacked capacitors Stacked together and electrically connected between at least one of the first conductive terminals and at least one of the second conductive terminals, wherein a plurality of the first stacked capacitors are disposed at a top end of at least one of the first conductive terminals And a top end of the at least one of the second conductive terminals, and each of the first stacked capacitors has a first positive portion and a first negative portion; forming a package to completely cover the capacitor unit, At least one of the first conductive terminals has a first embedded portion electrically connected to the first positive portion of the first stacked capacitor and covered in the package, and a first embedded portion a first embedded portion and exposed to the first exposed portion outside the package, and at least one of the second conductive terminals has a first negative portion electrically connected to the first stacked capacitor a second embedded portion encapsulated in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; and bending the first exposed portion and the portion The second exposed portion is configured such that the first exposed portion and the second exposed portion both extend along an outer surface of the package. The at least one first conductive terminal includes a first core layer and a first cladding layer covering the first core layer, and the first core layer has a bare body from the first cladding layer And a first exposed upper surface and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface having a first upper coverage area covered by the package And a first upper exposed area connected to the first upper coverage area and exposed outside the package, and the first exposed lower surface has a first lower coverage area covered by the package and a Connected to the first lower coverage area and exposed to the first lower exposed area outside the package. At least one of the second conductive terminals includes a second core layer and a second cladding layer covering the second core layer, and the second core layer has a bare core from the second cladding layer And a second exposed upper surface and a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface a second upper coverage area covered by the package and a second upper exposed area connected to the second upper coverage area and exposed outside the package, and the second exposed lower surface has a a second lower coverage area covered by the package and a second lower exposed area connected to the second lower coverage area and exposed outside the package.

The beneficial effects of the present invention may be that the first core layer has a first exposed upper surface exposed from the first cladding layer and a first cladding layer. a first exposed lower surface that is exposed" and "the second core layer has a second exposed upper surface exposed from the second cladding layer and a bare exposed surface from the second cladding layer The second exposed lower surface is designed to enhance "between at least one of the first conductive terminals and the contact surface of the package" and "at least one of the second conductive terminals and the package" The tightness between the contact surfaces of the person.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧First stacked capacitor

P‧‧‧First positive part

N‧‧‧First negative part

100‧‧‧ valve metal foil

101‧‧‧Oxide layer

1010‧‧‧ Around the area

102‧‧‧ Conductive polymer layer

End of 1020‧‧

103‧‧‧carbon layer

End of 1030‧‧

104‧‧‧Silver layer

End of 1040‧‧

105‧‧‧round insulation

10'‧‧‧Second stacked capacitor

P’‧‧‧Second positive part

N’‧‧‧second negative part

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side surface

202‧‧‧Second side surface

203‧‧‧ bottom surface

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

311‧‧‧First exposed department

31A‧‧‧ first core layer

311A‧‧‧First exposed upper surface

3111‧‧‧First upper coverage area

3112‧‧‧First exposed area

312A‧‧‧First exposed lower surface

3121‧‧‧First coverage area

3122‧‧‧First exposed area

313A‧‧‧First through hole

3131‧‧‧First filling section

3132‧‧‧The first hollow department

31B‧‧‧First cladding

311B‧‧‧First connection layer

312B‧‧‧First welding layer

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧Second exposed department

32A‧‧‧ second core layer

321A‧‧‧Second exposed upper surface

3211‧‧‧Second upper coverage area

3212‧‧‧Second exposed area

322A‧‧‧Second exposed lower surface

3221‧‧‧Second coverage area

3222‧‧‧Second exposed area

323A‧‧‧second through hole

3231‧‧‧Second filling section

3232‧‧‧Second Hollow Department

32B‧‧‧Second coating

321B‧‧‧Second connection layer

322B‧‧‧Second welding layer

1 is a side cross-sectional view showing a capacitor unit according to first and second embodiments of the present invention.

2 is a top plan view of a conductive unit according to a first embodiment of the present invention.

3 is a top plan view showing a capacitor unit disposed on a conductive unit according to a first embodiment of the present invention.

4 is a side elevational view showing a package structure of a solid electrolytic capacitor according to a first embodiment of the present invention.

Figure 5 is an enlarged cross-sectional view showing a portion A of Figure 4.

Figure 6 is an enlarged cross-sectional view showing a portion B of Figure 4.

7 is a flow chart showing a method of fabricating a solid electrolytic capacitor package structure according to a first embodiment of the present invention.

Fig. 8 is a side elevational view showing the package structure of a solid electrolytic capacitor according to a second embodiment of the present invention.

[First Embodiment]

Referring to FIG. 1 to FIG. 6 , a first embodiment of the present invention provides a solid electrolytic capacitor package structure Z for improving the sealing performance, comprising: a capacitor unit 1 , a package unit 2 , and a conductive unit 3 .

First, as shown in FIG. 1, the capacitor unit 1 can provide a plurality of first stacked capacitors 10 (or wafer type capacitors, and currently only one of the first stacked capacitors 10 is shown in FIG. 1), wherein each of the first stacks The capacitor 10 has a first positive electrode portion P and a first negative electrode portion N. For example, each of the first stacked capacitors 10 includes a valve metal foil 100, an oxide layer 101 completely covering the valve metal foil 100, a conductive polymer layer 102 covering a portion of the oxide layer 101, and a The carbon glue layer 103 completely covering the conductive polymer layer 102 and the silver glue layer 104 completely covering the carbon glue layer 103. Further, each of the first stacked capacitors 10 includes a surrounding insulating layer 105 disposed on the outer surface of the oxide layer 101 and surrounding the oxide layer 101, and the length of the conductive polymer layer 102 of the first stacked capacitor 10, carbon Both the length of the adhesive layer 103 and the length of the silver paste layer 104 are limited by the surrounding insulating layer 105. Further, the outer surface of the oxide layer 101 has a surrounding area 1010, and the surrounding insulating layer 105 of the first stacked type capacitor 10 is disposed around the surrounding area 1010 of the oxide layer 101 while contacting the conductive polymer layer. End 1020 of 102, end 1030 of carbon glue layer 103, and end 1040 of silver glue layer 104. However, the first stacked capacitor 10 used in the present invention is not limited to the example of the first embodiment described above.

Furthermore, as shown in FIG. 2, FIG. 3 and FIG. 4, a plurality of first stacked capacitors 10 may be sequentially stacked and electrically connected to each other, wherein two of each two adjacent first stacked capacitors 10 The first negative electrode portions N are permeable to silver paste (not labeled) to be stacked on each other, and the two first positive electrode portions P of each two adjacent first stacked capacitors 10 are permeable to the solder layer (not labeled) Stacked together. In addition, the package unit 2 includes a package body 20 for completely covering the capacitor unit 1, and the package body 20 can be made of an opaque packaging material such as epoxy or silicone. In addition, the conductive unit 3 (ie, the lead frame) includes a first conductive terminal 31 and a second conductive terminal 32 separated from the first conductive terminal 31. The first conductive terminal 31 has a first positive electrode portion P electrically connected to the first stacked capacitor 10 (ie, electrically contacting the first positive electrode portion P of the first stacked capacitor 10 at the bottom end) and is The first embedded portion 310 is encapsulated in the package body 20 and the first exposed portion 311 is connected to the first embedded portion 310 and exposed outside the package body 20, and the second conductive terminal 32 has an electrical connection The first negative electrode portion N of the first stacked capacitor 10 (that is, electrically contacting the first negative electrode portion N of the first stacked capacitor 10 at the bottom end) and covered in the second embedded portion in the package body 20 320 and a second exposed portion 321 connected to the second embedded portion 320 and exposed outside the package 20 .

Furthermore, as shown in FIG. 3 and FIG. 4, the package body 20 has a first side surface 201, a second side surface 202 facing away from (or opposite to) the first side surface 201, and a first connecting surface. A bottom surface 203 between the side surface 201 and the second side surface 202. The first exposed portion 311 of the first conductive terminal 31 may extend along the first side surface 201 and the bottom surface 203 of the package body 20 to form an L-shaped folding leg, and the second conductive terminal 32 is second. The exposed portion 321 can extend along the second side surface 202 and the bottom surface 203 of the package 20 to form another L-shaped fold.

In addition, as shown in FIG. 3, FIG. 4 and FIG. 5, the first conductive terminal 31 includes a first core layer 31A and a first cladding layer 31B covering the first core layer 31A, and the first core layer 31A has A first exposed upper surface 311A exposed from the first cladding layer 31B and a first exposed lower surface 312A exposed from the first cladding layer 31B. The first exposed upper surface 311A has a first upper coverage area 3111 covered by the package body 20 and a first upper exposed area 3112 connected to the first upper coverage area 3111 and exposed outside the package body 20, and An exposed lower surface 312A has a first lower coverage area 3112 covered by the package body 20 and a first lower exposed area connected to the first lower coverage area 3121 and exposed outside the package body 20. 3122. Furthermore, the first upper exposed area 3112 of the first exposed upper surface 311A and the first lower exposed area 3122 of the first exposed lower surface 312A are both connected to the first side surface 201 of the package body 20. The first core layer 31A has a first through hole 313A penetrating through the first core layer 31A and connected between the first exposed upper surface 311A and the first exposed lower surface 312A, and the first through hole 313A has a packaged body 20 The filled first filling portion 3131 and the first hollow portion 3132 that communicate with the first filling portion 3131 and are exposed outside the package 20 are formed. Of course, except for the upper surface and the lower surface of the first core layer 31A (that is, the first exposed upper surface 311A and the first exposed lower surface 312A) may be exposed from the first cladding layer 31B, the two of the first core layer 31A The opposite side surface may also be exposed from the first cladding layer 31B.

For example, the first core layer 31A may be Cu or a Cu alloy, and the first cladding layer 31B includes a first connection layer 311B of Ni (Nickel) and a Sn (Stannum) and a first connection layer 311B. The first solder layer 312B. In addition, the present invention may employ laser engraving, etching, sand blasting or grinding, etc., so that the first core layer 31A, which may be Cu or Cu alloy, is exposed from the first cladding layer 31B, and the first core layer 31A is from the first The first upper cover region 3111 and the first lower cover region 3121 exposed by a cladding layer 31B may extend from the first through hole 313A toward the second conductive terminal 32 by a predetermined length, which is covered by the extended length. The scope is not intended to limit the invention. Since the melting point of the Cu or Cu alloy is higher than that of Sn, the sealing property between the contact faces of the first core layer 31A of the first conductive terminal 31 and the package 20 can be effectively improved. It is worth mentioning that a part of the first cladding layer 31B is removed by laser engraving, etching, sand blasting or grinding, and the rough surface generated by the first cladding layer 31B can also effectively improve both the first conductive terminal 31 and the package body 20. Between the joints. An inert gas may be added during the removal of a portion of the first cladding layer 31B to effectively reduce the thickness of the oxide layer formed on the surface of the Cu or Cu alloy, which also helps to lift the first conductive terminal 31 and the package. The bond between the two bodies 20.

In addition, as shown in FIG. 3, FIG. 4 and FIG. 6, the second conductive terminal 32 includes a second core layer 32A and a second cladding layer 32B covering the second core layer 32A, and The second core layer 32A has a second exposed upper surface 321A exposed from the second cladding layer 32B and a second exposed lower surface 322A exposed from the second cladding layer 32B. The second exposed upper surface 321A has a second upper coverage area 3211 covered by the package body 20 and a second upper exposed area 3212 connected to the second upper coverage area 3211 and exposed outside the package body 20, and The second exposed lower surface 322A has a second lower coverage area 3221 covered by the package 20 and a second lower exposed area 3222 exposed to the second lower coverage area 3221 and exposed outside the package 20. Furthermore, the second upper exposed area 3212 of the second exposed upper surface 321A and the second lower exposed area 3222 of the second exposed lower surface 322A are both connected to the second side surface 202 of the package body 20. The second core layer 32A has a second through hole 323A penetrating the second core layer 32A and connected between the second exposed upper surface 321A and the second exposed lower surface 322A, and the second through hole 323A has a packaged body 20 The filled second filling portion 3231 and a second hollow portion 3232 that communicate with the second filling portion 3231 and are exposed outside the package 20 are formed. Of course, except for the upper surface and the lower surface of the second core layer 32A (ie, the second exposed upper surface 321A and the second exposed lower surface 322A) may be exposed from the second cladding layer 32B, and the second core layer 32A is The opposite side surface may also be exposed from the second cladding layer 32B.

For example, the second core layer 32A may be Cu or a Cu alloy, and the second cladding layer 32B includes a second connection layer 321B that is Ni and a second solder layer 322B that is Sn and covers the second connection layer 321B. . In addition, the present invention may employ laser engraving, etching, sand blasting or grinding, etc., such that the second core layer 32A, which may be Cu or Cu alloy, is exposed from the second cladding layer 32B, and the second core layer 32A is The second upper cover region 3211 and the second lower cover region 3221 exposed by the second cladding layer 32B may extend from the second through hole 323A toward the first conductive terminal 31 by a predetermined length, which is covered by the extended length. The scope is not intended to limit the invention. Since the melting point of the Cu or Cu alloy is higher than that of Sn, the sealing property between the contact faces of the second core layer 32A of the second conductive terminal 32 and the package 20 can be effectively improved. It is worth mentioning that part of the second cladding layer 32B is laser engraved, etched, sandblasted or The rough surface generated after the polishing or the like is removed can also effectively improve the bondability between the second conductive terminal 32 and the package body 20. An inert gas may be added during the removal of a portion of the second cladding layer 32B to effectively reduce the thickness of the oxide layer formed on the surface of the Cu or Cu alloy, which also helps to lift the second conductive terminal 32 and the package. The bond between the two bodies 20.

Furthermore, with reference to FIG. 1 to FIG. 7 , a first embodiment of the present invention provides a method for fabricating a solid electrolytic capacitor package structure Z, which includes the following steps: First, as shown in FIG. 1 and FIG. 2, at least one a conductive terminal 31 and at least one second conductive terminal 32 (S100); then, as shown in FIG. 1 to FIG. 3, a plurality of first stacked capacitors 10 are sequentially stacked and electrically connected to the first conductive terminal. 31 and the second conductive terminal 32, wherein a plurality of first stacked capacitors 10 are disposed on the top end of the first conductive terminal 31 and the top end of the second conductive terminal 32, and each of the first stacked capacitors 10 has a a first positive electrode portion P and a first negative electrode portion N (S102); then, a package body 20 is formed to completely cover the capacitor unit 1, wherein the first conductive terminal 31 has a first electrical connection terminal 10 electrically connected to the first stacked capacitor 10. a first positive portion P and a first embedded portion 310 covered in the package 20 and a first exposed portion 311 connected to the first embedded portion 310 and exposed outside the package 20, and a second conductive terminal 32 has an electrical connection to the first stacked capacitor 10 a first buried portion N and a second embedded portion 320 encased in the package 20 and a second exposed portion 321 connected to the second embedded portion 320 and exposed outside the package 20 (S104); As shown in FIG. 3 and FIG. 4 , the first exposed portion 311 and the second exposed portion 321 are bent such that the first exposed portion 311 and the second exposed portion 321 both extend along the outer surface of the package 20 ( S106 ).

Further, as shown in FIG. 4 and FIG. 5, the first conductive terminal 31 includes a first core layer 31A and a first cladding layer 31B covering the first core layer 31A, and the first core layer 31A has A first exposed upper surface 311A exposed from the first cladding layer 31B and a first exposed lower surface 312A exposed from the first cladding layer 31B. The first exposed upper surface 311A has a covered body 20 a first upper cover region 3111 and a first upper exposed region 3112 connected to the first upper cover region 3111 and exposed outside the package 20, and the first exposed lower surface 312A has a first cover covered by the package 20. The coverage area 3121 and a first lower exposed area 3122 connected to the first lower coverage area 3121 and exposed outside the package body 20.

Furthermore, as shown in FIG. 4 and FIG. 6, the second conductive terminal 32 includes a second core layer 32A and a second cladding layer 32B covering the second core layer 32A, and the second core layer 32A has A second exposed upper surface 321A exposed from the second cladding layer 32B and a second exposed lower surface 322A exposed from the second cladding layer 32B. The second exposed upper surface 321A has a second upper coverage area 3211 covered by the package body 20 and a second upper exposed area 3212 connected to the second upper coverage area 3211 and exposed outside the package body 20, and The second exposed lower surface 322A has a second lower coverage area 3221 covered by the package 20 and a second lower exposed area 3222 exposed to the second lower coverage area 3221 and exposed outside the package 20.

[Second embodiment]

Referring to FIG. 8 , a second embodiment of the present invention provides a solid electrolytic capacitor package structure Z for improving the sealing performance, comprising: a capacitor unit 1 , a package unit 2 , and a conductive unit 3 . It can be seen from the comparison between FIG. 8 and FIG. 4 that the biggest difference between the second embodiment of the present invention and the first embodiment is that, in the second embodiment, the capacitor unit 1 includes a plurality of capacitors that are sequentially stacked and electrically connected to each other. Two stacked capacitors 10'. The plurality of second stacked capacitors 10' are disposed on the bottom end of the first conductive terminal 31 and the bottom end of the second conductive terminal 32, and each of the second stacked capacitors 10' has an electrical connection The second positive portion P' of the conductive terminal 31 and the second negative portion N' electrically connected to the second conductive terminal 32.

[Possible effects of the examples]

In summary, the beneficial effects of the present invention may be that the first core layer 31A has a first exposed upper surface 311A exposed from the first cladding layer 31B and a first package. The first exposed lower surface 312A" and the "second core layer 32A" of the cladding layer 31B have a second exposed upper surface 321A exposed from the second cladding layer 32B and a second exposed layer 32B exposed from the second cladding layer 32B. The second exposed lower surface 322A" is designed to enhance the "between the contact faces of the first conductive terminal 31 and the package 20" and the "contact surface of the second conductive terminal 32 and the package 20". "The seal". Regarding the effect of the solid electrolytic capacitor package structure Z in this case, it is possible to achieve the effect of improving the sealing performance. Taking 15 samples as an example, under the environmental conditions of 93 ° C and 100% relative humidity, after 8 hours in the steam pot, the case can be sealed. The difference in capacitance before and after the improvement is shown in the following experimental results:

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

Z‧‧‧ capacitor package structure

1‧‧‧Capacitor unit

10‧‧‧First stacked capacitor

P‧‧‧First positive part

N‧‧‧First negative part

2‧‧‧Package unit

20‧‧‧Package

201‧‧‧ first side surface

202‧‧‧Second side surface

203‧‧‧ bottom surface

3‧‧‧Conducting unit

31‧‧‧First conductive terminal

310‧‧‧First Internal Department

311‧‧‧First exposed department

31A‧‧‧ first core layer

313A‧‧‧First through hole

31B‧‧‧First cladding

32‧‧‧Second conductive terminal

320‧‧‧Second Internal Department

321‧‧‧Second exposed department

32A‧‧‧ second core layer

323A‧‧‧second through hole

32B‧‧‧Second coating

Claims (10)

A solid electrolytic capacitor package structure comprising: a capacitor unit comprising a plurality of first stacked capacitors stacked in series and electrically connected to each other, wherein each of the first stacked capacitors has a a first positive electrode portion and a first negative electrode portion; a package unit, the package unit includes a package body for completely covering the capacitor unit; and a conductive unit, the conductive unit including at least one first conductive terminal And at least one second conductive terminal separated from the at least one of the first conductive terminals by a predetermined distance, wherein the plurality of first stacked capacitors are disposed on a top end of at least one of the first conductive terminals and at least one At least one of the first conductive terminals on the top end of the second conductive terminal has a first positive electrode portion electrically connected to the first stacked capacitor and is covered in the first body of the package body a buried portion and a first exposed portion connected to the first embedded portion and exposed outside the package, and at least one of the second conductive terminals has an electrical connection a first buried portion of the stacked capacitor and covered in the second embedded portion of the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; The at least one first conductive terminal includes a first core layer and a first cladding layer covering the first core layer, and the first core layer has a bare body from the first cladding layer And a first exposed upper surface and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface having a first upper coverage area covered by the package And a first upper exposed area connected to the first upper coverage area and exposed outside the package, and the first exposed lower surface has a first lower coverage area covered by the package and a a first lower exposed area connected to the first lower coverage area and exposed outside the package; At least one of the second conductive terminals includes a second core layer and a second cladding layer covering the second core layer, and the second core layer has a bare core from the second cladding layer And a second exposed upper surface and a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface having a second upper coverage area covered by the package And a second upper exposed area connected to the second upper coverage area and exposed outside the package, and the second exposed lower surface has a second lower coverage area covered by the package and a Connected to the second lower coverage area and exposed to a second lower exposed area outside the package. The solid electrolytic capacitor package structure of claim 1, wherein the capacitor unit comprises a plurality of second stacked capacitors stacked in series and electrically connected to each other, and the plurality of second stacked capacitors are disposed in at least one The bottom end of the first conductive terminal and the bottom end of at least one of the second conductive terminals, and each of the second stacked capacitors has a second electrically connected to the at least one of the first conductive terminals a positive electrode portion and a second negative electrode portion electrically connected to at least one of the second conductive terminals, wherein the first core layer is Cu or a Cu alloy, and the first cladding layer includes a first connection that is Ni a layer and a first solder layer that is Sn and covers the first connection layer, and the second core layer is Cu or a Cu alloy, and the second cladding layer includes a second connection layer that is Ni and One is Sn and covers the second solder layer of the second connection layer. The solid electrolytic capacitor package structure of claim 1, wherein the package body has a first side surface, a second side surface facing away from the first side surface, and a first side surface and a a bottom surface between the second side surfaces, the first upper exposed area of the first exposed upper surface and the first lower exposed area of the first exposed lower surface are all connected to the package The first side surface, and the second upper exposed area of the second exposed upper surface and the second lower exposed area of the second exposed lower surface are both connected to the first portion of the package a two-sided surface, wherein the first bare body of at least one of the first conductive terminals The exposed portion extends along the first side surface of the package body and the bottom surface, and the second exposed portion of at least one of the second conductive terminals is along the second side of the package body The surface extends from the bottom surface. The solid electrolytic capacitor package structure of claim 1, wherein the first core layer has a first through the first core layer and connected between the first exposed upper surface and the first exposed lower surface a through hole, and the second core layer has a second through hole penetrating the second core layer and connected between the second exposed upper surface and the second exposed lower surface, wherein the first The through hole has a first filling portion filled by the package body and a first hollow portion connected to the first filling portion and exposed outside the package body, and the second through hole has a a second filling portion filled with the package body and a second hollow portion connected to the second filling portion and exposed outside the package body. The solid electrolytic capacitor package structure of claim 1, wherein each of the first stacked capacitors comprises a valve metal foil, an oxide layer completely covering the valve metal foil, and an oxide layer covering the oxide layer. a part of the conductive polymer layer, a carbon glue layer completely covering the conductive polymer layer, and a silver glue layer completely covering the carbon glue layer, wherein each of the first stacked type capacitors comprises a setting a surrounding insulating layer on the outer surface of the oxide layer and surrounding the oxide layer, and a length of the conductive polymer layer of the first stacked capacitor, a length of the carbon adhesive layer, and the silver The length of the adhesive layer is limited by the surrounding insulating layer, wherein the outer surface of the oxide layer has a surrounding area, and the surrounding insulating layer of the first stacked capacitor is disposed around The surrounding region of the oxide layer simultaneously contacts the end of the conductive polymer layer, the end of the carbon glue layer, and the end of the silver paste layer. A conductive unit comprising: at least one first conductive terminal and at least one second conductive terminal separated from each other by at least one of the first conductive terminals by a predetermined distance, wherein at least one of the first conductive terminals and at least one of the The second conductive terminals are all connected to a package; The at least one first conductive terminal has a first embedded portion encapsulated in the package body and a first exposed portion connected to the first embedded portion and exposed outside the package body. And the at least one second conductive terminal has a second embedded portion encapsulated in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; At least one of the first conductive terminals includes a first core layer and a first cladding layer covering the first core layer, the first core layer having a bare side from the first cladding layer a first exposed upper surface and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface having a first upper coverage area covered by the package body, And the first exposed lower surface has a first lower coverage area covered by the package; wherein at least one of the second conductive terminals comprises a second core layer and a second core layer a second cladding layer, the second core layer having a second cladding a second exposed upper surface exposed and a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface having a second upper cover covered by the package a region, and the second exposed lower surface has a second lower coverage area covered by the package. The conductive unit of claim 6, wherein the first exposed upper surface has a first upper exposed area connected to the first upper cover area and exposed outside the package, the first exposed lower surface having a a first lower exposed area exposed to the first lower cover area and exposed outside the package, the second exposed upper surface having a first exposed upper cover area and exposed to the outside of the package a second exposed lower surface, the second exposed lower surface has a second lower exposed area connected to the second lower coverage area and exposed outside the package, and the first upper exposed area, the first The lower exposed region, the second upper exposed region and the second lower exposed region are all completely covered by the filling of the Sn material, wherein the first core layer is Cu or a Cu alloy, the first cladding layer The first connecting layer including Ni and the first covering the first connecting layer a solder layer, and the second core layer is Cu or a Cu alloy, the second cladding layer includes a second connection layer of Ni and a second solder which is Sn and covers the second connection layer Floor. The conductive unit of claim 7, wherein the package has a first side surface, a second side surface facing away from the first side surface, and a first side surface and the second side a bottom surface between the side surfaces, the first upper exposed region of the first exposed upper surface and the first lower exposed region of the first exposed lower surface are all connected to the first portion of the package a side surface, and the second upper exposed area of the second exposed upper surface and the second lower exposed area of the second exposed lower surface are both connected to the second side surface of the package The first exposed portion of at least one of the first conductive terminals extends along the first side surface of the package body and the bottom surface, and the at least one of the second conductive terminals The second exposed portion extends along the second side surface of the package body and the bottom surface. The conductive unit of claim 6, wherein the first core layer has a first through hole penetrating the first core layer and connected between the first exposed upper surface and the first exposed lower surface, And the second core layer has a second through hole penetrating the second core layer and connected between the second exposed upper surface and the second exposed lower surface, wherein the first through hole has a first filling portion filled by the package body and a first hollow portion connected to the first filling portion and exposed outside the package body, and the second through hole has a package a second filling portion filled with the body and a second hollow portion connected to the second filling portion and exposed outside the package body. A manufacturing method of a solid electrolytic capacitor package structure, comprising the steps of: providing at least one first conductive terminal and at least one second conductive terminal; stacking a plurality of first stacked capacitors in sequence and electrically connecting to at least one Between the first conductive terminal and the at least one second conductive terminal, wherein a plurality of the first stacked capacitors are disposed on at least one of the first conductive ends And a first positive electrode portion and a first negative electrode portion of each of the first stacked capacitors; forming a package to completely cover the a capacitor unit, wherein at least one of the first conductive terminals has a first embedded portion electrically connected to the first positive portion of the first stacked capacitor and is covered in the package and a connection The first embedded portion is exposed in the first exposed portion outside the package, and at least one of the second conductive terminals has a first negative portion electrically connected to the first stacked capacitor And a second embedded portion covered in the package body and a second exposed portion connected to the second embedded portion and exposed outside the package body; and bending the first exposed portion and the The second exposed portion is configured such that the first exposed portion and the second exposed portion both extend along an outer surface of the package; wherein at least one of the first conductive terminals includes a first core layer and a first cladding layer covering the first core layer, The first core layer has a first exposed upper surface exposed from the first cladding layer and a first exposed lower surface exposed from the first cladding layer, the first exposed upper surface Having a first upper coverage area covered by the package, and the first exposed lower surface has a first lower coverage area covered by the package; wherein at least one of the second conductive terminals a second core layer and a second cladding layer covering the second core layer, the second core layer having a second exposed upper surface exposed from the second cladding layer and a a second exposed lower surface exposed from the second cladding layer, the second exposed upper surface having a second upper coverage area covered by the package, and the second exposed lower surface having a second lower coverage area covered by the package.