TWI833661B - Capacitor assembly package structure - Google Patents

Abstract

The present invention provides a capacitor assembly package structure, which includes a capacitor assembly, a first inner conductive structure, a second inner conductive structure, an insulating package body, a first bottom electrode structure, a second bottom electrode structure, a first outermost strengthening structure and a second outermost strengthening structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other. Each capacitor element has a positive portion and a negative portion. The positive portion of each capacitor element can be electrically connected to the first bottom electrode structure through the first inner conductive structure, so that a first shortest conductive path is formed between the positive portion of each capacitor element and the first bottom electrode structure. The negative portion of each capacitor element can be electrically connected to the second bottom electrode structure through the second inner conductive structure, so that a second shortest conductive path is formed between the negative portion of each capacitor element and the second bottom electrode structure.

Description

Capacitor component packaging structure

The present invention relates to a capacitor component packaging structure, and in particular to a capacitor component packaging structure with the shortest conductive path.

Capacitors have been widely used in consumer home appliances, computer motherboards and peripherals, power supplies, communication products, and basic components of automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, To become one of the indispensable components in electronic products. According to different materials and uses, capacitors include aluminum electrolytic capacitors, tantalum electrolytic capacitors, laminated ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior frequency characteristics, and can be applied to the decoupling function of the power circuit of the central processor. Generally speaking, a high-capacitance solid electrolytic capacitor can be formed by stacking multiple capacitor units. The stacked solid electrolytic capacitor in the current technology includes multiple capacitor units and a lead frame. Each capacitor unit includes an anode portion, The cathode part and the insulating part, and the insulating part will electrically insulate the anode part and the cathode part from each other. In particular, the cathode portions of the capacitor units are stacked on each other, and a conductor layer is disposed between two adjacent capacitor units so that the plurality of capacitor units can be electrically connected to each other. However, there is still room for improvement in stacked capacitors in the prior art.

The problem to be solved by the present invention is to provide a capacitor component packaging structure in view of the shortcomings of the existing technology, so that a first shortest conductive path is formed between the positive electrode portion of each capacitor element and the first bottom electrode structure, and each capacitor element is A second shortest conductive path is formed between the negative electrode portion of a capacitor element and the second bottom electrode structure.

In order to solve the above problems, one of the technical means adopted by the present invention is to provide a capacitor component packaging structure, which includes: a capacitor component, a first internal conductive structure, a second internal conductive structure, an insulating package, and an A first bottom electrode structure, a second bottom electrode structure, a first outermost strengthening structure and a second outermost strengthening structure. The capacitor component includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode part and a negative electrode part. The first internal conductive structure is in electrical contact with the positive electrode portion of each capacitor element, and the first internal conductive structure has a first exposed bottom end. The second internal conductive structure is in electrical contact with the negative electrode portion of each capacitor element, and the second internal conductive structure has a second exposed bottom end. The insulating package is configured to encapsulate the capacitor component, the first inner conductive structure and the second inner conductive structure, and the first exposed bottom end of the first inner conductive structure and the second exposed bottom end of the second inner conductive structure are from One bottom end of the insulating package is exposed. The first bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the first exposed bottom end of the first internal conductive structure. The second bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the second exposed bottom end of the second internal conductive structure. The first outermost strengthening structure is adjacent to the first bottom electrode structure and is disposed on a first side of the insulating package. The second outermost reinforcement structure is adjacent to the second bottom electrode structure and is disposed on a second side of the insulating package. Wherein, the positive electrode portion of each capacitor element is electrically connected to the first bottom electrode structure through the first internal conductive structure, thereby forming a first bottom electrode structure between the positive electrode portion of each capacitor element and the first bottom electrode structure. A shortest conductive path; wherein the negative electrode portion of each capacitor element is electrically connected to the second bottom electrode structure through the second internal conductive structure, thereby making the negative electrode portion of each capacitor element and the second bottom electrode structure A second shortest conductive path is formed between them; wherein, the first shortest conductive path does not need to pass through the first outermost reinforced structure, and the second shortest conductive path does not need to pass through the second outermost reinforced structure; wherein, the first outermost reinforced structure The structure is configured to provide a first outermost exposed surface in contact with the outside world, and the second outermost reinforced structure is configured to provide a second outermost exposed surface in contact with the outside world.

In order to solve the above problems, another technical means adopted by the present invention is to provide a capacitor component packaging structure, which includes: a capacitor component, a first internal conductive structure, a second internal conductive structure, an insulating package, and an A first bottom electrode structure, a second bottom electrode structure, a first outermost strengthening structure and a second outermost strengthening structure. The capacitor component includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode part and a negative electrode part. The first internal conductive structure is in electrical contact with the positive electrode portion of each capacitor element, and the first internal conductive structure has a first exposed bottom end. The second internal conductive structure is in electrical contact with the negative electrode portion of each capacitor element, and the second internal conductive structure has a second exposed bottom end. The insulating package is configured to encapsulate the capacitor component, the first inner conductive structure and the second inner conductive structure, and the first exposed bottom end of the first inner conductive structure and the second exposed bottom end of the second inner conductive structure are from One bottom end of the insulating package is exposed. The first bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the first exposed bottom end of the first internal conductive structure. The second bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the second exposed bottom end of the second internal conductive structure. The first outermost strengthening structure is adjacent to the first bottom electrode structure and is disposed on a first side of the insulating package. The second outermost reinforcement structure is adjacent to the second bottom electrode structure and is disposed on a second side of the insulating package.

One of the beneficial effects of the present invention is that the capacitor component packaging structure provided by the present invention can electrically contact the positive electrode portion of each capacitor element through "a first internal conductive structure, and the first internal conductive structure has a first "Exposed bottom end", "The second internal conductive structure is in electrical contact with the negative electrode portion of each capacitor element, and the second internal conductive structure has a second exposed bottom end", "The first bottom electrode structure is disposed on the insulating package "The second bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the second exposed bottom of the second internal conductive structure." end", "the first outermost reinforcing structure is adjacent to the first bottom electrode structure and is disposed on a first side of the insulating package" and "the second outermost reinforcing structure is adjacent to the second bottom electrode structure and is disposed on the insulating package "on a second side of the body" technical solution, so that the positive electrode portion of each capacitor element can be electrically connected to the first bottom electrode structure through the first internal conductive structure (thereby so that the positive electrode portion of each capacitor element forming a first shortest conductive path between the first and first bottom electrode structures), and allowing the negative electrode portion of each capacitor element to be electrically connected to the second bottom electrode structure through the second internal conductive structure (thereby Such that a second shortest conductive path is formed between the negative electrode portion of each capacitor element and the second bottom electrode structure).

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation of the "capacitor component packaging structure" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Referring to FIGS. 1 to 3 , a first embodiment of the present invention provides a capacitor component packaging structure Z (such as a solid electrolytic capacitor, but the present invention is not limited thereto), which includes: a capacitor component 1, a first internal Conductive structure 2, a second internal conductive structure 3, an insulating package 4, a first bottom electrode structure 5 (for example, a first lead frame structure), a second bottom electrode structure 6 (for example, a second lead frame structure) ), a first outermost strengthening structure 7 (for example, a first auxiliary function structure) and a second outermost strengthening structure 8 (for example, a second auxiliary function structure).

First, as shown in FIG. 1 , the capacitor component 1 includes a plurality of capacitor elements 10 (or capacitor units) that are electrically connected to each other, and each capacitor element 10 has a positive electrode portion 10P (or anode portion) and a negative electrode portion 10N. (or cathode part). For example, multiple capacitor elements 10 can be stacked sequentially, and each capacitor element 10 can include a metal foil 101 (such as an Al foil), an insulating surrounding layer 102, a conductive polymer layer 103, and a carbon glue. layer 104 and a silver glue layer 105. Furthermore, the insulating surrounding layer 102 is arranged around the metal foil 101 , the conductive polymer layer 103 covers a part of the metal foil 101 and contacts the insulating surrounding layer 102 , and the carbon glue layer 104 covers the conductive polymer layer 103 and contacts the insulating surrounding layer 102 , and the silver glue layer 105 covers the carbon glue layer 104 and contacts the insulating surrounding layer 102 . In addition, a dielectric layer (or oxide layer) is formed on two opposite surfaces of the metal foil 101, and the dielectric layer has a dielectric constant between 5 and 300, or is called a relative dielectric. constant(relative permittivity). However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

Furthermore, as shown in FIGS. 1 and 2 , the first internal conductive structure 2 is in electrical contact with the positive electrode portion 10P of each capacitor element 10 , and the first internal conductive structure 2 has a first exposed bottom end 2000 . In addition, the second internal conductive structure 3 is electrically in contact with the negative electrode portion 10N of each capacitor element 10, and has a second exposed bottom end 3000. Furthermore, the positive electrode portion 10P of each capacitor element 10 has one side surface, and the first internal conductive structure 2 is in electrical contact (for example, through conductive glue or without passing through other additional conductive media) of each capacitor element 10 The side surface of the positive electrode portion 10P. In addition, the negative electrode portion 10N of each capacitor element 10 has one side surface, and the second internal conductive structure 3 is in electrical contact (for example, through conductive glue or without other additional conductive media) with the negative electrode portion 10N of each capacitor element 10 side surface. For example, depending on different requirements, the first internal conductive structure 2 can be a pre-made first internal conductive sheet (such as a pre-made copper sheet, aluminum sheet or conductive sheet made of any material) or through A first inner conductive layer formed by curing (for example, first forming a conductive material through dipping method, and then curing the conductive material to form a conductive layer, so the first inner conductive layer can be a silver layer, a copper layer or a conductive layer made of any material), and the second internal conductive structure 3 can be a pre-fabricated second internal conductive sheet (such as a pre-fabricated copper sheet, aluminum sheet, or a conductive sheet made of any material). ) or a second inner conductive layer formed by curing (for example, first through dipping to form a conductive material, and then curing the conductive material to form a conductive layer. The second inner conductive layer can be a silver layer, Copper layer or conductive layer made of any material). However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

Furthermore, as shown in FIG. 2 , the insulating package 4 may be configured to cover the capacitor component 1 , the first inner conductive structure 2 and the second inner conductive structure 3 , and the first exposed bottom of the first inner conductive structure 2 The end 2000 and the second exposed bottom end 3000 of the second internal conductive structure 3 will be exposed from a bottom end 4000 of the insulating package 4 . That is to say, the plurality of capacitor elements 10 can be completely covered inside the insulating package 4, and the first internal conductive structure 2 can be completely covered inside the insulating package 4 except for the first exposed bottom end 2000. And the second inner conductive structure 3 may be completely covered inside the insulating package 4 except for the second exposed bottom end 3000 . For example, according to different requirements, the first internal conductive structure 2 can contact a top end of the first bottom electrode structure 5 vertically or obliquely, and the second internal conductive structure 3 can contact the second bottom electrode vertically or obliquely. A top of structure 6. In addition, according to different requirements, the insulating packaging body 4 can be silicon resin, epoxy resin or any insulating packaging material. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

In addition, as shown in Figure 2, the first bottom electrode structure 5 is disposed on the bottom end 4000 of the insulating package 4 and electrically contacts the first exposed bottom end 2000 of the first internal conductive structure 2, and the second bottom electrode The structure 6 is disposed on the bottom end 4000 of the insulating package 4 and electrically contacts the second exposed bottom end 3000 of the second internal conductive structure 3 . Furthermore, the positive electrode portion 10P of each capacitor element 10 can be electrically connected to the first bottom electrode structure 5 through the first internal conductive structure 2, thereby allowing the positive electrode portion 10P of each capacitor element 10 to be connected to the first bottom electrode structure 5. A first shortest conductive path is formed between a bottom electrode structure 5 (that is, a first vertical conductive path, which is located between the positive electrode portion 10P of each capacitor element 10 and the first bottom electrode structure 5). In addition, the negative electrode portion 10N of each capacitor element 10 can be electrically connected to the second bottom electrode structure 6 through the second internal conductive structure 3, thereby allowing the negative electrode portion 10N of each capacitor element 10 to be connected to the second bottom terminal A second shortest conductive path is formed between the electrode structures 6 (that is, a second vertical conductive path is located between the negative electrode portion 10N of each capacitor element 10 and the second bottom electrode structure 6). It is worth noting that the first shortest conductive path does not need to pass through the first outermost reinforced structure 7 , and the second shortest conductive path does not need to pass through the second outermost reinforced structure 8 . That is to say, the first inner conductive structure 2 can be electrically connected to the first bottom electrode structure 5 without passing through the first outermost reinforcing structure 7 (or in other words, the first shortest conductive path does not need to be laterally moved outward to the first An outermost reinforced structure 7 and then returns to the first bottom electrode structure 5), and the second inner conductive structure 3 can be electrically connected to the second bottom electrode structure 6 without passing through the second outermost reinforced structure 8 ( In other words, the second shortest conductive path does not need to move laterally outward to the second outermost strengthening structure 8 and then return to the second bottom electrode structure 6). For example, only the bottom surface of both the first bottom electrode structure 5 and the second bottom electrode structure 6 will be exposed from the insulating package 4 , and the second bottom electrode structure 6 will extend to the capacitor component package structure Z. Near the central position, thereby improving the supporting force of the second bottom electrode structure 6 for the plurality of capacitor elements 10, thereby effectively increasing the overall structural strength of the capacitor component packaging structure Z, and the bottom of the second bottom electrode structure 6 has a A recessed space filled by the insulating package 4. The first bottom electrode structure 5 and the second bottom electrode structure 6 can be made of copper material, aluminum material or any conductive material. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

Furthermore, as shown in FIG. 2 , the first outermost reinforcement structure 7 is adjacent to the first bottom electrode structure 5 and is disposed on a first side 4001 of the insulating package 4 , and the first bottom electrode structure 5 and the first The outermost reinforcing structures 7 are separated from each other by a predetermined distance (in other words, the first bottom electrode structure 5 and the first outermost reinforcing structure 7 are not in contact with each other). In addition, the second outermost reinforcement structure 8 is adjacent to the second bottom electrode structure 6 and is disposed on a second side 4002 of the insulating package 4 , and both the second bottom electrode structure 6 and the second outermost reinforcement structure 8 They are separated from each other by a predetermined distance (in other words, the second bottom electrode structure 6 and the second outermost reinforcement structure 8 are not in contact with each other). Furthermore, the first outermost reinforced structure 7 may be configured to provide a first outermost exposed surface 7000 that is in contact with the outside world, and the second outermost reinforced structure 8 may be configured to provide a first outermost exposed surface 7000 that is in contact with the outside world. A second outermost exposed surface 8000. For example, the first outermost reinforced structure 7 may be a pre-fabricated first outermost conductive sheet (such as a pre-fabricated copper sheet, aluminum sheet or conductive sheet made of any material) or formed by solidification. A first outermost conductive layer (for example, first through a dipping method to form a conductive material, and then solidify the conductive material to form a conductive layer, so the first outermost conductive layer can be a silver layer, a copper layer or conductive layer made of any material), and the second outermost reinforced structure 8 can be a pre-made second outermost conductive sheet (such as a pre-made copper sheet, aluminum sheet or conductive sheet made of any material). sheet) or a second outermost conductive layer formed by curing (for example, first through dipping to form a conductive material, and then curing the conductive material to form a conductive layer, so the second outermost conductive layer can It is a conductive layer made of silver, copper or any material). However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

In addition, as shown in FIGS. 2 and 3 , when the capacitor component package structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can pass through a first conductive material M1 (such as solder balls, solder paste or any other conductive material) to be electrically connected to a first pad P101 of the circuit substrate P, and the second bottom electrode structure 6 can pass through a second conductive material M2 (such as solder ball, solder paste or any conductive material). Electrically connected to a second pad P102 of the circuit substrate P. Furthermore, as shown in FIG. 3 , when the capacitor component packaging structure Z is disposed on the circuit substrate P, part or all of the first outermost exposed surface 7000 of the first outermost reinforced structure 7 may be covered with the first conductive material. M1 is covered (that is, the first conductive material M1 can penetrate the first outermost exposed surface 7000 to create a first tin climbing structure), and a part of the second outermost exposed surface 8000 of the second outermost reinforced structure 8 Or it can all be covered by the second conductive material M2 (that is, the second conductive material M2 can pass through the second outermost exposed surface 8000 to create a second tin-climbing structure), thereby increasing the first outermost strengthening structure. 7 and the first conductive material M1, and increase the contact area of the second outermost reinforced structure 8 and the second conductive material M2.

It is worth noting that, for example, as shown in Figure 3, the first conductive material M1 can also be distinguished as "electrically connected between the first bottom electrode structure 5 and the first pad P101 of the circuit substrate P" A first conductive part (providing electrical conduction function) and a first tin climbing part (providing structural strengthening function) "used to cover the first outermost exposed surface 7000 of the first outermost strengthening structure 7", and The first conductive part and the first soldering part of a conductive material M1 may be separated from each other or connected to each other. In addition, the second conductive material M2 can also be divided into a second conductive part "electrically connected between the second bottom electrode structure 6 and the second pad P102 of the circuit substrate P" (providing electrical conduction function) and a second tin-climbing portion "for covering the second outermost exposed surface 8000 of the second outermost reinforcement structure 8" (providing a structural strengthening function), and the second conductive portion of the second conductive material M2 and the second tin-climbing portion The tin parts can be separated from each other or connected to each other. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

[Second Embodiment]

Referring to Figure 4, a second embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating package 4, A first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost strengthening structure 7 and a second outermost strengthening structure 8. It can be seen from the comparison between FIG. 4 and FIG. 2 that the main difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the first internal conductive structure 2 can penetrate multiple capacitor elements 10 The positive electrode portion 10P thereby electrically contacts the first bottom electrode structure 5 . For example, the first internal conductive structure 2 (such as a soldering flux or a soldering flux) may be made by laser welding or other welding methods to penetrate and electrically connect the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 to the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 .

[Third Embodiment]

Referring to Figures 5 and 6, a third embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, and an insulating package. body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost strengthening structure 7 and a second outermost strengthening structure 8. In addition, when the capacitor component packaging structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can be electrically connected to a first pad P101 of the circuit substrate P through a first conductive material M1, and the third The two bottom electrode structures 6 can be electrically connected to a second pad P102 of the circuit substrate P through a second conductive material M2. From the comparison between Figure 5 and Figure 2, and the comparison between Figure 6 and Figure 3, it can be seen that the main difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the first bottom electrode structure 5 The first outermost reinforcing structure 7 may be connected to each other, and the second bottom electrode structure 6 and the second outermost reinforcing structure 8 may be connected to each other.

Furthermore, as shown in FIG. 5 , when the first bottom electrode structure 5 and the first outermost reinforcing structure 7 are connected to each other, the first bottom electrode structure 5 and the first outermost reinforcing structure 7 can be connected to each other. Cooperate to form a first L-shaped structure (or a first similar L-shaped structure). In addition, when the second bottom electrode structure 6 and the second outermost reinforcement structure 8 are connected to each other, the second bottom electrode structure 6 and the second outermost reinforcement structure 8 can cooperate with each other to form a second L-shaped structure. (Or a second similar L-shaped structure).

[Fourth Embodiment]

Referring to Figure 7, the fourth embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating package 4, A first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost strengthening structure 7 and a second outermost strengthening structure 8. It can be seen from the comparison between FIG. 7 and FIG. 5 that the main difference between the fourth embodiment of the present invention and the third embodiment of the present invention is that in the fourth embodiment, the first internal conductive structure 2 can penetrate multiple capacitor elements 10 The positive electrode portion 10P thereby electrically contacts the first bottom electrode structure 5 . For example, the first internal conductive structure 2 (such as a soldering flux or a soldering flux) may be made by laser welding or other welding methods to penetrate and electrically connect the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 to the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 .

[Fifth Embodiment]

Referring to Figures 8 and 9, the fifth embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, and an insulating package. body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost strengthening structure 7 and a second outermost strengthening structure 8. In addition, when the capacitor component packaging structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can be electrically connected to a first pad P101 of the circuit substrate P through a first conductive material M1, and the third The two bottom electrode structures 6 can be electrically connected to a second pad P102 of the circuit substrate P through a second conductive material M2. It can be seen from the comparison between Figure 8 and Figure 5 and the comparison between Figure 9 and Figure 6 that the main difference between the fifth embodiment and the third embodiment of the present invention is that in the fifth embodiment, the first outermost reinforced structure 7 Neither the second outermost reinforcing structure 8 nor the second outermost reinforcing structure 8 extends to a top end 4003 of the insulating package 4 .

Furthermore, as shown in FIG. 8 , the first bottom electrode structure 5 and the first outermost reinforcing structure 7 can be connected to each other to form a first end structure U1. For example, the first end structure U1 may include a first inner conductive layer U101 covering a first portion of the insulating package 4 , a first intermediate conductive layer U102 covering the first inner conductive layer U101 and A first outer conductive layer U103 of the first middle conductive layer U102. In addition, the first inner conductive layer U101 may be at least one of an Ag layer and a Cu layer, the first intermediate conductive layer U102 may be a Ni layer, and the first outer conductive layer U103 may be a Sn layer. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

Furthermore, as shown in FIG. 8 , the second bottom electrode structure 6 and the second outermost reinforcing structure 8 can be connected to each other to form a second end structure U2. For example, the second end structure U2 may include a second inner conductive layer U201 covering a second portion of the insulating package 4, a second middle conductive layer U202 covering the second inner conductive layer U201, and A second outer conductive layer U203 covers the second middle conductive layer U202. In addition, the second inner conductive layer U201 may be at least one of an Ag layer and a Cu layer, the second middle conductive layer U202 may be a Ni layer, and the second outer conductive layer U203 may be a Sn layer. However, the above examples are only one of the possible embodiments and are not intended to limit the present invention.

[Beneficial effects of the embodiment]

One of the beneficial effects of the present invention is that the capacitor component packaging structure Z provided by the present invention can electrically contact the positive electrode portion 10P of each capacitor element 10 through the "first internal conductive structure 2, and the first internal conductive structure 2 2 has a first exposed bottom end 2000", "the second internal conductive structure 3 is in electrical contact with the negative electrode portion 10N of each capacitor element 10, and the second internal conductive structure 3 has a second exposed bottom end 3000", "the A bottom electrode structure 5 is disposed on the bottom end 4000 of the insulating package 4 and electrically contacts the first exposed bottom end 2000 of the first internal conductive structure 2. "The second bottom electrode structure 6 is disposed on the insulating package 4 on the bottom end 4000 and electrically contacting the second exposed bottom end 3000 of the second internal conductive structure 3, "the first outermost reinforcing structure 7 is adjacent to the first bottom electrode structure 5 and is disposed on a first side of the insulating package 4 "on a side 4001" and "the second outermost reinforcement structure 8 is adjacent to the second bottom electrode structure 6 and is provided on a second side 4002 of the insulating package 4", so that the positive electrode of each capacitor element 10 The portion 10P can be electrically connected to the first bottom electrode structure 5 through the first internal conductive structure 2 (thereby forming a first first bottom electrode structure 5 between the positive electrode portion 10P of each capacitor element 10 and the first bottom electrode structure 5 shortest conductive path), and allows the negative electrode portion 10N of each capacitor element 10 to be electrically connected to the second bottom electrode structure 6 through the second internal conductive structure 3 (thereby allowing the negative electrode portion 10N of each capacitor element 10 A second shortest conductive path is formed between the second bottom electrode structure 6 and the second bottom electrode structure 6).

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

Z: Capacitor component packaging structure 1: Capacitor component 10: Capacitor element 10P: Positive electrode part 10N: Negative part 101:Metal foil 102: Insulating surrounding layer 103:Conductive polymer layer 104: Carbon glue layer 105:Silver glue layer 2: First internal conductive structure 2000: First exposed bottom 3: Second internal conductive structure 3000: The second exposed bottom 4: Insulating package 4000: bottom 4001: First side 4002: Second side 4003:Top 5: First bottom electrode structure 6: Second bottom electrode structure 7: The first outermost reinforced structure 7000: First outermost exposed surface 8: The second outermost reinforced structure 8000: Second outermost exposed surface U1: first end structure U101: First inner conductive layer U102: first middle conductive layer U103: first outer conductive layer U2: Second end structure U201: Second inner conductive layer U202: Second middle conductive layer U203: Second outer conductive layer P: circuit board P101: First soldering pad P102: Second soldering pad M1: first conductive material M2: Second conductive material

FIG. 1 is a schematic cross-sectional view of a capacitor element of a capacitor component packaging structure provided by the first embodiment of the present invention.

FIG. 2 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the first embodiment of the present invention.

3 is a partial cross-sectional view of a capacitor component packaging structure provided on a circuit substrate according to the first embodiment of the present invention.

FIG. 4 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the second embodiment of the present invention.

FIG. 5 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the third embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of a capacitor component packaging structure provided on a circuit substrate according to the third embodiment of the present invention.

FIG. 7 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the fourth embodiment of the present invention.

FIG. 8 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the fifth embodiment of the present invention.

FIG. 9 is a partial cross-sectional view of a capacitor component packaging structure provided on a circuit substrate according to the fifth embodiment of the present invention.

FIG. 10 is a partial cross-sectional schematic diagram of the capacitor component packaging structure provided by the sixth embodiment of the present invention.

Z: Capacitor component packaging structure

1: Capacitor component

10: Capacitor element

10P: Positive electrode part

10N: Negative part

2: First internal conductive structure

2000: First exposed bottom

3: Second internal conductive structure

3000: The second exposed bottom

4: Insulating package

4000: bottom

4001: First side

4002: Second side

5: First bottom electrode structure

6: Second bottom electrode structure

7: The first outermost reinforced structure

7000: First outermost exposed surface

8: The second outermost reinforced structure

8000: Second outermost exposed surface

Claims (10)

A capacitor component packaging structure, which includes: A capacitor component, the capacitor component includes a plurality of capacitor elements electrically connected to each other, each of the capacitor elements having a positive electrode part and a negative electrode part; a first internal conductive structure electrically contacting the positive electrode portion of each capacitor element, the first internal conductive structure having a first exposed bottom end; a second internal conductive structure electrically contacting the negative electrode portion of each capacitor element, the second internal conductive structure having a second exposed bottom end; An insulating package configured to enclose the capacitor assembly, the first inner conductive structure, and the second inner conductive structure, and the third portion of the first inner conductive structure An exposed bottom end and the second exposed bottom end of the second internal conductive structure are exposed from a bottom end of the insulating package; a first bottom electrode structure, the first bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the first exposed bottom end of the first internal conductive structure; a second bottom electrode structure, the second bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the second exposed bottom end of the second internal conductive structure; a first outermost reinforcement structure adjacent to the first bottom electrode structure and disposed on a first side of the insulating package; and a second outermost reinforcement structure, the second outermost reinforcement structure is adjacent to the second bottom electrode structure and is disposed on a second side of the insulating package; Wherein, the positive electrode portion of each capacitor element is electrically connected to the first bottom electrode structure through the first internal conductive structure, thereby making the positive electrode portion of each capacitor element Forming a first shortest conductive path with the first bottom electrode structure; Wherein, the negative electrode portion of each capacitor element is electrically connected to the second bottom electrode structure through the second internal conductive structure, thereby making the negative electrode portion of each capacitor element A second shortest conductive path is formed between the second bottom electrode structure and the second bottom electrode structure; Wherein, the first shortest conductive path does not need to pass through the first outermost reinforced structure, and the second shortest conductive path does not need to pass through the second outermost reinforced structure; Wherein, the first outermost reinforced structure is configured to provide a first outermost exposed surface in contact with the outside world, and the second outermost reinforced structure is configured to provide a second exposed surface in contact with the outside world. The outermost exposed surface. The capacitor component packaging structure as described in claim 1, Wherein, each capacitor element includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, and the insulating surrounding layer is arranged around the metal foil, The conductive polymer layer covers a part of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue The layer completely covers the carbon glue layer and contacts the insulating surrounding layer; Wherein, the positive electrode portion of each capacitor element has a side surface, and the first internal conductive structure is in electrical contact with the side surface of the positive electrode portion of each capacitor element; Wherein, the negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure is in electrical contact with the side surface of the negative electrode portion of each capacitor element; Wherein, a plurality of the capacitor elements are completely covered inside the insulating package, and the first internal conductive structure is completely covered inside the insulating package except for the first exposed bottom end. , and the second internal conductive structure is completely covered inside the insulating package except for the second exposed bottom end. The capacitor component packaging structure as described in claim 1, Wherein, each capacitor element includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, and the insulating surrounding layer is arranged around the metal foil, The conductive polymer layer covers a part of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue The layer completely covers the carbon glue layer and contacts the insulating surrounding layer; Wherein, the first internal conductive structure metal foil penetrates the plurality of positive electrode portions of the plurality of capacitor elements to electrically contact the first bottom electrode structure; Wherein, the negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure is in electrical contact with the side surface of the negative electrode portion of each capacitor element; Wherein, a plurality of the capacitor elements are completely covered inside the insulating package, and the first internal conductive structure is completely covered inside the insulating package except for the first exposed bottom end. , and the second internal conductive structure is completely covered inside the insulating package except for the second exposed bottom end. The capacitor component packaging structure as described in claim 1, Wherein, the first bottom electrode structure and the first outermost reinforced structure are connected to each other or separated from each other by a predetermined distance, and the second bottom electrode structure and the second outermost reinforced structure are both connected to each other or separated from each other by a predetermined distance. connected to each other or separated from each other by a predetermined distance; Wherein, when the first bottom electrode structure and the first outermost reinforcing structure are connected to each other, the first bottom electrode structure and the first outermost reinforcing structure cooperate with each other to form a first L-shaped structure; Wherein, when the second bottom electrode structure and the second outermost strengthening structure are connected to each other, the second bottom electrode structure and the second outermost strengthening structure cooperate with each other to form a second L-shaped structure; Wherein, the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure ; Wherein, the first inner conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcing structure, and the second inner conductive structure does not need to pass through the second outermost strengthening structure. The outer strengthening structure is electrically connected to the second bottom electrode structure; Wherein, the first internal conductive structure is a pre-fabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a pre-fabricated second inner conductive layer. A conductive sheet or a second inner conductive layer formed by curing; Wherein, the first outermost reinforced structure is a pre-fabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforced structure is a pre-fabricated first outermost conductive sheet a second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor component packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the The second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is disposed on the circuit substrate, part or all of the first outermost exposed surface of the first outermost reinforced structure is covered by the first conductive material, and A part or all of the second outermost exposed surface of the second outermost reinforced structure is covered by the second conductive material, thereby increasing the number of the first outermost reinforced structure and the first conductive material. The contact area of the second outermost reinforced structure and the second conductive material is increased. The capacitor component packaging structure as described in claim 1, Wherein, neither the first outermost reinforced structure nor the second outermost reinforced structure extends to a top end of the insulating package; Wherein, the first bottom electrode structure and the first outermost strengthening structure are connected to each other to form a first end structure; Wherein, the second bottom electrode structure and the second outermost strengthening structure are connected to each other to form a second end structure; Wherein, the first end structure includes a first inner conductive layer covering a first portion of the insulating package, a first intermediate conductive layer covering the first inner conductive layer, and a first intermediate conductive layer covering the first portion of the insulating package. a first outer conductive layer of the first intermediate conductive layer, and the second end structure includes a second inner conductive layer covering a second portion of the insulating package, covering the second inner conductive layer a second middle conductive layer of the layer and a second outer conductive layer covering the second middle conductive layer; Wherein, the first inner conductive layer and the second inner conductive layer are both at least one layer of Ag layer and Cu layer, and the first middle conductive layer and the second middle conductive layer are both Ni. layer, and the first external conductive layer and the second external conductive layer are both Sn layers; Wherein, the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure ; Wherein, the first inner conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcing structure, and the second inner conductive structure does not need to pass through the second outermost strengthening structure. The outer strengthening structure is electrically connected to the second bottom electrode structure; Wherein, the first internal conductive structure is a pre-fabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a pre-fabricated second inner conductive layer. A conductive sheet or a second inner conductive layer formed by curing; Wherein, the first outermost reinforced structure is a pre-fabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforced structure is a pre-fabricated first outermost conductive sheet a second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor component packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the The second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is disposed on the circuit substrate, part or all of the first outermost exposed surface of the first outermost reinforced structure is covered by the first conductive material, and A part or all of the second outermost exposed surface of the second outermost reinforced structure is covered by the second conductive material, thereby increasing the number of the first outermost reinforced structure and the first conductive material. The contact area of the second outermost reinforced structure and the second conductive material is increased. A capacitor component packaging structure, which includes: A capacitor component, the capacitor component includes a plurality of capacitor elements electrically connected to each other, each of the capacitor elements having a positive electrode part and a negative electrode part; a first internal conductive structure electrically contacting the positive electrode portion of each capacitor element, the first internal conductive structure having a first exposed bottom end; a second internal conductive structure electrically contacting the negative electrode portion of each capacitor element, the second internal conductive structure having a second exposed bottom end; An insulating package configured to enclose the capacitor assembly, the first inner conductive structure, and the second inner conductive structure, and the third portion of the first inner conductive structure An exposed bottom end and the second exposed bottom end of the second internal conductive structure are exposed from a bottom end of the insulating package; a first bottom electrode structure, the first bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the first exposed bottom end of the first internal conductive structure; a second bottom electrode structure, the second bottom electrode structure is disposed on the bottom end of the insulating package and electrically contacts the second exposed bottom end of the second internal conductive structure; a first outermost reinforcement structure adjacent to the first bottom electrode structure and disposed on a first side of the insulating package; and A second outermost reinforcement structure, the second outermost reinforcement structure is adjacent to the second bottom electrode structure and is disposed on a second side of the insulating package. The capacitor component packaging structure as described in claim 6, Wherein, each capacitor element includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, and the insulating surrounding layer is arranged around the metal foil, The conductive polymer layer covers a part of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue The layer completely covers the carbon glue layer and contacts the insulating surrounding layer; Wherein, the positive electrode portion of each capacitor element has a side surface, and the first internal conductive structure is in electrical contact with the side surface of the positive electrode portion of each capacitor element; Wherein, the negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure is in electrical contact with the side surface of the negative electrode portion of each capacitor element; Wherein, a plurality of the capacitor elements are completely covered inside the insulating package, and the first internal conductive structure is completely covered inside the insulating package except for the first exposed bottom end. , and the second internal conductive structure is completely covered inside the insulating package except for the second exposed bottom end. The capacitor component packaging structure as described in claim 6, Wherein, each capacitor element includes a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, and the insulating surrounding layer is arranged around the metal foil, The conductive polymer layer covers a part of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue The layer completely covers the carbon glue layer and contacts the insulating surrounding layer; Wherein, the first internal conductive structure metal foil penetrates the plurality of positive electrode portions of the plurality of capacitor elements to electrically contact the first bottom electrode structure; Wherein, the negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure is in electrical contact with the side surface of the negative electrode portion of each capacitor element; Wherein, a plurality of the capacitor elements are completely covered inside the insulating package, and the first internal conductive structure is completely covered inside the insulating package except for the first exposed bottom end. , and the second internal conductive structure is completely covered inside the insulating package except for the second exposed bottom end. The capacitor component packaging structure as described in claim 6, Wherein, the first bottom electrode structure and the first outermost reinforced structure are connected to each other or separated from each other by a predetermined distance, and the second bottom electrode structure and the second outermost reinforced structure are both connected to each other or separated from each other by a predetermined distance. connected to each other or separated from each other by a predetermined distance; Wherein, when the first bottom electrode structure and the first outermost reinforcing structure are connected to each other, the first bottom electrode structure and the first outermost reinforcing structure cooperate with each other to form a first L-shaped structure; Wherein, when the second bottom electrode structure and the second outermost strengthening structure are connected to each other, the second bottom electrode structure and the second outermost strengthening structure cooperate with each other to form a second L-shaped structure; Wherein, the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure ; Wherein, the first inner conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcing structure, and the second inner conductive structure does not need to pass through the second outermost strengthening structure. The outer strengthening structure is electrically connected to the second bottom electrode structure; Wherein, the first internal conductive structure is a pre-fabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a pre-fabricated second inner conductive layer. A conductive sheet or a second inner conductive layer formed by curing; Wherein, the first outermost reinforced structure is a pre-fabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforced structure is a pre-fabricated first outermost conductive sheet a second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor component packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the The second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is disposed on the circuit substrate, part or all of a first outermost exposed surface of the first outermost reinforced structure is covered by the first conductive material, and the A part or all of a second outermost exposed surface of the second outermost reinforced structure is covered by the second conductive material, thereby increasing the contact between the first outermost reinforced structure and the first conductive material. area, and increase the contact area between the second outermost reinforcing structure and the second conductive material. The capacitor component packaging structure as described in claim 6, Wherein, neither the first outermost reinforced structure nor the second outermost reinforced structure extends to a top end of the insulating package; Wherein, the first bottom electrode structure and the first outermost strengthening structure are connected to each other to form a first end structure; Wherein, the second bottom electrode structure and the second outermost strengthening structure are connected to each other to form a second end structure; Wherein, the first end structure includes a first inner conductive layer covering a first portion of the insulating package, a first intermediate conductive layer covering the first inner conductive layer, and a first intermediate conductive layer covering the first portion of the insulating package. a first outer conductive layer of the first intermediate conductive layer, and the second end structure includes a second inner conductive layer covering a second portion of the insulating package, covering the second inner conductive layer a second middle conductive layer of the layer and a second outer conductive layer covering the second middle conductive layer; Wherein, the first inner conductive layer and the second inner conductive layer are both at least one layer of Ag layer and Cu layer, and the first middle conductive layer and the second middle conductive layer are both Ni. layer, and the first external conductive layer and the second external conductive layer are both Sn layers; Wherein, the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure ; Wherein, the first inner conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcing structure, and the second inner conductive structure does not need to pass through the second outermost strengthening structure. The outer strengthening structure is electrically connected to the second bottom electrode structure; Wherein, the first internal conductive structure is a pre-fabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a pre-fabricated second inner conductive layer. A conductive sheet or a second inner conductive layer formed by curing; Wherein, the first outermost reinforced structure is a pre-fabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforced structure is a pre-fabricated first outermost conductive sheet a second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor component packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the The second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is disposed on the circuit substrate, part or all of a first outermost exposed surface of the first outermost reinforced structure is covered by the first conductive material, and the A part or all of a second outermost exposed surface of the second outermost reinforced structure is covered by the second conductive material, thereby increasing the contact between the first outermost reinforced structure and the first conductive material. area, and increase the contact area between the second outermost reinforcing structure and the second conductive material.

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