CN206758285U - Matrix array type stacked-type solid electrolytic capacitor encapsulating structure - Google Patents
Matrix array type stacked-type solid electrolytic capacitor encapsulating structure Download PDFInfo
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- CN206758285U CN206758285U CN201520836895.2U CN201520836895U CN206758285U CN 206758285 U CN206758285 U CN 206758285U CN 201520836895 U CN201520836895 U CN 201520836895U CN 206758285 U CN206758285 U CN 206758285U
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Abstract
A kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure includes a lead frame component, multiple capacitor cells and an encapsulation unit, and lead frame component is connected to the connection framework of multiple conducting brackets including multiple conducting brackets arranged in a matrix fashion and one.Each conducting bracket includes one first conducting terminal and one second conducting terminal.Multiple capacitor cells are separately positioned on multiple conducting brackets.Each capacitor cell includes multiple the first stacked-type capacitors being sequentially stacked together.First positive pole portion and one of each first stacked-type capacitor with first conducting terminal for being electrically connected at corresponding conducting bracket are electrically connected at the first negative pole portion of the second conducting terminal of corresponding conducting bracket.Encapsulation unit includes the packing colloid that multiple difference coat multiple capacitor cells completely.The utility model also provides a kind of preparation method of matrix array type stacked-type solid electrolytic capacitor encapsulating structure.
Description
Technical field
The utility model system is related to a kind of capacitor packaging structure, espespecially a kind of matrix array type stacked-type solid state electrolysis
Capacitor packaging structure.
Background technology
Capacitor has been widely used for consumer electrical home appliances, computer motherboard and its periphery, power supply unit, led to
The basic module of product and automobile etc. is interrogated, its main effect includes：Filtering, bypass, rectification, coupling, decoupling, phase inversion etc..It is
One of indispensable component in electronic product.Capacitor has different kenels according to different material and purposes.Including aluminum
Electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc..In look-ahead technique, solid electrolytic capacitor has small
The advantages that size, high capacitance, superior frequency characteristic, and can be used in the decoupling effect of the power circuit of central processing unit
On.In general, using the storehouse of multiple capacitor cells, and the solid electrolytic capacitor of high-capacitance is formed, known storehouse
Formula solid electrolytic capacitor includes multiple capacitor cells and lead frame, each of which capacitor cell include anode portion, negative pole part with
Insulation division, this insulation division make anode portion be electrically insulated from negative pole part.Particularly, the negative pole part of capacitor cell storehouse each other,
And conductor layer is set by between adjacent capacitor cell, so as to be electrically connected to each other between multiple capacitor cells.
However, known solid electrolytic capacitor nevertheless suffers from the limitation of many in the design largely produced.Therefore how to lead to
The improvement of structure design is crossed, to overcome above-mentioned missing, it has also become one of this cause important topic to be solved.
The content of the invention
Technical problem to be solved in the utility model is, provides a kind of matrix arrangement in view of the shortcomings of the prior art
Formula stacked-type solid electrolytic capacitor encapsulating structure, its can effective lifting lead wire frame member utilization rate, and reduce encapsulation consumptive material
(packaging adhesive material saved in runner), is advantageous to largely produce.
A kind of matrix array type stacked-type solid electrolytic capacitor encapsulation that the utility model wherein embodiment is provided
Structure, it includes：One lead frame component, multiple capacitor cells and an encapsulation unit.The lead frame component includes multiple with square
Conducting bracket and one that battle array mode arranges are connected to the connection framework of multiple conducting brackets, conductive branch described in each of which
Frame is connected to the connection framework including first conducting terminal for being connected to the connection framework and one and led with described first
Electric terminal separates the second conducting terminal of a preset distance each other；Multiple capacitor cells are separately positioned on multiple conductions
On support, capacitor cell described in each of which includes multiple the first stacked-types for being sequentially stacked together and being electrically connected to each other
Capacitor, and each described first stacked-type capacitor has one to be electrically connected at the described of the corresponding conducting bracket
First positive pole portion of the first conducting terminal and second conducting terminal for being electrically connected at the corresponding conducting bracket
The first negative pole portion；The encapsulation unit includes the packing colloid that multiple difference coat multiple capacitor cells completely；Wherein,
First conducting terminal of each conducting bracket has an institute for being electrically connected at the corresponding capacitor cell
Buried in first for stating the first positive pole portion of the first stacked-type capacitor and being covered by the corresponding packing colloid
Portion and one it is connected to the first exposed portion that portion is buried in described first and is exposed to outside the corresponding packing colloid；Wherein,
Second conducting terminal of each conducting bracket has an institute for being electrically connected at the corresponding capacitor cell
Buried in second for stating the first negative pole portion of the first stacked-type capacitor and being covered by the corresponding packing colloid
Portion and one it is connected to the second exposed portion that portion is buried in described second and is exposed to outside the corresponding packing colloid.
A kind of matrix array type stacked-type solid electrolytic capacitor encapsulation that the other embodiment of the utility model is provided
Structure, it includes：One lead frame component, multiple capacitor cells and an encapsulation unit.The lead frame component includes multiple with square
Conducting bracket and one that battle array mode arranges are connected to the connection framework of multiple conducting brackets, conductive branch described in each of which
Frame is connected to the connection framework including first conducting terminal for being connected to the connection framework and one and led with described first
Electric terminal separates the second conducting terminal of a preset distance each other；Multiple capacitor cells are separately positioned on multiple described lead
On electric support, capacitor cell described in each of which includes multiple the first stacked-type capacitors being sequentially stacked together, and often
One the first stacked-type capacitor has first conducting end for being electrically connected at the corresponding conducting bracket
The the first positive pole portion and one of son are electrically connected at the first negative pole of second conducting terminal of the corresponding conducting bracket
Portion；The encapsulation unit includes the packing colloid that multiple difference coat multiple capacitor cells completely；Wherein, described in each
First conducting terminal of conducting bracket have one be covered by the corresponding packing colloid first in bury portion and
One is exposed to the first exposed portion outside the corresponding packing colloid；Wherein, described the of each conducting bracket
Two conducting terminals have one be covered by the corresponding packing colloid second in bury portion and one be exposed to it is corresponding
The packing colloid outside the second exposed portion.
A kind of matrix array type stacked-type solid electrolytic capacitor envelope that the other another embodiment of the utility model is provided
The preparation method of assembling structure, it includes：A lead frame component is provided, the lead frame component arranges in a matrix fashion including multiple
Conducting bracket and a connection framework for being connected to multiple conducting brackets, conducting bracket described in each of which include one and connect
Be connected to it is described connection framework the first conducting terminal and one be connected to it is described connection framework and with first conducting terminal each other
Separate the second conducting terminal of a preset distance；Multiple capacitor cells are separately positioned on multiple conducting brackets, wherein
Each described capacitor cell includes multiple the first stacked-type capacitors for being sequentially stacked together and being electrically connected to each other, and often
One the first stacked-type capacitor has first conducting end for being electrically connected at the corresponding conducting bracket
The the first positive pole portion and one of son are electrically connected at the first negative pole of second conducting terminal of the corresponding conducting bracket
Portion；And by a mould structure, multiple packing colloids are coated to multiple capacitor cells completely respectively；Wherein, it is each
First conducting terminal of the individual conducting bracket has one to be electrically connected at described the of the corresponding capacitor cell
The first positive pole portion of one stacked-type capacitor and be covered by the corresponding packing colloid first in bury portion and
One is connected to the first exposed portion that portion is buried in described first and is exposed to outside the corresponding packing colloid；Wherein, it is each
Second conducting terminal of the individual conducting bracket has one to be electrically connected at described the of the corresponding capacitor cell
The first negative pole portion of one stacked-type capacitor and be covered by the corresponding packing colloid second in bury portion and
One is connected to the second exposed portion that portion is buried in described second and is exposed to outside the corresponding packing colloid.
The beneficial effects of the utility model can be, the matrix array type stacked-type that the utility model embodiment is provided
Solid electrolytic capacitor encapsulating structure, it can be by the way that " the lead frame component includes multiple conductive branch arranged in a matrix fashion
Frame and a connection framework for being connected to multiple conducting brackets, conducting bracket described in each of which are connected to described including one
Connect the first conducting terminal of framework and one be connected to the connection framework and to separate one each other with first conducting terminal pre-
Second conducting terminal of set a distance " and " by a mould structure, multiple packing colloids are coated to multiple electricity completely respectively
The design of appearance unit ", with the utilization rate of effective lifting lead wire frame member, and reduce the encapsulation consumptive material (encapsulation saved in each runner
Glue material), be advantageous to largely produce.
Feature of the present utility model and technology contents are further understood that to be enabled, are referred to below in connection with the utility model
Detailed description and accompanying drawing, but institute's accompanying drawings only provide with reference to and explanation use, not be used for the utility model is any limitation as
Person.
Brief description of the drawings
Below by drawings and examples, the technical solution of the utility model is described in further detail.
Fig. 1 is the flow of the preparation method of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
Figure.
Fig. 2 is showing for the lead frame component of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
It is intended to.
Fig. 3 is the enlarged diagram of Fig. 2 part A.
The step of Fig. 4 is the preparation method of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
S102 amplification regards schematic diagram.
The step of Fig. 5 is the preparation method of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
S104 amplification regards schematic diagram.
Fig. 6 is the signal of the mould structure of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
Figure.
Fig. 7 is single first stacked-type of the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure
The side elevational cross-section schematic diagram of capacitor or the second stacked-type capacitor.
Fig. 8 is that the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure uses multiple sequentially storehouses
The first stacked-type capacitor side elevational cross-section schematic diagram.
Fig. 9 is that the utility model matrix array type stacked-type solid electrolytic capacitor encapsulating structure uses multiple sequentially storehouses
The first stacked-type capacitor and multiple sequentially storehouses the second stacked-type capacitor side elevational cross-section schematic diagram.
Embodiment
It is to be illustrated by specific instantiation disclosed by the utility model about " matrix array type stacked-type is consolidated below
The embodiment of state electrolytic capacitor encapsulating structure ", those skilled in the art can understand this by content disclosed in the present specification
The advantages of utility model and effect.The utility model can be implemented or applied, this theory by other different specific embodiments
Every details in bright book can also be based on different viewpoints and application, and various modifications are carried out in the case where not departing from spirit of the present utility model
With change.In addition, schema of the present utility model is only simple schematically illustrate, not according to the description of actual size, first give chat it is bright.With
Under embodiment will be explained in further detail correlation technique content of the present utility model, but disclosed content and be not used to limit
Make technology category of the present utility model.
Refer to shown in Fig. 1 to Fig. 8, the utility model provides a kind of matrix array type stacked-type (or chip-shaped) solid-state electricity
The preparation method of electrolysis condenser encapsulating structure, it comprises the following steps：
First, coordinate shown in Fig. 1, Fig. 2 and Fig. 3, there is provided a lead frame component 1 (that is, lead frame leadframe), lead
Coil holder component 1 includes the connection framework that multiple conducting brackets 10 and one arranged in a matrix fashion are connected to multiple conducting brackets 10
11, each of which conducting bracket 10 includes first conducting terminal 101 and one for being connected to connection framework 11 and is connected to connection
Framework 11 and the second conducting terminal 102 (S100) for separating a preset distance each other with the first conducting terminal 101.Further to
Say, connection framework 11 has one around shape frame portion 110 and multiple is connected to around shape frame portion 110 and by around the institute of shape frame portion 110
The connecting portion 111 surrounded.In addition, definition one first predeterminated level direction X1 and one second predeterminated level direction X2 is orthogonal,
Wherein along the second adjacent conducting terminal of two adjacent first conducting terminals 101 or two of the first predeterminated level direction X1 extensions
102 separate each other, and adjacent along two adjacent first conducting terminals 101 or two of the second predeterminated level direction X2 extensions
Second conducting terminal 102 can be connected with each other and be presented each other relative to corresponding connecting portion 111 by connecting framework 11
It is symmetrical arranged.
Then, coordinate shown in Fig. 1, Fig. 3 and Fig. 4, multiple capacitor cells 2 be separately positioned on multiple conducting brackets 10,
Each of which capacitor cell 2 includes multiple the first stacked-type capacitors 21 for being sequentially stacked together and being electrically connected to each other,
And each first stacked-type capacitor 21 has first conducting terminal for being electrically connected at corresponding conducting bracket 10
101 the first positive pole portion P1 and one is electrically connected at the first negative pole of the second conducting terminal 102 of corresponding conducting bracket 10
Portion N1 (S102).
Next, coordinating Fig. 1, Fig. 5 and Fig. 6, by a mould structure M, multiple packing colloids 30 are wrapped completely respectively
Cover multiple capacitor cells 2 (S104).For example, as shown in fig. 6, mould structure M includes a sprue M1 and at least four connects
In sprue M1 secondary fluid course M2, and each secondary fluid course M2 has multiple colloid injection channels towards same direction extension
M20.In addition, each secondary fluid course M2 multiple colloid injection channel M20 can correspond to corresponding lead frame component 1, so
Packing colloid 30 (such as lighttight encapsulating material) can be sequentially by sprue M1 and corresponding secondary fluid course M2 and its more
Individual colloid injection channel M20, to be directed to lead frame component 1.In other words, for any one lead frame component 1, wherein
One secondary fluid course M2 multiple colloid injection channel M20 can correspond to lead frame component 1, so packing colloid 30 can sequentially pass through
Sprue M1 and one of secondary fluid course M2 and its multiple colloid injection channel M20, to be directed to lead frame component 1.
Thereby, coordinate shown in Fig. 2, Fig. 5 and Fig. 7, the utility model still further provides a kind of matrix array type storehouse
Type solid electrolytic capacitor encapsulating structure, it includes：One lead frame component 1, the encapsulation unit 3 of multiple capacitor cells 2 and one.Lead
Coil holder component 1 includes the connection framework that multiple conducting brackets 10 and one arranged in a matrix fashion are connected to multiple conducting brackets 10
11, each of which conducting bracket 10 includes first conducting terminal 101 and one for being connected to connection framework 11 and is connected to connection
Framework 11 and the second conducting terminal 102 for separating a preset distance each other with the first conducting terminal 101.Furthermore multiple electric capacity lists
Member 2 is separately positioned on multiple conducting brackets 10, and each of which capacitor cell 2 includes multiple be sequentially stacked together and each other
The first stacked-type capacitor 21 being electrically connected with, and each first stacked-type capacitor 21 has one to be electrically connected at relatively
The first positive pole portion P1 and one of first conducting terminal 101 of the conducting bracket 10 answered is electrically connected at corresponding conducting bracket 10
The second conducting terminal 102 the first negative pole portion N1.In addition, encapsulation unit 3 coats multiple electric capacity lists completely including multiple difference
The packing colloid 30 of member 2.
For further, as shown in figure 5, the first conducting terminal 101 of each conducting bracket 10 has one electrically to connect
The the first positive pole portion P1 for being connected to the first stacked-type capacitor 21 of corresponding capacitor cell 2 (that is, in electrical contact is located at most bottom
End the first stacked-type capacitor 21 the first positive pole portion P1) and be covered by corresponding packing colloid 30 first in bury
Portion 101A and one is connected to the first exposed portion 101B that portion 101A is buried in first and is exposed to outside corresponding packing colloid 30.
In addition, the second conducting terminal 102 of each conducting bracket 10 has one to be electrically connected at the first of corresponding capacitor cell 2
The first negative pole portion N1 (that is, first of the first stacked-type capacitor 21 in electrical contact positioned at lowermost end of stacked-type capacitor 21
Negative pole portion N1) and be covered by corresponding packing colloid 30 second in bury portion 102A and one and be connected in second portion of burying
102A and the second exposed portion 102B being exposed to outside corresponding packing colloid 30.
For further, as shown in fig. 7, each first stacked-type capacitor 21 includes a valve metal paillon foil 200, one
The oxide layer 201, one of cladding valve metal paillon foil 200 completely coats the electroconductive polymer layer 202, one of a part for oxide layer 201
The elargol layer 204 of the rubber layer 203 and one of complete coated with conductive macromolecule layer 202 cladding rubber layer 203 completely.It is in addition, each
Individual first stacked-type capacitor 21 includes one and is arranged on the outer surface of oxide layer 201 and surrounds the exhausted around shape of oxide layer 201
Edge layer 205, and the length of the electroconductive polymer layer 202 of the first stacked-type capacitor 21, the length of rubber layer 203 and elargol layer
204 length is all limited around shape insulating barrier 205.Have one to surround for further, on the outer surface of oxide layer 201
Region 2010, and oxide layer 201 is arranged on around shape insulating barrier 205 surrounding area with surrounding of the first stacked-type capacitor 21
Contact on domain 2010 and simultaneously the end 2020 of electroconductive polymer layer 202, the end 2030 of rubber layer 203 and elargol layer 204
End 2040.However, the first stacked-type capacitor 21 used in the utility model is not limited with above-mentioned institute's illustrated example.
It is noted that coordinate shown in Fig. 5 and Fig. 8, when lead frame component 1 is cut, and by the first exposed portion
After outer surfaces of the exposed portion 102B of 101B and second along packing colloid 30 is bent, you can form multiple capacitor package knots
Structure Z.For further, multiple first stacked-type capacitors 21 sequentially can be stacked together and be electrically connected to each other, wherein often
Two the first negative pole portion N1 of two the first adjacent stacked-type capacitors 21 can pass through elargol (non-label) mutually repeatedly to pile up
Together, and two the first positive pole portion P1 of adjacent the first stacked-type capacitor 21 of each two can pass through weld layer (non-label)
With the stack up that mutually changes.
It is worth noting that, referring to shown in Fig. 9, each capacitor cell 2 can also further include multiple sequentially heaps
Together and the second stacked-type capacitor 22 for being electrically connected to each other, and each second stacked-type capacitor 22 has one to stack
The the second positive pole portion P2 and one for being electrically connected at the first conducting terminal 101 of corresponding conducting bracket 10 is electrically connected at relatively
Second negative pole portion N2 of the second conducting terminal 102 of the conducting bracket 10 answered, multiple first heaps of each of which capacitor cell 2
Stack-type capacitor 21 is arranged on the upper surface of corresponding conducting bracket 10, and multiple the second of each capacitor cell 2
Stacked-type capacitor 22 is arranged on the lower surface of corresponding conducting bracket 10.
(feasible effect of embodiment)
In summary, the beneficial effects of the utility model can be, the matrix row that the utility model embodiment is provided
Column stacked-type solid electrolytic capacitor encapsulating structure, it can be by the way that " lead frame component 1 includes multiple arranging in a matrix fashion
Conducting bracket 10 and one is connected to the connection framework 11 of multiple conducting brackets 10, and each of which conducting bracket 10 includes one and connected
The first conducting terminal 101 and one for being connected to connection framework 11 is connected to connection framework 11 and divided each other with the first conducting terminal 101
From the second conducting terminal 102 " of a preset distance and " by a mould structure M, by multiple packing colloids 30 difference bag completely
The design of multiple capacitor cells 2 " is covered, with the utilization rate of effective lifting lead wire frame member 1, and encapsulation consumptive material is reduced and (saves each stream
Packaging adhesive material in road), be advantageous to largely produce.
It the foregoing is only preferable possible embodiments of the present utility model, non-therefore limitation patent model of the present utility model
Enclose, therefore the equivalence techniques change done such as with the utility model specification and schema content, it is both contained in the utility model
Protection domain in.
【Symbol description】
Capacitor packaging structure Z
Lead frame component 1
Conducting bracket 10
First conducting terminal 101
Portion 101A is buried in first
First exposed portion 101B
Second conducting terminal 102
Portion 102A is buried in second
Second exposed portion 102B
Connect framework 11
Around shape frame portion 110
Connecting portion 111
Capacitor cell 2
First stacked-type capacitor 21
First positive pole portion P1
First negative pole portion N1
Second stacked-type capacitor 22
Second positive pole portion P2
Second negative pole portion N2
Valve metal paillon foil 200
Oxide layer 201
Encircled area 2010
Electroconductive polymer layer 202
End 2020
Rubber layer 203
End 2030
Elargol layer 204
End 2040
Around shape insulating barrier 205
Encapsulation unit 3
Packing colloid 30
Mould structure M
Sprue M1
Secondary fluid course M2
Colloid injection channel M20
First predeterminated level direction X1
Second predeterminated level direction X2
Claims (6)
1. a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure, it includes：
One lead frame component, the lead frame component are connected to multiple including multiple conducting brackets arranged in a matrix fashion and one
The connection framework of the conducting bracket, conducting bracket described in each of which are connected to the first of the connection framework including one and led
Electric terminal and one it is connected to the connection framework and separates the second conductive of a preset distance each other with first conducting terminal
Terminal；
Multiple capacitor cells, multiple capacitor cells are separately positioned on multiple conducting brackets, described in each of which
Capacitor cell includes multiple the first stacked-type capacitors for being sequentially stacked together and being electrically connected to each other, and each described
One stacked-type capacitor have first conducting terminal for being electrically connected at the corresponding conducting bracket first just
Pole portion and one be electrically connected at the corresponding conducting bracket second conducting terminal the first negative pole portion；And
One encapsulation unit, the encapsulation unit include the packing colloid that multiple difference coat multiple capacitor cells completely；
Wherein, first conducting terminal of each conducting bracket has one to be electrically connected at the corresponding electric capacity
The first positive pole portion of the first stacked-type capacitor of unit and it is covered by the corresponding packing colloid
Portion is buried in first and one to be connected to portion is buried in described first and is exposed to outside the corresponding packing colloid first exposed
Portion；
Wherein, second conducting terminal of each conducting bracket has one to be electrically connected at the corresponding electric capacity
The first negative pole portion of the first stacked-type capacitor of unit and it is covered by the corresponding packing colloid
Portion is buried in second and one to be connected to portion is buried in described second and is exposed to outside the corresponding packing colloid second exposed
Portion.
2. matrix array type stacked-type solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that institute
Stating connection framework has one described around shape frame portion to be surrounded around shape frame portion and by described around shape frame portion and multiple be connected to
Connecting portion, along two adjacent first conducting terminals of one first predeterminated level direction extension or two adjacent described the
Two conducting terminals separate each other, two adjacent first conducting terminals or two extended along one second predeterminated level direction
Adjacent second conducting terminal by it is described connection framework be connected with each other and relative to the corresponding connecting portion with
Presentation is arranged symmetrically in relation to each other, and the first predeterminated level direction and the second predeterminated level direction are orthogonal.
3. matrix array type stacked-type solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that every
One the first stacked-type capacitor coats the oxide layer of the valve metal paillon foil, one completely including a valve metal paillon foil, one
Coat the electroconductive polymer layer of a part for the oxide layer, one coat the rubber layer and one of the electroconductive polymer layer completely
The elargol layer of the rubber layer is coated completely, and the first stacked-type capacitor described in each of which is arranged on the oxidation including one
Shape insulating barrier is surrounded on the outer surface of layer and around the oxide layer, and the first stacked-type capacitor is described conductive high
The length of the length of molecular layer, the length of the rubber layer and the elargol layer is all limited by described around shape insulating barrier, its
Described in oxide layer the outer surface on there is an encircled area, and the first stacked-type capacitor is described exhausted around shape
Edge layer is arranged in the encircled area of the oxide layer and contacts the end of the electroconductive polymer layer, institute simultaneously with surrounding
State the end of rubber layer and the end of the elargol layer.
4. matrix array type stacked-type solid electrolytic capacitor encapsulating structure according to claim 1, it is characterised in that every
One capacitor cell includes multiple the second stacked-type capacitors for being sequentially stacked together and being electrically connected to each other, and each
The individual second stacked-type capacitor has first conducting terminal for being electrically connected at the corresponding conducting bracket
The second positive pole portion and one be electrically connected at the corresponding conducting bracket second conducting terminal the second negative pole portion,
Multiple first stacked-type capacitors of capacitor cell described in each of which are arranged on the corresponding conducting bracket
On upper surface, and multiple second stacked-type capacitors of each capacitor cell are arranged on the corresponding conduction
On the lower surface of support.
5. matrix array type stacked-type solid electrolytic capacitor encapsulating structure according to claim 4, it is characterised in that every
One the second stacked-type capacitor coats the oxide layer of the valve metal paillon foil, one completely including a valve metal paillon foil, one
Coat the electroconductive polymer layer of a part for the oxide layer, one coat the rubber layer and one of the electroconductive polymer layer completely
The elargol layer of the rubber layer is coated completely, and the second stacked-type capacitor described in each of which is arranged on the oxidation including one
Shape insulating barrier is surrounded on the outer surface of layer and around the oxide layer, and the second stacked-type capacitor is described conductive high
The length of the length of molecular layer, the length of the rubber layer and the elargol layer is all limited by described around shape insulating barrier, its
Described in oxide layer the outer surface on there is an encircled area, and the second stacked-type capacitor is described exhausted around shape
Edge layer is arranged in the encircled area of the oxide layer and contacts the end of the electroconductive polymer layer, institute simultaneously with surrounding
State the end of rubber layer and the end of the elargol layer.
6. a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure, it includes：
One lead frame component, the lead frame component are connected to multiple including multiple conducting brackets arranged in a matrix fashion and one
The connection framework of the conducting bracket, conducting bracket described in each of which are connected to the first of the connection framework including one and led
Electric terminal and one it is connected to the connection framework and separates the second conductive of a preset distance each other with first conducting terminal
Terminal；
Multiple capacitor cells, multiple capacitor cells are separately positioned on multiple conducting brackets, described in each of which
Capacitor cell includes multiple the first stacked-type capacitors being sequentially stacked together, and each described first stacked-type capacitor
The first positive pole portion and one with first conducting terminal for being electrically connected at the corresponding conducting bracket electrically connect
It is connected to the first negative pole portion of second conducting terminal of the corresponding conducting bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520836895.2U CN206758285U (en) | 2015-10-27 | 2015-10-27 | Matrix array type stacked-type solid electrolytic capacitor encapsulating structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520836895.2U CN206758285U (en) | 2015-10-27 | 2015-10-27 | Matrix array type stacked-type solid electrolytic capacitor encapsulating structure |
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| Publication Number | Publication Date |
|---|---|
| CN206758285U true CN206758285U (en) | 2017-12-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112652488A (en) * | 2019-10-10 | 2021-04-13 | 美商祥茂光电科技股份有限公司 | Capacitor stack for noise filtering in high frequency switching applications and optical subassembly module employing same |
-
2015
- 2015-10-27 CN CN201520836895.2U patent/CN206758285U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112652488A (en) * | 2019-10-10 | 2021-04-13 | 美商祥茂光电科技股份有限公司 | Capacitor stack for noise filtering in high frequency switching applications and optical subassembly module employing same |
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