CN104637688B - Solid electrolytic capacitor encapsulating structure and preparation method thereof and conductive unit - Google Patents

Abstract

A kind of solid electrolytic capacitor encapsulating structure of present disclosure and preparation method thereof and conductive unit.Solid electrolytic capacitor encapsulating structure includes capacitor cell, encapsulation unit and conductive unit.Encapsulation unit includes a packaging body for being used to coat capacitor cell.Conductive unit includes the first conducting terminal and the second conducting terminal.First conducting terminal includes the first core layer and the first clad.The first exposed upper that first core layer is exposed from the first clad with one and goes out, and the first exposed upper has the first upper overlay area that a packed body is covered.Second conducting terminal includes the second core layer and the second clad.The second exposed upper that second core layer is exposed from the second clad with one and goes out, and the second exposed upper has the second upper overlay area that a packed body is covered.Thereby, the present invention can lift the sealing between the contact surface of both conducting terminal and packaging body.

Description

Solid electrolytic capacitor encapsulating structure and preparation method thereof and conductive unit

Technical field

It is espespecially a kind of the present invention relates to a kind of solid electrolytic capacitor encapsulating structure and preparation method thereof and conductive unit For lifting the solid electrolytic capacitor encapsulating structure and its system of the sealing between both conducting terminal and packaging body contact surface Make method and conductive unit.

Background technology

Capacitor has been widely used for consumer electrical home appliances, computer motherboard and its periphery, power supply unit, led to Believe the primary element of product and automobile etc., its main effect includes：Filtering, bypass, rectification, coupling, decoupling, phase inversion etc..It is One of indispensable element in electronic product.Capacitor has different kenels according to different material and purposes.Including aluminum Electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc..In the prior art, solid electrolytic capacitor has small The advantages that size, high capacitance, superior frequency characteristic, and can be used in the decoupling effect of the power circuit of central processing unit On.In general, using the stacking of multiple capacitor cells, and form the solid electrolytic capacitor of high-capacitance, it is known that stack Formula solid electrolytic capacitor includes multiple capacitor cells and lead frame, each of which capacitor cell include anode portion, negative pole part with Insulation division, this insulation division make anode portion be electrically insulated from negative pole part.Particularly, the negative pole part of capacitor cell overlies one another, And by setting conductor layer between adjacent capacitor cell, so as to be electrically connected to each other between multiple capacitor cells.However, Sealing between the conducting terminal of known solid electrolytic capacitor and the contact surface of both packaging bodies is bad.Therefore how to lead to The improvement of structure design is crossed, to lift the sealing between the contact surface of both conducting terminal and packaging body, it has also become this thing One of industry important topic to be solved.

The content of the invention

The embodiment of the present invention is to provide a kind of solid electrolytic capacitor encapsulating structure and preparation method thereof and conductive list Member, it can effectively solve the " sealing between the conducting terminal of known solid electrolytic capacitor and the contact surface of both packaging bodies Property is bad " the problem of.

A kind of solid electrolytic capacitor encapsulating structure that a wherein embodiment of the invention is provided, it includes：One electric capacity list Member, an encapsulation unit and a conductive unit.The capacitor cell includes multiple being sequentially stacked and being electrically connected to each other First stacked capacitor, the first stacked capacitor described in each of which have one first positive pole portion and one first negative pole Portion.The encapsulation unit includes a packaging body for being used to coat the capacitor cell completely.Conductive unit includes at least one first Conducting terminal and at least one the second conducting terminal for separating a specific range each other with least 1 first conducting terminal, wherein First stacked capacitor is arranged on described at least on the top of one first conducting terminal and described at least one second conductive On the top of terminal, at least one first conducting terminal has one to be electrically connected at the described of first stacked capacitor First positive pole portion and be covered by the packaging body first in bury portion and one be connected in described first portion of burying and it is exposed The first exposed portion outside the packaging body, and at least one second conducting terminal has one to be electrically connected at first stacking The first negative pole portion of type capacitor and be covered by the packaging body second in bury portion and one be connected to described second Inside bury portion and exposed the second exposed portion outside the packaging body.Wherein, at least one first conducting terminal includes one first First clad of core layer and cladding first core layer, first core layer have one from first clad The first exposed lower surface that the first exposed upper and one exposed and go out are exposed from first clad and go out, described first Exposed upper is connected to the area of coverage on described first with first upper overlay area covered by the packaging body and one Domain and it is exposed outside the packaging body first on exposed region, and the first exposed lower surface has one by the packaging body The first lower overlay area covered and one be connected to first lower overlay area and it is exposed outside the packaging body first Lower exposed region.Wherein, at least one second conducting terminal includes one second core layer and cladding second core layer The second clad, second core layer has that one is exposed from second clad and the second exposed upper gone out and one It is exposed from second clad and the second exposed lower surface for going out, second exposed upper have one by the packaging body The second upper overlay area covered and one be connected to second upper overlay area and it is exposed outside the packaging body second Upper exposed region, and the second exposed lower surface has second lower overlay area covered by the packaging body and a company It is connected to second lower overlay area and exposed second time exposed region outside the packaging body.

A kind of conductive unit that the other embodiment of the present invention is provided, it includes：At least one first conducting terminal and extremely Few one separates the second conducting terminal of a specific range with least one first conducting terminal each other, wherein described at least 1 the One conducting terminal and at least one second conducting terminal are connected to a packaging body.Wherein, at least one first conducting end Son have one be covered by the packaging body first in bury portion and one be connected in described first portion of burying and exposed described The first exposed portion outside packaging body, and at least one second conducting terminal have one be covered by the packaging body second Inside bury portion and one be connected to portion and exposed the second exposed portion outside the packaging body are buried in described second.Wherein, it is described at least One first conducting terminal includes the first clad of one first core layer and cladding first core layer, first core Layer has first exposed upper and one exposed from first clad and go out exposed from first clad and gone out The first exposed lower surface, first exposed upper has first upper overlay area covered by the packaging body, And the first exposed lower surface has first lower overlay area covered by the packaging body.Wherein, described at least one Second conducting terminal includes the second clad of one second core layer and cladding second core layer, second core layer And second exposed upper that goes out exposed from second clad with one and one exposed from second clad and go out Second exposed lower surface, second exposed upper have second upper overlay area covered by the packaging body, and The second exposed lower surface has second lower overlay area covered by the packaging body.

A kind of preparation method of solid electrolytic capacitor encapsulating structure that another embodiment is provided in addition of the invention, it is wrapped Include the following steps：At least one first conducting terminal and at least one second conducting terminal are provided；By multiple first stacked capacitors Sequentially be stacked and be electrically connected at it is described between at least one first conducting terminal and at least one second conducting terminal, Wherein described first stacked capacitor is arranged on described at least on the top of one first conducting terminal and described at least one second On the top of conducting terminal, and each described first stacked capacitor has one first positive pole portion and one first negative pole portion； A packaging body is formed to coat the capacitor cell completely, wherein at least one first conducting terminal has one to be electrically connected at The first positive pole portion of first stacked capacitor and be covered by the packaging body first in bury portion and one connect It is connected to and portion and exposed the first exposed portion outside the packaging body is buried in described first, and at least one second conducting terminal has There are a first negative pole portion for being electrically connected at first stacked capacitor and be covered by the packaging body Portion is buried in two and one is connected to portion and exposed the second exposed portion outside the packaging body is buried in described second；And bending institute The first exposed portion and the described second exposed portion are stated, to cause the described first exposed portion with the described second exposed portion all along the envelope Fill the outer surface extension of body.Wherein, at least one first conducting terminal includes one first core layer and a cladding described first First clad of core layer, first core layer have that one is exposed from first clad and the first exposed upper table for going out Face and one is exposed from first clad and the first exposed lower surface for going out, first exposed upper have one described The first upper overlay area and one that packaging body is covered are connected to first upper overlay area and exposed outside the packaging body First on exposed region, and the first exposed lower surface has first lower overlay area covered by the packaging body And one be connected to first lower overlay area and exposed first time exposed region outside the packaging body.Wherein, it is described extremely Few one second conducting terminal includes the second clad of one second core layer and cladding second core layer, second core Central layer have second exposed upper and one exposed from second clad and go out it is exposed from second clad and The the second exposed lower surface gone out, second exposed upper have second upper overlay area covered by the packaging body And one be connected to second upper overlay area and it is exposed outside the packaging body second on exposed region, and outside described second Dew lower surface is connected to second lower overlay area with second lower overlay area covered by the packaging body and one And exposed second time exposed region outside the packaging body.

Beneficial effects of the present invention can be that the embodiment of the present invention can be by the way that " first core layer has one from institute State that the first clad is exposed and the first exposed upper and one that go out are exposed from first clad and go out first it is exposed under Surface " and " second core layer have that one is exposed from second clad and the second exposed upper for going out and one from institute State that the second clad is exposed and the second exposed lower surface for going out " design, to lift " at least one first conducting terminal and the institute Between the contact surface for stating both packaging bodies " and " contact surface of both at least one second conducting terminal and described packaging body it Between " sealing.

For the enabled feature and technology contents for being further understood that the present invention, refer to below in connection with the present invention specifically Bright and accompanying drawing, but institute's accompanying drawings are only provided and used with reference to explanation, are not used for the present invention person of being any limitation as.

Brief description of the drawings

Fig. 1 is the side elevational cross-section schematic diagram of the capacitor cell of first embodiment of the invention and second embodiment.

Fig. 2 is the upper schematic diagram of the conductive unit of first embodiment of the invention.

Fig. 3 is the upper schematic diagram that the capacitor cell of first embodiment of the invention is arranged on conductive unit.

Fig. 4 is the schematic side view of the solid electrolytic capacitor encapsulating structure of first embodiment of the invention.

Fig. 5 is the amplification profile schematic diagram of part A in Fig. 4.

Fig. 6 is the amplification profile schematic diagram of part B in Fig. 4.

Fig. 7 is the flow chart of the preparation method of the solid electrolytic capacitor encapsulating structure of first embodiment of the invention.

Fig. 8 is the schematic side view of the solid electrolytic capacitor encapsulating structure of second embodiment of the invention.

【Symbol description】

Capacitor packaging structure Z

Capacitor cell 1

First stacked capacitor 10

First positive pole portion P

First negative pole portion N

Valve metal paillon foil 100

Oxide layer 101

Encircled area 1010

Electroconductive polymer layer 102

End 1020

Rubber layer 103

End 1030

Elargol layer 104

End 1040

Around shape insulating barrier 105

Second stacked capacitor 10 '

Second positive pole portion P '

Second negative pole portion N '

Encapsulation unit 2

Packaging body 20

First side surface 201

Second side surface 202

Basal surface 203

Conductive unit 3

First conducting terminal 31

Portion 310 is buried in first

First exposed portion 311

First core layer 31A

First exposed upper 311A

First upper overlay area 3111

Exposed region 3112 on first

First exposed lower surface 312A

First lower overlay area 3121

First time exposed region 3122

First through hole 313A

First filling part 3131

First hollow-out parts 3132

First clad 31B

First articulamentum 311B

First weld layer 312B

Second conducting terminal 32

Portion 320 is buried in second

Second exposed portion 321

Second core layer 32A

Second exposed upper 321A

Second upper overlay area 3211

Exposed region 3212 on second

Second exposed lower surface 322A

Second lower overlay area 3221

Second time exposed region 3222

Second through hole 323A

Second filling part 3231

Second hollow-out parts 3232

Second clad 32B

Second articulamentum 321B

Second weld layer 322B

Embodiment

(first embodiment)

Refer to shown in Fig. 1 to Fig. 6, first embodiment of the invention provides a kind of solid state electrolysis electricity for lift-off seal Container packaging structure Z, it includes：One capacitor cell 1, an encapsulation unit 2 and a conductive unit 3.

First, as shown in figure 1, capacitor cell 1 can provide multiple first stacked capacitors 10（Or chip-shaped electric capacity Device, at present Fig. 1 only show one of them first stacked capacitor 10）, the first stacked capacitor of each of which 10 has One first positive pole portion P and one first negative pole portion N.For example, each first stacked capacitor 10 includes a valve metal paper tinsel The oxide layer 101, one of the cladding valve metal paillon foil 100 completely of piece 100, one coats the conducting polymer of a part for oxide layer 101 The elargol layer 104 of the rubber layer 103 and one of 102, one complete coated with conductive macromolecule layer 102 of layer cladding rubber layer 103 completely. It is arranged in addition, each first stacked capacitor 10 includes one on the outer surface of oxide layer 101 and around oxide layer 101 Around shape insulating barrier 105, and the length of the electroconductive polymer layer 102 of the first stacked capacitor 10, the length of rubber layer 103 And the length of elargol layer 104 is all limited around shape insulating barrier 105.For further, have on the outer surface of oxide layer 101 There is an encircled area 1010, and the shape insulating barrier 105 that surrounds of the first stacked capacitor 10 is arranged on oxide layer 101 with surrounding Encircled area 1010 on and contact the end 1020 of electroconductive polymer layer 102, the end 1030 of rubber layer 103 and elargol simultaneously The end 1040 of layer 104.However, what the first stacked capacitor 10 used in the present invention was not lifted with above-mentioned first embodiment Example is limited.

Furthermore coordinate shown in Fig. 2, Fig. 3 and Fig. 4, multiple first stacked capacitors 10 can sequentially be stacked and that This is electrically connected with, and two the first negative pole portion N of wherein the first adjacent stacked capacitor 10 of each two can pass through elargol（Do not mark Number）To be stacked together, and two the first positive pole portion P of adjacent the first stacked capacitor 10 of each two can pass through Weld layer（Non- label）To be stacked together.In addition, encapsulation unit 2 includes an envelope for being used to coat capacitor cell 1 completely Body 20 is filled, and packaging body 20 can be by lighttight encapsulating material（Such as epoxy resin（epoxy）Or silicones （silicone））It is made.In addition, conductive unit 3（Namely lead frame leadframe）Including one first conducting terminal 31 and one The second conducting terminal 32 separated each other with the first conducting terminal 31.Wherein, the first conducting terminal 31 has one to be electrically connected at First positive pole portion P of the first stacked capacitor 10（Namely the first stacked capacitor 10 in electrical contact positioned at lowermost end First positive pole portion P）And portion 310 and one is buried in first be covered by packaging body 20 and is connected in first portion of burying 310 and exposed The first exposed portion 311 outside packaging body 20, and the second conducting terminal 32 has one to be electrically connected at the first stacked electric capacity First negative pole portion N of device 10（Namely the first negative pole portion N of the first stacked capacitor 10 in electrical contact positioned at lowermost end）And Portion 320 and one is buried in second be covered by packaging body 20 and is connected in second portion of burying 320 and exposed outside packaging body 20 Second exposed portion 321.

For further, coordinate shown in Fig. 3 and Fig. 4, packaging body 20 have one first side surface 201, one back in（Or In contrast to）Second side surface 202, one of the first side surface 201 is connected between the first side surface 201 and the second side surface 202 Basal surface 203.Wherein, the first of the first conducting terminal 31 the exposed portion 311 can along the first side surface 201 of packaging body 20 with Basal surface 203 is extended, and to form L-type folding pin, and the second exposed portion 321 of the second conducting terminal 32 can be along Second side surface 202 of packaging body 20 is extended with basal surface 203, to form another L-type folding pin.

In addition, coordinating shown in Fig. 3, Fig. 4 and Fig. 5, the first conducting terminal 31 includes the claddings of one first core layer 31A and one the One core layer 31A the first clad 31B, and the first core layer 31A have one it is exposed from the first clad 31B and go out the The first exposed lower surface 312A that one exposed upper 311A and one is exposed from the first clad 31B and goes out.Wherein, first is exposed The first upper overlay area 3111 and one that there is upper surface 311A a packed body 20 to be covered is connected to the first upper overlay area 3111 and it is exposed outside packaging body 20 first on exposed region 3112, and the first exposed lower surface 312A have it is one packed The first lower overlay area 3121 and one that body 20 is covered are connected to the first lower overlay area 3121 and exposed outside packaging body 20 First time exposed region 3122.For further, the first exposed upper 311A first on exposed region 3112 and the One exposed lower surface 312A first time exposed region 3122 is connected to the first side surface 201 of packaging body 20.First core Layer 31A have one through the first core layer 31A and be connected to the exposed lower surface 312A of the first exposed upper 311A and first it Between the first through hole 313A, and the first through hole 313A have the first filling part 3131 that a packed body 20 filled up and One is communicated in the first filling part 3131 and exposed the first hollow-out parts 3132 outside packaging body 20.Certainly, except the first core layer 31A upper surface and lower surface（Namely the first exposed upper 311A and the first exposed lower surface 312A）Can be from the first cladding Layer 31B is exposed and go out, the first core layer 31A two opposite side surfaces also can be exposed from the first clad 31B and go out.

For example, the first core layer 31A can be Cu or Cu alloys, and the first clad 31B is Ni including one（Nickel） The first articulamentum 311B and one be Sn（Stannum）And the first articulamentum 311B of cladding the first weld layer 312B.In addition, this Invention can use the mode such as laser engraving, etching, sandblasting or grinding so that can be Cu or Cu alloys the first core layer 31A from First clad 31B is exposed and goes out, and the first core layer 31A from the first clad 31B it is exposed and go out first on cover The lower overlay area 3121 of region 3111 and first can be carried out from the first through hole 313A towards the direction of the second conducting terminal 32 The extension of one length-specific, the scope that this development length is covered not are used for limiting the present invention.Due to melting for Cu or Cu alloys Point is more taller than Sn, so close between both contact surfaces of the first core layer 31A and packaging body 20 of the first conducting terminal 31 Feng Xingke is effectively lifted.It is noted that the first partial clad 31B passes through laser engraving, etching, sandblasting or grinding etc. Mode caused rough surface after removing, it also can effectively lift the first conducting terminal 31 and the engagement of packaging body 20 between the two Property.Inert gas can be added during the first clad 31B of part is removed, effectively to reduce the table of Cu or Cu alloys The thickness for the oxide layer that face is generated, this mode also contribute to be lifted the first conducting terminal 31 with packaging body 20 connecing between the two Conjunction property.

In addition, coordinating shown in Fig. 3, Fig. 4 and Fig. 6, the second conducting terminal 32 includes the claddings of one second core layer 32A and one the Two core layer 32A the second clad 32B, and the second core layer 32A have one it is exposed from the second clad 32B and go out the The second exposed lower surface 322A that two exposed upper 321A and one are exposed from the second clad 32B and go out.Wherein, second is exposed The second upper overlay area 3211 and one that there is upper surface 321A a packed body 20 to be covered is connected to the second upper overlay area 3211 and it is exposed outside packaging body 20 second on exposed region 3212, and the second exposed lower surface 322A have it is one packed The second lower overlay area 3221 and one that body 20 is covered are connected to the second lower overlay area 3221 and exposed outside packaging body 20 Second time exposed region 3222.For further, the second exposed upper 321A second on exposed region 3212 and the Two exposed lower surface 322A second time exposed region 3222 is connected to the second side surface 202 of packaging body 20.Second core Layer 32A have one through the second core layer 32A and be connected to the exposed lower surface 322A of the second exposed upper 321A and second it Between the second through hole 323A, and the second through hole 323A have the second filling part 3231 that a packed body 20 filled up and One is communicated in the second filling part 3231 and exposed the second hollow-out parts 3232 outside packaging body 20.Certainly, except the second core layer 32A upper surface and lower surface（Namely the second exposed upper 321A and the second exposed lower surface 322A）Can be from the second cladding Layer 32B is exposed and go out, the second core layer 32A two opposite side surfaces also can be exposed from the second clad 32B and go out.

For example, the second core layer 32A can be Cu or Cu alloys, and the second clad 32B includes one and connected for the second of Ni Layer 321B and one is met to be Sn and coat the second articulamentum 321B the second weld layer 322B.In addition, the present invention can use laser to carve The modes such as quarter, etching, sandblasting or grinding so that can be exposed from the second clad 32B for the second core layer 32A of Cu or Cu alloys And go out, and the second core layer 32A from the second clad 32B cover under exposed and the second upper overlay area 3211 and second for going out Cover area 3221 can carry out the extension of a length-specific from the second through hole 323A towards the direction of the first conducting terminal 31, this The scope that development length is covered not is used for limiting the present invention.Because the fusing point of Cu or Cu alloys is more taller than Sn, so the Sealing between both contact surfaces of the second core layer 32A and packaging body 20 of two conducting terminals 32 can be lifted effectively.It is worth One is mentioned that, the second clad 32B of part removed by modes such as laser engraving, etching, sandblasting or grindings after caused by Rough surface, it can also effectively lift the second conducting terminal 32 and the zygosity of packaging body 20 between the two.The second bag in part Coating 32B can add inert gas during being removed, effectively to reduce the oxide layer that the surface of Cu or Cu alloys is generated Thickness, this mode also contributes to the conducting terminal 32 of lifting second and the zygosity of packaging body 20 between the two.

Furthermore coordinate shown in Fig. 1 to Fig. 7, first embodiment of the invention provides a kind of solid electrolytic capacitor encapsulating structure Z Preparation method, it comprises the following steps：First, coordinate shown in Fig. 1 and Fig. 2, there is provided at least one first conducting terminal 31 and extremely Few one second conducting terminal 32（S100）；Then, coordinate shown in Fig. 1 to Fig. 3, by multiple first stacked capacitors 10 sequentially heap Stack and be electrically connected between the first conducting terminal 31 and the second conducting terminal 32, plurality of first stacked electric capacity Device 10 is arranged on the top of the first conducting terminal 31 and on the top of the second conducting terminal 32, and each first stacked Capacitor 10 has one first positive pole portion P and one first negative pole portion N（S102）；Then, a packaging body 20 is formed to coat completely Capacitor cell 1, wherein the first conducting terminal 31 have one be electrically connected at the first stacked capacitor 10 the first positive pole portion P and Portion 310 and one is buried in first be covered by packaging body 20 and is connected in first portion of burying 310 and exposed outside packaging body 20 First exposed portion 311, and the second conducting terminal 32 has first negative pole for being electrically connected at the first stacked capacitor 10 Portion N and be covered by packaging body 20 second in bury portion 320 and one and be connected in second portion of burying 320 and exposed in packaging body 20 The second outer exposed portion 321（S104）；Finally, coordinate shown in Fig. 3 and Fig. 4, bend the first exposed 311 and second exposed portion of portion 321, to cause the first exposed 311 and second exposed portion 321 of portion to extend each along the outer surface of packaging body 20（S106）.

For further, coordinate shown in Fig. 4 and Fig. 5, the first conducting terminal 31 includes the bags of one first core layer 31A and one Cover the first core layer 31A the first clad 31B, and the first core layer 31A have it is one exposed from the first clad 31B and go out The first exposed upper 311A and one is exposed from the first clad 31B and the first exposed lower surface 312A for going out.Wherein, first The first upper overlay area 3111 and one that exposed upper 311A has that a packed body 20 covered, which are connected on first, to be covered Region 3111 and it is exposed outside packaging body 20 first on exposed region 3112, and the first exposed lower surface 312A has a quilt The first lower overlay area 3121 and one that packaging body 20 is covered are connected to the first lower overlay area 3121 and exposed in packaging body First time exposed region 3122 outside 20.

For further, coordinate shown in Fig. 4 and Fig. 6, the second conducting terminal 32 includes the bags of one second core layer 32A and one Cover the second core layer 32A the second clad 32B, and the second core layer 32A have it is one exposed from the second clad 32B and go out The second exposed upper 321A and one is exposed from the second clad 32B and the second exposed lower surface 322A for going out.Wherein, second The second upper overlay area 3211 and one that exposed upper 321A has that a packed body 20 covered, which are connected on second, to be covered Region 3211 and it is exposed outside packaging body 20 second on exposed region 3212, and the second exposed lower surface 322A has a quilt The second lower overlay area 3221 and one that packaging body 20 is covered are connected to the second lower overlay area 3221 and exposed in packaging body Second time exposed region 3222 outside 20.

(second embodiment)

Refer to shown in Fig. 8, second embodiment of the invention provides a kind of solid electrolytic capacitor for lift-off seal Encapsulating structure Z, it includes：One capacitor cell 1, an encapsulation unit 2 and a conductive unit 3.From Fig. 8 and Fig. 4 comparison, sheet The invention second embodiment difference maximum with first embodiment is：In a second embodiment, capacitor cell 1 include it is multiple sequentially The second stacked capacitor 10 ' for being stacked and being electrically connected to each other.Wherein, multiple second stacked capacitors 10 ' are set Put on the bottom of the first conducting terminal 31 and on the bottom of the second conducting terminal 32, and each second stacked capacitor 10 ' there is a second positive pole portion P ' and one for being electrically connected at the first conducting terminal 31 to be electrically connected at the second conducting terminal 32 Second negative pole portion N '.

(the possibility effect of embodiment)

In summary, beneficial effects of the present invention can be, the embodiment of the present invention can be by the way that " the first core layer 31A has There is a first exposed upper 311A and one that is exposed from the first clad 31B and going out exposed from the first clad 31B and go out First exposed lower surface 312A " and " the second core layer 32A have one it is exposed from the second clad 32B and go out second it is exposed on The design for the second exposed lower surface 322A " that surface 321A and one is exposed from the second clad 32B and goes out, with lifting, " first leads Between both contact surfaces of electric terminal 31 and packaging body 20 " and " second conducting terminal 32 and packaging body 20 both contact surfaces it Between " sealing.The effect of lift-off seal can be reached on solid electrolytic capacitor encapsulating structure Z of the present invention, lift 15 Exemplified by individual sampling, under the environmental condition of 93 DEG C and 100% relative humidity, to pass through 8 hours in steam boiler, this hair can be obtained It is bright that forward and backward capacitance difference is lifted in sealing, as shown in following experimental result：

It the foregoing is only the preferred possible embodiments of the present invention, non-therefore the limitation present invention the scope of the claims, therefore such as The equivalence techniques done with description of the invention and schema content changes, and is both contained in the claims of the present invention It is interior.

Claims (10)

1. a kind of solid electrolytic capacitor encapsulating structure, it is characterised in that the solid electrolytic capacitor encapsulating structure includes：

One capacitor cell, the capacitor cell include multiple the first stacked electricity for being sequentially stacked and being electrically connected to each other Container, the first stacked capacitor described in each of which have one first positive pole portion and one first negative pole portion；

One encapsulation unit, the encapsulation unit include a packaging body for being used to coat the capacitor cell completely；And

One conductive unit, the conductive unit include at least one first conducting terminal and with least one first conducting terminal that At least one second conducting terminal of this one specific range of separation, wherein first stacked capacitor is arranged on described at least one It is on the top of first conducting terminal and described at least on the top of one second conducting terminal, at least one first conducting terminal tool There are a first positive pole portion for being electrically connected at first stacked capacitor and be covered by the packaging body Portion is buried in one and one is connected to portion and exposed the first exposed portion outside the packaging body is buried in described first, and described at least one Second conducting terminal has one to be electrically connected at the first negative pole portion of first stacked capacitor and be covered by institute State and portion is buried in second in packaging body and one is connected to portion and exposed second exposed outside the packaging body is buried in described second Portion；

Wherein, at least one first conducting terminal includes the first bag of one first core layer and cladding first core layer Coating, first core layer have that one is exposed from first clad and the first exposed upper for going out and one from described the The first exposed lower surface that one clad is exposed and goes out, what first exposed upper was covered with one by the packaging body First upper overlay area and one be connected to first upper overlay area and it is exposed outside the packaging body first on exposed area Domain, and the first exposed lower surface have first lower overlay area covered by the packaging body and one be connected to it is described First lower overlay area and exposed first time exposed region outside the packaging body；

Wherein, at least one second conducting terminal includes the second bag of one second core layer and cladding second core layer Coating, second core layer have that one is exposed from second clad and the second exposed upper for going out and one from described the The second exposed lower surface that two clads are exposed and go out, what second exposed upper was covered with one by the packaging body Second upper overlay area and one be connected to second upper overlay area and it is exposed outside the packaging body second on exposed area Domain, and the second exposed lower surface have second lower overlay area covered by the packaging body and one be connected to it is described Second lower overlay area and exposed second time exposed region outside the packaging body.

2. solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that the capacitor cell includes more Individual the second stacked capacitor for being sequentially stacked and being electrically connected to each other, second stacked capacitor are arranged on institute State at least on the bottom of one first conducting terminal and described at least on the bottom of one second conducting terminal, and each described second Stacked capacitor is electrically connected at a second positive pole portion for being electrically connected at least one first conducting terminal and one Second negative pole portion of at least one second conducting terminal, wherein first core layer is Cu or Cu alloys, first bag Coating includes first articulamentum for be Ni and one is Sn and coats the first weld layer of first articulamentum, and described second Core layer is Cu or Cu alloys, and second clad includes second articulamentum for be Ni and one is Sn and coats described second Second weld layer of articulamentum.

3. solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that the packaging body has one the One side surface, one are connected to first side surface and described the back in the second side surface of first side surface and one Basal surface between two side surfaces, first exposed upper described first on exposed region and the first exposed following table First time exposed region in face is connected to first side surface of the packaging body, and second exposed upper Described second on exposed region and second time exposed region of the second exposed lower surface be connected to the encapsulation Second side surface of body, wherein the described first exposed portion of at least one first conducting terminal is along the packaging body First side surface and the basal surface extend, and the described second exposed portion of at least one second conducting terminal is along institute Second side surface and the basal surface for stating packaging body extend.

4. solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that first core layer has One runs through first core layer and be connected between first exposed upper and the first exposed lower surface first Through hole, and second core layer has one through second core layer and is connected to second exposed upper and institute The second through hole between the second exposed lower surface is stated, wherein what first through hole was filled up with one by the packaging body First filling part and one it is communicated in first filling part and exposed the first hollow-out parts outside the packaging body, and described second Through hole has second filling part filled up by the packaging body and one is communicated in second filling part and exposed in institute State the second hollow-out parts outside packaging body.

5. solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that each described first stacking Type capacitor includes a valve metal paillon foil, one coats the oxide layer of the valve metal paillon foil, the cladding oxide layer completely The electroconductive polymer layer of a part, one coat the rubber layer of the electroconductive polymer layer and one coat the carbon paste completely completely The elargol layer of layer, the first stacked capacitor is arranged on the outer surface of the oxide layer and enclosed including one described in each of which Shape insulating barrier, and the length of the electroconductive polymer layer of first stacked capacitor, institute are surrounded around the oxide layer State the length of rubber layer and the length of the elargol layer is limited by described around shape insulating barrier, wherein the oxide layer is outer There is an encircled area on surface, and first stacked capacitor it is described be arranged on around shape insulating barrier around ground described in In the encircled area of oxide layer and the simultaneously end with the electroconductive polymer layer, the end of the rubber layer and the silver The end contact of glue-line.

6. a kind of conductive unit, it is characterised in that the conductive unit includes：At least one first conducting terminal and with it is described at least One first conducting terminal separates at least one second conducting terminal of a specific range each other, wherein at least one first conducting end Sub and described at least one second conducting terminal is connected to a packaging body；

Wherein, at least one first conducting terminal have one be covered by the packaging body first in bury portion and one connection Portion and exposed the first exposed portion outside the packaging body are buried in described first, and at least one second conducting terminal has One be covered by the packaging body second in bury portion and one be connected in described second and bury portion and exposed in the packaging body The second outer exposed portion；

Wherein, at least one first conducting terminal includes the first bag of one first core layer and cladding first core layer Coating, first core layer have that one is exposed from first clad and the first exposed upper for going out and one from described the The first exposed lower surface that one clad is exposed and goes out, what first exposed upper was covered with one by the packaging body First upper overlay area, and the first exposed lower surface has first lower overlay area covered by the packaging body；

Wherein, at least one second conducting terminal includes the second bag of one second core layer and cladding second core layer Coating, second core layer have that one is exposed from second clad and the second exposed upper for going out and one from described the The second exposed lower surface that two clads are exposed and go out, what second exposed upper was covered with one by the packaging body Second upper overlay area, and the second exposed lower surface has second lower overlay area covered by the packaging body.

7. conductive unit according to claim 6, it is characterised in that first exposed upper has one to be connected to institute State the first upper overlay area and it is exposed outside the packaging body first on exposed region, the first exposed lower surface have one It is connected to first lower overlay area and exposed first time exposed region outside the packaging body, the second exposed upper table Face have one be connected to second upper overlay area and it is exposed outside the packaging body second on exposed region, described second Exposed lower surface has one to be connected to second lower overlay area and exposed second time exposed region outside the packaging body, And exposed region on described first, first time exposed region, exposed region and second time exposed area on described second Domain filling up to be completely covered by Sn materials, wherein first core layer is Cu or Cu alloys, first cladding Layer is Sn including first articulamentum for being Ni and one and coats the first weld layer of first articulamentum, and second core Central layer is Cu or Cu alloys, and second clad is Sn including second articulamentum for being Ni and one and cladding described second connects Connect the second weld layer of layer.

8. conductive unit according to claim 7, it is characterised in that the packaging body has one first side surface, a back of the body The second side surface and one for first side surface are connected between first side surface and second side surface Basal surface, first exposed upper described first on exposed region and the first exposed lower surface described first under Exposed region is connected to first side surface of the packaging body, and naked on described the second of second exposed upper Second time exposed region of dew region and the second exposed lower surface is connected to second side of the packaging body Surface, wherein first side surface of the described first exposed portion of at least one first conducting terminal along the packaging body Extend with the basal surface, and the described second exposed portion of at least one second conducting terminal is along described in the packaging body Second side surface extends with the basal surface.

9. conductive unit according to claim 6, it is characterised in that first core layer has one to run through described first Core layer and the first through hole being connected between first exposed upper and the first exposed lower surface, and described Two core layers have one through second core layer and are connected to second exposed upper and the described second exposed following table The second through hole between face, wherein first through hole has first filling part and one filled up by the packaging body First filling part and exposed the first hollow-out parts outside the packaging body are communicated in, and second through hole has a quilt The second filling part and one that the packaging body is filled up be communicated in second filling part and it is exposed outside the packaging body Two hollow-out parts.

10. a kind of preparation method of solid electrolytic capacitor encapsulating structure, it is characterised in that the preparation method includes following step Suddenly：

At least one first conducting terminal and at least one second conducting terminal are provided；

There is provided a capacitor cell, the capacitor cell includes multiple being sequentially stacked and being electrically connected at described at least 1 the The first stacked capacitor between one conducting terminal and at least one second conducting terminal, wherein first stacked is electric Container is arranged on described at least on the top of one first conducting terminal and described at least on the top of one second conducting terminal, and often One first stacked capacitor has one first positive pole portion and one first negative pole portion；

A packaging body is formed to coat the capacitor cell completely, wherein at least one first conducting terminal has one electrically to connect Buried in first for being connected to the first positive pole portion of first stacked capacitor and being covered by the packaging body portion and One is connected to portion and exposed the first exposed portion outside the packaging body is buried in described first, and at least one second conducting end Son has one to be electrically connected at the first negative pole portion of first stacked capacitor and be covered by the packaging body Second in bury portion and one be connected to portion and exposed the second exposed portion outside the packaging body are buried in described second；And

The described first exposed portion and the described second exposed portion are bent, to cause the described first exposed portion and the described second exposed portion equal Extend along the outer surface of the packaging body；

Wherein, at least one first conducting terminal includes the first bag of one first core layer and cladding first core layer Coating, first core layer have that one is exposed from first clad and the first exposed upper for going out and one from described the The first exposed lower surface that one clad is exposed and goes out, what first exposed upper was covered with one by the packaging body First upper overlay area, and the first exposed lower surface has first lower overlay area covered by the packaging body；

Wherein, at least one second conducting terminal includes the second bag of one second core layer and cladding second core layer Coating, second core layer have that one is exposed from second clad and the second exposed upper for going out and one from described the The second exposed lower surface that two clads are exposed and go out, what second exposed upper was covered with one by the packaging body Second upper overlay area, and the second exposed lower surface has second lower overlay area covered by the packaging body.